CN218728808U

CN218728808U - Novel computer mainboard

Info

Publication number: CN218728808U
Application number: CN202222942538.7U
Authority: CN
Inventors: 李约勇; 李约军
Original assignee: Shenzhen Jintaiyi Electronic Co ltd
Current assignee: Shenzhen Jintaiyi Electronic Co ltd
Priority date: 2022-11-05
Filing date: 2022-11-05
Publication date: 2023-03-24
Anticipated expiration: 2032-11-05

Abstract

The utility model provides a novel computer mainboard. The novel computer mainboard includes: the main part, be equipped with the heat exchanger that looses in the main part, be equipped with heat dissipation mechanism in the heat exchanger that looses, heat dissipation mechanism is including two installation pieces, mounting panel and semiconductor refrigeration piece group, and two equal fixed mounting of installation piece are in the heat exchanger that looses, and the installation slot has all been seted up to one side outer wall that two installation pieces are close to each other, the mounting panel sets up in the main part, the both sides of mounting panel extend to respectively in two installation slots and with the inner wall sliding connection of installation slot, semiconductor refrigeration piece group sets up on the mounting panel, semiconductor refrigeration piece group comprises semiconductor refrigeration piece cold junction and semiconductor refrigeration piece hot junction. The utility model provides a novel computer mainboard can come to dispel the heat to the mainboard component one to one, causes and to strengthen the radiating effect to can avoid influencing the advantage of the use of mainboard because of high temperature.

Description

Novel computer mainboard

Technical Field

The utility model belongs to the technical field of the computer mainboard, especially, relate to a novel computer mainboard.

Background

A plurality of circuit elements with large current and large heat generation are installed in a computer motherboard, and an excessively high temperature has a considerable influence on the operation of electronic elements, hereinafter referred to as heating elements, which causes so-called "hot" in general, and the conventional method for reducing "hot" is to install a heat dissipation fan for the heating elements to reduce the temperature of the heat dissipation environment of the heating elements, thereby facilitating the heat dissipation of the heating elements. However, the conventional heat dissipation fans in the workshops are fixed in several sizes, and for the heat generating elements with different sizes, the heat dissipation fans cannot correspond to all the sizes of the heat generating elements one to one, so that the heat generating elements cannot be used as the effective heat dissipation range of the heat dissipation fans.

However, the above structure has disadvantages that most milling machines lack effective positioning and clamping for parts, and the parts of the instrument and meter are fine, so that it is difficult to accurately adjust manually during processing, and it is inconvenient to process when adjusting to the side or oblique angle.

Therefore, there is a need to provide a new computer motherboard to solve the above-mentioned technical problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem provide a can come to dispel the heat to mainboard component one to one, cause and to strengthen the radiating effect to can avoid influencing the novel computer mainboard of the use of mainboard because of high temperature.

In order to solve the above technical problem, the utility model provides a novel computer motherboard includes: the main part, be equipped with the heat exchanger in the main part, be equipped with heat dissipation mechanism in the heat exchanger, heat dissipation mechanism is including two installation pieces, mounting panel and semiconductor refrigeration piece group, and two equal fixed mounting of installation piece are in the heat exchanger, and the installation slot has all been seted up to one side outer wall that two installation pieces are close to each other, the mounting panel sets up in the main part, the both sides of mounting panel extend to respectively in two installation slots and with the inner wall sliding connection of installation slot, semiconductor refrigeration piece group sets up on the mounting panel, semiconductor refrigeration piece group comprises semiconductor refrigeration piece cold junction and semiconductor refrigeration piece hot junction, be equipped with first heat conduction silicone grease and second heat conduction silicone grease on semiconductor refrigeration piece cold junction and the semiconductor refrigeration piece hot junction respectively.

As a further scheme of the utility model, two spacing slots have been seted up at the top of mounting panel, be equipped with spacing subassembly on the installation piece, spacing subassembly includes spacing inserted block, blocks piece and expanding spring, spacing inserted block slidable mounting is on the installation piece, the bottom of spacing inserted block extend to in the installation slot and with spacing slot looks adaptation.

As a further aspect of the utility model, block the piece setting in the installation slot, block piece fixed mounting on spacing inserted block, the expanding spring slip cap is established on spacing inserted block, expanding spring's bottom and the top fixed connection who blocks the piece, expanding spring's top and installation slot's top inner wall fixed connection.

As a further scheme of the utility model, the top inner wall fixed mounting of main part has the mounting bracket, be equipped with radiator fan on the mounting bracket, radiator fan is located the top of second heat conduction silicone grease.

As a further aspect of the present invention, the top of the heat dissipation cover is provided with a first dustproof assembly, the first dustproof assembly includes a first vent and a first dustproof net, the first vent is provided on the top of the heat dissipation cover, and the first dustproof net is provided in the first vent.

As a further scheme of the utility model, the both sides outer wall of heat exchanger all is equipped with the dustproof subassembly of second, the dustproof subassembly of second is including second ventilation opening and second dust screen, the second ventilation opening is seted up on one side outer wall of heat exchanger, the second dust screen sets up in the second ventilation opening.

Compared with the prior art, the utility model provides a novel computer mainboard has following beneficial effect:

1. the utility model can radiate the mainboard element one by arranging the radiating mechanism, so that the radiating effect can be enhanced, thereby avoiding the influence on the use of the mainboard due to high temperature;

2. the utility model discloses a set up under the cooperation of first dustproof subassembly and the dustproof subassembly of second for easy operation can play dustproof effect, causes to avoid the dust to enter into in the heat exchanger 2 come to cause the influence to the use of semiconductor refrigeration piece group and component.

Drawings

To facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.

FIG. 1 is a schematic view of the present invention;

fig. 2 is a schematic structural view of the heat dissipation mechanism of the present invention;

fig. 3 is an enlarged structural view of a portion a in fig. 2.

In the figure: 1. a main body; 2. a heat dissipation cover; 3. mounting blocks; 4. mounting a plate; 5. a semiconductor refrigerating sheet set; 51. cold ends of the semiconductor refrigerating sheets; 52. the hot end of the semiconductor refrigerating sheet; 53. a first thermally conductive silicone grease; 54. a second thermally conductive silicone grease; 6. limiting the inserting block; 7. a blocking block; 8. a tension spring; 9. a mounting frame; 10. a heat radiation fan; 11. a first vent; 12. a first dust screen; 13. a second ventilation opening; 14. and a second dust screen.

Detailed Description

Please refer to fig. 1, fig. 2 and fig. 3 in combination, wherein fig. 1 is a schematic view of the present invention; fig. 2 is a schematic structural view of the heat dissipation mechanism of the present invention; fig. 3 is an enlarged schematic view of a portion a in fig. 2. The novel computer mainboard includes: main part 1, be equipped with heat exchanger 2 on main part 1, be equipped with heat dissipation mechanism in the heat exchanger 2, heat dissipation mechanism is including two installation pieces 3, mounting panel 4 and semiconductor refrigeration piece group 5, and two equal fixed mounting of installation piece 3 are in heat exchanger 2, and the installation slot has all been seted up to one side outer wall that two installation pieces 3 are close to each other, mounting panel 4 sets up in main part 1, the both sides of mounting panel 4 extend to respectively in two installation slots and with the inner wall sliding connection of installation slot, semiconductor refrigeration piece group 5 sets up on mounting panel 4, semiconductor refrigeration piece group 5 comprises semiconductor refrigeration piece cold junction 51 and semiconductor refrigeration piece hot junction 52, be equipped with first heat conduction silicone grease 53 and second heat conduction silicone grease 54 on semiconductor refrigeration piece cold junction 51 and the semiconductor refrigeration piece hot junction 52 respectively.

As shown in fig. 1, two limiting slots are formed in the top of the mounting plate 4, a limiting assembly is arranged on the mounting block 3 and comprises a limiting insertion block 6, a blocking block 7 and a telescopic spring 8, the limiting insertion block 6 is slidably mounted on the mounting block 3, and the bottom of the limiting insertion block 6 extends into the mounting slots and is matched with the limiting slots.

As shown in fig. 1, the blocking block 7 is arranged in the installation slot, the blocking block 7 is fixedly installed on the limiting insertion block 6, the telescopic spring 8 is slidably sleeved on the limiting insertion block 6, the bottom end of the telescopic spring 8 is fixedly connected with the top of the blocking block 7, and the top end of the telescopic spring 8 is fixedly connected with the inner wall of the top of the installation slot.

As shown in fig. 1, a mounting frame 9 is fixedly mounted on the inner wall of the top of the main body 1, a heat dissipation fan 10 is disposed on the mounting frame 9, and the heat dissipation fan 10 is located above the second heat conductive silicone grease 54.

As shown in fig. 1, a first dust-proof component is disposed at the top of the heat dissipation cover 2, the first dust-proof component includes a first ventilation opening 11 and a first dust-proof net 12, the first ventilation opening 11 is disposed at the top of the heat dissipation cover 2, and the first dust-proof net 12 is disposed in the first ventilation opening 11.

As shown in fig. 1, the outer walls of two sides of the heat dissipation cover 2 are both provided with a second dustproof assembly, the second dustproof assembly includes a second ventilation opening 13 and a second dustproof net 14, the second ventilation opening 13 is arranged on the outer wall of one side of the heat dissipation cover 2, and the second dustproof net 14 is arranged in the second ventilation opening 13.

An opening is formed in the outer wall of one side of the heat dissipation cover 2, a sealing door is hinged to the outer wall of one side of the heat dissipation cover 2 and matched with the opening, and a handle is arranged on the sealing door;

the utility model provides a novel computer motherboard's theory of operation as follows:

the first step is as follows: when the semiconductor refrigerating sheet cooling device is used, the plurality of heat dissipation covers 2 and the plurality of heat dissipation mechanisms can be arranged, the heat dissipation covers 2 can be covered on a main board element needing heat dissipation through screws, then the semiconductor refrigerating sheet group 5 is started to operate through an external power supply, when direct current is switched on, the temperature of the cold ends 51 of the semiconductor refrigerating sheets can be rapidly reduced, the temperature of the hot ends 52 of the semiconductor refrigerating sheets can be increased, therefore, the semiconductor refrigerating sheets can be cooled and dissipated through the cold ends 51 of the semiconductor refrigerating sheets, the phenomenon that the use of the main body 1 is affected due to overhigh temperature is avoided, meanwhile, the heat dissipation fan 10 is started to operate, heat generated by the hot ends 52 of the semiconductor refrigerating sheets can be extracted through the heat dissipation fan 10, then the semiconductor refrigerating sheets are discharged to the outside through the first ventilation opening 11 and the first dustproof net 12, and under the action of the second ventilation opening 13 and the second dustproof net 14, outside air can enter the heat dissipation covers 2 to form air circulation, so that the heat dissipation of the hot ends 52 of the semiconductor refrigerating sheets can be achieved, and the semiconductor refrigerating sheet group 5 can be facilitated;

the second step is as follows: open the sealing door through the handle, then stimulate spacing inserted block 6 and remove, make it drive through spacing inserted block 6 and block 7 and extrude expanding spring 8 when removing, cause spacing inserted block 6 to break away from in the spacing slot, later stimulate mounting panel 4 and function, cause mounting panel 4 to break away from in the mounting slot, make it can come to dismantle semiconductor refrigeration piece group 5.

It should be noted that the device structure and the accompanying drawings of the present invention mainly describe the principle of the present invention, and in the design principle, the settings of the power mechanism, the power supply system, the control system, etc. of the device are not completely described, and on the premise that the skilled person understands the principle of the present invention, the details of the power mechanism, the power supply system, and the control system can be clearly known, the control mode of the application file is automatically controlled by the controller, and the control circuit of the controller can be realized by simple programming of the skilled person in the art;

the standard parts used in the method can be purchased from the market, and can be customized according to the description of the specification and the accompanying drawings, the specific connection mode of each part adopts conventional means such as mature bolts, rivets, welding and the like in the prior art, the machines, parts and equipment adopt conventional models in the prior art, and the structure and the principle of the parts known by the skilled person can be known by technical manuals or conventional experimental methods.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and it is intended that the scope of the invention be defined by the appended claims and their equivalents and that all such modifications are intended to be encompassed by the scope of the invention as defined in the claims.

Claims

1. A novel computer mainboard is characterized by comprising:

the main part, be equipped with the heat exchanger in the main part, be equipped with heat dissipation mechanism in the heat exchanger, heat dissipation mechanism is including two installation pieces, mounting panel and semiconductor refrigeration piece group, and two equal fixed mounting of installation piece are in the heat exchanger, and the installation slot has all been seted up to one side outer wall that two installation pieces are close to each other, the mounting panel sets up in the main part, the both sides of mounting panel extend to respectively in two installation slots and with the inner wall sliding connection of installation slot, semiconductor refrigeration piece group sets up on the mounting panel, semiconductor refrigeration piece group comprises semiconductor refrigeration piece cold junction and semiconductor refrigeration piece hot junction, be equipped with first heat conduction silicone grease and second heat conduction silicone grease on semiconductor refrigeration piece cold junction and the semiconductor refrigeration piece hot junction respectively.

2. The novel computer motherboard of claim 1, wherein: two spacing slots have been seted up at the top of mounting panel, be equipped with spacing subassembly on the installation piece, spacing subassembly includes spacing inserted block, blocks piece and expanding spring, spacing inserted block slidable mounting is on the installation piece, the bottom of spacing inserted block extend to in the installation slot and with spacing slot looks adaptation.

3. The novel computer motherboard of claim 2, wherein: the stop block is arranged in the installation slot, the stop block is fixedly installed on the limiting insertion block, the telescopic spring sliding sleeve is arranged on the limiting insertion block, the bottom end of the telescopic spring is fixedly connected with the top of the stop block, and the top end of the telescopic spring is fixedly connected with the inner wall of the top of the installation slot.

4. The novel computer motherboard of claim 1, wherein: the top inner wall fixed mounting of main part has the mounting bracket, be equipped with radiator fan on the mounting bracket, radiator fan is located the top of second heat conduction silicone grease.

5. The novel computer motherboard of claim 1, wherein: the top of the heat dissipation cover is provided with a first dustproof assembly, the first dustproof assembly comprises a first ventilation opening and a first dustproof net, the first ventilation opening is formed in the top of the heat dissipation cover, and the first dustproof net is arranged in the first ventilation opening.

6. The novel computer motherboard of claim 1, wherein: the outer walls of the two sides of the heat dissipation cover are respectively provided with a second dustproof assembly, the second dustproof assemblies comprise second ventilation openings and second dustproof nets, the second ventilation openings are formed in the outer wall of one side of the heat dissipation cover, and the second dustproof nets are arranged in the second ventilation openings.