CN218728596U - Multi-light-source photoetching machine - Google Patents

Abstract

The embodiment of the present disclosure relates to a multi-light source lithography machine, which includes: the device comprises a substrate fixing module, a mask plate fixing module, an image acquisition module and an exposure module; the substrate fixing module, the mask plate fixing module and the exposure module are sequentially arranged along a preset direction, and the image acquisition module is arranged on one side, facing the exposure module, of the mask plate fixing module; wherein: the substrate fixing module is used for placing a substrate to be photoetched; the mask plate fixing module is used for fixing a mask plate; the image acquisition module is used for acquiring images at different preset positions of the mask plate and/or the substrate so as to align the substrate and the mask plate at multiple points; the exposure module comprises a plurality of movable lamp groups with selectable light sources, and is used for moving a target movable lamp group in the plurality of movable lamp groups to a photoetching working area under control so as to carry out alignment exposure on the substrate covered by the mask plate. Thereby, multi-light source exposure is realized.

Description

Multi-light-source photoetching machine

Technical Field

The disclosure relates to the technical field of micro-nano processing, in particular to a multi-light-source photoetching machine

Background

Photolithography is a very important process in semiconductor manufacturing, and is a process of removing a specific portion of a thin film on a wafer surface through a series of production steps, and transferring a pattern on a mask plate to the thin film on the wafer surface through exposure to form a film layer with a specific pattern. Thereafter, a film with a micro-pattern structure is left on the surface of the wafer. After the photoetching process is carried out, a characteristic pattern part is finally reserved on the wafer, the photoetching process precision determines the key size of the device, and the photoetching process has important significance in the field of micro-nano processing and is a core step of large-scale integrated circuit manufacturing. The method is mainly used for the development and production of medium and small scale integrated circuits, semiconductor components, optoelectronic devices and surface acoustic wave devices.

However, the existing lithography machines cannot meet the requirements of different exposure accuracy and exposure size.

SUMMERY OF THE UTILITY MODEL

To solve the technical problem or to at least partially solve the technical problem, the present disclosure provides a multi-light source lithography machine.

The present disclosure provides a multi-light source lithography machine, comprising: the device comprises a substrate fixing module, a mask plate fixing module, an image acquisition module and an exposure module;

the substrate fixing module, the mask plate fixing module and the exposure module are sequentially arranged along a preset direction, and the image acquisition module is arranged on one side, facing the exposure module, of the mask plate fixing module;

wherein: the substrate fixing module is used for placing a substrate to be photoetched; the mask plate fixing module is used for fixing a mask plate; the image acquisition module is used for acquiring images at different preset positions of the mask plate and/or the substrate so as to perform multi-point alignment on the substrate and the mask plate; the exposure module comprises a plurality of movable lamp groups with selectable light sources, and is used for moving a target movable lamp group in the movable lamp groups to a photoetching working area under control so as to carry out alignment exposure on the substrate covered by a mask plate.

Optionally, the lithography machine may further include: a photoetching machine shell and a damping block;

the photoetching machine shell is used for accommodating at least the substrate fixing module, the mask plate fixing module, the image acquisition module and the exposure module in the photoetching machine, and the damping block is fixedly connected to one side of the photoetching machine shell;

the photoetching machine shell is used for protecting the contained components, preventing dust and blocking light from leaking outwards, and the shock absorption block is used for stabilizing the photoetching machine shell and the components contained in the photoetching machine shell.

Optionally, the exposure module further comprises a movable slide rail;

the movable slide rail is fixed at one end of the inner side of the photoetching machine shell, and the plurality of movable lamp groups are respectively connected with the movable slide rail in a sliding manner;

and the exposure module is controlled to move the movable lamp group with the target working wavelength to a photoetching working area along the movable sliding rail.

Optionally, the substrate holding module comprises an XYZR axis alignment stage, a suction table, and a vacuum pump;

the sheet suction table is fixedly connected with a displacement table of the XYZR axis alignment platform and moves along with the displacement table; the sheet suction table is also connected with the vacuum pump and used for fixing the substrate through vacuum adsorption;

the XYZR axis alignment platform controls the displacement platform to move along an XYR axis based on a differential head with preset precision so as to align the substrate with the mask plate; and controlling the displacement table to move along the Z axis so as to adjust the distance between the substrate and the mask plate.

Optionally, the mask plate fixing module comprises a support rod, a mask plate mounting seat, a mask plate pressing plate and a mask plate mounting tray;

the one end fixed connection of bracing piece to basement fixed module, the other end installation of bracing piece the mask plate mount pad, mask plate installation tray inserts the mask plate mount pad for place the mask plate, the mask plate clamp plate is located the mask plate mount pad and keeps away from one side of bracing piece, and set up in the at least both sides side of mask plate mount pad for fixed mask plate.

Optionally, the image acquisition module comprises a microscope, a microscope support structure, a camera and an XY axis sliding table;

the microscope is fixed on the XY axis sliding table through the microscope supporting structure, and the camera is fixed on one side of an image space of the microscope;

the XY axis sliding table is used for driving the microscope to move so as to observe different positions of the mask plate, and the camera is used for acquiring images observed at corresponding positions.

Optionally, the lithography machine further comprises an illumination lamp;

the illuminating lamp is arranged in the microscope and used for controlled microscopic illumination.

Optionally, the lithography machine further comprises a display module, a receiving groove and a support bracket;

the accommodating groove is formed by inwards sinking of the photoetching machine shell, and the display module is rotatably connected to the photoetching machine shell through the supporting bracket;

the accommodating groove is used for accommodating the display module when the display module rotates to the reference position;

the display module is also in communication connection with the image acquisition module and is used for displaying the image acquired by the image acquisition module.

Optionally, the lithography machine further comprises a controller; the controller is fixedly connected to the photoetching machine shell;

the controller is used for controlling at least one of determining the target movable lamp group, controlling the target movable lamp group to move to a photoetching working area and controlling exposure time.

Optionally, the lithography machine further comprises an optical plate;

the optical flat plate is used for fixing the photoetching machine shell, a component accommodated by the photoetching machine shell and a component connected with the photoetching machine.

Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages:

the multi-light source lithography machine provided by the embodiment of the disclosure comprises: the device comprises a substrate fixing module, a mask plate fixing module, an image acquisition module and an exposure module; the substrate fixing module, the mask plate fixing module and the exposure module are sequentially arranged along a preset direction, and the image acquisition module is arranged on one side, facing the exposure module, of the mask plate fixing module; wherein: the substrate fixing module is used for placing a substrate to be photoetched; the mask plate fixing module is used for fixing a mask plate; the image acquisition module is used for acquiring images at different preset positions of the mask plate and/or the substrate so as to align the substrate and the mask plate at multiple points; the exposure module comprises a plurality of movable lamp groups with selectable light sources, and is used for moving a target movable lamp group in the plurality of movable lamp groups to a photoetching working area under control so as to carry out alignment exposure on the substrate covered by the mask plate. Different movable lamp groups are light sources corresponding to different exposure sizes and exposure accuracy, so that different target movable lamp groups (namely different light sources) can be controlled to move to a photoetching working area by arranging that an exposure module in the photoetching machine comprises a plurality of movable lamp groups with selectable light sources, exposure of different sizes of a substrate is realized by using the work of the light source with a target wavelength, and the requirement of a target key size is met.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic structural diagram of a multi-light-source lithography machine according to an embodiment of the disclosure;

FIG. 2 is a schematic structural diagram of another multi-light-source lithography machine according to an embodiment of the disclosure;

FIG. 3 is a schematic structural diagram of another multi-light-source lithography machine according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural diagram of another multi-light-source lithography machine according to an embodiment of the present disclosure;

FIG. 5 is a schematic structural diagram of another multi-light-source lithography machine according to an embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram of another multi-light-source lithography machine according to an embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of yet another multi-light-source lithography machine according to an embodiment of the present disclosure;

FIG. 8 is a schematic structural diagram of another multi-light-source lithography machine according to an embodiment of the present disclosure;

fig. 9 is a schematic flow chart of a photolithography method according to an embodiment of the present disclosure.

110, an exposure module; 111. a movable lamp group; 120. a substrate fixing module; 130. a mask plate; 131. a substrate; 140. an image acquisition module; 150. a mask plate fixing module; 160. a display module; 211. a lithography machine housing; 212. a damper block; 213. a controller; 214. An optical flat plate; 112. moving the slide rail; 141. a camera; 142. a microscope; 143. a microscope support structure; 144. an XY axis sliding table; 121. an XYZR axis alignment platform; 122. a sheet suction table; 151. a support bar; 153. a mask plate pressing plate; 154. and a mask plate mounting tray.

Detailed Description

In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced in other ways than those described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.

First, the related art and the existing drawbacks thereof, as well as the solution of the embodiment of the present disclosure proposed for the improvement, will be briefly described.

In the related art, the resolution of a microscope of a lithography machine is not high, and because the light source is single, the light source cannot be adjusted adaptively according to the lithography requirement, that is, the light sources with different working wavelengths cannot be selected as required, so that only a film layer with a specific pattern with single size and precision can be formed on a substrate by using the lithography machine, and further, the requirements of different exposure precision and exposure size cannot be met.

In view of at least one of the above drawbacks, embodiments of the present disclosure provide a multi-light source lithography machine, in which an exposure module includes a plurality of movable lamp sets with selectable light sources, and different target movable lamp sets (i.e., different light sources) can be controlled to move to a lithography working area, so as to implement exposure of different sizes on a substrate by using the work of light sources with target wavelengths, thereby meeting the requirements of target critical sizes.

Further, embodiments of the present disclosure provide a multi-light source lithography machine wherein the substrate holding module may include an xyz z axis alignment stage with a high precision differential head and the image acquisition module may include a 2k high resolution microscope. The high-precision microscope and the XYZR axis alignment platform are mutually matched through controlling the high-resolution microscope and adjusting the high-precision differential head in the XYZR axis alignment platform, so that the overall alignment precision of the photoetching machine reaches 2 mu m, and the alignment precision of the photoetching machine is improved.

In addition, the multi-light source photoetching machine provided by the embodiment of the disclosure mainly focuses on the arrangement of structures related to alignment accuracy, and the material and configuration cost of other components are lower, so that the whole cost of the photoetching machine is lower.

The multi-light source lithography machine provided by the embodiment of the disclosure is exemplarily described below with reference to the drawings.

Exemplarily, fig. 1 is a schematic structural diagram of a multi-light-source lithography machine provided by an embodiment of the present disclosure, and referring to fig. 1, the lithography machine includes: a substrate fixing module 120, a mask fixing module 150, an image obtaining module 140, and an exposure module 110; the substrate fixing module 120, the mask fixing module 150, and the exposure module 110 are sequentially disposed along a predetermined direction (e.g., a direction from bottom to top in fig. 1), and the image obtaining module 140 is disposed on a side of the mask 130 fixing module 150 facing the exposure module 110; wherein: the substrate fixing module 120 is used for placing a substrate 131 to be photoetched; the mask fixing module 150 is used for fixing the mask 130; the image acquisition module 140 is configured to perform image acquisition at different preset positions on the mask 130 and/or the substrate 131, so as to perform multi-point alignment on the substrate 131 and the mask 130; the exposure module 110 includes a plurality of movable lamp sets 111 with selectable light sources, and is used for controlling to move a target movable lamp set in the plurality of movable lamp sets 111 to a working area of lithography so as to perform alignment exposure on a substrate 131 covered by a mask plate 130.

The substrate 131 is a substrate for forming a specific material pattern layer by exposure. Illustratively, the substrate may be a chip on which a portion of the circuit structure has been formed, and is not limited herein.

The substrate 131 is placed on the substrate fixing module 120 and fixed, so that the substrate 131 can be fixed and adjusted in spatial position by the substrate fixing module 120, thereby facilitating alignment exposure.

The mask fixing module 150 can fix the mask 130, and can carry the mask 130 to adjust the spatial position, so as to adjust the spatial position of the mask 130 relative to the substrate 131, thereby achieving alignment of the mask 130 and the substrate 131.

The exposure module 110 includes a plurality of movable lamp sets 111, each movable lamp set 111 is used as a light source of one wavelength or wavelength range, and the exposure light source is selected by selecting a target movable lamp set in the movable lamp set 111. Thus, by moving the target movable lamp set in the exposure module 110 to the working area of the photolithography, the alignment exposure of the substrate 131 covered by the mask plate 130 can be performed using the selected light source.

Specifically, the image acquisition module 140 acquires images at different preset positions of the mask plate 130 and/or the substrate 131, so that the mask plate 130 and the substrate 131 can be adjusted in relative spatial positions, and the two can be aligned in multiple points, thereby facilitating accurate alignment. Further, after the mask plate 130 is aligned with the substrate 131, the exposure module 110 moves the target light source to a working area of the photolithography by moving the movable lamp group 111, thereby exposing the substrate 131 covered by the mask plate 130 in combination.

It should be noted that fig. 1 only exemplarily shows that the substrate 131 is located above the substrate fixing module 120, and the mask plate 130 is located above the mask plate fixing module 150, but does not constitute a limitation of the lithography machine provided by the embodiment of the present disclosure. In other embodiments, the substrate 131 may be sunk into the substrate fixing module 120, and the mask 130 may be located in or under the mask fixing module 150, or may be located in a spatial position known to those skilled in the art, which is not limited herein.

In addition, it should be noted that fig. 1 only exemplarily shows that the image acquisition module 140 performs image acquisition from above the mask 130 and the substrate 131 to achieve multi-point alignment, and does not constitute a limitation on the lithography machine provided by the embodiment of the present disclosure. In other embodiments, the image acquisition module 140 may also perform image acquisition from the lower, side or other directions to achieve multi-point alignment between the mask 130 and the substrate 131, which is not limited herein.

In other embodiments, it is ensured that the substrate fixing module 120, the mask fixing module 150, and the exposure module 110 are sequentially disposed, and the image acquisition module 140 may perform image acquisition of different preset positions on the mask 130 and/or the substrate 131 for alignment.

The multi-light-source lithography machine provided by the embodiment of the disclosure sequentially sets the substrate fixing module 120, the mask plate fixing module 150 and the exposure module 110 along the preset direction, and the image acquisition module 140 is arranged on one side of the mask plate fixing module 150 facing the exposure module 110, so that the image acquisition module 140 can be used for acquiring images at different preset positions on the mask plate 130 and/or the substrate 131, and the multi-point alignment of the substrate 131 and the mask plate 130 during lithography is favorably realized, thereby realizing accurate alignment. Meanwhile, a plurality of different movable lamp sets 111 corresponding to different exposure sizes and exposure accuracies are arranged in the exposure module 110, and different target movable lamp sets (i.e. light sources with different operating wavelengths) are controlled to move to the working area of the lithography, so that exposure of different sizes is performed on the substrate 131 by using the work of the light sources with the target wavelengths, thereby meeting the requirements of target critical sizes and widening the functions and the application range of the lithography machine.

In some embodiments, fig. 2 is a schematic structural diagram of another multi-light-source lithography machine provided in the embodiments of the present disclosure. On the basis of fig. 1, referring to fig. 2, the lithography machine may further include: the lithography machine housing 211 and the damper 212; the lithography machine housing 211 accommodates at least the substrate fixing module 120, the mask plate fixing module 150, the image acquisition module 140 and the exposure module 110 in the lithography machine, and the damping block 212 is fixedly connected to one side of the lithography machine housing 211; the photo-etching machine housing 211 is used for protecting the contained components, preventing dust and blocking light from leaking outwards, and the shock absorption block 212 is used for stabilizing the photo-etching machine housing 211 and the components contained in the photo-etching machine housing 211.

The photo-etching machine housing 211 is a protection structure, and can protect the components disposed therein, and has the functions of preventing dust and blocking light from leaking outwards. Illustratively, referring to FIG. 2, the three-dimensional shape of the lithography housing 211 can be square; in other embodiments, the lithography machine housing 211 can be provided in other structural forms, which are not described or limited herein.

Wherein, the photoetching machine shell 211 is used as a boundary, and the internal structure can be distinguished from the external structure; specifically, the substrate fixing module 120, the mask fixing module 150, the image obtaining module 140, and the exposure module 110 are all internal structures, and the damping block 212 is an external structure.

Furthermore, the damping block 212 is disposed outside the lithography machine housing 211, so as to achieve a damping effect, thereby improving stability of the lithography machine housing 211 and improving stability of the overall structure of the lithography machine.

For example, taking the photolithography machine housing 211 as a square structure, the damping blocks 212 may be four rubber blocks connected and fixed to the bottom of the photolithography machine housing 211, and by setting each of the rubber blocks to be located at four corners of the photolithography machine housing 211, the rubber blocks can be used to correspondingly support the four corners of the bottom of the photolithography machine housing 211, thereby ensuring stability of components contained in the photolithography machine housing 211.

In other embodiments, according to the structural form of the lithography machine housing 211 and the bottom shape thereof, the number of the shock absorbing blocks 212 may be set to other numbers, so as to ensure the overall stability of the lithography machine to meet the corresponding lithography requirements, which is not limited herein.

In addition, the material of the damping block 212 is exemplified by rubber, but in other embodiments, other materials known to those skilled in the art may be used for the damping block 212, and the requirement of the overall stability of the lithography machine may be satisfied, which is not limited herein.

In some embodiments, fig. 3 is a schematic structural diagram of another multi-light-source lithography machine provided in the embodiments of the present disclosure. On the basis of fig. 1 and 2, referring to fig. 3, in the lithography machine, the exposure module 110 further includes a movable slide rail 112; the movable slide rail 112 is fixed at one end of the inner side of the photoetching machine shell 211, and the plurality of movable lamp groups 111 are respectively connected with the movable slide rail 112 in a sliding manner; wherein, in the plurality of movable lamp sets 111, each movable lamp set 111 corresponds to an operating wavelength, and the exposure module 110 is controlled to move the movable lamp set 111 with the target operating wavelength along the movable slide rail 112 to the working area of the lithography.

The movable slide rail 112 is disposed inside the lithography machine housing 211, and is connected to at least one end of the inside of the lithography machine housing 211, for example, the movable slide rail can be fixed only by one end, or can be fixed by two ends, which is not limited herein. Further, the plurality of movable lamp sets 111 in the exposure module 110 are respectively slidably connected to the movable slide rails 112, specifically, each movable lamp set 111 can slide along the extending direction of the movable slide rail 112, and by controlling the target movable lamp set in the movable lamp set 111 to move on the movable slide rail 112 along the extending direction of the movable slide rail 112 to the working area of the lithography, the corresponding movable lamp set 111 can be selected for exposure according to the wavelength required by the lithography. For example, the movable slide 112 can be fixed inside the lithography machine housing 211 by mechanical fixing, adhesive fixing, and the like, which are not described or limited herein.

In the embodiment of the present disclosure, the movable lamp set with the selected target operating wavelength in the exposure module 110 may be an ultraviolet lamp light source with a specific wavelength. Illustratively, the center wavelengths of the ultraviolet light source may include: visible light g line with the wavelength of 436nm, ultraviolet light i line with the wavelength of 365nm, deep ultraviolet light with the wavelength of 254nm, 248nm, 193nm or 157nm, extreme ultraviolet light with the wavelength range of 10nm-15nm and ultraviolet light with other wavelengths.

The number of the movable lamp sets 111 in the exposure module 110 is one, two, three, or more, and the movable lamp sets correspond to different operating wavelengths, and may be set based on the requirements of the lithography machine, which is not limited herein.

Therefore, by controlling the movable lamp set 111 to move on the movable slide rail 112, the movable lamp set 111 selected based on the target operating wavelength required for exposure, that is, the selected target movable lamp set, can be moved to the working area of the lithography, so as to realize exposure based on the target movable lamp set.

In some embodiments, with continued reference to fig. 1-3, the substrate holding module 120 includes an xyz shaft alignment stage 121, a suction stage 122, and a vacuum pump (not shown); the suction piece table 122 is fixedly connected with a displacement table of the XYZR axis alignment platform 121 and moves along with the displacement table; the sheet suction stage 122 is also connected to a vacuum pump for fixing the substrate 131 by vacuum suction; the XYZR axis alignment stage 121 controls the displacement stage to move along the XYZR axis based on a differential head of a preset precision to align the substrate 131 with the mask plate 130; and controlling the displacement table to move along the Z-axis to adjust the distance between the substrate 131 and the mask plate 130.

The suction stage 122 is a stage for vacuum-sucking the substrate 131 by a vacuum pump. Illustratively, the sheet suction table 122 is a sheet suction table 122 with sheet suction holes, three or more sets of sheet suction holes are arranged on the sheet suction table 122, the number of the sets of sheet suction holes can be set according to the size of the substrate 131, when the substrate 131 is smaller in size, the number of the sets of sheet suction holes is relatively smaller, and when the substrate 131 is larger in size, the number of the sets of sheet suction holes is relatively larger, so as to realize firm adsorption and fixation of the substrate 131. Meanwhile, the suction pad hole is connected to a vacuum pump and controlled by a corresponding switch, so that after the substrate is placed on the suction pad 122, the vacuum pump is turned on and the substrate 131 is fixed by vacuum suction.

Illustratively, the suction table 122 is provided with a plurality of sets of suction holes to accommodate substrates 131 of different sizes; specifically, the size of the substrate 131 may be 1 inch, 2 inches, 4 inches, and other sizes, and the number and position of sets of suction holes may be selected according to the size of the substrate 131 to stably fix the substrate 131 using the suction sheet table 122.

It can be understood that, in the embodiment of the present disclosure, the suction stage 122 is in communication with a vacuum pump to fix the substrate 131 by the action of vacuum suction; in other embodiments, the substrate 131 may be fixed by other methods known to those skilled in the art according to the requirements of the lithography machine, which are not described or limited herein.

The displacement table of the XYZR axis alignment platform 121 is fixedly connected to the sheet suction table 122, and can drive the sheet suction table 122 and the substrate 131 disposed thereon to move, so as to control the spatial relative position of the substrate 131 with respect to the mask plate 130, and achieve multi-point alignment.

Illustratively, in a three-dimensional space, a spatial rectangular coordinate system is defined by three directions which are perpendicular to each other in pairs, such as an X axis, a Y axis and a Z axis; wherein, X axle and Y axle are all in the horizontal plane, and the Z axle is the vertical direction of being perpendicular to this horizontal plane. The XYZR axis alignment platform 121 is translatable along the X axis, translatable along the Y axis, translatable along the Z axis, and rotatable about the R axis in either horizontal direction. Therefore, based on the xyz-axis alignment platform 121, the displacement table is controlled by combining a differential head with preset precision to drive the suction table 122 and the substrate 131 adsorbed by the suction table to move along the xyz-axis, so as to achieve alignment between the substrate 131 and the mask plate 130, and the displacement table is controlled to move along the Z-axis, so as to adjust the distance between the mask plate 130 and the substrate 131, and meet the requirements of exposure alignment precision and exposure distance. In addition, after the exposure is finished, the Z axis may also be rotated to make the suction table away from the mask plate 130 along the Z axis even if the substrate 131 and the mask plate 130 are away from each other to take out the mask plate 130, and thereafter the XY axis may be rotated to move out the substrate 131.

In the embodiment of the present disclosure, the substrate 131 and the mask plate 130 are controlled to achieve multi-point alignment, that is, the substrate 131 and the mask plate 130 are observed through the microscope 142 and the camera 141 in the image acquisition module, and the spatial relative position relationship between the substrate 131 and the mask plate 130 is adjusted according to the requirement of photolithography, so as to achieve multi-point alignment. Among them, in the case of multi-point alignment to be achieved, on the premise that the accuracy requirement is very high, since it is far from sufficient to perform alignment with only two points, it is possible to perform alignment between the substrate 131 and the mask plate 130 using three points or four points.

Illustratively, one plane may be determined based on three points, and alignment verification is performed through the fourth point, thereby better achieving precise alignment between the substrate 131 and the mask plate 130. Illustratively, taking the example of performing multi-point alignment based on four points, the first point is used to roughly determine the position of the mask plate 130, i.e., one point is used to achieve coarse alignment of the mask plate 130 with the substrate 131; then, selecting a point on any two sides adjacent to the first point as a second point and a third point, thereby realizing the alignment of the substrate 131 and the mask 130 on two adjacent sides (such as horizontal transverse direction and longitudinal direction); finally, a point in the diagonal direction corresponding to the first point is selected as a fourth point to check whether there is a complete alignment between the substrate 131 and the mask 130, which is equivalent to performing a verification process using the fourth point.

Further, after the multi-point alignment is performed, by adjusting the distance between the substrate 131 and the mask plate 130 on the Z-axis, the close contact of the two at a preset distance is achieved. Wherein, the distance between the substrate 131 and the mask plate 130 is realized by manually adjusting the XYZR axis aligning platform 121; specifically, the displacement stage of the xyz axis alignment stage 121 may be automatically or manually controlled to move along the Z axis to adjust the substrate 131 upward relative to the mask plate 130, and the substrate 131 and the mask plate 130 may be in contact with each other in a state of ensuring that they are parallel to each other (e.g., horizontally parallel to each other), the substrate 131 is adjusted upward all the time during the contact, and after a color interference fringe appears in the image acquired by the image acquisition module 140, the Z axis of the xyz axis alignment stage 121 is adjusted to adjust the substrate downward. At this time, a blurred image appears in the field of view of the microscope 142, and it is confirmed that the substrate 131 and the mask plate 130 are in close contact at a predetermined distance. Thus, the relative positional relationship of the substrate 131 and the mask plate 130 in the vertical direction is determined by observing phenomena in different images using the microscope 142 so that they are parallel and in close contact with each other. Further, it is advantageous to increase the overall uniformity of the lithographic exposure.

The differential head with preset precision in the XYZR axis alignment platform 121 is a high-precision moving device for controlling the displacement table to move precisely along the XYRZ axis. Illustratively, the alignment precision of the differential head in the XYZR axis alignment platform 121 is 2 μm, the moving precision of the differential head of the used X axis, Y axis, Z axis and R axis is higher, and the minimum moving precision can reach 2 μm, and because it has high moving precision, the displacement platform can drive the substrate 131 to move precisely by adjusting the high precision differential head, which is beneficial to realize precise multi-point alignment and close contact between the substrate 131 and the mask plate 130 at a preset distance, and further increase the overall uniformity of the lithography exposure.

In some embodiments, with continued reference to fig. 1-3, mask holding module 150 includes a support rod 151, a mask mounting seat (not shown), a mask pressing plate 153, and a mask mounting tray 154; one end of the supporting rod 151 is fixedly connected to the substrate fixing module 150, the other end of the supporting rod 151 is provided with a mask plate mounting seat, a mask plate mounting tray 154 is inserted into the mask plate mounting seat and used for placing a mask plate 130, and a mask plate pressing plate 153 is located on one side, away from the supporting rod 151, of the mask plate mounting seat and is arranged on at least two sides of the mask plate mounting seat and used for fixing the mask plate 130.

The mask fixing module 150 is a module for placing the mask 130; the mask fixing module 150 is located between the substrate fixing module 120 and the exposure module 110 to combine with the target light source in the exposure module 130 to realize mask exposure of the substrate 131 placed on the substrate fixing module 120. Illustratively, the bottom of the mask fixing module 150 is provided with a bottom plate and is fixedly connected to the bottom plate by four support rods 151, and a mask mounting seat is connected to the upper side of the four support rods 151 and is used for supporting the mask pressing plate 153 and the mask mounting tray 154. The mask An Tuopan is fixed to the mask mounting base in an inserting manner, the mask 130 is placed on the mask mounting tray 154, and meanwhile, the mask 130 is fixed by the mask pressing plates 153 on two sides of the mask mounting base, so that stability of the mask 130 is ensured.

For example, the mask pressing plates 153 on both sides of the mask mounting seat may further have two compression nuts to fix the mask 130. In other embodiments, other numbers of compression nuts or other structures known to those skilled in the art may be provided to fix the mask plate 130, which is not limited herein.

Illustratively, the mask An Tuopan can be removed from the mask mount and the mask 130 can be further removed after the substrate 131 is moved away from the mask 130 after the end of the photolithography.

Taking the structure shown in fig. 3 as an example, since the bottom of the mask fixing module 150 is provided with a quadrilateral bottom plate, the number of the support rods 151 is correspondingly four, so as to support four vertex angles at the bottom, thereby improving the stability of the overall structure of the mask fixing module 150. Correspondingly, when other structural forms are adopted, the number of the supporting rods 151 can also be other numbers, and can be set based on the specific shape of the bottom of the mask fixing module 150 and the overall requirement of the lithography machine, which is not limited herein.

In some embodiments, with continued reference to fig. 1-3, the image acquisition module 140 includes a microscope 142, a microscope support structure 143, a camera 141, and an XY axis slide 144; the microscope 142 is fixed on the XY axis sliding table 144 through the microscope supporting structure 143, and the camera 141 is fixed on the image side of the microscope 142; the XY axis sliding table 144 is configured to drive the microscope 142 to move, so as to observe different positions of the mask plate 130, and the camera 141 is configured to obtain an image observed at a corresponding position.

The microscope supporting structure 143 is a structure for supporting the microscope 142, and exemplarily, the microscope supporting structure 143 may include a microscope supporting fixing frame and a microscope supporting rod, the microscope supporting fixing frame is fixed on the XY axis sliding table 144 through the microscope supporting rod, and the position adjustment on the Z axis may be implemented. It should be noted that the microscope 142 is located above the substrate fixing module 120 and the mask fixing module 150, and is fixed on the slide table 144 of an XY axis through the microscope support fixing frame and the microscope support rod, so as to adjust the spatial position of the microscope 142 relative to the mask 130 and the substrate 131, and observe the images corresponding to the mask 130 and the substrate 131.

Wherein, a focusing knob (not shown in the figure) with 360 degrees in the direction of Q can be arranged on the microscope supporting and fixing frame to realize the focusing of the microscope. From the microscope as a whole, the resolution of the microscope can reach 2k, and compared with the microscope in the prior art, the resolution is higher, so that images corresponding to different relative positions of the mask plate 130 and the substrate 131 can be clearly obtained, the relative positions of the mask plate 130 and the substrate 131 can be accurately judged, and the accurate alignment of the two can be further realized. In other embodiments, the microscope may also be focused by using other structures or manners, which are not described or limited herein.

The XY axis sliding table 144 is a platform for driving the microscope 142 to move. Illustratively, the XY axis slide 144 is fixed to the bottom of the lithography housing 211, which can be, for example, an optical plate 214; the camera 141 and the microscope 142 are fixed on the XY-axis slide table by a microscope support structure 143 to realize spatial position adjustment in the X-axis and Y-axis directions.

For example, referring to fig. 2 and 3, since the microscope 142 is adjustable in position and can move up and down during focusing, the microscope 142 can be spaced from the mask 130 and the substrate 131 to observe the relative spatial relationship therebetween. As can be seen from comparison between fig. 2 and fig. 3, fig. 2 and fig. 3 respectively show two different spatial relative positional relationships between the microscope 142 and the mask 130 and the substrate 131, specifically, with reference to the position of the mask 130 or the substrate 131, the microscope 142 in fig. 3 is located at an upper position, i.e., a position farther away from it; whereas the microscope 142 in fig. 2 is positioned lower, i.e. closer to it.

In the lithography machine provided by the embodiment of the disclosure, in a three-dimensional space, a spatial rectangular coordinate system is defined by two three directions which are perpendicular to each other, for example, an X axis, a Y axis and a Z axis, wherein the X axis and the Y axis are both in a horizontal plane, and the Z axis is a vertical direction perpendicular to the horizontal plane. Based on this, the XY-axis sliding table 144 can translate along the X-axis and the Y-axis to drive the microscope 142 and the camera 141 to translate along the X-axis and the Y-axis, that is, to adjust the positions of the microscope 142 and the camera 141, so as to facilitate observation of different positions of the mask plate 130 and the substrate 131, and further achieve multi-point alignment between the substrate 131 and the mask plate 130.

In other embodiments, the position of the microscope 142 and the camera 141 may be adjusted by using a multi-degree-of-freedom displacement stage or other structural forms, which are not described or limited herein.

Here, the camera 141 can acquire an image observed on the image side of the microscope 142, and the camera 141 may be fixed to a housing of the microscope 142. Illustratively, the camera 141 may be a CCD camera. In the embodiment of the present disclosure, the upper end of the microscope 142 is connected to a high-definition industrial CCD camera, and the high-definition CCD camera is connected to a display 160 (described in detail later), so that the display 160 is used to present the acquired image for observation.

In other embodiments, the camera 141 may also be another type of camera known to those skilled in the art, or may employ another device for acquiring a viewing image known to those skilled in the art, which is not limited herein.

It can be understood that, aiming at the disadvantage of poor alignment accuracy between the mask plate 130 and the substrate 131 in the related art, in the lithography machine provided in the embodiment of the present disclosure, by controlling the microscope 142 and adjusting the differential head with preset accuracy in the xyz axis alignment platform 121, and by utilizing the mutual cooperation of the two, the resolution of the microscope 142 is improved and the xyz axis alignment platform 121 is controlled to move accurately, so that the alignment accuracy reaches a value of 2 μm, that is, the alignment accuracy is improved, and the lithography critical dimension is conveniently improved.

In some embodiments, the lithography machine further comprises an illumination lamp (not shown); the illuminating lamp is arranged in the microscope and used for controlled microscopic illumination.

The illuminating lamp is a device for illuminating the microscope, and exemplarily, the illuminating lamp may be a yellow light LED lamp, and in other embodiments, the illuminating lamp may also be of other colors or of other pattern structures, and only the microscope needs to be illuminated, which is not limited herein.

In some embodiments, fig. 4 is a schematic structural diagram of another multi-light-source lithography machine provided in the embodiments of the present disclosure. On the basis of fig. 3, referring to fig. 2 and 4, the lithography machine further includes a display module 160, a receiving groove (not shown), and a support bracket (shown in the form of a hinge); the accommodating groove is formed by sinking the photoetching machine shell 211, and the display module 160 is rotatably connected to the photoetching machine shell 211 by a supporting bracket; the accommodating groove is used for accommodating the display module 160 when the display module 160 rotates to the reference position; the display module 160 is also in communication with the image acquisition module 140, and is configured to display the image acquired by the image acquisition module.

The display module 160 is a module for displaying an image observed by the microscope 142; the display module 160 may be any size and type of display screen that can be set according to the display effect required by the photolithography, and is not limited herein.

The connection between the display module 160 and the image acquisition module 140 is a communication connection, and for example, a corresponding connection relationship may be established through an electrical connection line, or a connection relationship may be established through a wireless communication, which is not limited herein.

The accommodating groove may be a groove disposed on one side of the photolithography machine housing 211, and correspondingly, the supporting bracket is disposed on one side of the groove of the photolithography machine housing 211, the display module 160 is rotatably connected to the photolithography machine housing 211 via the supporting bracket, and when the display module 160 horizontally rotates around the supporting bracket to a reference position, that is, a position just capable of accommodating the display module 160 (see fig. 4), the display state of the display module 160 is finished; the display may be automatically displayed or controlled to begin displaying when the display module 160 is rotated about the support bracket to the deployed position (see fig. 2). So set up, can be convenient for carry out more audio-visual demonstration to the photoetching process, be favorable to promoting the observation effect, and be convenient for the holistic storage of photoetching machine and place.

In some embodiments, with continued reference to FIG. 4, the lithography machine further includes a controller 213; the controller 213 is fixedly connected to the lithography housing 211; the controller 213 is configured to control at least one of the determination of the target movable lamp set, the movement of the target movable lamp set to the working area of the lithography, and the control of the exposure duration.

The controller 213 may control the movable lamp set 111 to move along the movable slide rail 112 above, select a work of one of the movable lamp sets 111, control an exposure duration of the selected movable lamp set 111, control a switch of a vacuum pump connected to the stage 122, and control a switch of an illumination lamp in the microscope 142.

In some embodiments, with continued reference to fig. 1-3, the lithography machine further includes an optical flat 214; the optical flat 214 is used to fix the lithography machine housing 211, the components accommodated by the lithography machine housing 211, and the components connected to the lithography machine.

Illustratively, the optical plate 214 is a holding structure having a three-dimensional shape of a quadrilateral; in other embodiments, the optical flat 214 may have other shapes to meet the requirements of the corresponding lithography machine, and is not limited herein.

It should be noted that the substrate fixing module 120, the mask fixing module 150, and the image obtaining module 140 are all disposed on corresponding supporting structures such as the optical flat plate 214, and the relative position relationship between the substrate and the mask fixing module is adjusted on the basis of the supporting structures, so as to ensure the stability of the overall structure of the lithography machine.

Exemplarily, fig. 5 is a schematic structural diagram of another multi-light-source lithography machine provided by the embodiment of the present disclosure, which shows a front view of the multi-light-source lithography machine. Exemplarily, fig. 6 is a schematic structural diagram of another multi-light-source lithography machine provided in an embodiment of the present disclosure, and illustrates a top view of the multi-light-source lithography machine. Exemplarily, fig. 7 is a schematic structural diagram of another multi-light-source lithography machine provided in an embodiment of the present disclosure, which shows a side view of the multi-light-source lithography machine. Exemplarily, fig. 8 is a schematic structural diagram of another multi-light-source lithography machine provided in an embodiment of the present disclosure, which shows an oblique view of the multi-light-source lithography machine. Fig. 5-8 show the structure of the lithography machine at various viewing angles, respectively, in order to understand the structure of the lithography machine.

According to the multi-light-source photoetching machine provided by the embodiment of the disclosure, the substrate fixing module, the mask plate fixing module and the exposure module are sequentially arranged along the preset direction, and the image acquisition module is arranged on one side of the mask plate fixing module, which faces the exposure module, so that the image acquisition module can be used for acquiring images of different preset positions on the mask plate and/or the substrate, and the multi-point alignment of the substrate and the mask plate is favorably realized; meanwhile, different movable lamp groups corresponding to different exposure sizes and exposure accuracy are arranged in the exposure module, and different target movable lamp groups (namely light sources with different working wavelengths) are controlled to move to a photoetching working area, so that exposure with different sizes is carried out on a substrate by using the work of the light sources with the target wavelengths, and the requirement of target key sizes is met, and the function and the application range of the photoetching machine are expanded.

On the basis of the above embodiment, the embodiment of the present disclosure further provides a multi-light-source lithography machine lithography method, which can be implemented by applying any one of the multi-light-source lithography machines provided in the above embodiments, and has corresponding beneficial effects.

In some embodiments, fig. 9 is a schematic flow chart of a multi-light-source lithography machine lithography method according to an embodiment of the present disclosure. Referring to fig. 9, the method includes the steps of:

and S31, fixing the substrate to be photoetched based on the substrate fixing module.

In conjunction with the above, the substrate fixing module exemplarily performs vacuum suction on the substrate 131 by combining the suction stage 122 with a vacuum pump, thereby fixing the substrate 131.

And S32, fixing the mask plate based on the mask plate fixing module.

In conjunction with the above, the mask plate 130 is fixed by the mask plate pressing plates 153 at both sides of the mask plate mounting seat in the mask plate fixing module, for example.

And S33, carrying out multi-point alignment on the substrate and the mask plate at least based on the image acquisition module, and controlling the distance between the substrate and the mask plate to be a preset distance.

In combination with the above, for example, image acquisition at different preset positions is performed on the mask plate 130 and the substrate 131 according to the image acquisition module, adjustment of the spatial relative position is performed on the mask plate 130 and the substrate 131, after the substrate 131 and the mask plate 130 are observed under a microscope to be aligned, the substrate 131 is adjusted to be aligned with the Z axis in the xyz axis alignment platform, so that the displacement platform moves in the Z axis direction, and the mask plate is in close contact with the substrate, which is not described herein again.

And S34, controlling and selecting a target movable lamp group based on the exposure module, and moving the target movable lamp group to a photoetching working area so as to carry out alignment exposure on the substrate covered by the mask plate.

In combination with the above, as an example, the exposure module may select the light source with the target operating wavelength under the control of the controller, and specifically may include: and adjusting the wavelength parameter in the controller, selecting a movable lamp group with a proper working wavelength by the controller according to the wavelength parameter required by photoetching, moving the movable lamp group to a photoetching working area for working, and controlling the exposure time of the selected movable lamp group.

The smaller the wavelength of the selected target movable lamp group is, the sharper the blade is correspondingly, the finer the size or the finer lines can be engraved on the substrate, and the finer the engraving is, the higher the precision is.

According to the multi-light-source photoetching method of the photoetching machine, the mask plate and the substrate are observed at the relative spatial positions based on the image acquisition module, the distance between the substrate and the mask plate under close contact is adjusted by utilizing different phenomena observed by a microscope, and the overall uniformity of exposure is improved. And the substrate and the mask plate are controlled to carry out multi-point alignment, so that the substrate and the mask plate are accurately aligned, and a better photoetching effect is favorably obtained. Meanwhile, a light source with a proper working wavelength is selected from a movable lamp group of the exposure module, and the exposure of different sizes of the substrate is realized by utilizing the work of the light source with the target wavelength, so that the requirement of the target key size is met, and the function and the application range of the photoetching machine are widened.

In some embodiments, in combination with the above, the substrate holding module comprises an xyz axis alignment stage and a displacement stage; carrying out multi-point alignment on the substrate and the mask plate, comprising the following steps: the XYZR axis alignment platform controls the displacement platform to move along the XYR axis based on a differential head with preset precision so as to align the substrate with the mask plate; the distance between control basement and the mask plate is preset distance, includes: the XYZR axis alignment platform controls the displacement platform to move along the Z axis based on a differential head with preset precision so as to adjust the distance between the substrate and the mask plate.

The XYZR axis alignment platform controls the displacement platform to move along a preset direction, namely the XYZR axis direction, based on a differential head with preset precision, and then drives a substrate on the displacement platform to move synchronously. It should be noted that the embodiment of the present disclosure uses a high-precision differential head to control the movement of the displacement stage, so as to perform multi-point alignment between the substrate and the mask plate and achieve a predetermined distance therebetween. In conjunction with the above, the process of performing multi-point alignment and forming the predetermined distance between the substrate and the mask is not repeated herein.

In some embodiments, the lithography machine further comprises a display module; based on at least the image acquisition module, carrying out multi-point alignment on the substrate and the mask plate, and the method comprises the following steps: observing different positions of the mask plate relative to the substrate based on the image acquisition module to acquire corresponding images; an image is displayed based on the display module to align the substrate and the mask plate at a corresponding plurality of different positions.

The alignment platform in the XYR axis direction is manually adjusted to control the displacement platform to move so as to drive the substrate to move relative to the mask plate, so that the substrate is aligned with the mask plate, the alignment of the substrate and the mask plate is observed under a microscope, and the alignment platform in the Z axis direction is manually adjusted after alignment so that the mask plate and the substrate are in close contact, even if the preset distance is met between the mask plate and the substrate.

It should be noted that, the alignment of the substrate and the mask plate at a plurality of different positions is visually displayed through the display module, so as to facilitate the viewing of the operator.

For example, referring to fig. 2 and 4, fig. 2 illustrates that the display module 160 rotates around the support bracket to achieve the unfolded state, in which an image can be displayed based on the display module 160, and it is convenient for a worker to align the substrate and the mask plate at a corresponding plurality of different positions. Fig. 4 shows a state in which the display module 160 is accommodated in the accommodating groove when the operator finishes viewing, and the image acquired by the image acquisition module is not displayed.

In some embodiments, the lithography machine further comprises a controller, the exposure module further comprises a moving slide; moving a target movable lamp group to a working area of lithography, comprising: and controlling the target movable lamp group to move to a photoetching working area along the movable sliding rail based on the controller.

The required light source is selected on the controller, the manual adjustment controller moves the required target movable lamp set to the exposure area through the movable slide rail for exposure, it should be noted that the process that the target movable lamp set moves through the movable slide rail is realized through the manual adjustment controller, in other embodiments, a suitable light source can be selected from the plurality of light sources in an automatic control or other terminal control mode, and the method is not limited herein.

In some embodiments, further comprising: based on the controller, the control determines the target movable lamp group and/or controls the exposure time length.

The controller can select a target movable lamp group with a proper working wavelength and control exposure of the target movable lamp group, and the length of the exposure time is set through the controller. For example, a timer may count down to set the exposure time in advance, and the target movable lamp set may be automatically turned off after the timer is ended.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

The foregoing are merely exemplary embodiments of the present disclosure, which enable those skilled in the art to understand or practice the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A multi-light-source lithography machine, comprising: the device comprises a substrate fixing module, a mask plate fixing module, an image acquisition module and an exposure module;

the substrate fixing module, the mask plate fixing module and the exposure module are sequentially arranged along a preset direction, and the image acquisition module is arranged on one side, facing the exposure module, of the mask plate fixing module;

wherein: the substrate fixing module is used for placing a substrate to be photoetched; the mask plate fixing module is used for fixing a mask plate; the image acquisition module is used for acquiring images at different preset positions of the mask plate and/or the substrate so as to perform multi-point alignment on the substrate and the mask plate; the exposure module comprises a plurality of movable lamp groups with selectable light sources, and is used for moving a target movable lamp group in the movable lamp groups to a photoetching working area under control so as to carry out alignment exposure on the substrate covered by a mask plate.

2. The lithography machine according to claim 1, further comprising: a lithography machine housing and a damper block;

the photoetching machine shell is used for accommodating at least the substrate fixing module, the mask plate fixing module, the image acquisition module and the exposure module in the photoetching machine, and the damping block is fixedly connected to one side of the photoetching machine shell;

the photoetching machine shell is used for protecting the contained components, preventing dust and blocking light from leaking outwards, and the shock absorption block is used for stabilizing the photoetching machine shell and the components contained in the photoetching machine shell.

3. The lithography machine according to claim 2, wherein said exposure module further comprises a moving slide;

the movable slide rail is fixed at one end of the inner side of the photoetching machine shell, and the plurality of movable lamp groups are respectively connected with the movable slide rail in a sliding manner;

and the exposure module is controlled to move the movable lamp group with the target working wavelength to a photoetching working area along the movable sliding rail.

4. The lithographic apparatus according to any one of claims 1 to 3, wherein the substrate holding module comprises an XYZR axis alignment stage, a suction stage, and a vacuum pump;

the film suction table is fixedly connected with a displacement table of the XYZR axis alignment platform and moves along with the displacement table; the sheet suction table is also connected with the vacuum pump and used for fixing the substrate through vacuum adsorption;

the XYZR axis alignment platform controls the displacement platform to move along an XYR axis based on a differential head with preset precision so as to align the substrate with the mask plate; and controlling the displacement table to move along the Z axis so as to adjust the distance between the substrate and the mask plate.

5. The lithography machine according to any one of claims 1 to 3, wherein the mask fixing module comprises a support rod, a mask mounting seat, a mask pressing plate and a mask mounting tray;

the one end fixed connection of bracing piece to basement fixed module, the other end installation of bracing piece the mask plate mount pad, mask plate installation tray inserts the mask plate mount pad for place the mask plate, the mask plate clamp plate is located the mask plate mount pad and keeps away from one side of bracing piece, and set up in the at least both sides side of mask plate mount pad for fixed mask plate.

6. The lithography machine according to any one of claims 1 to 3, wherein the image acquisition module comprises a microscope, a microscope support structure, a camera, and an XY axis slide;

the microscope is fixed on the XY axis sliding table through the microscope supporting structure, and the camera is fixed on one side of an image space of the microscope;

the XY axis sliding table is used for driving the microscope to move so as to observe different positions of the mask plate, and the camera is used for acquiring images observed at corresponding positions.

7. The lithography machine of claim 6, further comprising an illumination lamp;

the illuminating lamp is arranged in the microscope and used for controlled microscopic illumination.

8. The lithography machine according to claim 2 or 3, further comprising a display module, a receiving slot and a support bracket;

the accommodating groove is formed by inwards sinking of the photoetching machine shell, and the display module is rotatably connected to the photoetching machine shell through the supporting bracket;

the accommodating groove is used for accommodating the display module when the display module rotates to the reference position;

the display module is also in communication connection with the image acquisition module and is used for displaying the image acquired by the image acquisition module.

9. The lithography machine according to claim 2 or 3, further comprising a controller; the controller is fixedly connected to the photoetching machine shell;

the controller is used for controlling at least one of determining the target movable lamp group, controlling the target movable lamp group to move to a photoetching working area and controlling exposure time.

10. A lithography machine according to any one of claims 1 to 3, further comprising an optical plate;

the optical flat plate is used for fixing the photoetching machine shell, a component accommodated by the photoetching machine shell and a component connected with the photoetching machine.

Images