CN218725549U - Novel pure steam sampling device and equipment - Google Patents

Abstract

The embodiment of the application provides a novel pure steam sampling device and equipment, and relates to the field of detection equipment. Novel pure steam sampling device is provided with semiconductor refrigeration module including being used for letting in the condenser pipe of pure steam, the periphery parcel of condenser pipe, and semiconductor refrigeration module's periphery still is provided with radiator fan. Novel pure steam sampling equipment includes casing, power and foretell novel pure steam sampling device, and novel pure steam sampling device, power are installed respectively in the casing, and the power is connected with semiconductor refrigeration module electricity, and the both ends of condenser pipe extend to outside the casing respectively. Novel pure steam sampling device and equipment need not the cooling water, utilize the electric energy to make steam cooling condensation, and whole size is less, and it is convenient to use.

Description

Novel pure steam sampling device and equipment

Technical Field

The application relates to the field of detection equipment, particularly, relates to a novel pure steam sampling device and equipment.

Background

Pure steam sampling is generally to condense steam into liquid, and then collect the liquid to be convenient for it to detect, has extensive demand in trades such as pharmaceutical factory, laboratory, industrial production, especially in pharmaceutical factory, and pure steam sampling is the essential link of quality control process.

The traditional method for realizing pure steam sampling is to provide a set of condenser, for example, a return coil pipe continuously circulating cooling water, and heat exchange is carried out between the cooling water and steam to condense the steam, and the mode needs to reserve a cooling water interface and a cooling water external pipeline in a workshop, so that the operation is very complex. In addition, the water tank for storing cooling water and the condenser are combined into a movable pure steam sampling device, the size is usually large although mobility can be provided, operation in a narrow space is not facilitated, and the cooling water in the water tank needs to be replaced frequently so as to ensure a cooling effect.

Therefore, a pure steam sampling device which has a small volume and can meet the requirement of convenience in use is needed.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a novel pure steam sampling device and equipment, need not the cooling water, utilize the electric energy to make steam cooling condensation, whole size is less, and it is convenient to use.

First aspect, this application embodiment provides a novel pure steam sampling device, and it is including the condenser pipe that is used for letting in pure steam, and the periphery parcel of condenser pipe is provided with semiconductor refrigeration module, and semiconductor refrigeration module's periphery still is provided with radiator fan.

In the implementation process, the semiconductor refrigeration module is electrified to realize heat conduction, so that pure steam wrapped in the condensation pipe is cooled and condensed, and meanwhile, the heat of the semiconductor refrigeration module is dissipated as soon as possible by using the cooling fan, and the normal operation of the semiconductor refrigeration module is ensured. Traditional water-cooling mode has been abandoned to this scheme, need not the cooling water, and the direct electric energy cooling mode of having adopted of innovation has left out structural component such as cold water storage cistern and delivery pump, makes the pure steam sample more convenient.

In one possible implementation, a certain gap is formed between the semiconductor refrigeration module and the heat dissipation fan;

and/or a heat conduction aluminum block is also arranged between the condensation pipe and the semiconductor refrigeration module.

In the implementation process, the arrangement of the gap can enable the cooling fan to form an air channel, so that self-heating generated by the operation of the semiconductor refrigeration module is dissipated as soon as possible.

In a possible implementation manner, two ends of the condensation pipe extend out of the semiconductor refrigeration module, and a pure steam valve and a condensation water valve are respectively arranged at the two ends.

In the implementation process, the pure steam valve and the condensate water valve are opened and closed, so that the pure steam is controlled to be introduced into the condensation pipe, a pure steam condensation space is formed, and condensate generated in the condensation pipe flows out.

In a possible implementation mode, the semiconductor refrigeration module is a cuboid, and the condensation pipe penetrates through the semiconductor refrigeration module along the long edge direction of the semiconductor refrigeration module.

In the implementation process, the cuboid shape ensures that the semiconductor refrigeration module occupies less land and is convenient for integrated design; the condenser pipe link up through semiconductor refrigeration module along long limit direction, make the condenser pipe directly carry out the length of heat-conducting district section by semiconductor refrigeration module and be the biggest to make the pure whole express delivery cooling condensation in the condenser pipe.

In a possible implementation, the number of the condensation pipes is at least two, and all the condensation pipes are arranged side by side.

In the implementation process, by arranging the plurality of condensation pipes, pure integral cooling condensation in different condensation pipes can be simultaneously realized by one set of semiconductor refrigeration module, and different steam sampling requirements are met.

In one possible implementation manner, the number of the heat dissipation fans is two, and the two heat dissipation fans are respectively positioned outside two opposite side surfaces of the semiconductor refrigeration module.

In the implementation process, the cooling fan and the semiconductor refrigeration module are integrated together, so that the occupied space is small.

In a second aspect, the embodiment of the present application provides a novel pure steam sampling device, which comprises a casing, a power supply and a novel pure steam sampling device provided by the first aspect, wherein the novel pure steam sampling device and the power supply are respectively installed in the casing, the power supply is electrically connected with a semiconductor refrigeration module, and two ends of a condenser pipe are respectively extended out of the casing.

In the implementation process, the device has few components, does not need to supplement cooling water, does not have a water tank, does not have a cooling water circulating pump and a pipeline, has small overall size, can be lifted and moved by hands when the 220V maximum power of power supply is less than 1KW, and is a pure steam sampling device which is very suitable for practical use.

In a possible implementation manner, the condensation pipe is horizontally arranged, the two ends of the condensation pipe are respectively communicated with the connection pipes, and the connection pipes all extend out of the shell.

In the implementation process, the condensation pipe is horizontally arranged, so that the overall size of the novel pure steam sampling device can be conveniently controlled.

In one possible implementation, the condensation pipe is vertically arranged, and two ends of the condensation pipe extend out of the shell.

In the implementation process, the condensation pipe is vertically arranged, and condensed water formed by condensation in the condensation pipe can be automatically discharged.

In one possible implementation, both ends of the semiconductor refrigeration module are fixed on the housing through mounting plates.

In the implementation process, the two ends of the semiconductor refrigeration module are fixed on the shell through the mounting disc, so that the novel pure steam sampling device can be stably mounted.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a novel pure vapor sampling device provided in a first embodiment of the present application;

fig. 2 is a schematic structural diagram of a novel pure vapor sampling device according to a second embodiment of the present application.

An icon: 01-a first semiconductor refrigeration sheet; 11-a first cooling fan; 02-a condenser pipe; 03-pure steam valve; 04-heat conducting aluminum block; 05-a second semiconductor refrigerating sheet; 51-a second heat dissipation fan; 06-condensation water valve; 07-a housing; 08-power supply.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

In the description of the present application, it is to be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally laid out when products of the application are used, and are only used for convenience in describing the application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the application.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

First embodiment

Please refer to fig. 1, the novel pure steam sampling device provided by this embodiment includes a condensation pipe 02 for introducing pure steam, a heat conducting aluminum block 04 is wrapped around the condensation pipe 02, a semiconductor refrigeration module is wrapped around the heat conducting aluminum block 04, and a cooling fan is further disposed around the semiconductor refrigeration module.

In this embodiment, semiconductor refrigeration module is the cuboid, and the quantity of condenser pipe 02 is 8, arranges into 2 rows altogether, 4 condenser pipes 02 in every row, and every condenser pipe 02 runs through semiconductor refrigeration module along semiconductor refrigeration module's long limit direction. The heat conduction aluminum block 04 is wrapped outside the condensing pipe 02, and the semiconductor refrigeration module is composed of two semiconductor refrigeration pieces: the first semiconductor refrigeration piece 01 and the second semiconductor refrigeration piece 05 are stacked, a through groove for the condensation pipe 02 to pass through is formed in the stacking surface of each semiconductor refrigeration piece, and after the first semiconductor refrigeration piece 01 and the second semiconductor refrigeration piece 05 are stacked together, the through groove is butted to form a through hole for the condensation pipe 02 to pass through. In other embodiments, the number of the condensation pipes 02 is at least two, and all the condensation pipes 02 are arranged side by side. The number of the heat radiation fans is two: the first cooling fan 11 and the second cooling fan 51 are respectively located outside two opposite side surfaces of the semiconductor refrigeration module, that is, the condensation pipe 02, the semiconductor refrigeration modules (the first semiconductor refrigeration sheet 01 and the second semiconductor refrigeration sheet 05) on the two sides thereof, and the cooling fans (the first cooling fan 11 and the second cooling fan 51) on the two sides thereof are in a stacked state of a sandwich structure, and a certain gap is formed between the semiconductor refrigeration module and the adjacent cooling fan.

In this embodiment, two ends of the condensation pipe 02 extend out of the semiconductor refrigeration module, and two ends are respectively provided with the pure steam valve 03 and the condensation water valve 06.

Novel pure steam sampling device during operation, pure steam gets into the condenser pipe 02 that the multiunit was arranged from pure steam valve 03, the cold volume of first semiconductor refrigeration piece 01 and second semiconductor refrigeration piece 05 transmits condenser pipe 02 from heat conduction aluminium pig 04, make the pure steam condensate of high temperature become the water storage in the pipeline, the heat in the work gives off aloft through first radiator fan 11 and second radiator fan 51, after cooling a period, open condensation water valve 06, collect pure steam condensate water and accomplish the sample.

Second embodiment

Referring to fig. 2, the novel pure vapor sampling device provided in this embodiment includes a housing 07, a power supply 08, and the novel pure vapor sampling device of the first embodiment, where the novel pure vapor sampling device and the power supply 08 are respectively installed in the housing 07, the power supply 08 is electrically connected to the semiconductor refrigeration module, and two ends of the condenser tube 02 respectively extend out of the housing 07.

In this embodiment, novel pure steam sampling device level sets up, condenser pipe 02 and the equal level setting of semiconductor refrigeration module (first semiconductor refrigeration piece 01, second semiconductor refrigeration piece 05) promptly, and the both ends of semiconductor refrigeration module are fixed in on the casing 07 through the mounting disc. The two ends of the condensing pipe 02 are respectively communicated with connecting pipes, the connecting pipes extend out of the shell 07, and the height of the connecting pipes communicated with the end part of the condensing pipe 02 provided with the pure steam valve 03 is higher than that of the connecting pipes communicated with the end part provided with the condensed water valve 06. Some ventilation and heat dissipation holes are designed in the shell 07, so that heat inside the shell 07 is dissipated, and stable operation of all parts is guaranteed.

When in actual use, but this novel pure steam sampling device in the novel pure steam sampling equipment horizontal installation, can also vertical installation, during vertical installation, the vertical setting of condenser pipe 02, the tip that condenser pipe 02 is provided with pure steam valve 03 is located the top, and the both ends of condenser pipe 02 stretch out outside casing 07.

To sum up, novel pure steam sampling device and equipment of this application embodiment need not the cooling water, utilize the electric energy to make steam cooling condensation, and whole size is less, and it is convenient to use.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (9)

1. The utility model provides a novel pure steam sample device which characterized in that, its condenser pipe that is used for letting in pure steam, the periphery parcel of condenser pipe is provided with semiconductor refrigeration module, semiconductor refrigeration module is the cuboid, the condenser pipe is followed semiconductor refrigeration module's long limit direction runs through semiconductor refrigeration module, semiconductor refrigeration module's periphery still is provided with radiator fan.

2. The novel pure vapor sampling device of claim 1, wherein a gap is provided between the semiconductor refrigeration module and the heat dissipation fan;

and/or a heat conduction aluminum block is arranged between the condensation pipe and the semiconductor refrigeration module.

3. The novel pure steam sampling device as claimed in claim 1, wherein two ends of the condensation pipe extend out of the semiconductor refrigeration module, and are respectively provided with a pure steam valve and a condensation water valve.

4. The novel pure steam sampling device as claimed in claim 1, wherein the number of the condensation pipes is at least two, and all the condensation pipes are arranged side by side.

5. The novel pure vapor sampling device of claim 1, wherein the number of the heat dissipation fans is two, and the two heat dissipation fans are respectively positioned outside two opposite side surfaces of the semiconductor refrigeration module.

6. The novel pure steam sampling device is characterized by comprising a shell, a power supply and the novel pure steam sampling device as claimed in claim 1, wherein the novel pure steam sampling device and the power supply are respectively installed in the shell, the power supply is electrically connected with the semiconductor refrigeration module, and two ends of the condensation pipe respectively extend out of the shell.

7. The novel pure steam sampling device as claimed in claim 6, wherein the condenser tube is horizontally arranged, connecting tubes are respectively communicated with two ends of the condenser tube, and the connecting tubes extend out of the shell.

8. The novel pure vapor sampling device according to claim 6, wherein the condensation pipe is vertically arranged, and two ends of the condensation pipe extend out of the shell.

9. The novel pure vapor sampling device of claim 6, wherein both ends of the semiconductor refrigeration module are secured to the housing by mounting plates.

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