CN210139130U - Semiconductor cooling power generation facility for reflow soldering experiments - Google Patents
Semiconductor cooling power generation facility for reflow soldering experiments Download PDFInfo
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- CN210139130U CN210139130U CN201920389124.1U CN201920389124U CN210139130U CN 210139130 U CN210139130 U CN 210139130U CN 201920389124 U CN201920389124 U CN 201920389124U CN 210139130 U CN210139130 U CN 210139130U
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- reflow soldering
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Abstract
The utility model relates to a semiconductor cooling power generation device for reflow soldering experiments, which belongs to the technical field of reflow soldering experiment equipment and particularly comprises a support rod fixed on a bottom plate, a support plate is installed on the support rod, a cooling water tank is installed at the bottom of the support plate, a shell is installed on the support plate, four support columns are also installed on the support plate, a heat conduction copper sheet is fixed on the four support columns, a heat exchange tube is installed at the bottom of the heat conduction copper sheet, the two ends of the heat exchange tube are respectively connected with the cooling water tank through a water inlet tube and a water outlet tube, a circulating water pump is installed on the water inlet tube, a semiconductor refrigeration sheet is installed on the heat conduction copper sheet, a fan installation seat is installed at the top of the shell, a cooling fan is installed on the fan installation seat, a plurality of air inlet holes are, the utility model discloses simple structure adopts semiconductor cooling device, and the temperature is controllable, and the cooling effect is good.
Description
Technical Field
The utility model relates to a semiconductor cooling power generation facility for reflow soldering experiments belongs to reflow soldering experimental facilities technical field.
Background
In the reflow soldering test, a sample needs to pass through a section of cooling area after passing through a peak temperature section, different test standards have different cooling requirements, when the standard requires a slower cooling speed, the cooling fan carried by the equipment can meet the requirements, but when some standards require a faster cooling speed, the original cooling fan of the equipment cannot meet the test requirements.
At present, the publication number is CN 207563877U, and the patent name is a cooling device for reflow soldering experiments, which mainly uses cooling water to cool air around a fan, so that the fan blows cold air to cool a sample; however, with the structure, the fan is of an open structure, the cooling effect is not obvious, and the cooling effect is poor.
SUMMERY OF THE UTILITY MODEL
For solving the technical problem that prior art exists, the utility model provides a simple structure adopts semiconductor cooling device, and the temperature is controllable, semiconductor cooling power generation facility for the reflow soldering experiment that the cooling effect is good.
In order to achieve the purpose, the technical scheme adopted by the utility model is a semiconductor cooling power generation device for reflow soldering experiments, which comprises a bottom plate, wherein a support rod is fixedly arranged on the bottom plate, a support plate is arranged on the support rod, a cooling water tank is arranged at the bottom of the support plate, a shell is arranged on the support plate, four support columns are also arranged on the support plate, a heat conduction copper sheet is fixedly arranged on the four support columns, a heat exchange tube is arranged at the bottom of the heat conduction copper sheet, two ends of the heat exchange tube are respectively connected with the cooling water tank through a water inlet tube and a water outlet tube, a circulating water pump is arranged on the water inlet tube, a semiconductor refrigerating sheet is arranged on the heat conduction copper sheet, a fan mounting seat is arranged at the top of the shell, a cooling fan is arranged on the fan mounting seat, a plurality of air, the storage battery is installed in the power box, the storage battery is connected with the semiconductor refrigeration piece through a lead, and a control switch is installed on the lead.
Preferably, the heat exchange tube is a spiral square tube, the spiral square tube is fixed at the bottom of the heat conduction copper sheet, and the spiral square tube is fixed close to the bottom of the heat conduction copper sheet.
Preferably, the bottom and the periphery of the shell are provided with heat insulation layers.
Preferably, a small water turbine is further mounted on the water outlet pipe, a small generator is connected to the small water turbine, and the small generator is connected with the storage battery through a voltage regulator.
Compared with the prior art, the utility model discloses following technological effect has: the utility model has simple structure and convenient use, adopts the semiconductor refrigeration piece to rapidly cool down, and simultaneously utilizes the cooling water heat exchange tube to rapidly dissipate heat of the hot end of the semiconductor refrigeration piece, thereby greatly improving the refrigeration efficiency of the semiconductor refrigeration piece; and the refrigeration piece is arranged in the relatively closed shell, so that refrigeration can be better carried out, and the fan blows cold air
The sample is rapidly cooled, and the cooling effect is good.
In addition, a small water turbine and a small generator are further installed on the circulating water pipeline, the circulating water is used for driving the small generator to rotate to generate electricity, the generated electric energy is stored in the storage battery, and the cruising ability of the storage battery is further improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in figure 1, a semiconductor cooling power generation device for reflow soldering experiments comprises a bottom plate 1, a supporting rod 2 is fixedly arranged on the bottom plate 1, a supporting plate 3 is arranged on the supporting rod 2, a cooling water tank 4 is arranged at the bottom of the supporting plate 3, a shell 5 is arranged on the supporting plate 3, four supporting columns 6 are further arranged on the supporting plate 3, heat-conducting copper sheets 7 are fixedly arranged on the four supporting columns 6, heat exchange tubes 8 are arranged at the bottoms of the heat-conducting copper sheets 7, two ends of each heat exchange tube 8 are respectively connected with the cooling water tank 4 through a water inlet tube 9 and a water outlet tube 10, a circulating water pump 11 is arranged on the water inlet tube 9, semiconductor refrigerating sheets 12 are arranged on the heat-conducting copper sheets 7, a fan mounting seat 13 is arranged at the top of the shell 5, a cooling fan 14 is arranged on the fan mounting seat 13, a plurality of power supplies, the storage battery is connected with the semiconductor refrigeration piece 12 through a lead, and a control switch is arranged on the lead.
The utility model discloses during the use, the cooling water of packing into in the cooling trough 4, switch on semiconductor refrigeration piece 12 through control switch, and the top surface of semiconductor refrigeration piece 12 absorbs heat and then refrigerates, and the bottom surface is released heat. The semiconductor refrigeration piece 12 cools air in the shell, and the cooling fan starts to blow cold air to the sample for rapid cooling. In order to ensure the refrigerating efficiency of the semiconductor refrigerating sheet 12, the bottom surface of the semiconductor refrigerating sheet 12 is rapidly cooled by the heat exchange tube, so that the generated heat is taken away in time, and the refrigerating effect of the semiconductor refrigerating sheet 12 can be improved.
The heat exchange tube 8 is a spiral square tube, the spiral square tube is fixed at the bottom of the heat conduction copper sheet, and the spiral square tube is fixed close to the bottom of the heat conduction copper sheet. The heat exchange tube is larger in contact area with the heat conduction copper sheet, and the heat exchange effect is good. The bottom and the periphery of the shell 5 are provided with heat insulation layers 19, the heat insulation layers can reduce heat transfer, the influence of surrounding air on the shell is reduced, and the refrigeration effect is influenced.
In addition, a small water turbine 17 is further installed on the water outlet pipe 10, a small generator 18 is connected to the small water turbine 17, the small generator 18 is connected with a storage battery through a voltage regulator, kinetic energy of circulating water is fully utilized through the small water turbine 17 and the small generator 18, the small generator 18 generates electricity under the driving of the small water turbine, the generated electricity is stored in the storage battery, and the cruising ability of the storage battery is improved.
The foregoing is considered as illustrative and not restrictive of the preferred embodiments of the invention, and any modifications, equivalents and improvements made within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (4)
1. The utility model provides a semiconductor cooling power generation facility for reflow soldering experiments which characterized in that: the cooling device comprises a bottom plate, wherein a support rod is fixedly arranged on the bottom plate, a support plate is arranged on the support rod, a cooling water tank is arranged at the bottom of the support plate, a shell is arranged on the support plate, four support columns are further arranged on the support plate, a heat conduction copper sheet is fixedly arranged on the four support columns, a heat exchange tube is arranged at the bottom of the heat conduction copper sheet, two ends of the heat exchange tube are respectively connected with the cooling water tank through a water inlet tube and a water outlet tube, a circulating water pump is arranged on the water inlet tube, a semiconductor refrigerating sheet is arranged on the heat conduction copper sheet, a fan mounting seat is arranged at the top of the shell, a cooling fan is arranged on the fan mounting seat, a plurality of air inlet holes are formed in two sides of the upper part of the shell, a, and the wire is provided with a control switch.
2. The semiconductor cooling power generation device for the reflow soldering experiment as set forth in claim 1, wherein: the heat exchange tube is heliciform side pipe, and this heliciform side pipe is fixed in the bottom of heat conduction copper sheet, and this heliciform side pipe is hugged closely heat conduction copper sheet bottom and is fixed.
3. The semiconductor cooling power generation device for the reflow soldering experiment as set forth in claim 1, wherein: and heat insulation layers are arranged at the bottom and around the shell.
4. The semiconductor cooling power generation device for the reflow soldering experiment as set forth in claim 1, wherein: the water outlet pipe is further provided with a small water turbine, the small water turbine is connected with a small generator, and the small generator is connected with the storage battery through a voltage regulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920389124.1U CN210139130U (en) | 2019-03-26 | 2019-03-26 | Semiconductor cooling power generation facility for reflow soldering experiments |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920389124.1U CN210139130U (en) | 2019-03-26 | 2019-03-26 | Semiconductor cooling power generation facility for reflow soldering experiments |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210139130U true CN210139130U (en) | 2020-03-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920389124.1U Active CN210139130U (en) | 2019-03-26 | 2019-03-26 | Semiconductor cooling power generation facility for reflow soldering experiments |
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| Country | Link |
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| CN (1) | CN210139130U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114226888A (en) * | 2021-12-02 | 2022-03-25 | 浙江艾格森智能制造有限公司 | Cooling structure of wire cut electric discharge machine and control method |
-
2019
- 2019-03-26 CN CN201920389124.1U patent/CN210139130U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114226888A (en) * | 2021-12-02 | 2022-03-25 | 浙江艾格森智能制造有限公司 | Cooling structure of wire cut electric discharge machine and control method |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221008 Address after: 030500 west of wangmingzhai village, Jiaocheng County, Luliang City, Shanxi Province (XiaJiaYing Industrial Park) Patentee after: Shanxi Guojin Coal Power Co.,Ltd. Address before: No. 2601, Unit 3, Block C, Changfeng Huajuan, No. 918, Tiyu West Road, Xiaodian District, Taiyuan City, Shanxi Province 030006 Patentee before: Zhang Fan |
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| TR01 | Transfer of patent right |