CN218717351U

CN218717351U - Heat radiator for air compressor

Info

Publication number: CN218717351U
Application number: CN202222421767.4U
Authority: CN
Inventors: 张汉国
Original assignee: Zhejiang Solofor Technology Co ltd
Current assignee: Zhejiang Solofor Technology Co ltd
Priority date: 2022-09-13
Filing date: 2022-09-13
Publication date: 2023-03-24
Anticipated expiration: 2032-09-13

Abstract

The utility model relates to an air compressor technical field just discloses an air compressor's heat abstractor, comprising a base plate, the last fixed surface of bottom plate is connected with the box, the last fixed surface of bottom plate is connected with the compressor main part, the venthole has been seted up on the right side of box, the inlet port has been seted up to the upper surface of box. The utility model discloses a set up the bottom plate, the box, the venthole, the inlet port, the installing support, the fan, the fixed bolster, spacing post, the apron, the fixed block, solid fixed ring, the through-hole, the fin, semiconductor refrigeration piece and copper, wherein, when semiconductor refrigeration piece is opened, through semiconductor refrigeration piece and copper, make the temperature in the box reduce, then, through opening the fan, make the air conditioning in the box blow in the compressor main part through the venthole, at this moment, absorb the heat of compressor main part through air conditioning, and then the temperature of messenger's compressor main part during operation can not be too high.

Description

Heat radiator for air compressor

Technical Field

The utility model relates to an air compressor technical field especially relates to an air compressor's heat abstractor.

Background

An air compressor is a device used to compress gas and is similar in construction to a water pump, most of which are reciprocating pistons, rotating blades or rotating screws. At present, the air compressor can generate a large amount of heat when in use, if the heat dissipation is not timely, the air compressor is very unfavorable for the air compressor, and the machine can be damaged due to overheating, so that the heat dissipation device of the air compressor is provided to avoid the problem.

SUMMERY OF THE UTILITY MODEL

The purpose of the utility model is to solve the shortcoming that exists among the prior art, if: at present, an air compressor can generate a large amount of heat when in use, if the heat dissipation is not timely, the heat dissipation is very unfavorable for the air compressor, and the machine can be damaged due to overheating, so that the heat dissipation device of the air compressor is provided.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides an air compressor's heat abstractor, includes the bottom plate, the last fixed surface of bottom plate is connected with the box, the last fixed surface of bottom plate is connected with the compressor main part, the venthole has been seted up on the right side of box, the inlet port has been seted up to the upper surface of box, the inner wall fixedly connected with installing support of box, the installing support is located the top of venthole, the inner wall fixedly connected with fan of installing support, the last fixed surface of box is connected with the fixed bolster, the upper and lower both sides of box inner wall all laminate and are provided with spacing post, the left side fixedly connected with apron of spacing post, the right side of apron and the left side contact of box, the equal laminating in both sides is provided with the fixed block around the box, the left side of fixed block and the right side fixed connection of apron, the last fixed surface of fixed block is connected with solid fixed ring, gu fixed ring's inner wall and fixed bolster's surface contact, the through-hole has been seted up to the inside of apron, the inner wall fixedly connected with fin of through-hole, the right side fixedly connected with semiconductor refrigeration piece of fin, the copper, the right side fixedly connected with semiconductor refrigeration piece.

Preferably, the fixed bolster includes electric putter, electric putter's bottom is connected with the last fixed surface of box, electric putter's last fixed surface is connected with the U-shaped plate, both sides all contact with the inner wall of U-shaped plate around the box, the hollow block of the equal fixedly connected with in both sides around the U-shaped plate, the inner wall fixedly connected with L shape post of hollow block, the surface of L shape post and solid fixed ring's inner wall contact.

Preferably, the maximum distance between the L-shaped column and the fixing block is greater than the height of the fixing ring.

Preferably, the bottom fixedly connected with spring of installing support, the first sealed piece of bottom fixedly connected with of spring, the right side of apron and the inner wall of box all with the surface contact of first sealed piece, first sealed piece is located the top of venthole, the right side of first sealed piece is seted up flutedly, the inner wall laminating of recess is provided with the sealed piece of second, the right side of the sealed piece of second and the inner wall fixed connection of box, the inside fixed intercommunication of apron has the L venturi tube, the L venturi tube is located the left side of first sealed piece.

Preferably, the pulling force of the spring on the first sealing block is greater than the gravity of the first sealing block.

Preferably, the centers of the radiating fin, the semiconductor refrigerating fin and the copper plate are all on the same horizontal line.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) The utility model discloses a set up the bottom plate, the box, the venthole, the inlet port, the installing support, the fan, the fixed bolster, spacing post, the apron, the fixed block, gu fixed ring, the through-hole, the fin, semiconductor refrigeration piece and copper, wherein, when semiconductor refrigeration piece is opened, through semiconductor refrigeration piece and copper, make the temperature in the box reduce, then, through opening the fan, make the air conditioning in the box blow in the compressor main part through the venthole, this moment, absorb the heat of compressor main part through air conditioning, and then make the temperature of compressor main part during operation can not be too high, and simultaneously, through the fixed bolster, fixed column and solid fixed ring's cooperation, it is comparatively convenient to make the dismouting between apron and the box, and then the person of facilitating the use maintains fan and semiconductor refrigeration piece.

(2) The utility model discloses a set up the spring, first sealed piece, a groove, sealed piece of second and L venturi tube, wherein, when the fan is opened, the atmospheric pressure increase of the wind-force messenger first sealed piece top that produces through the fan, when atmospheric pressure is greater than the pressure of spring to first sealed piece, make first sealed piece downstream through atmospheric pressure, when first sealed piece separates with the sealed piece of second, first sealed piece staggers with the L venturi tube, at this moment, air accessible L venturi tube and venthole in the box discharge, then, blow off the heat of fin through the wind that the L venturi tube blew off, and then through the spring, first sealed piece, a groove, the cooperation of the sealed piece of second and L venturi tube, make this heat abstractor can dispel the heat to the fin.

Drawings

FIG. 1 is a schematic view of the structure of the present invention;

fig. 2 is a front view of the structure of the present invention;

fig. 3 is a bottom view of the mounting bracket of the present invention;

fig. 4 is a left side view of the fixing bracket of the present invention;

fig. 5 is a left side view of the cover plate of the present invention;

fig. 6 is a top view of the first sealing block of the present invention.

In the figure: 1. a base plate; 2. a box body; 3. a compressor main body; 4. an air outlet; 5. an air inlet; 6. mounting a bracket; 7. a fan; 8. fixing a bracket; 81. an electric push rod; 82. a U-shaped plate; 83. a hollow block; 84. an L-shaped column; 9. a limiting column; 10. a cover plate; 11. a fixed block; 12. a fixing ring; 13. a through hole; 14. a heat sink; 15. a semiconductor refrigeration sheet; 16. a copper plate; 17. a spring; 18. a first seal block; 19. a groove; 20. a second seal block; 21. an L-shaped tube.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

The first embodiment is as follows:

referring to fig. 1-5, a heat dissipation device of an air compressor comprises a bottom plate 1, a box body 2 is fixedly connected to the upper surface of the bottom plate 1, a compressor main body 3 is fixedly connected to the upper surface of the bottom plate 1, the compressor main body 3 is positioned at the right side of the box body 2, an air outlet hole 4 is formed at the right side of the box body 2, an air inlet hole 5 is formed at the upper surface of the box body 2, a mounting bracket 6 is fixedly connected to the inner wall of the box body 2, the mounting bracket 6 is positioned above the air outlet hole 4, a fan 7 is fixedly connected to the inner wall of the mounting bracket 6, when the fan 7 is opened, air outside the box body 2 enters the box body 2 through the air inlet hole 5 by the fan 7, the air inside the box body 2 is discharged through the air outlet hole 4, the upper surface of the box body 2 is fixedly connected with the fixed support 8, the upper side and the lower side of the inner wall of the box body 2 are both provided with the limiting columns 9 in a fitting manner, the left side of each limiting column 9 is fixedly connected with the cover plate 10, the right side of the cover plate 10 is in contact with the left side of the box body 2, when the limiting column 9 is contacted with the box body 2, the cover plate 10 is positioned through the limiting column 9, the front side and the rear side of the box body 2 are respectively provided with a fixed block 11 in a fitting manner, the left side of the fixed block 11 is fixedly connected with the right side of the cover plate 10, the upper surface of the fixed block 11 is fixedly connected with a fixed ring 12, the inner wall of the fixed ring 12 is contacted with the surface of the fixed bracket 8, the cover plate 10 is internally provided with a through hole 13, the inner wall of the through hole 13 is fixedly connected with a radiating fin 14, the right side of the radiating fin 14 is fixedly connected with a semiconductor refrigerating fin 15, the heat dissipation of the semiconductor refrigeration piece 15 is carried out through the heat dissipation piece 14, the copper plate 16 is fixedly connected with the right side of the semiconductor refrigeration piece 15, the refrigeration area of the semiconductor refrigeration piece 15 is increased through the copper plate 16, and the centers of the radiating fin 14, the semiconductor refrigeration piece 15 and the copper plate 16 are all on the same horizontal line.

The fixing support 8 comprises an electric push rod 81, the bottom of the electric push rod 81 is fixedly connected with the upper surface of the box body 2, the upper surface of the electric push rod 81 is fixedly connected with a U-shaped plate 82, the front side and the rear side of the box body 2 are in contact with the inner wall of the U-shaped plate 82, the front side and the rear side of the U-shaped plate 82 are fixedly connected with hollow blocks 83, the inner wall of each hollow block 83 is fixedly connected with an L-shaped column 84, the surface of each L-shaped column 84 is in contact with the inner wall of the fixing ring 12, the maximum distance between each L-shaped column 84 and the fixing block 11 is larger than the height of the fixing ring 12, when the fixing ring 12 is in contact with the L-shaped column 84, the fixing block 11 is matched with the L-shaped columns 84 and the limiting columns 9, the cover plate 10 is fixed on the box body 2, when the fixing ring 12 is separated from the L-shaped columns 84, the cover plate 10 can be directly separated from the box body 2, and then the fixing support 8 is matched with the fixing ring 12, so that the cover plate 10 and the box body 2 can be conveniently dismounted and the fan 7 and the semiconductor refrigerating sheet 15 can be conveniently maintained by a user.

Example two:

referring to fig. 1-6, the bottom of the mounting bracket 6 is fixedly connected with a spring 17, the bottom of the spring 17 is fixedly connected with a first sealing block 18, the pulling force of the spring 17 on the first sealing block 18 is greater than the gravity of the first sealing block 18, the right side of the cover plate 10 and the inner wall of the box body 2 are both in surface contact with the first sealing block 18, the first sealing block 18 is located above the air outlet 4, a groove 19 is formed in the right side of the first sealing block 18, a second sealing block 20 is arranged on the inner wall of the groove 19 in an attached manner, the right side of the second sealing block 20 is fixedly connected with the inner wall of the box body 2, an L-shaped pipe 21 is fixedly communicated with the inside of the cover plate 10, and the L-shaped pipe 21 is located on the left side of the first sealing block 18.

The heat dissipation device is provided with the spring 17, the first sealing block 18, the groove 19, the second sealing block 20 and the L-shaped pipe 21, wherein when the fan 7 is opened, air pressure above the first sealing block 18 is increased through wind power generated by the fan 7, when the air pressure is larger than the pressure of the spring 17 on the first sealing block 18, the first sealing block 18 moves downwards through the air pressure, when the first sealing block 18 is separated from the second sealing block 20, the first sealing block 18 is staggered with the L-shaped pipe 21, at the moment, air in the box body 2 can be discharged through the L-shaped pipe 21 and the air outlet 4, then the heat of the heat dissipation fins 14 is blown away through the wind blown out by the L-shaped pipe 21, and further through the cooperation of the spring 17, the first sealing block 18, the groove 19, the second sealing block 20 and the L-shaped pipe 21, the heat dissipation fins 14 can be dissipated by the heat dissipation device.

In the utility model, when the user uses the device, firstly, the temperature in the box body 2 is gradually reduced under the matching of the semiconductor refrigeration piece 15 and the copper plate 16 by opening the semiconductor refrigeration piece 15, then, the air pressure above the first sealing block 18 is increased by opening the fan 7, when the air pressure is larger than the pressure of the spring 17 to the first sealing block 18, the first sealing block 18 is moved downwards by the air pressure, when the first sealing block 18 is separated from the second sealing block 20, the first sealing block 18 is staggered with the L-shaped pipe 21, then, the air in the box body 2 can be discharged through the L-shaped pipe 21 and the vent hole 4, at the moment, the cold air in the box body 2 is blown on the compressor body 3 through the vent hole 4, and the heat of the compressor body 3 is absorbed through the cold air, and further, the temperature of the compressor body 3 during working can not be too high, the heat of the radiating fins 14 is blown away by the air blown out by the L-shaped pipes 21, and further the heat dissipation effect of the radiating fins 14 on the semiconductor refrigerating sheet 15 is improved, when a user needs to maintain the fan 7 and the semiconductor refrigerating sheet 15, firstly, the electric push rod 81 is opened, the L-shaped columns 84 move upwards, after the L-shaped columns 84 are separated from the fixing ring 12, the cover plate 10 can be detached from the box body 2, at the moment, the fan 7 and the semiconductor refrigerating sheet 15 can be maintained, when the cover plate 10 is fixed on the box body 2, the limiting columns 9 are inserted into the box body 2, then, the L-shaped columns 84 move downwards through the electric push rod 81, after the L-shaped columns 84 are inserted into the fixing ring 12, the cover plate 10 is fixed on the box body 2 through the matching of the fixing ring 12, the fixing block 11, the L-shaped columns 84 and the limiting columns 9.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Claims

1. The heat dissipation device of the air compressor comprises a bottom plate (1) and is characterized in that a box body (2) is fixedly connected to the upper surface of the bottom plate (1), a compressor main body (3) is fixedly connected to the upper surface of the bottom plate (1), an air outlet (4) is formed in the right side of the box body (2), an air inlet (5) is formed in the upper surface of the box body (2), an installation support (6) is fixedly connected to the inner wall of the box body (2), the installation support (6) is located above the air outlet (4), a fan (7) is fixedly connected to the inner wall of the installation support (6), a fixed support (8) is fixedly connected to the upper surface of the box body (2), a limiting column (9) is arranged on the upper side and the lower side of the inner wall of the box body (2) in a laminating mode, a cover plate (10) is fixedly connected to the left side of the limiting column (9), the right side of the cover plate (10) is in contact with the left side of the box body (2), two sides of the front and back of the box body (2) are respectively provided with a fixing ring (11), the left side of the fixing ring (11) is fixedly connected with the cover plate (10), a through hole (12) is formed in a through hole (13) and a fixing ring (12) is arranged on the inner wall of the fixing ring (13), the inner wall fixedly connected with fin (14) of through-hole (13), the right side fixedly connected with semiconductor refrigeration piece (15) of fin (14), the right side fixedly connected with copper (16) of semiconductor refrigeration piece (15).

2. The heat dissipation device of an air compressor, according to claim 1, wherein the fixing bracket (8) comprises an electric push rod (81), the bottom of the electric push rod (81) is fixedly connected with the upper surface of the box body (2), the upper surface of the electric push rod (81) is fixedly connected with a U-shaped plate (82), the front side and the rear side of the box body (2) are both contacted with the inner wall of the U-shaped plate (82), the front side and the rear side of the U-shaped plate (82) are both fixedly connected with hollow blocks (83), the inner wall of each hollow block (83) is fixedly connected with an L-shaped column (84), and the surface of each L-shaped column (84) is contacted with the inner wall of the fixing ring (12).

3. The heat sink of claim 2, wherein the maximum distance between the L-shaped posts (84) and the fixing block (11) is greater than the height of the fixing ring (12).

4. The heat dissipation device of an air compressor, according to claim 1, wherein a spring (17) is fixedly connected to the bottom of the mounting bracket (6), a first sealing block (18) is fixedly connected to the bottom of the spring (17), the right side of the cover plate (10) and the inner wall of the box body (2) are both in contact with the surface of the first sealing block (18), the first sealing block (18) is located above the air outlet hole (4), a groove (19) is formed in the right side of the first sealing block (18), a second sealing block (20) is attached to the inner wall of the groove (19), the right side of the second sealing block (20) is fixedly connected with the inner wall of the box body (2), an L-shaped pipe (21) is fixedly communicated with the inside of the cover plate (10), and the L-shaped pipe (21) is located on the left side of the first sealing block (18).

5. The heat sink of an air compressor as claimed in claim 4, wherein the spring (17) exerts a greater pulling force on the first sealing block (18) than the weight of the first sealing block (18).

6. The heat dissipating device of an air compressor as claimed in claim 1, wherein the heat dissipating fins (14), the semiconductor cooling fins (15) and the copper plate (16) are all on the same horizontal line at their centers.