CN218709963U - Glass cup cooling device - Google Patents

Abstract

The glass cup cooling device comprises a negative pressure fan, a semiconductor refrigerating mechanism, a cooling box, a pressure cover, a supporting plate, a power supply module, a voltage regulator and a temperature control circuit; the upper end of the cooling box is of an open structure, the upper end of the cooling box is provided with a lower magnet, a plurality of glass placing inlets are distributed on the supporting plate at intervals, a plurality of air holes are formed between every two glass placing inlets, and the rear end of the pressure cover is hinged to the rear part of the cooling box; the negative pressure fan is arranged in the cooling box, one end of a side end vent pipe of the cooling box is connected with the air inlet of the negative pressure fan, the other end of the vent pipe is connected with one end of the shell, and the semiconductor refrigeration mechanism is arranged outside the shell; the power module, the voltage regulator and the temperature control circuit are arranged in the element box and are electrically connected. This is novel has brought the facility for the staff, and has correspondingly improved work efficiency, can prevent that the glass cup from receiving the wind-force influence and bumping the damage to the cooling rate of glass cup has been improved.

Description

Glass cup cooling device

Technical Field

The utility model relates to a glass cup production auxiliary assembly technical field, especially a glass cup cooling device.

Background

The glass is a liquid drinking tool which is very common in use, and the glass needs to be cooled by air cooling after being produced and formed, so that the physical performance of the glass can be correspondingly changed on the premise of reducing the production time.

Current glass cup cooling arrangement generally only has the function that provides forced air cooling etc, for example the authorized patent of chinese patent number "201620380384.9", patent name "cooling device of thick end glass cup", its content records "the utility model discloses a cooling device of thick end glass cup, including hollow ring base, ring base's internal diameter and glass cup bottom size cooperate, ring base upper portion be equipped with glass cup bottom section appearance matched with tray portion, be equipped with the round exhaust vent on the ring base inner wall at least, the ring base lateral surface is equipped with the air-supply line. This device can prevent that thick end glass cup from taking place deformation in the cooling process ". As can be seen from the above, although the comparative patent reduces the probability of deformation of the thick-bottom glass during the cooling process to some extent, the following disadvantages still exist as all other glass cooling apparatuses in the prior art: before and after each cooling, the worker needs to adopt equipment such as a clamp to put each glass cup produced in the previous procedure into the equipment one by one or take the glass cups out of the equipment, and the mode not only brings inconvenience to the worker, but also has the defects of time and labor waste. The second step is as follows: the cooling air that it provided is unanimous with the temperature of surrounding environment, like this, just can't satisfy actual need when actual production needs improve cooling rate, can cause the adverse effect to improving work efficiency more or less. And the third step: when many glass cups cool, because do not have a spacing fixed establishment, under the effect is blown to wind-force, there is the probability of collision damage each other between the glass cup, though fill the glass cup in cooling body, reduce the gap between the glass cup and can overcome above-mentioned problem to a certain extent, the density of placing between the glass cup is relatively big, can cause the not unobstructed of flow of cooling air, brings adverse effect to the cooling effect.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defect of the existing glass cup cooling equipment due to the limited structure, the utility model provides a under the combined action of related mechanisms, a worker can place a plurality of glass cups in a cooling box for cooling at one time, the spacing distance between every two glass cups is kept between, and under the action of a pressure cover, the glass cups can be prevented from being influenced by the wind power and being collided and damaged, and the worker can conveniently set the cooling temperature according to the needs, thereby realizing the convenience for the worker, improving the work efficiency and the like.

The utility model provides a technical scheme that its technical problem adopted is:

the glass cup cooling device comprises a negative pressure fan, a semiconductor refrigeration mechanism, a cooling box, a pressure cover, a supporting plate, a power supply module and a voltage regulator, and is characterized by also comprising a temperature control circuit; the upper end of the cooling box is of an open structure, the upper end of the cooling box is provided with a lower magnet, the supporting plates are multiple, a plurality of glass placing openings are distributed on each supporting plate at intervals, a plurality of air holes are formed between every two glass placing openings, and handles are arranged on two sides of each supporting plate; the rear end of the pressure cover is hinged to the rear part of the cooling box; the negative pressure fan is arranged in the cooling box, a vent pipe is arranged at the side end of the cooling box, one end of the vent pipe is connected with the air inlet of the negative pressure fan, the other end of the vent pipe is connected with one end of the shell positioned outside the cooling box, and the semiconductor refrigeration mechanism is arranged outside the shell; the power supply module, the voltage regulator and the temperature control circuit are arranged in the element box; and the power output end of the temperature control circuit is electrically connected with the power input end of the semiconductor refrigerating mechanism.

Furthermore, an upper magnet is installed at the lower end of each supporting plate, the outer diameter of the lower magnet is consistent with that of the upper magnet, and a sealing gasket is installed at the upper end of the lower magnet.

Furthermore, the inner diameter of the glass placing opening on the supporting plate is smaller than the outer diameter of the outer side of the upper part of the glass to be cooled and larger than the outer diameter below the outer side of the upper part of the glass.

Further, the cold end of the semiconductor refrigeration mechanism is tightly attached to the outer side of the shell.

Further, the temperature control circuit comprises a temperature control switch, a relay and a power switch which are electrically connected, one end of the power switch is connected with one end of the temperature control switch, the other end of the power switch is connected with the input end of the relay control power supply, and the other end of the temperature control switch is connected with the input end of the relay positive power supply.

The utility model discloses beneficial effect is: the utility model discloses owing to have a plurality of layer boards, and every layer board has a plurality of glass cups respectively and puts into the mouth, like this, the staff can put on the layer board together glass cups after glass cup production process produces, and then put and carry out the forced air cooling on the cooler bin, owing to reduced the staff and put into the cooler bin or take out the process from the cooler bin to a plurality of glass cups one by one, brought the facility for the staff, and correspondingly improved work efficiency. The glass cup is pressurized under the action of gravity of the cover, so that the glass cup can be prevented from being impacted and damaged by wind power; this is novel through effects such as control by temperature change circuit and semiconductor refrigeration mechanism, and the staff can conveniently set for refrigerated temperature, like this, has improved the cooling rate of glass, and is corresponding also to have improved work efficiency. To sum up, the utility model discloses good application prospect has.

Drawings

The invention will be further explained with reference to the drawings and examples.

Fig. 1 is a schematic view of the whole structure of the utility model when the movable cover is opened.

Fig. 2 is a schematic view of the partial structure of the movable cover in the closed state.

Fig. 3 is a circuit diagram of the present invention.

Detailed Description

As shown in fig. 1, 2 and 3, the glass cup cooling device includes an axial flow negative pressure fan M2, a semiconductor refrigeration mechanism M1, a cooling box 1, a pressure cover 2, a supporting plate 3, a power supply module U1, a voltage regulator U2, and a temperature control circuit 4; the upper end of the cooling box 1 is of an open structure, the upper end of the cooling box 1 is provided with an annular hollow lower permanent magnet 5 in a gluing mode, a plurality of supporting plates 3 are arranged, a plurality of glass placing openings 31 are distributed on each supporting plate 3 at intervals, a plurality of air holes 32 are formed between every two glass placing openings 31, and a handle 33 (which is convenient for workers to use hoisting equipment or hands and the like to transfer the supporting plates) is vertically welded at the left end and the right end of each supporting plate 3; the upper middle part of the rear end of the cooling box 1 is transversely welded with a supporting seat 101, the supporting seat 101 is transversely provided with a through hole, the left side and the right side of the middle part of the rear end of the pressure cover 2 are respectively welded with an Z-shaped supporting plate 21 with a shaft hole, the two supporting plates 21 of the pressure cover 2 are positioned at the two side ends of the supporting seat 101, a hinged screw penetrates through the opening of the supporting plate 21 at the right end, the through hole of the supporting seat 101 and the opening of the supporting plate 21 at the left end from right to left, the left end of the screw is screwed into a limiting nut, and the rear end of the pressure cover 2 is hinged and installed at the rear part of the upper end of the cooling box 1; the lower end of the axial flow negative pressure fan M2 is arranged at the lower middle part in the cooling box 1 through a screw nut, the fan blades of the axial flow negative pressure fan M2 face the upper end, the middle part of the right side end of the cooling box 1 is welded with a vent pipe 6, the left end of the vent pipe 6 is connected with an air inlet pipe of the negative pressure fan M2 through a pipeline joint, the right end of the vent pipe 6 is positioned at the outer side end of the cooling box 1, the right end of the vent pipe 6 is connected with a left end middle pipeline of a rectangular hollow metal shell 7 through a pipeline joint, the middle part of the right end of the shell 7 is welded with a front pipe 8 communicated with the shell, two sets of semiconductor refrigerating mechanisms M1 are arranged, and the two sets of semiconductor refrigerating mechanisms M1 are respectively arranged at the outer sides of the front end and the rear end of the shell 7 through screw nuts; the power supply module U1, the voltage regulator U2 and the temperature control circuit 4 are installed in an element box 9, and the element box 9 is installed at the outer side end of the front upper portion of the cooling box 1.

As shown in fig. 1, 2 and 3, an annular hollow upper permanent magnet 10 is adhesively bonded to the lower end of each support plate 3, the polarity of the lower end of the upper permanent magnet 10 is opposite to that of the upper end of the lower permanent magnet 5, the outer diameter of the lower permanent magnet 5 is identical to that of the upper permanent magnet 10, and an annular hollow sealing rubber pad 11 is adhesively bonded to the upper end of the lower permanent magnet 5. The inner diameter of the glass cup placing opening 31 on the supporting plate is smaller than the outer diameter of the upper outer side of the glass cup 12 to be cooled and larger than the outer diameter below the upper outer side of the glass cup 12, and the outer diameter of the pressure cover 2 is consistent with the outer diameters of the supporting plate 3 and the upper end of the cooling box 1. The cold ends of the two sets of semiconductor refrigerating mechanisms M1 are respectively tightly attached to the front end and the rear end of the shell 7, and the hot ends of the two sets of semiconductor refrigerating mechanisms M1 are positioned on the outer sides of the cold ends. The temperature control circuit comprises a temperature control switch T, a relay K1 and a power switch S1 which are connected through a lead, wherein a handle of the power switch S1 is positioned at the outer side end of the front end of the element box 9, a temperature sensing head of the temperature control switch T is positioned at the front end of the cooling box 1 and enters the cooling box 1 through an opening at the front end of the cooling box 1, and an adjusting handle of the temperature control switch T is positioned outside an opening at the middle part of the front end of the element box 9; one end of a power switch S1 is connected with one end of a temperature control switch T, the other end of the power switch S1 is connected with the control power input end of a relay K1, and the other end of the temperature control switch T is connected with the positive power input end of the relay K1. Pins 1 and 2 of a power input end of a power module U1 and pins 1 and 2 of a power input end of a voltage regulator U2 are respectively connected with two poles of an alternating current 220V power supply through leads, pins 3 and 4 of a power output end of the power module U1 and a power input end relay K1 of a temperature control circuit control the power input end and a negative power input end to be respectively connected through leads, and a normally open contact end and a negative power input end of the power output end relay K1 of the temperature control circuit and two power input ends of two sets of semiconductor refrigerating mechanisms M1 are respectively connected through leads; pins 3 and 4 of a power output end of the voltage regulator U2 are respectively connected with two ends of a power input end of the axial flow fan M2 through leads.

As shown in fig. 1, 2, and 3, after two poles of a 220V power supply enter a power supply input terminal of a power supply module U1, a power supply output terminal of the power supply module U1 outputs a 12V dc power supply to enter a temperature control circuit, and the temperature control circuit is powered on to operate. The utility model discloses owing to have a plurality of layer boards 3, and every layer board 3 has a plurality of glass cups respectively and puts into mouth 31, like this, the staff can put into a plurality of glass cups 31 of layer board together after glass cup production process produces (do not have the glass cup of hand (hold), and glass cup is big-end-up, if need cool off other appearance glass cups, put into 31 appearances of glass cup and do the adaptability processing just right) in the mouth 31 is put into to a plurality of glass cups of layer board, and then put and carry out the air-cooled on cooler bin 1, owing to reduced the staff and put into cooler bin 1 or take out the process from cooler bin 1 to a plurality of glass cups 12 one by one, bring the facility for the staff, and correspondingly improved work efficiency (the layer board is put on the cooler bin after, owing to the sealed effect of two magnets and sealed cushion, can effectively prevent the air escape in the cooler bin). This is novel put into layer board 3 before on cooler bin 1, open pressure lid 2 towards the back along rear end hinge point, made things convenient for putting of layer board, put the back, close pressure lid 2 down along rear end hinge point with the back, like this, pressure lid 2 (also can set up a plurality of bleeder vents, the air is directly discharged from pressure lid upper end after the heat absorption) presses in the upper end of many glasses, the action of gravity of pressure lid 2 plays the pressure effect to glass 12, can prevent that glass 12 is follow-up to receive wind-force influence collision damage etc.. After the power switch of the voltage regulator U1 is turned on, the axial flow wind pressure fan M2 is electrified to work, fan blades of the axial flow wind pressure fan rotate to generate negative pressure, outside air is pumped into the cooling box 1 through the shell 7 and then is upwards discharged through the plurality of air holes 32 of the supporting plate, and the lower end of the pressure cover is provided with a spacing distance between the upper end of the glass cup and the upper end of the supporting plate, so that after the heat of the glass cup is taken away by flowing air, the flowing air is discharged to the atmosphere from the outer end of the pressure cover, and a good air circulation cooling effect is achieved. Specifically, when the output voltage of the voltage regulator U2 is regulated to be low by the worker, the wind power generated by the axial flow fan M2 is small, and the cooling speed is relatively slow, and when the output voltage of the voltage regulator U2 is regulated to be large by the worker, the wind power generated by the axial flow fan M2 is large, and the cooling speed is relatively fast; the cooling speed is set by workers according to the glass cup production process and the actual production requirement. In this is novel, because glass cup lower extreme and side can both obtain the cooling simultaneously, prevented that cooling temperature inequality from to the adverse effect that glass cup quality brought.

Fig. 1, 2, 3 show, in this is novel, after power switch S1 is opened, the temperature control circuit works with electricity, and when the temperature was less than the temperature of settlement (for example, was less than 20 ℃) in the cooler bin, the inside contact of temperature control switch T was opened a way, and relay K1 can not be got electricity, so, semiconductor refrigeration mechanism M1 can not get electricity work, keeps invariable temperature in the cooler bin. When the temperature in the cooling box is higher than the set temperature (for example, higher than 20 ℃), the internal contact of the temperature control switch T is closed, the relay K1 can be electrically attracted, the control power supply input end and the normally open contact end of the relay K are closed, then, the two sets of semiconductor refrigerating mechanisms M1 can be electrically operated to generate cold and cool the shell, and as the shell 7 is cooled, the air subsequently entering the shell 7 through the front pipe 8 and the axial flow fan M1 is cooled, the glass can be cooled at a relatively low temperature. When the temperature in the cooling box is lower than 20 ℃ again, the internal contacts of the temperature switch T are opened again, the relay K1 loses power again and does not attract the control power supply input end and the normally open contact end to open, and the two sets of semiconductor refrigerating mechanisms M1 lose power again and do not work, so that the temperature set by a worker through the temperature control switch T in the cooling box is guaranteed. Through the combined action of all the mechanisms and circuits, the novel glass cup cooling device reduces the working procedure that a plurality of glass cups are placed into a cooling box or taken out of the cooling box one by a worker, brings convenience to the worker, correspondingly improves the working efficiency, and can prevent the glass cups from being impacted and damaged by wind power; through the effects of the temperature control circuit, the semiconductor refrigerating mechanism and the like, the cooling temperature can be conveniently set by the working personnel, so that the cooling speed of the glass cup is increased, and the working efficiency is correspondingly increased. In fig. 3, the relay K1 is a DC12V relay; the power supply module U1 is a finished product of a 220V/12V/2KW AC-to-DC 12V switching power supply module; the temperature control switch T is a finished product of an adjustable temperature switch (the internal contact is closed above a set temperature) with the model TS-120S; the voltage regulator U2 is an alternating current 220V voltage regulator of a model TDGC 3; the semiconductor refrigeration mechanism M1 is a high-power semiconductor refrigerator with working voltage of direct current of 12V and power of 240W; axial fan M2 power 1.2KW, operating voltage exchange 220V (have casing and motor, blade, the motor is installed in the casing, and the blade is installed on the motor shaft, and the casing upper end is open structure, and the casing side is installed the breather pipe).

It should be understood by those skilled in the art that although the present specification describes embodiments, these embodiments do not include only a single embodiment, and the description is for clarity purposes only, and those skilled in the art will recognize that the embodiments may be combined as a whole to form other embodiments as would be understood by those skilled in the art, and thus the scope of the present application is defined by the claims.

Claims (5)

1. The glass cup cooling device comprises a negative pressure fan, a semiconductor refrigeration mechanism, a cooling box, a pressure cover, a supporting plate, a power supply module and a voltage regulator, and is characterized by also comprising a temperature control circuit; the upper end of the cooling box is of an open structure, the upper end of the cooling box is provided with a lower magnet, the supporting plates are multiple, multiple glass cup placing openings are distributed on each supporting plate at intervals, multiple air holes are formed between every two glass cup placing openings, and handles are arranged on two sides of each supporting plate; the rear end of the pressure cover is hinged to the rear part of the cooling box; the negative pressure fan is arranged in the cooling box, a vent pipe is arranged at the side end of the cooling box, one end of the vent pipe is connected with the air inlet of the negative pressure fan, the other end of the vent pipe is connected with one end of the shell positioned outside the cooling box, and the semiconductor refrigeration mechanism is arranged outside the shell; the power supply module, the voltage regulator and the temperature control circuit are arranged in the element box; and the power output end of the temperature control circuit is electrically connected with the power input end of the semiconductor refrigerating mechanism.

2. The glass cooling apparatus as claimed in claim 1, wherein an upper magnet is installed at a lower end of each of the support plates, an outer diameter of the lower magnet is identical to an outer diameter of the upper magnet, and a packing is installed at an upper end of the lower magnet.

3. The apparatus for cooling glass according to claim 1, wherein the inner diameter of the glass inlet on the pallet is smaller than the outer diameter of the upper part of the glass to be cooled and larger than the outer diameter of the glass below the outer part of the upper part of the glass.

4. A glass cooling apparatus as claimed in claim 1, wherein the cold end of the semiconductor refrigeration mechanism is located against the outside of the housing.

5. A glass cooling apparatus according to claim 1, wherein the temperature control circuit includes a temperature controlled switch, a relay, and a power switch electrically connected to each other, one end of the power switch is connected to one end of the temperature controlled switch, the other end of the power switch is connected to the control power input terminal of the relay, and the other end of the temperature controlled switch is connected to the positive power input terminal of the relay.

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