CN218700281U

CN218700281U - Ash removal device for cutting of thin silicon wafer

Info

Publication number: CN218700281U
Application number: CN202222827170.XU
Authority: CN
Inventors: 朱仁德; 王伟
Original assignee: Wuxi Rongneng Semiconductor Material Co ltd
Current assignee: Wuxi Rongneng Semiconductor Material Co ltd
Priority date: 2022-10-26
Filing date: 2022-10-26
Publication date: 2023-03-24
Anticipated expiration: 2032-10-26

Abstract

The utility model discloses a thin slice is ash removal device for silicon chip cutting, including the cutting organism, be provided with the deashing mechanism on the cutting organism, the deashing mechanism is including fixing the fixing base on the cutting organism, and the top of fixing base is run through from top to bottom and is equipped with trapezoidal mouthful, trapezoidal intraoral fixedly connected with rack, the equal fixedly connected with backup pad in both sides at fixing base top, one side fixedly connected with fan of one of them backup pad, the opposite side fixedly connected with dust blowing nozzle of this backup pad, the air-out end and the dust blowing nozzle intercommunication of fan, the deashing mechanism is still including fixing the fixed plate on the cutting organism, the top fixedly connected with cylinder of fixed plate. The utility model discloses a briquetting moves down and presses at the silicon chip to fix the silicon chip, make wind blow off from blowing dust nozzle again under the effect of fan, thereby blow off the dust on the silicon chip, and then clear up the dust on the silicon chip, in order to avoid influencing the precision of cutting the silicon chip.

Description

Ash removal device for cutting of thin silicon wafer

Technical Field

The utility model relates to a silicon chip deashing technical field especially relates to a thin slice is ash removal device for silicon chip cutting.

Background

In the process of producing the thin slice silicon wafer, the thin slice silicon wafer needs to be cut by utilizing a multi-wire cutting technology. During cutting, many factors affect the cutting quality, for example, dust which is not cleaned up adheres to the surface of the silicon wafer, and a slight deviation occurs in the cutting result. Therefore, the silicon wafer is subjected to ash removal before cutting.

However, because the existing ash removal equipment cannot completely remove ash or dust adheres to the surface of the silicon wafer again in the operation process, a small amount of dust may still exist on the surface of the silicon wafer during actual cutting, but because the cutting device has no ash removal function, the dust adhering to the surface of the silicon wafer cannot be removed, and during cutting, the cutting precision of the silicon wafer may be affected, and the requirements of people cannot be met.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing the ash removal device for cutting the thin slice silicon wafer.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a deashing device is used in cutting of thin slice silicon chip, includes the cutting organism, be provided with deashing mechanism on the cutting organism, deashing mechanism is including fixing the fixing base on the cutting organism, and the top of fixing base runs through from top to bottom and is equipped with trapezoidal mouthful, trapezoidal intraoral fixedly connected with rack, the equal fixedly connected with backup pad in both sides at fixing base top, one side fixedly connected with fan of one of them backup pad, the opposite side fixedly connected with dust blowing nozzle of this backup pad, the air-out end and the dust blowing nozzle intercommunication of fan, deashing mechanism is still including fixing the fixed plate on the cutting organism, the top fixedly connected with cylinder of fixed plate, the piston rod one end fixedly connected with clamp plate of cylinder, a plurality of springs of bottom fixedly connected with of clamp plate, the bottom fixedly connected with briquetting of per two springs.

As the utility model discloses the scheme of furthering again, the equal fixedly connected with first closing plate in both sides of clamp plate bottom.

As the utility model discloses scheme further again, the equal fixedly connected with second closing plate in both sides at fixing base top, second closing plate and first closing plate contact.

As a further proposal of the utility model, the bottom of the fixing seat is connected with a cover plate.

As the utility model discloses scheme further still, one side welding of apron and one side fixedly connected with supporting shoe of fixing base, the screw thread is pegged graft between two supporting shoes and is had clamping screw.

As the utility model discloses further scheme again, deashing mechanism is still including fixing the limiting plate on the cutting organism, and the apron can contact with the limiting plate.

As the utility model discloses scheme further again, two guide posts of the top fixedly connected with of clamp plate, guide post and fixed plate slip grafting.

The utility model has the advantages that:

1. move down through the briquetting and press at the silicon chip to fix the silicon chip, make wind blow off from blowing dust nozzle again under the effect of fan, thereby blow off the dust on the silicon chip, and then clear up the dust on the silicon chip, in order to avoid influencing the precision of cutting the silicon chip, avoid appearing the error.

2. The pressure of the pressing block pressing on the silicon wafer can be relieved under the elastic action of the spring, so that the silicon wafer is prevented from being damaged.

3. The first sealing plate moves downwards to be in contact with the second sealing plate, and then the pressing plate and the fixed seat are sealed under the matching use of the supporting plate, so that the splashing of dust is prevented, and the pollution to the working environment is avoided.

Drawings

FIG. 1 is a schematic view of the ash removal mechanism of the present invention;

FIG. 2 is a schematic top view of the ash removal mechanism of the present invention;

FIG. 3 is a schematic side view of the ash removal mechanism of the present invention;

fig. 4 is a schematic view of a partial bottom view structure of the present invention;

fig. 5 is a schematic perspective view of the present invention.

In the figure: 1. cutting the machine body; 2. a fixed seat; 3. a fan; 4. a dust blowing nozzle; 5. placing a rack; 6. a support plate; 7. a fixing plate; 8. a cylinder; 9. pressing a plate; 10. a spring; 11. pressing into blocks; 12. a first sealing plate; 13. a second sealing plate; 14. a trapezoidal mouth; 15. a cover plate; 16. a support block; 17. fixing the screw rod; 18. a limiting plate; 19. and a guide post.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-5, an ash removal device for slicing silicon wafers comprises a cutting machine body 1, an ash removal mechanism is arranged on the cutting machine body 1, the ash removal mechanism comprises a fixed seat 2 fixed on the cutting machine body 1 through bolts, a trapezoidal opening 14 penetrates through the top of the fixed seat 2 from top to bottom, a placing rack 5 is fixed in the trapezoidal opening 14 through bolts, so that silicon wafers can be placed on the placing rack 5 conveniently, supporting plates 6 are welded on two sides of the top of the fixed seat 2, a fan 3 is fixed on one side of one of the supporting plates 6 through bolts, a dust blowing nozzle 4 is fixed on the other side of the supporting plate 6 through bolts, an air outlet end of the fan 3 is communicated with the dust blowing nozzle 4, air is blown out from the dust blowing nozzle 4 under the action of the fan 3, so that dust on the silicon wafers is blown out, the ash removal mechanism further comprises a fixed plate 7 fixed on the cutting machine body 1 through bolts, an air cylinder 8 is fixed on the top of the fixed plate 7 through bolts, a piston rod end of the air cylinder 8 is fixed with a pressing plate 9 through bolts, a plurality of springs 10 are fixed through bolts at the bottom of the pressing plate 9, a pressing plate is fixed through bolts, a pressing block 11 is driven by the pressing plate 9 of the air cylinder 8 to move downwards, and further move to press the silicon wafers to move downwards, and then move the silicon wafers to move.

The utility model discloses in, first closing plate 12 has all been welded to the both sides of clamp plate 9 bottom, second closing plate 13 has all been welded to the both sides at 2 tops of fixing base, second closing plate 13 and the contact of first closing plate 12, first closing plate 12 moves down and second closing plate 13 contacts, use down to seal between clamp plate 9 and the fixing base 2 again in the cooperation of backup pad 6, thereby prevent splashing of dust, the bottom of fixing base 2 is rotated and is connected with apron 15, the dust that blows off falls on apron 15 from trapezoidal mouth 14 and collects, one side welding of apron 15 and the one side welding of fixing base 2 have supporting shoe 16, screw thread grafting has clamping screw 17 between two supporting shoes 16, deashing mechanism still includes limiting plate 18 through the bolt fastening on cutting machine body 1, apron 15 can contact with limiting plate 18, screw 17 unscrews down, open apron 15 and make the dust on it derive, there are two guide posts 19 at the top of clamp plate 9 through the bolt fastening, guide post 19 pegs graft with fixing plate 7.

The working principle is as follows: when the silicon wafer cleaning device is used, firstly, a silicon wafer is placed on the placing frame 5, then, the air cylinder 8 is started, the pressing plate 9 moves downwards under the driving of the air cylinder 8, so that the pressing block 11 is driven to move downwards to press the silicon wafer, the silicon wafer is further fixed, the pressure of the pressing block 11 pressing on the silicon wafer is relieved under the elastic action of the spring 10, so that damage to the silicon wafer is avoided, meanwhile, the pressing plate 9 drives the first sealing plate 12 to move downwards to be in contact with the second sealing plate 13, then, the pressing plate 9 and the fixing seat 2 are sealed under the matching of the supporting plate 6, so that dust is prevented from splashing, the fan 3 is started again, wind is blown out from the dust blowing nozzle 4 under the action of the fan 3, so that dust on the silicon wafer is blown down, the blown down dust falls onto the cover plate 15 from the trapezoid port 14, finally, the fixing screw 17 is screwed down, and the cover plate 15 is opened, so that the dust on the cover plate is led out.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a deashing device is used in cutting of thin slice silicon chip, includes cutting organism (1), its characterized in that, be provided with deashing mechanism on cutting organism (1), deashing mechanism is including fixing base (2) on cutting organism (1), and the top of fixing base (2) is run through from top to bottom and is equipped with trapezoidal mouth (14), fixedly connected with rack (5) in trapezoidal mouth (14), the equal fixedly connected with backup pad (6) in both sides at fixing base (2) top, one side fixedly connected with fan (3) of one of them backup pad (6), the opposite side fixedly connected with dust blowing nozzle (4) of this backup pad (6), the air-out end and the dust blowing nozzle (4) intercommunication of fan (3), deashing mechanism still including fixing fixed plate (7) on cutting organism (1), the top fixedly connected with cylinder (8) of fixed plate (7), piston rod one end fixedly connected with clamp plate (9) of cylinder (8), a plurality of springs (10) of bottom fixedly connected with of clamp plate (9), the bottom fixedly connected with briquetting (11) of per two springs (10).

2. The ash removal device for slicing silicon wafer cutting as claimed in claim 1, wherein the first sealing plate (12) is fixedly connected to both sides of the bottom of the pressure plate (9).

3. The ash removal device for slicing silicon wafer cutting according to claim 2, wherein the two sides of the top of the fixing seat (2) are fixedly connected with second sealing plates (13), and the second sealing plates (13) are in contact with the first sealing plates (12).

4. The ash removing device for slicing silicon wafer cutting according to claim 1, wherein the bottom of the fixed seat (2) is rotatably connected with a cover plate (15).

5. The ash removal device for slicing silicon wafer cutting according to claim 4, wherein one side of the cover plate (15) is welded and one side of the fixed seat (2) is fixedly connected with a supporting block (16), and a fixed screw (17) is inserted between the two supporting blocks (16) in a threaded manner.

6. The ash removal device for slicing silicon wafer cutting according to claim 4, wherein the ash removal mechanism further comprises a limiting plate (18) fixed on the cutting machine body (1), and the cover plate (15) can contact with the limiting plate (18).

7. The ash removal device for slicing silicon wafer cutting according to claim 1, wherein two guide posts (19) are fixedly connected to the top of the pressure plate (9), and the guide posts (19) are slidably inserted into the fixing plate (7).