CN218694698U - Integrated semiconductor laser tin ball welding desktop machine - Google Patents
Integrated semiconductor laser tin ball welding desktop machine Download PDFInfo
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- CN218694698U CN218694698U CN202222015927.5U CN202222015927U CN218694698U CN 218694698 U CN218694698 U CN 218694698U CN 202222015927 U CN202222015927 U CN 202222015927U CN 218694698 U CN218694698 U CN 218694698U
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Abstract
The utility model relates to the technical field of welding devices, a integrated semiconductor laser tin ball welding desktop machine is disclosed, including desktop base, XYZ axle motion subassembly, tin ball welding subassembly and laser emission subassembly, XYZ axle motion subassembly sets up on the desktop base, tin ball welding subassembly sets up on XYZ axle motion subassembly, XYZ axle motion subassembly is used for driving tin ball welding subassembly along X direction, Y direction and Z direction motion; the solder ball welding component comprises a spraying component, the laser emission component comprises a semiconductor laser generator, and the semiconductor laser generator guides laser into the spraying component through optical fibers to act on the solder balls; the utility model provides a pair of integrated semiconductor laser tin ball welding desktop machine has solved the relatively poor problem that can cause the optical device to damage even of welding effect that current tin ball welding equipment adopted fiber laser to exist.
Description
Technical Field
The utility model relates to a welding set technical field, concretely relates to integrated semiconductor laser tin ball welding desktop machine of integration.
Background
At present, a fiber laser is adopted as a light source in a laser tin ball welding machine on the market, the light source emitted by the fiber laser is a Gaussian light source, namely the intensity of a light beam is in Gaussian distribution in space, the middle intensity of the light beam is very high, the light beam gradually decreases outwards along a Gaussian profile, the energy distribution of the Gaussian light beam is uneven, the middle energy is too high, the local temperature is too high, so that the interaction between the laser and a substance is influenced, in addition, the energy of two wings of the light beam of the Gaussian light source is usually wasted, so that the energy utilization rate is greatly reduced; at the same time, the energy of both wings also damages the surrounding area outside the target area, thereby expanding the heat affected zone. On the other hand, the high intensity portions above the burning threshold are referred to as excess energy, which may damage the substrate; furthermore, the central part is too concentrated in energy, which easily damages the optics. In addition, because the fiber laser is large in size, the design of a vertical structure or a desktop split structure is adopted in the integrated design application, the design occupies large space, and the use and the transportation are inconvenient.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an integrated semiconductor laser tin ball welding desktop machine for solve at least one above-mentioned problem that exists among the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the integrated semiconductor laser tin ball welding desktop machine comprises a desktop base, an XYZ-axis motion assembly, a tin ball welding assembly and a laser emission assembly, wherein the XYZ-axis motion assembly is arranged on the desktop base, the tin ball welding assembly is arranged on the XYZ-axis motion assembly, and the XYZ-axis motion assembly is used for driving the tin ball welding assembly to move along the X direction, the Y direction and the Z direction;
the tin ball welding assembly comprises a spraying assembly, the spraying assembly comprises a connecting chamber, a spray head, an inert gas inlet, a tin ball inlet and an optical fiber connector, the laser emission assembly comprises a semiconductor laser generator, the semiconductor laser generator is connected with the optical fiber connector through optical fibers, and the semiconductor laser generator is used for guiding laser into the spraying assembly through the optical fibers to act on the tin ball.
In the technical scheme, the laser emission component comprises a semiconductor laser generator, compared with the traditional fiber laser, the energy distribution of light beams generated by the semiconductor laser generator is flat-top type, the energy distribution is uniform, and different from Gaussian light beams generated by the fiber laser, the energy of the flat-top light beams can be contained in a given area more clearly, the flat-top light beams are used for welding, the welding is more accurate, the damage to the surrounding area can be reduced, and when the flat-top light beams are used for welding, the welding gap can be smoother than that of the Gaussian light beams.
Further, in order to promote the radiating effect of the semiconductor laser generator and ensure the stability of the operation of the equipment, the laser emission assembly comprises a radiator, a radiating fan is arranged on one side of the radiator, and the semiconductor laser generator is arranged on the other side of the radiator.
Further, the laser emitting assembly is arranged inside the desktop base. The compact integrated design is adopted, the components including the laser emitting assembly are integrated in the desktop-level equipment as much as possible, the whole volume of the equipment is small, the occupied space is small, and the packaging and transportation cost is lower.
Further, the solder ball assembly includes a vision device located on one side of the jetting assembly. The vision device comprises a CCD camera used for collecting the welding spot images in real time, the controller can automatically visually detect and analyze the welding effect according to the welding spot images, then the supplementary welding is executed according to the welding effect, the welding quality is improved, the image recognition and control of the part are the prior art, and the description is omitted.
Furthermore, in order to better achieve the compact effect of the overall structure of the device, the XYZ-axis motion assembly comprises an X-axis motion assembly, a Y-axis motion assembly and a Z-axis motion assembly, a gantry is arranged on the desktop base, the X-axis motion assembly is arranged on the gantry, the Y-axis motion assembly is arranged on the X-axis motion assembly, the X-axis motion assembly drives the Y-axis motion assembly to move in the X-axis direction, the jetting assembly and the visual device are both arranged on the Y-axis motion assembly, the Y-axis motion assembly drives the solder ball welding assembly to move in the Y-axis direction, the Z-axis motion assembly is arranged on the desktop base, the Z-axis motion assembly is located below the Y-axis motion assembly, the solder ball welding assembly comprises a support plate, the support plate is arranged on the Z-axis motion assembly, and the Z-axis motion assembly drives the support plate to move in the Z-axis direction.
Furthermore, in order to improve the working efficiency, when welding work is conveniently carried out on one support plate, a product to be welded can be placed on the other support plate by feeding the other support plate in the period so as to prepare for welding, the Z-axis movement assembly and the support plate form two welding positioning assemblies, the two welding positioning assemblies are arranged on the desktop base side by side, and the two welding positioning assemblies are both positioned below the Y-axis movement assembly.
Furthermore, in order to achieve a more accurate driving and positioning effect, the X-axis movement assembly comprises an X-axis driving motor, an X-axis lead screw nut and an X-axis slide rail, the X-axis driving motor drives the X-axis lead screw to rotate, the X-axis lead screw nut is in threaded connection with the X-axis lead screw, an X-axis sliding part is arranged on the X-axis lead screw nut, the Y-axis movement assembly is fixedly connected with the X-axis sliding part, and the X-axis sliding part is in sliding connection with the X-axis slide rail;
the Y-axis movement assembly comprises a Y-axis driving motor, a Y-axis lead screw nut and a Y-axis slide rail, the Y-axis driving motor drives the Y-axis lead screw to rotate, the Y-axis lead screw nut is in threaded connection with the Y-axis lead screw, a Y-axis sliding piece is arranged on the Y-axis lead screw nut, the injection assembly is fixedly connected with the Y-axis sliding piece, and the Y-axis sliding piece is in sliding connection with the Y-axis slide rail;
the Z-axis movement assembly comprises a Z-axis driving motor, a Z-axis lead screw nut and a Z-axis slide rail, the Z-axis driving motor drives the Z-axis lead screw to rotate, the Z-axis lead screw nut is in threaded connection with the Z-axis lead screw, a Z-axis sliding part is arranged on the Z-axis lead screw nut, the supporting plate is fixedly connected with the Z-axis sliding part, and the Z-axis sliding part is in sliding connection with the Z-axis slide rail.
Furthermore, in order to conveniently realize the control operation of the welding process, a display support is arranged on one side of the door-shaped support, and a display is arranged on the display support.
Furthermore, in order to facilitate control operation of the device from different angles, the display support is an angle-adjustable display support.
Further, in order to promote the inside radiating effect of desktop base, inside industrial computer and the servo motor driver of being equipped with of desktop base, the rear of desktop base is equipped with radiator fan.
The utility model has the advantages that: in the technical scheme, the laser emission component comprises a semiconductor laser generator, compared with the traditional fiber laser, the energy distribution of light beams generated by the semiconductor laser generator is flat-top type, the energy distribution is uniform, and different from Gaussian light beams generated by the fiber laser, the energy of the flat-top light beams can be contained in a given area more clearly, the flat-top light beams are used for welding, the welding is more accurate, the damage to the surrounding area can be reduced, and when the flat-top light beams are used for welding, the welding gap can be smoother than that of the Gaussian light beams.
Drawings
Fig. 1 is a schematic structural view of a first viewing angle of the present invention;
FIG. 2 is a schematic view of the hidden part of the present invention;
FIG. 3 is another schematic view of the hidden part of the present invention;
FIG. 4 is a schematic view of a solder ball bonding assembly according to the present invention;
fig. 5 is a schematic structural diagram of the middle laser emitting assembly of the present invention.
In the figure: a desktop base 1; solder ball bonding the component 2; a laser emitting assembly 3; a heat sink 3.1; a heat dissipation channel 3.2; the injection assembly 4; 4.1 of a spray head; a connecting chamber 4.2; an inert gas inlet 4.3; a semiconductor laser generator 5; an optical fiber connector 6; a heat radiation fan 7; a vision device 8; an X-axis motion assembly 9; a Y-axis motion assembly 10; a Z-axis motion assembly 11; a gate bracket 12; a support plate 13; a coaming 14; an upper end plate 15; an operation button 16; an X-axis drive motor 17; an X-axis screw 18; an X-axis slider 20; a display stand 21; a display 22; an industrial personal computer 23; a servo motor driver 24; a support leg 25; an X-axis slide rail 26; a Y-axis drive motor 27; a Z-axis drive motor 28; a Y-axis screw 29; a Y-axis screw nut 30; a Y-axis slider 31; a Y-axis slide rail 32; a Z-axis lead screw 33 and a Z-axis lead screw nut 34; a Z-axis slide rail 35; a Z-axis slide 36.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be briefly described below with reference to the accompanying drawings and the description of the embodiments or the prior art, and it is obvious that the following description of the structure of the accompanying drawings is only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without any inventive work. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto.
Example 1:
as shown in fig. 1-5, the present embodiment provides an integrated semiconductor laser solder ball bonding desktop machine, which includes a desktop base 1, an XYZ axis motion assembly, a solder ball bonding assembly 2 and a laser emission assembly 3, wherein the XYZ axis motion assembly is disposed on the desktop base 1, the solder ball bonding assembly 2 is disposed on the XYZ axis motion assembly, and the XYZ axis motion assembly is configured to drive the solder ball bonding assembly 2 to move along an X direction, a Y direction and a Z direction;
the tin ball welding component 2 comprises a spraying component 4, the spraying component 4 comprises a connecting chamber 4.2, a spray head 4.1, an inert gas inlet 4.3, a tin ball inlet and an optical fiber connector 6, specifically, the spray head 4.1 is arranged at the lower end of the connecting chamber 4.2, the inert gas inlet 4.3 and the tin ball inlet are communicated with the connecting chamber 4.2, and the optical fiber connector 6 is arranged at the top of the connecting chamber 4.2; the laser emission component 3 comprises a semiconductor laser generator 5, the semiconductor laser generator 5 is connected with the optical fiber connector 6 through optical fibers, and the semiconductor laser generator 5 guides laser into the injection component 4 through the optical fibers to act on the solder balls.
It should be noted that the injection component 4 is designed in the prior art, and the specific principle is that the solder ball enters the connecting chamber 4.2 from the solder ball inlet, and meanwhile, the semiconductor laser generator 5 is connected with the optical fiber connector 6 through the optical fiber, so that the laser is guided into the connecting chamber 4.2 to act on the solder ball, the solder ball is melted, meanwhile, the inert gas enters the connecting chamber 4.2 from the inert gas inlet, and the high-pressure gas can cause the laser melted tin liquid to be sprayed out from the nozzle 4.1 to the position of the product to be welded, which needs to be welded.
In the technical scheme, as the laser emission component 3 comprises the semiconductor laser generator 5, compared with the traditional fiber laser, the energy distribution of the light beam generated by the semiconductor laser generator 5 is flat-top type, the energy distribution is uniform, and different from the Gaussian light beam generated by the fiber laser, the energy of the flat-top light beam can be more clearly contained in a given area, the flat-top light beam welding is used, the welding is more accurate, the damage to the surrounding area can be reduced, and when the flat-top light beam is used for welding, the welding gap can be more uniform and smooth than the Gaussian light beam, therefore, the technical scheme adopts the semiconductor laser generator 5, namely, a semiconductor module is coupled into a laser tin ball welding system, so that the light source generated by the semiconductor laser generator 5 is the flat-top light in the technical aspect, the technical requirement of laser tin ball welding is better met compared with the Gaussian light source of the fiber laser, the heat affected area and the damage can be reduced while the utilization rate of the laser energy can be improved, and the problem that the device is easily damaged when the Gaussian light beam generated by the fiber laser in the tin ball welding system in the prior art is solved.
Example 2:
this embodiment is optimized based on embodiment 1 described above.
In order to improve the heat dissipation effect of the semiconductor laser generator 5 and ensure the stability of the operation of the device, the laser emission assembly 3 comprises a heat radiator 3.1, a heat dissipation fan 7 is arranged on one side of the heat radiator 3.1, and the semiconductor laser generator 5 is arranged on the other side of the heat radiator 3.1. In order to achieve better heat dissipation effect, the heat sink 3.1 includes a plurality of heat dissipation channels 3.2, the heat dissipation fan 7 is located at one side close to the heat dissipation channels 3.2, and the semiconductor laser generator 5 is located at the other side far from the heat dissipation channels 3.2.
Example 3:
this embodiment is optimized based on embodiment 1 described above.
The laser emitting assembly 3 is arranged inside the desktop base 1. The compact integrated design is adopted, the components including the laser emitting assembly 3 are integrated in a desktop-level device as much as possible, the whole volume of the device is small, the occupied space is small, and the packaging and transportation cost is lower.
Example 4:
this embodiment is optimized based on embodiment 1 described above.
The solder ball bonding package 2 comprises a vision device 8, the vision device 8 being located at one side of the jetting package 4. The vision device 8 comprises a CCD camera used for collecting the welding spot images in real time, the controller can automatically visually detect and analyze the welding effect according to the welding spot images, then the supplementary welding is executed according to the welding effect, the welding quality is improved, the image recognition and control of the part are the prior art, and the description is omitted.
Example 5:
this embodiment is optimized based on embodiment 4 described above.
In order to better realize the compact effect of the whole structure of the device, the XYZ axis motion assembly comprises an X axis motion assembly 9, a Y axis motion assembly 10 and a Z axis motion assembly 11, a door-shaped support 12 is arranged on the desktop base 1, the X axis motion assembly 9 is arranged on the door-shaped support 12, the Y axis motion assembly 10 is arranged on the X axis motion assembly 9, the X axis motion assembly 9 drives the Y axis motion assembly 10 to move in the X axis direction, the spraying assembly 4 and the vision device 8 are both arranged on the Y axis motion assembly 10, the Y axis motion assembly 10 drives the solder ball welding assembly 2 to move in the Y axis direction, the Z axis motion assembly 11 is arranged on the desktop base 1, the Z axis motion assembly 11 is positioned below the Y axis motion assembly 10, the solder ball welding assembly 2 comprises a support plate 13, the support plate 13 is arranged on the Z axis motion assembly 11, and the Z axis motion assembly 11 drives the support plate 13 to move in the Z axis direction.
Example 6:
this example was optimized based on example 5 described above.
In order to improve the working efficiency and facilitate the welding work on one support plate 13, the other support plate 13 can be loaded during the period, the product to be welded is placed on the other support plate 13 to be ready for welding, the Z-axis moving assembly 11 and the support plate 13 form two welding positioning assemblies, the two welding positioning assemblies are arranged on the desktop base 1 side by side, and the two welding positioning assemblies are both positioned below the Y-axis moving assembly 10.
It should be noted that the desktop base 1 includes a bottom plate and a surrounding plate 14 disposed around the bottom plate, an upper end plate 15 is disposed at an upper end of the surrounding plate 14, and the z-axis moving assembly 11 is disposed at a middle position of the upper end plate 15.
For convenient operation, the front enclosing plate of the desktop base is provided with an inclined surface, and an operation button 16 is arranged on the inclined surface.
Example 7:
this example was optimized based on example 5 described above.
In order to achieve a more accurate driving and positioning effect, the X-axis movement assembly 9 comprises an X-axis driving motor 17, an X-axis lead screw 18, an X-axis lead screw nut and an X-axis slide rail 26, the X-axis driving motor 17 drives the X-axis lead screw 18 to rotate, the X-axis lead screw nut is in threaded connection with the X-axis lead screw 18, an X-axis sliding part 20 is arranged on the X-axis lead screw nut, the Y-axis movement assembly 10 is fixedly connected with the X-axis sliding part 20, and the X-axis sliding part 20 is in sliding connection with the X-axis slide rail 26;
the Y-axis movement assembly 10 comprises a Y-axis driving motor 27, a Y-axis lead screw 29, a Y-axis lead screw nut 30 and a Y-axis slide rail 32, the Y-axis driving motor 27 drives the Y-axis lead screw 29 to rotate, the Y-axis lead screw nut 30 is in threaded connection with the Y-axis lead screw 29, a Y-axis sliding piece 31 is arranged on the Y-axis lead screw nut 30, the injection assembly 4 is fixedly connected with the Y-axis sliding piece 31, and the Y-axis sliding piece 31 is in sliding connection with the Y-axis slide rail 32;
the Z-axis movement assembly 11 comprises a Z-axis driving motor 28, a Z-axis lead screw 33, a Z-axis lead screw nut 34 and a Z-axis slide rail 35, the Z-axis driving motor 28 drives the Z-axis lead screw 33 to rotate, the Z-axis lead screw nut 34 is in threaded connection with the Z-axis lead screw 33, a Z-axis sliding piece 36 is arranged on the Z-axis lead screw nut 34, the supporting plate 13 is fixedly connected with the Z-axis sliding piece 36, and the Z-axis sliding piece 36 is in sliding connection with the Z-axis slide rail 35.
Example 8:
this embodiment is optimized based on embodiment 5 described above.
In order to realize the control operation of the welding process, a display bracket 21 is arranged on one side of the door-shaped bracket 12, and a display 22 is arranged on the display bracket 21.
Example 9:
this embodiment is optimized based on embodiment 8 described above.
In order to facilitate the control operation of the device from different angles, the display bracket 21 is an angle-adjustable display bracket.
Example 10:
this embodiment is optimized based on embodiment 1 described above.
In order to improve the integration effect and the heat dissipation effect inside the desktop base 1, an industrial personal computer 23 and a servo motor driver 24 are arranged inside the desktop base 1, and a heat dissipation fan 7 is arranged behind the desktop base 1. The desktop base 1 comprises a bottom plate and surrounding plates 14 arranged around the bottom plate, the three cooling fans 7 are arranged on the surrounding plates at the rear of the desktop base 1, and specifically, the number of the cooling fans 7 is three, and other numbers can be set according to conditions.
In order to ensure the stability of the working state of the desktop base 1, supporting legs 25 are arranged at four corner positions of the lower end of the desktop base 1.
According to the technical scheme, the device is highly integrated in the overall structural layout of the device, has the advantage of small volume, and greatly improves the laser control response and the optical process effect.
Finally, it should be noted that: the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. Integrated semiconductor laser tin ball welding desktop machine which characterized in that: the desktop comprises a desktop base, an XYZ-axis motion assembly, a solder ball welding assembly and a laser emission assembly, wherein the XYZ-axis motion assembly is arranged on the desktop base, the solder ball welding assembly is arranged on the XYZ-axis motion assembly, and the XYZ-axis motion assembly is used for driving the solder ball welding assembly to move along the X direction, the Y direction and the Z direction;
the tin ball welding assembly comprises a spraying assembly, the spraying assembly comprises a connecting chamber, a spray head, an inert gas inlet, a tin ball inlet and an optical fiber connector, the laser emission assembly comprises a semiconductor laser generator, the semiconductor laser generator is connected with the optical fiber connector through optical fibers, and the semiconductor laser generator is used for guiding laser into the spraying assembly through the optical fibers to act on the tin ball.
2. The integrated desktop welding machine of claim 1, wherein: the laser emission assembly comprises a radiator, a radiating fan is arranged on one side of the radiator, and the semiconductor laser generator is arranged on the other side of the radiator.
3. The integrated semiconductor laser tin ball welding desktop machine as claimed in claim 1, wherein: the laser emitting assembly is arranged inside the desktop base.
4. The integrated semiconductor laser tin ball welding desktop machine as claimed in claim 1, wherein: the solder ball bonding assembly includes a vision device located on one side of the jetting assembly.
5. The integrated semiconductor laser tin ball welding desktop machine as claimed in claim 4, wherein: the X-axis and Y-axis movement assembly comprises an X-axis movement assembly, a Y-axis movement assembly and a Z-axis movement assembly, a door-shaped support is arranged on the desktop base, the X-axis movement assembly is arranged on the door-shaped support, the Y-axis movement assembly is arranged on the X-axis movement assembly, the X-axis movement assembly drives the Y-axis movement assembly to move in the X-axis direction, the spraying assembly and the vision device are both arranged on the Y-axis movement assembly, the Y-axis movement assembly drives the solder ball welding assembly to move in the Y-axis direction, the Z-axis movement assembly is arranged on the desktop base, the Z-axis movement assembly is located below the Y-axis movement assembly, the solder ball welding assembly comprises a supporting plate, the supporting plate is arranged on the Z-axis movement assembly, and the Z-axis movement assembly drives the supporting plate to move in the Z-axis direction.
6. The integrated semiconductor laser tin ball welding desktop machine as claimed in claim 5, wherein: z axle motion subassembly and backup pad constitute the welding position subassembly, the welding position subassembly has two, and two welding position subassemblies set up side by side on the desktop base, and two welding position subassemblies all are located the below of Y axle motion subassembly.
7. The integrated semiconductor laser tin ball welding desktop machine as claimed in claim 5, wherein: the X-axis movement assembly comprises an X-axis driving motor, an X-axis lead screw nut and an X-axis slide rail, the X-axis driving motor drives the X-axis lead screw to rotate, the X-axis lead screw nut is in threaded connection with the X-axis lead screw, an X-axis sliding part is arranged on the X-axis lead screw nut, the Y-axis movement assembly is fixedly connected with the X-axis sliding part, and the X-axis sliding part is in sliding connection with the X-axis slide rail;
the Y-axis movement assembly comprises a Y-axis driving motor, a Y-axis lead screw nut and a Y-axis slide rail, the Y-axis driving motor drives the Y-axis lead screw to rotate, the Y-axis lead screw nut is in threaded connection with the Y-axis lead screw, a Y-axis sliding piece is arranged on the Y-axis lead screw nut, the injection assembly is fixedly connected with the Y-axis sliding piece, and the Y-axis sliding piece is in sliding connection with the Y-axis slide rail;
the Z-axis movement assembly comprises a Z-axis driving motor, a Z-axis lead screw nut and a Z-axis slide rail, the Z-axis driving motor drives the Z-axis lead screw to rotate, the Z-axis lead screw nut is in threaded connection with the Z-axis lead screw, a Z-axis sliding part is arranged on the Z-axis lead screw nut, the supporting plate is fixedly connected with the Z-axis sliding part, and the Z-axis sliding part is in sliding connection with the Z-axis slide rail.
8. The integrated semiconductor laser tin ball welding desktop machine as claimed in claim 5, wherein: and a display support is arranged on one side of the door-shaped support, and a display is arranged on the display support.
9. The integrated semiconductor laser tin ball welding desktop machine as claimed in claim 8, wherein: the display support is an angle-adjustable display support.
10. The integrated semiconductor laser tin ball welding desktop machine as claimed in claim 1, wherein: the desktop base is internally provided with an industrial personal computer and a servo motor driver, and the rear of the desktop base is provided with a cooling fan.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222015927.5U CN218694698U (en) | 2022-08-01 | 2022-08-01 | Integrated semiconductor laser tin ball welding desktop machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222015927.5U CN218694698U (en) | 2022-08-01 | 2022-08-01 | Integrated semiconductor laser tin ball welding desktop machine |
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| CN218694698U true CN218694698U (en) | 2023-03-24 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117399735A (en) * | 2023-10-26 | 2024-01-16 | 深圳市昊芯科技有限公司 | Automatic laser soldering method and device |
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2022
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117399735A (en) * | 2023-10-26 | 2024-01-16 | 深圳市昊芯科技有限公司 | Automatic laser soldering method and device |
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