CN218691653U

CN218691653U - Testing device for various chip packaging forms

Info

Publication number: CN218691653U
Application number: CN202222694018.9U
Authority: CN
Inventors: 邵立伟; 刘富强
Original assignee: Jiangxi Jijing Microelectronics Co ltd
Current assignee: Jiangxi Jijing Microelectronics Co ltd
Priority date: 2022-10-13
Filing date: 2022-10-13
Publication date: 2023-03-24
Anticipated expiration: 2032-10-13

Abstract

The utility model relates to a package chip detects technical field, concretely relates to testing arrangement that can be used to multiple chip package form. The utility model provides a simple operation, high testing arrangement that can be used to multiple chip package form of efficiency of software testing. The utility model provides a testing device which can be used for a plurality of chip packaging forms, comprising a bracket, a slide rail, a bottom frame, a cylinder, a connecting plate and the like; the slide rail is installed symmetrically to chassis length direction's both sides, and common slidingtype is connected with the support on the slide rail, and the chassis top is located to the support, and support upside middle part is connected with the cylinder, and the cylinder telescopic link is connected with the connecting plate. Through the cooperation of first clamp plate and first elastic component, the cooperation of second clamp plate and shell fragment, realize carrying out effectual centre gripping fixedly to the encapsulation chip of different encapsulation forms, drive through the cylinder and detect the piece and move down, realize carrying out effective test to the encapsulation chip that uses different packaging material on a detection device.

Description

Testing device for various chip packaging forms

Technical Field

The utility model relates to a package chip detects technical field, concretely relates to testing arrangement that can be used to multiple chip package form.

Background

After the chip is packaged, various detections are needed to be carried out on the chip so as to separate a good product from a bad product; there are many tests for chips, and among them, the package chip pressure-resistant test is one of the test contents of the chip.

The packaging forms of the chip are various, metal packaging, plastic packaging and ceramic packaging are distinguished according to materials, the packaging materials are different, clamping mechanisms needed to be used for testing the chip are different, and the conventional chip packaging testing device is generally provided with corresponding clamping devices for different materials of the chip.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an overcome among the prior art and need adopt different packaging hardware just can carry out effective test to the packaging chip and lead to the shortcoming that efficiency of software testing is low to the packaging chip of using different packaging material's encapsulation chip, the to-be-solved technical problem of the utility model is to provide a testing arrangement that can be used to multiple chip package form.

In order to solve the technical problem, the utility model provides a such testing arrangement that can be used to multiple chip package form, which comprises a bracket, the cylinder, detect the piece, the chassis, a slide rail, connecting plate and fixture, the slide rail is installed to chassis length direction's bilateral symmetry, common slidingtype connection has the support on the slide rail, the chassis top is located to the support, support upside middle part is connected with the cylinder, the cylinder telescopic link is connected with the connecting plate, the connecting plate bottom is connected with the detection piece that is used for carrying out the test for the packaged chip evenly at interval, a plurality of standing grooves that are used for placing the test chip are offered evenly at interval on the chassis, be equipped with in the standing groove and be used for carrying out the fixed fixture of centre gripping with the chip that awaits measuring.

Preferably, the clamping mechanism comprises a first clamping plate, a second elastic piece, sliding rods, a second clamping plate and elastic pieces, wherein the two sides of the underframe in the length direction are symmetrically and slidably connected with a plurality of sliding rods, the sliding rods penetrate through the corresponding side faces of the underframe and slidably extend into the placing grooves, the end portions of the sliding rods extending into the placing grooves are jointly connected with the first clamping plate, the second elastic piece is arranged between the first clamping plate and the underframe, the second elastic piece is wound on the sliding rods, the two inner side walls of the rest placing grooves are symmetrically connected with the elastic pieces, and the elastic pieces are connected with the second clamping plate.

Preferably, the storage rack further comprises a placing plate, a push-pull frame and first elastic pieces, wherein the push-pull frame is connected to the inner side of the underframe in a sliding mode, the push-pull frame is arranged below the placing groove, the placing plates with the number being consistent with that of the placing groove are uniformly arranged on the push-pull frame at intervals, and the first elastic pieces are symmetrically arranged between the push-pull frame and the inner side of the underframe.

Preferably, the device further comprises a guide rod, the guide rod is symmetrically connected to the upper portion of the connecting plate, and the guide rod penetrates through the support and is connected with the support in a sliding mode.

Preferably, the device also comprises a slide way, and the inner side of the bottom of the underframe is provided with the slide way.

Preferably, the slideway is arranged obliquely towards the outer side of the underframe.

The utility model discloses the beneficial effect who reaches as follows:

1. the device can effectively clamp and fix the packaged chips of different packaging materials and can carry out batch testing, has high testing efficiency, and testers can test the packaged chips of different packaging materials only on one device, and has the advantages of simple operation and high testing efficiency;

2. the qualified chips drop on the placing plate below the tested chips, and the qualified packaged chips on the placing plate are collected in a concentrated mode by pulling the push-pull frame, so that the chip packaging device has a high-efficiency collecting function.

Drawings

Fig. 1 is a perspective view of the present invention.

Fig. 2 is a schematic view of a three-dimensional structure of the components of the present invention, such as the first clamping plate and the second clamping plate.

Fig. 3 is a schematic view of a three-dimensional structure of the sliding rod and the elastic sheet of the present invention.

Fig. 4 is the three-dimensional structure schematic diagram of the parts such as the cylinder, the connecting plate and the slide.

Fig. 5 is a schematic perspective view of the push-pull frame and the placing plate of the present invention.

The labels in the figures are: 1-bracket, 2-cylinder, 201-connecting plate, 3-guide rod, 4-detecting block, 5-base frame, 501-slideway, 502-placing plate, 503-push-pull frame, 504-first elastic piece, 6-sliding rail, 7-first clamping plate, 701-second elastic piece, 702-sliding rod, 8-second clamping plate, 801-shrapnel and 9-placing groove.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and examples.

Example 1

As shown in fig. 1, a testing device applicable to multiple chip packaging forms includes a support 1, a cylinder 2, a guide rod 3, a detection block 4, a chassis 5, a slide rail 6, a connecting plate 201 and a clamping mechanism, the slide rail 6 is symmetrically installed on the left side and the right side of the chassis 5 by a welding mode, the support 1 of the shape of the character 20866is jointly and slidably connected to the slide rail 6, the cylinder 2 is connected to the middle part of the upper side of the support 1 by a bolt, the cylinder 2 is connected to a telescopic rod, the connecting plate 201 is connected to 3 detection blocks 4 for testing packaged chips at uniform intervals, the guide rod 3 is symmetrically connected to the upper part of the connecting plate 201 by taking the cylinder 2 as the center, the guide rod 3 penetrates through the support 1 and is slidably connected to the support, the guide rod 3 provides a guiding function for the lifting of the

detection blocks

4, 9 placing grooves 9 for placing the test chips are uniformly arranged on the chassis 5 at intervals, and the clamping mechanism for clamping and fixing the chips to be tested is arranged in the placing grooves 9.

As shown in fig. 1-3, the clamping mechanism includes a first clamping plate 7, a second elastic member 701, a sliding rod 702, a second clamping plate 8 and a spring plate 801, the left and right sides of the bottom frame 5 are symmetrically and slidably connected with a plurality of sliding rods 702, the sliding rods 702 penetrate through the corresponding side surfaces of the bottom frame 5 and slidably extend into the placing groove 9, the end portions of the sliding rods 702 extending into the placing groove 9 are jointly connected with the first clamping plate 7, the second elastic member 701 is arranged between the first clamping plate 7 and the bottom frame 5, the second elastic member 701 is wound on the sliding rods 702, the inner walls of the two symmetrical sides of the placing groove 9 in the middle of the bottom frame 5 are symmetrically connected with the spring plate 801, and the spring plate 801 is connected with the second clamping plate 8.

As shown in fig. 4-5, the foldable type portable electronic device further comprises a placement plate 502, a push-pull frame 503 and first elastic members 504, wherein the push-pull frame 503 is slidably connected to the inner side of the bottom frame 5, the push-pull frame 503 is disposed below the placement groove 9, the placement plates 502 are uniformly spaced on the push-pull frame 503, the number of the placement plates 502 is the same as that of the placement grooves 9, and the first elastic members 504 are symmetrically disposed between the push-pull frame 503 and the inner side of the bottom frame 5.

When the device is required to be used for carrying out compression resistance testing on packaged chips, a worker places the packaged chips to be tested in the placing groove 9 of the underframe 5, the packaged chips are tightly pressed between the inner wall of the placing groove 9 and the first clamping plate 7 through the matching of the first clamping plate 7 and the second elastic piece 701, similarly, the second clamping plate 8 is matched with the elastic piece 801 to tightly press the packaged chips between the symmetrical second clamping plates 8, and the placing plate 502 provides bottom auxiliary supporting effect for the packaged chips below the placing groove 9, so that the packaged chips to be tested are clamped and fixed; the connecting plate 201 is driven to move downwards through the air cylinder 2, the connecting plate 201 drives the detection block 4 to move downwards, the detection block 4 moves downwards to test the packaged chips in the placing groove 9, when the packaged chips are tested and confirmed to be good through the detection block 4, the controller respectively compresses the second elastic piece 701 and the elastic piece 801 through controlling the first clamping plate 7 and the second clamping plate 8, so that the good packaged chips fall onto the placing plate 502 below the good packaged chips, and the packaged chips which do not pass the detection block 4 and are not good are kept in a clamping state; the packaged chips in the placing groove 9 are sequentially tested by moving the bracket 1 on the slide rail 6; after the test is completed, the worker pulls the push-pull frame 503 backwards, the push-pull frame 503 moves backwards to push the packaged chips on the placing plate 502 to the position below the placing plate 502, the first elastic piece 504 enables the push-pull frame 503 to keep a proper displacement distance and can reset in time, and therefore the packaged chips after the test are collected in a centralized mode.

Example 2

As shown in fig. 4, on the basis of embodiment 1, the present invention further includes a slide 501, the inner side of the bottom frame 5 is provided with the slide 501, and the slide 501 is inclined toward the outer side of the bottom frame 5.

The arrangement of the slide 501 enables the packaged chip to slide from back to front after falling off from the placing plate 502, so that the function of centralized collection is realized.

The above-mentioned embodiments only represent the preferred embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several changes, modifications and substitutions can be made, which are all within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a testing arrangement that can be used to multiple chip package form, including support (1), cylinder (2), chassis (5) and slide rail (6), slide rail (6) are installed to chassis (5) length direction's bilateral symmetry, common sliding type connection has support (1) on slide rail (6), chassis (5) top is located in support (1), support (1) upside middle part is connected with cylinder (2), a serial communication port, still including detecting piece (4), connecting plate (201) and fixture, cylinder (2) telescopic link is connected with connecting plate (201), connecting plate (201) bottom is connected with detection piece (4) that are used for carrying out the test for the packaged chip evenly at interval, a plurality of standing grooves (9) that are used for placing the test chip have been seted up on chassis (5) evenly at interval, be equipped with in standing groove (9) and be used for carrying out the fixed fixture of centre gripping to the chip.

2. The testing device for the multiple chip packaging forms according to claim 1, wherein the clamping mechanism comprises a first clamping plate (7), a second elastic member (701), a sliding rod (702), a second clamping plate (8) and an elastic sheet (801), wherein a plurality of sliding rods (702) are symmetrically and slidably connected to two sides of the chassis (5) in the length direction, the sliding rods (702) penetrate through corresponding side faces of the chassis (5) and slidably extend into the placing groove (9), the end portions of the sliding rods (702) extending into the placing groove (9) are jointly connected with the first clamping plate (7), the second elastic member (701) is arranged between the first clamping plate (7) and the chassis (5), the second elastic member (701) is wound on the sliding rods (702), the elastic sheets (801) are symmetrically connected to two symmetrical side inner walls of the rest placing grooves (9), and the second clamping plate (8) is connected to the elastic sheet (801).

3. The testing device for the multiple chip packaging forms is characterized by further comprising a placing plate (502), a push-pull frame (503) and first elastic members (504), wherein the push-pull frame (503) is slidably connected to the inner side of the bottom frame (5), the push-pull frame (503) is arranged below the placing groove (9), the placing plates (502) are uniformly arranged on the push-pull frame (503) at intervals, the number of the placing plates (502) is the same as that of the placing grooves (9), and the first elastic members (504) are symmetrically arranged between the push-pull frame (503) and the inner side of the bottom frame (5).

4. A testing device applicable to multiple chip package types according to claim 3, further comprising guide rods (3), wherein the guide rods (3) are symmetrically connected to the upper portion of the connecting plate (201), and the guide rods (3) penetrate through the bracket (1) and are slidably connected with the bracket.

5. The testing device for multiple chip packaging forms according to claim 4, further comprising a slide way (501), wherein the slide way (501) is arranged on the inner side of the bottom frame (5).

6. A testing device applicable to multiple chip package forms according to claim 5, characterized in that the slide (501) is arranged obliquely towards the outer side of the chassis (5).