CN218677148U

CN218677148U - Integrated semiconductor transistor

Info

Publication number: CN218677148U
Application number: CN202223400491.8U
Authority: CN
Inventors: 江子标; 李青春
Original assignee: Shenzhen Quan Li Semiconductor Co ltd
Current assignee: Shenzhen Quan Li Semiconductor Co ltd
Priority date: 2022-12-16
Filing date: 2022-12-16
Publication date: 2023-03-21
Anticipated expiration: 2032-12-16

Abstract

The utility model discloses an integrated semiconductor transistor, which belongs to the technical field of semiconductor transistors and comprises a semiconductor transistor body consisting of a circuit board, a packaging shell and pins, wherein the circuit board is positioned inside the packaging shell, the pins are arranged on the circuit board, one ends of the pins, which are far away from the circuit board, penetrate through the packaging shell, a fixing shell is sleeved on the pins, the fixing shell is positioned outside the packaging shell, and tin rings are arranged in the fixing shell and sleeved on the pins; through aligning the set casing on two semiconductor transistor bodies for pin on two semiconductor transistor bodies can align, and the tin ring on two semiconductor transistor bodies simultaneously can align, and the heating pin can melt the tin ring, makes the molten tin that the tin ring melted can wrap up two relative pins, and then can be quick link two relative pins as an organic whole, and the welding of two semiconductor transistor bodies of being convenient for has improved the convenience.

Description

Integrated semiconductor transistor

Technical Field

The utility model belongs to the technical field of semiconductor transistor, concretely relates to integrated semiconductor transistor.

Background

A transistor is a solid semiconductor device and has a plurality of functions such as detection, rectification, amplification, switching, voltage stabilization, signal modulation, and the like. The transistor, which is a type of variable current switch, is capable of controlling an output current based on an input voltage. Unlike the ordinary mechanical switch, the transistor uses an electrical signal to control its own on/off, and the switching speed can be very fast, however, the existing semiconductor transistor has the following problems during the installation:

1. when the pins of the existing transistors are welded, the pins of two transistors need to be aligned and then welded by molten tin, and the two pins and a tin wire need to be pinched simultaneously in a suspended state, so that the pins are easy to shake, the welding of the pins is influenced, and the operation is complicated;

2. although the existing partial transistor has a heat dissipation function, the heat is mostly dissipated through a heat dissipation net, so that dust easily enters the transistor through the heat dissipation net, influences are caused on the transistor, and the service life of the transistor is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an integrated semiconductor transistor to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: an integrated semiconductor transistor comprises a semiconductor transistor body consisting of a circuit board, a packaging shell and pins, wherein the circuit board is located inside the packaging shell, the pins are arranged on the circuit board, one ends, far away from the circuit board, of the pins penetrate through the packaging shell, fixing shells are sleeved on the pins and located on the outer sides of the packaging shell, tin rings are arranged in the fixing shells, and the tin rings are sleeved on the pins.

In a preferred embodiment, the fixed shell and the tin ring are both slidably disposed on the pins, and one side surface of the fixed shell can be in contact with the packaging shell.

As a preferred embodiment, one end of the pin, which is far away from the circuit board, is provided with a limiting plate, the limiting plate and the pin are integrally formed, and the limiting plate is located inside the tin ring.

In a preferred embodiment, the fixing shell is made of an insulating material, and the fixing shell is made of a high temperature resistant material.

As a preferred embodiment, two heat-conducting plates are symmetrically arranged in the package shell, the two heat-conducting plates are respectively located at two sides of the circuit board, and both the two heat-conducting plates are in contact with the circuit board, and both the two circuit boards penetrate through the package shell.

As a preferred embodiment, a plurality of heat dissipation plates are symmetrically arranged on the package shell, and the plurality of heat dissipation plates are connected with the two heat conduction plates.

Compared with the prior art, the beneficial effects of the utility model are that:

according to the integrated semiconductor transistor, the pins on the two semiconductor transistor bodies can be aligned through aligning the fixing shells on the two semiconductor transistor bodies, the tin rings on the two semiconductor transistor bodies can be aligned at the same time, the tin rings can be melted through heating the pins, so that molten tin of the tin rings can wrap the two opposite pins, the two opposite pins can be rapidly connected into a whole, the two semiconductor transistor bodies can be conveniently welded, and convenience is improved;

this kind of integrated semiconductor transistor utilizes the contact between heat-conducting plate and the circuit board through setting up the heat-conducting plate for the heat that the circuit board effluvium can be derived through the heat-conducting plate, is convenient for dispel the heat to the circuit board, and inseparable contact between heat-conducting plate and the packaging shell can avoid the dust to get into in the packaging shell simultaneously, thereby avoids the dust to cause the influence to the circuit board.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of a partial structure of the present invention;

fig. 3 is a schematic sectional view of the present invention.

In the figure: 1. a circuit board; 2. packaging the shell; 3. a pin; 4. a semiconductor transistor; 5. a stationary housing; 6. a tin ring; 7. a limiting plate; 8. a heat conducting plate; 9. a heat sink.

Detailed Description

In a first embodiment, referring to fig. 1-3, the present invention provides an integrated semiconductor transistor 4 comprising a semiconductor transistor 4 body consisting of a circuit board 1, a package 2 and a pin 3, the circuit board 1 being located inside the package 2, the pin 3 being disposed on the circuit board 1, an end of the pin 3 remote from the circuit board 1 penetrating the package 2, a mounting shell 5 being fitted over the pin 3, the mounting shell 5 being located outside the package 2, a solder ring 6 being disposed within the mounting shell 5, the solder ring 6 being fitted over the pin 3, the two semiconductor transistor 4 bodies being brought into close proximity to each other, the pin 3 on the semiconductor transistor 4 bodies being bent, the ends of the pin 3 on the two semiconductor transistor 4 bodies being brought into alignment, the mounting shells 5 on the two semiconductor transistor 4 bodies being brought into contact, the pin 3 being heated, heat on the pin 3 being transferable to the solder ring 6, the solder ring 6 being melted into molten solder, the solder being able to solidify the mounting shells 4 after cooling, the solder pins 5 being able to be fixed in contact with the mounting shells 4, the pin 3, the mounting shell 3, the pin 3 being prevented from being easily bent, the mounting shell 3 and being brought into contact with the mounting shell 2, the pin 3, the pin being placed on a side of the mounting shell 2, limiting

plate

7 and 3 integrated into one piece of pin, limiting plate 7 are located the inside of tin ring 6, and limiting plate 7 can be spacing to set casing 5, avoids set casing 5 to break away from pin 3, has improved stability, and the material of set casing 5 is insulating material, and the material of set casing 5 is high temperature resistant material, can avoid taking place electrically conductive phenomenon between two pins 3 on the same semiconductor transistor 4 body, has improved the security.

Embodiment two, on the basis of embodiment one, the symmetry is provided with two heat-conducting plates 8 in the packaging shell 2, two heat-conducting plates 8 are located the both sides of circuit board 1 respectively, and two heat-conducting plates 8 all contact with circuit board 1, two circuit boards 1 all run through packaging shell 2, make the heat that circuit board 1 effused can derive through heat-conducting plate 8, be convenient for dispel the heat to circuit board 1, inseparable contact between heat-conducting plate 8 and the packaging shell 2 simultaneously, can avoid the dust to get into packaging shell 2, thereby avoid the dust to cause the influence to circuit board 1, the last symmetry of packaging shell 2 is provided with a plurality of heating panels 9, a plurality of heating panels 9 all are connected with two heat-conducting plates 8, the quantity of heating panel 9 is more, its area of contact with the air is great, when heat-conducting plate 8's heat transmits to heating panel 9, heating panel 9 can be quick dispels the heat.

When using, at first be close to each other two semiconductor transistor 4 bodies, then bend pin 3 on two semiconductor transistor 4 bodies, make the set casing 5 on two semiconductor transistor 4 can align and contact, then heat pin 3, heat transfer on pin 3 is to tin ring 6, can melt tin ring 6, and then can weld pin 3 on two semiconductor transistor 4 bodies, can use semiconductor transistor 4 body this moment, during the use, the heat that circuit board 1 gived off can be passed on to heating panel 9 through heat-conducting plate 8, and dispel the heat through heating panel 9.

Claims

1. An integrated semiconductor transistor, characterized by: the packaging structure comprises a semiconductor transistor body (4) composed of a circuit board (1), a packaging shell (2) and pins (3), wherein the circuit board (1) is located inside the packaging shell (2), the pins (3) are arranged on the circuit board (1), one ends, far away from the circuit board (1), of the pins (3) penetrate through the packaging shell (2), fixing shells (5) are sleeved on the pins (3), the fixing shells (5) are located on the outer sides of the packaging shell (2), tin rings (6) are arranged in the fixing shells (5), and the tin rings (6) are sleeved on the pins (3).

2. An integrated semiconductor transistor according to claim 1, characterized in that: the fixed shell (5) and the tin ring (6) are arranged on the pin (3) in a sliding mode, and one side face of the fixed shell (5) can be in contact with the packaging shell (2).

3. An integrated semiconductor transistor according to claim 2, characterized in that: one end, far away from circuit board (1), of pin (3) is provided with limiting plate (7), limiting plate (7) and pin (3) integrated into one piece, limiting plate (7) are located the inside of tin ring (6).

4. An integrated semiconductor transistor according to claim 1, characterized in that: the fixing shell (5) is made of an insulating material, and the fixing shell (5) is made of a high-temperature-resistant material.

5. An integrated semiconductor transistor according to claim 1, characterized in that: two heat-conducting plates (8) are symmetrically arranged in the packaging shell (2), the two heat-conducting plates (8) are respectively positioned at two sides of the circuit board (1), the two heat-conducting plates (8) are in contact with the circuit board (1), and the two circuit boards (1) penetrate through the packaging shell (2).

6. An integrated semiconductor transistor according to claim 5, characterized in that: a plurality of heat dissipation plates (9) are symmetrically arranged on the packaging shell (2), and the heat dissipation plates (9) are connected with the two heat conduction plates (8).