CN218676073U

CN218676073U - Non-contact dynamic smart card

Info

Publication number: CN218676073U
Application number: CN202223134093.6U
Authority: CN
Inventors: 苏晨; 黄粤宁; 雷玲; 蒋曲明; 邬凯; 孙丽
Original assignee: Chutian Dragon Co ltd
Current assignee: Chutian Dragon Co ltd
Priority date: 2022-11-24
Filing date: 2022-11-24
Publication date: 2023-03-21
Anticipated expiration: 2032-11-24

Abstract

The utility model discloses a non-contact developments smart card, it includes base plate, control circuit board and roof, base plate and roof all still are equipped with suggestion subassembly and anti-skidding structure, control circuit board includes that the non-connects the electricity of getting antenna module, voltage stabilizing module, a plurality of drive module, chip module one, chip module two and protection circuit. The utility model is provided with the prompt component for providing the fluorescence prompt function and the temperature change prompt function, thereby improving the searching convenience and the use safety; the non-access electricity-taking antenna module consisting of the wireless power supply coil and the non-contact communication coil is adopted, so that mutual interference is prevented, the stability of power supply driving and the stability of transaction data are ensured, and the stability of effect and data interaction of subsequent dynamic display of the intelligent card are ensured; the protection circuit is arranged to play a role of circuit disconnection protection.

Description

Non-contact dynamic smart card

Technical Field

The utility model relates to a technical field of intelligent transaction card, concretely relates to non-contact developments smart card.

Background

Due to the rapid development of electronic equipment, smart card consumption relates to various fields, such as telephone cards, bank cards, medical insurance cards and the like, and the smart card consumption brings convenience to both parties of users, so that the smart card consumption becomes a consumption mode which is deeply popular.

The existing non-contact smart card has no prompting function, the position of the smart card is difficult to quickly know at night or in a dark environment, the searching convenience is low, the loss is easy, and the user experience effect is influenced; the existing smart card has poor heat dissipation effect, internal electronic modules are easily damaged due to heat accumulation, and the long-time accumulation of temperature may affect the holding comfort level of a user and the sample extraction effect of the user; in order to improve the appearance effect, the existing smart card is provided with dynamic display of lamp beads when in use, but the lamp beads and the transaction module of the existing smart card are used alternately by adopting the same coil, and the coil can provide the power supply function and the antenna function; the existing smart card has no protection circuit, but when an internal coil breaks down to cause overvoltage and overcurrent, the internal chip or chip data can be damaged, and the use of a user is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a non-contact developments smart card to present technique not enough.

The utility model discloses a realize that the technical scheme that above-mentioned purpose adopted is:

a non-contact dynamic smart card comprises a base plate, a control circuit board and a top plate, wherein the base plate is provided with a cavity, the control circuit board is arranged in the cavity, the top plate is arranged above the base plate, both the base plate and the top plate are provided with a prompt component and an anti-skidding structure, the top plate is provided with a pattern display part, and the base plate is provided with a contact heat dissipation structure;

the control circuit board comprises a non-connection power taking antenna module, a voltage stabilizing module, a plurality of driving modules, a chip module I and a chip module II, wherein the non-connection power taking antenna module is electrically connected with the voltage stabilizing module, the voltage stabilizing module is electrically connected with the chip module I and the driving modules, the chip module I is electrically connected with the chip module II, the chip module I is electrically connected with the driving modules, the driving modules are provided with LED lamp array modules, the voltage stabilizing module is provided with a voltage stabilizing circuit, and the voltage stabilizing circuit is provided with a protection circuit.

The improved fluorescent light is characterized in that grooves are formed in the bottom surface of the base plate and the top surface of the top plate, a plurality of slotted holes are formed in the grooves and communicated with the cavity, the prompting assembly comprises a plurality of fluorescent temperature color-changing adhesive tapes which are arranged in the grooves respectively in a plurality of ways, and a plurality of contact portions are arranged in the slotted holes respectively and communicated with the cavity.

The LED lamp array module is arranged below the pattern display part, and the pattern display part comprises a transparent part and a color ink part.

The improved structure comprises a base plate, a contact heat dissipation structure and a plurality of through holes, wherein the outer side surface of the base plate is provided with a first groove, the inner side surface of the base plate is provided with a second groove, the first grooves are connected and communicated with the second grooves through a plurality of first through holes, the contact heat dissipation structure comprises a plurality of heat conduction heat dissipation silica gel strips, the plurality of heat conduction heat dissipation silica gel strips comprise a first heat conduction silica gel strip, a second heat conduction silica gel strip and a plurality of heat conduction silica gel columns, the first heat conduction silica gel strip is arranged in the first grooves, the second heat conduction silica gel strip is arranged in the second grooves, the plurality of heat conduction silica gel columns are arranged in the first through holes respectively, one ends of the heat conduction silica gel columns are connected with the first heat conduction silica gel strips, the other ends of the heat conduction silica gel columns are connected with the second heat conduction silica gel strips, the first heat conduction silica gel strips are also provided with a plurality of heat dissipation grooves, and the inner side surfaces of the heat dissipation grooves are also provided with a plurality of strip grooves.

The non-contact power taking antenna module comprises a wireless power supply coil, a non-contact communication coil and a placing plate, wherein the wireless power supply coil and the non-contact communication coil are arranged on the placing plate, an amorphous material layer is arranged between the wireless power supply coil and the non-contact communication coil and used for carrying out magnetic isolation processing on the non-contact communication coil, the amorphous material layer is subjected to magnetic loss reduction processing, the wireless power supply coil is provided with a connecting end VA1 and a connecting end VB1, the non-contact communication coil is provided with a connecting end VA2 and a connecting end VB2, the voltage stabilizing module comprises a capacitor C3, a capacitor C1, a full-wave finishing voltage stabilizing circuit and a voltage stabilizing diode D3, the connecting end VA1 is connected with one end of the capacitor C3, the connecting end VB1 is connected with the other end of the capacitor C3, the other end of the capacitor C1 is connected with the other end of the capacitor C3, the bridge type full-wave finishing voltage stabilizing circuit is provided with a connecting end I, a connecting end II and a connecting end III, one end of the capacitor C1 is connected with the other end of the connecting end of the capacitor C1, the connecting end of the voltage stabilizing diode D3 is connected with the connecting end of the capacitor C3, the connecting end of the voltage stabilizing diode 3 is connected with the connecting end of the diode VIN 3, the connecting end of the diode 3D 3, and the connecting end of the diode 3D 3 are connected with the connecting end of the diode 3, and the ground terminal of the diode 3D 3 are connected with the ground terminal, and the diode 3D 3 are provided with the ground terminal.

The protection circuit comprises two fusing protectors, and the fusing protectors are arranged between the connecting end VA1 and one end of the capacitor C3 and between the connecting end VB1 and the other end of the capacitor C3 respectively.

The chip module I is an SE chip, the chip module I is provided with an SPI interface module and a GPIO module, the chip module II is an SE non-connected wafer chip, the chip module I and the chip module II are respectively provided with a pin end 5, a pin end 6, a pin end 7, a pin end 8, a pin end 9 and a pin end 10, the pin end 5 is connected with the connecting end VA2, the pin end 6 is connected with the connecting end VB2, the pin end 7 of the chip module I is connected with the pin end 7 of the chip module II, the pin end 8 of the chip module I is connected with the pin end 8 of the chip module II, the pin end 9 of the chip module I is connected with the pin end 9 of the chip module II, and the pin end 10 of the chip module I is connected with the pin end 10 of the chip module II.

Chip module one still is equipped with VCC1 link and VCC2 link, VCC1 link and VCC2 link are connected, VCC1 link is equipped with four and five links of link with VCC2 link, the link is four to be equipped with electric capacity C4, electric capacity C4's the other end is connected with the earthing terminal, five links are equipped with test end M, be equipped with link six between five links and the test end M, link six with the VCC link is connected, chip module one still is equipped with VSS link and pin end 11, pin end 11 is equipped with resistor R4, resistor R4's the other end is equipped with DI1 end.

The voltage stabilizing circuit comprises a chip module III and a capacitor C5, the chip module III is provided with a connecting end OR, a connecting end OG, a connecting end OB, a connecting end GND, a connecting end VCC3, a connecting end DI and a connecting end DO, the connecting end VCC3 is connected with the VIN connecting end, a connecting end VII is arranged between the connecting end VCC3 and the VIN connecting end, the connecting end VII is connected with one end of the capacitor C5, the other ends of the connecting end GND and the capacitor C5 are provided with a grounding end II, the connecting end DI is connected with the DI1 end, the connecting end DO is provided with a resistor R5, the resistor R5 is provided with a connecting end DO1, and the connecting end DO1 is used for being connected with another voltage stabilizing circuit.

The LED lamp array module is composed of a plurality of light emitting diodes, one ends of the light emitting diodes are connected in series, the other ends of the light emitting diodes are provided with resistors R11, the other ends of the resistors R11 are connected with a connecting end OR, a connecting end OG and a connecting end OB respectively, and the other ends of the connecting end GND and the capacitor C5 are provided with grounding ends III.

The utility model has the advantages that: the utility model discloses a setting up the suggestion subassembly and being used for providing fluorescence prompt facility and temperature variation prompt facility, fluorescence prompt facility is convenient for know the position of smart card fast in the dim place of environment, conveniently takes, temperature variation prompt facility can change colour along with the change of temperature to audio-visual feedback goes out the temperature conditions of smart card, thereby prevents that the components and parts of internal control circuit board from appearing the short circuit or places the condition that overlong leads to temperature anomaly high temperature on the driver and appearing, is convenient for carry out cooling treatment action to the smart card fast, improves safety in utilization; the contact heat dissipation structure is used for improving the direct contact area between the control circuit board and the outside, so that the heat conduction and heat dissipation effect and efficiency are improved, heat accumulation generated by the non-access antenna module when the intelligent card is used is prevented, potential safety hazards existing in the intelligent card due to heat accumulation are prevented, the safety is improved, the temperature residual time is shortened, the holding comfort level of a user is improved, and the experience effect of the user is improved; by arranging the wireless power supply coil and the non-contact communication coil and arranging the amorphous material layer between the wireless power supply coil and the non-contact communication coil, the communication interaction of power supply and transaction data is separated, mutual interference is prevented, the stability of power supply driving and the stability of transaction data are ensured, and the stability of subsequent effect of dynamic display of the smart card and the stability of data interaction are ensured; the protection circuit is used for protecting the circuit from being disconnected, so that the influence of abnormal overcurrent and overvoltage on other elements in the control circuit board is prevented, data loss is prevented, the use safety and the protectiveness are improved, and the service life of the intelligent card is prolonged.

The present invention will be further described with reference to the accompanying drawings and the following detailed description.

Drawings

Fig. 1 is a schematic diagram of an overall structure of a contactless dynamic smart card according to the present embodiment;

FIG. 2 is a schematic bottom view of the contactless dynamic smart card of the present embodiment;

FIG. 3 is a schematic sectional view of the present embodiment;

fig. 4 is a schematic structural diagram of a non-antenna module of the present embodiment;

FIG. 5 is a schematic diagram of a control circuit board module according to the present embodiment;

fig. 6 is a circuit diagram of the control circuit board of the present embodiment.

Detailed Description

The following description is only a preferred embodiment of the present invention, and does not limit the scope of the present invention.

In the embodiment, referring to fig. 1 to 6, a non-contact dynamic smart card 1 includes a substrate 2, a control circuit board 3, and a top plate 4, where the substrate 2 has a cavity 5, the control circuit board 3 is disposed in the cavity 5, the top plate 4 is disposed above the substrate 2, the top plate 4 and the substrate 2 are fused into an integral structure by pressing, the substrate 2 and the top plate 4 are both provided with a prompt component 8 and an anti-slip structure 9, the top plate 4 is provided with a pattern display portion 10, and the substrate 2 is provided with a contact heat dissipation structure 11;

the control circuit board 3 comprises a non-connection electricity-taking antenna module 30, a voltage-stabilizing module 31, a plurality of driving modules 32, a first chip module 33 and a second chip module 34, the non-connection electricity-taking antenna module 30 is electrically connected with the voltage-stabilizing module 31, the voltage-stabilizing module 31 is electrically connected with the first chip module 33 and the driving modules 32, the first chip module 33 is electrically connected with the second chip module 34, the first chip module 33 is electrically connected with the plurality of driving modules 32, the plurality of driving modules 32 are provided with LED lamp array modules 35, the voltage-stabilizing module 31 is provided with a voltage-stabilizing circuit 37, and the voltage-stabilizing circuit 37 is provided with a protection circuit 38.

The bottom surface of base plate 2 and the top surface of roof 4 all are equipped with the recess, the recess all is equipped with a plurality of slotted holes, and is a plurality of the slotted hole all with cavity 5 is connected the intercommunication, suggestion subassembly 8 includes a plurality of fluorescence temperature adhesive tape that discolours, and is a plurality of fluorescence temperature adhesive tape that discolours sets up respectively in the recess, and is a plurality of fluorescence temperature adhesive tape that discolours all is equipped with a plurality of contact sites, the contact site sets up respectively in the slotted hole, just the contact site with the intercommunication is connected to cavity 5, carry out sealing process between suggestion subassembly 8 and the base plate 2, suggestion subassembly 8 is used for providing fluorescence prompt facility and temperature variation prompt facility, fluorescence prompt facility knows the position of smart card 1 fast in the dim place of environment, conveniently takes, temperature variation prompt facility can change along with the change two of temperature to audio-visual feedback out smart card 1's temperature condition, thereby prevent that the components and parts of internal control circuit board from appearing or place the condition that the overlength leads to temperature unusual high temperature and appearing on the driver, be convenient for carry out the short circuit to smart card and handle the action, improve safety in utilization.

The anti-skidding structure 9 is the dull polish antiskid face that a plurality of granules constitute, anti-skidding structure 9 sets up respectively on the bottom surface of base plate 2 and the top surface of roof 4, LED lamp array module 35 sets up the below of pattern show subtotal 10, pattern show subtotal 10 includes transparent portion and colour printing ink part, anti-skidding structure 9 is used for playing the antiskid effect, is convenient for hold, pattern show subtotal 10 is used for realizing the dynamic show action of smart card 1 with LED lamp array module 35 cooperation, improves the sight when using.

The outer side surface of the substrate 2 is provided with a first groove, the inner side surface of the substrate 2 is provided with a second groove, a plurality of first through holes are arranged between the first groove and the second groove and are connected and communicated, the contact heat dissipation structure 11 comprises a plurality of heat conduction heat dissipation silica gel strips, each of the plurality of heat conduction heat dissipation silica gel strips comprises a first heat conduction silica gel strip 110, a second heat conduction silica gel strip 111 and a plurality of heat conduction silica gel columns 112, the first heat conduction silica gel strip 110 is arranged in the first groove, the second heat conduction silica gel strip 111 is arranged in the second groove, the plurality of heat conduction silica gel columns 112 are respectively arranged in the first through holes, one end of the heat conduction silica gel column 112 is connected with the first heat conduction silica gel strip 110, the other end of heat conduction silica gel column 112 with heat conduction silica gel strip two 111 are connected, heat conduction silica gel strip 110 all still is equipped with many radiating grooves 1100, many the medial surface of radiating groove 1100 all still is equipped with many bar groove one, carry out butt fusion sealing process between contact heat radiation structure 11 and the base plate 2, contact heat radiation structure 11 is used for carrying the direct contact area between control circuit board 2 and the external world to improve heat conduction radiating effect and efficiency, prevent that the heat that non-access electricity taking antenna module 30 produced from piling up when smart card 1 uses, prevent that the heat from piling up the emergence of the potential safety hazard of 1 inside existence in smart card, improve the security.

The non-contact power-taking antenna module 30 comprises a wireless power supply coil 300, a non-contact communication coil 301 and a placing plate 302, wherein the wireless power supply coil 300 and the non-contact communication coil 301 are arranged on the placing plate 302, an amorphous material layer 303 is arranged between the wireless power supply coil 300 and the non-contact communication coil 301, the amorphous material layer 303 is used for carrying out magnetic isolation processing on the non-contact communication coil 301, the amorphous material layer 303 is subjected to magnetic loss reduction processing, the wireless power supply coil 300 is provided with a connecting end VA1 and a connecting end VB1, the non-contact communication coil 301 is provided with a connecting end VA2 and a connecting end VB2, the voltage stabilizing module 31 comprises a capacitor C3, a capacitor C1, a bridge type full-wave finishing voltage stabilizing circuit and a voltage stabilizing diode D3, the connecting end VA1 is connected with one end of the capacitor C3, and the connecting end VB1 is connected with the other end of the capacitor C3, one end of the capacitor C1 is connected with one end of the capacitor C3, the other end of the capacitor C1 is connected with the other end of the capacitor C3, the bridge-type full-wave finishing voltage stabilizing circuit 37 is provided with a first connecting end 1a, a second connecting end 1b and a third connecting end 1C, one end of the capacitor C1 is connected with the second connecting end 1b, the other end of the capacitor C1 is further connected with the first connecting end 1a, the second connecting end 1b is connected with one end of the zener diode D3, the other end of the zener diode D3 is provided with a grounding end, a VIN connecting end is arranged between the second connecting end 1b and the zener diode D3, the zener diode D3 is further provided with a VCC connecting end, the wireless power supply coil 300 is used for providing power supply for circuits in the smart card 1, the non-contact communication coil 301 is used for communication interaction of transaction data, the amorphous material layer 303 is used for magnetic isolation and interference prevention, the stability of power supply drive and transaction data is guaranteed, the stability of effect and the stability of data interaction of subsequent smart card 1 dynamic display are guaranteed, and the non-access electricity-taking antenna module 30 is used for greatly reducing the overall thickness and the volume of the smart card 1.

The protection circuit 38 includes two fusing protectors, the two fusing protectors are respectively arranged between the connection end VA1 and one end of the capacitor C3, and between the connection end VB1 and the other end of the capacitor C3, the protection circuit 38 is used for performing a circuit disconnection protection function, preventing abnormal overcurrent and overvoltage from affecting other elements in the control circuit board 3, preventing data from being lost, and improving the use safety and the protection performance, thereby prolonging the service life of the smart card.

The first chip module 33 is an SE chip, the first chip module 33 is provided with an SPI interface module and a GPIO module, the second chip module 34 is an SE non-contact wafer chip, the first chip module 33 and the second chip module 34 are respectively provided with a pin end 5, a pin end 6, a pin end 7, a pin end 8, a pin end 9 and a pin end 10, the pin end 5 is connected with the connection end VA2, the pin end 6 is connected with the connection end VB2, the pin end 7 of the first chip module 33 is connected with the pin end 7 of the second chip module 34, the pin end 8 of the first chip module 33 is connected with the pin end 8 of the second chip module 34, the pin end 9 of the first chip module 33 is connected with the pin end 9 of the second chip module 34, and the pin end 10 of the first chip module 33 is connected with the pin end 10 of the second chip module 34.

Chip module 33 still is equipped with VCC1 link and VCC2 link, VCC1 link and VCC2 link are connected, VCC1 link is equipped with four 1d of link and five 1e of link with VCC2 link, four 1d of link is equipped with electric capacity C4, electric capacity C4's the other end is connected with the earthing terminal, five 1e of link are equipped with test end M, be equipped with six 1f of link between five 1e of link and the test end M, six 1f of link with the VCC link is connected, chip module 33 still is equipped with VSS link and pin end 11, pin end 11 is equipped with resistor R4, resistor R4's the other end is equipped with DI1 end.

The voltage stabilizing circuit 37 comprises a chip module III and a capacitor C5, the chip module III is provided with a connecting end OR, a connecting end OG, a connecting end OB, a connecting end GND, a connecting end VCC3, a connecting end DI and a connecting end DO, the connecting end VCC3 is connected with the VIN connecting end, a connecting end seventy 1g is arranged between the connecting end VCC3 and the VIN connecting end, the connecting end seventy 1g is connected with one end of the capacitor C5, the other ends of the connecting end GND and the capacitor C5 are provided with a grounding end II, the connecting end DI is connected with the DI1 end, the connecting end DO is provided with a resistor R5, the resistor R5 is provided with a connecting end DO1, and the connecting end DO1 is used for being connected with the other voltage stabilizing circuit 37.

The LED lamp array module 35 comprises a plurality of light emitting diodes, one ends of the light emitting diodes are connected in series, the other ends of the light emitting diodes are further provided with resistors R11, the other ends of the resistors R11 are connected with a connecting end OR, a connecting end OG and a connecting end OB respectively, the other ends of the connecting end GND and a capacitor C5 are provided with a grounding end III, the LED lamp array module 35 is used for carrying out display control according to a control signal, and appearance display is achieved by matching with the pattern display part 10.

The utility model discloses a set up the suggestion subassembly and be used for providing fluorescence prompt facility and temperature variation prompt facility, fluorescence prompt facility is convenient for know the position of smart card fast in the dim place of environment, conveniently takes, temperature variation prompt facility can change colour along with the change of temperature to audio-visual feedback goes out the temperature conditions of smart card, thereby prevents that the components and parts of internal control circuit board from appearing the short circuit or placing the condition that the overlength leads to temperature anomaly high temperature on the driver and appearing, is convenient for carry out cooling treatment action to the smart card fast, improves the safety in utilization; the contact radiating structure is used for improving the direct contact area between the control circuit board and the outside, so that the heat conduction radiating effect and efficiency are improved, heat accumulation generated by the non-access antenna module when the intelligent card is used is prevented, potential safety hazards existing in the intelligent card due to heat accumulation are prevented, the safety is improved, the temperature residual time is shortened, the holding comfort level of a user is improved, and the experience effect of the user is improved; by arranging the wireless power supply coil and the non-contact communication coil and arranging the amorphous material layer between the wireless power supply coil and the non-contact communication coil, the communication interaction of power supply and transaction data is separated, mutual interference is prevented, the stability of power supply driving and the stability of transaction data are ensured, and the stability of subsequent effect of dynamic display of the smart card and the stability of data interaction are ensured; the protection circuit is used for protecting the circuit from being disconnected, so that the influence of abnormal overcurrent and overvoltage on other elements in the control circuit board is prevented, data loss is prevented, the use safety and the protectiveness are improved, and the service life of the intelligent card is prolonged.

The utility model discloses not be limited to above-mentioned embodiment, adopt with the utility model discloses the same or similar structure of above-mentioned embodiment, device, technology or method, and the other that obtain are used for non-contact dynamic smart card, all are in the utility model discloses an within the scope of protection.

Claims

1. A contactless dynamic smart card, characterized by: the intelligent card comprises a substrate, a control circuit board and a top plate, wherein the substrate is provided with a cavity, the control circuit board is arranged in the cavity, the top plate is arranged above the substrate, the substrate and the top plate are both provided with a prompt component and an anti-skid structure, the top plate is provided with a pattern display part, and the substrate is provided with a contact heat dissipation structure;

2. The contactless dynamic smart card of claim 1, wherein: the bottom surface of base plate and the top surface of roof all are equipped with the recess, the recess all is equipped with a plurality of slotted holes, and is a plurality of the slotted hole all with the intercommunication is connected to the cavity, the suggestion subassembly includes a plurality of fluorescence temperature adhesive tape that discolours, and is a plurality of fluorescence temperature adhesive tape that discolours sets up respectively in the recess, it is a plurality of fluorescence temperature adhesive tape that discolours all is equipped with a plurality of contact site, the contact site sets up respectively in the slotted hole, just the contact site with the cavity is connected the intercommunication.

3. The contactless dynamic smart card of claim 2, wherein: the anti-skidding structure is a frosted anti-skidding surface consisting of a plurality of particles, the anti-skidding structure is arranged on the bottom surface of the substrate and the top surface of the top plate respectively, the LED lamp array module is arranged below the pattern display part, and the pattern display part comprises a transparent part and a color ink part.

4. A contactless dynamic smart card according to claim 3, characterized in that: the lateral surface of base plate is equipped with recess one, the medial surface of base plate is equipped with recess two, be equipped with a plurality of through-hole one between recess one and the recess two and connect the intercommunication, the contact heat radiation structure includes many heat conduction heat dissipation silica gel strips, many heat conduction heat dissipation silica gel strips all include heat conduction silica gel strip one, heat conduction silica gel strip two and a plurality of heat conduction silica gel column, heat conduction silica gel strip one sets up in the recess one, heat conduction silica gel strip two sets up in the recess two, it is a plurality of heat conduction silica gel column sets up respectively in the through-hole one, heat conduction silica gel column's one end with heat conduction silica gel strip one is connected, heat conduction silica gel column's the other end with heat conduction silica gel strip two is connected, heat conduction silica gel strip one all still is equipped with many radiating grooves, many the medial surface of radiating groove all still is equipped with many bar grooves one.

5. The contactless dynamic smart card of claim 4, wherein: the utility model discloses a wireless power supply coil, including wireless power supply coil, non-contact communication coil and place the board, wireless power supply coil, non-contact communication coil set up place on the board, be equipped with the amorphous material layer between wireless power supply coil and the non-contact communication coil, the amorphous material layer is used for separating magnetic treatment for non-contact communication coil, the amorphous material layer is through reducing the magnetism and decreases the processing, wireless power supply coil is equipped with link VA1 and link VB1, non-contact communication coil is equipped with link VA2 and link VB2, voltage stabilizing module includes electric capacity C3, electric capacity C1, bridge type full wave arrangement voltage stabilizing circuit and voltage stabilizing diode D3, link VA1 with electric capacity C3's one end is connected, electric capacity C1's one end with electric capacity C3's one end is connected, electric capacity C1's the other end with electric capacity C3's the other end is connected, full wave arrangement voltage stabilizing circuit is equipped with link one, link two and link three, electric capacity C1's one end with the link two VCC voltage stabilizing diode D3's the other end is equipped with the VCC voltage stabilizing circuit, the link is equipped with the voltage stabilizing diode D3 one end, the link is equipped with the VCC connection terminal.

6. The contactless dynamic smart card of claim 5, wherein: the protection circuit comprises two fusing protectors, and the fusing protectors are arranged between the connecting end VA1 and one end of the capacitor C3 and between the connecting end VB1 and the other end of the capacitor C3 respectively.

7. The contactless dynamic smart card of claim 6, wherein: the first chip module is an SE chip, the first chip module is provided with an SPI interface module and a GPIO module, the second chip module is an SE non-contact wafer chip, the first chip module and the second chip module are respectively provided with a pin end 5, a pin end 6, a pin end 7, a pin end 8, a pin end 9 and a pin end 10, the pin ends 5 are respectively connected with the connecting end VA2, the pin end 6 is connected with the connecting end VB2, the pin end 7 of the first chip module is connected with the pin end 7 of the second chip module, the pin end 8 of the first chip module is connected with the pin end 8 of the second chip module, the pin end 9 of the first chip module is connected with the pin end 9 of the second chip module, and the pin end 10 of the first chip module is connected with the pin end 10 of the second chip module.

8. The contactless dynamic smart card of claim 7, wherein: chip module one still is equipped with VCC1 link and VCC2 link, VCC1 link and VCC2 link are connected, VCC1 link is equipped with four and five links of link with VCC2 link, the link is four to be equipped with electric capacity C4, electric capacity C4's the other end is connected with the earthing terminal, five links are equipped with test end M, be equipped with link six between five links and the test end M, link six with the VCC link is connected, chip module one still is equipped with VSS link and pin end 11, pin end 11 is equipped with resistor R4, resistor R4's the other end is equipped with DI1 end.

9. The contactless dynamic smart card of claim 8, wherein: the voltage stabilizing circuit comprises a chip module III and a capacitor C5, the chip module III is provided with a connecting end OR, a connecting end OG, a connecting end OB, a connecting end GND, a connecting end VCC3, a connecting end DI and a connecting end DO, the connecting end VCC3 is connected with the VIN connecting end, a connecting end VII is arranged between the connecting end VCC3 and the VIN connecting end, the connecting end VII is connected with one end of the capacitor C5, the other ends of the connecting end GND and the capacitor C5 are provided with a grounding end II, the connecting end DI is connected with the DI1 end, the connecting end DO is provided with a resistor R5, the resistor R5 is provided with a connecting end DO1, and the connecting end DO1 is used for being connected with another voltage stabilizing circuit.

10. The contactless dynamic smart card of claim 9, wherein: the LED lamp array module is composed of a plurality of light emitting diodes, one ends of the light emitting diodes are connected in series, the other ends of the light emitting diodes are provided with resistors R11, the other ends of the resistors R11 are connected with a connecting end OR, a connecting end OG and a connecting end OB respectively, and the other ends of the connecting end GND and the capacitor C5 are provided with grounding ends III.