CN218675904U - Compact all-in-one mainboard - Google Patents

Abstract

The utility model provides a compact all-in-one mainboard, include: the display device is arranged on the base through the host bracket; the heat dissipation module and the mainboard are respectively arranged in the host bracket, and the heat dissipation module is connected with the mainboard; the mainboard comprises a CPU module and a GPU module, wherein the CPU module and the GPU module are respectively arranged on two sides of the mainboard and arranged at one end of the mainboard close to the heat dissipation module. The utility model discloses holistic structural design has been optimized, and will CPU module and GPU module set up in the mainboard is close to the one end of heat dissipation module to satisfy the high-efficient heat dissipation demand of the host computer support of small volume. The utility model has the advantages of reasonable design and high efficiency, integrated degree is high, can satisfy the demand of all-in-one to performance upgrading in limited size and space well.

Description

Compact all-in-one mainboard

Technical Field

The utility model relates to an all-in-one especially relates to an all-in-one mainboard of compact.

Background

The all-in-one machine does not need to be provided with an additional host machine case, and is widely applied in various fields, but the all-in-one machine on the market is limited by size requirements and the limitation of the number of stacked layers of circuit boards at present, and a CPU and a GPU are not integrated into the all-in-one machine at present, so that the all-in-one machine for games, competitions and other high-performance requirements cannot well meet the actual requirements, and the performance upgrading requirements of the all-in-one machine are realized in a mode of independently inserting a GPU module or a display card module.

Disclosure of Invention

The utility model aims to solve the technical problem that a need provide one kind and optimized structural design, and then can integrate the all-in-one mainboard of the compact of CPU module and GPU module. The utility model discloses aim at providing fine basis for the performance and the application range that improve the all-in-one, satisfy the performance upgrading and the size demand of all-in-one simultaneously.

To this end, the utility model provides a compact all-in-one mainboard, include: the display device is arranged on the base through the host bracket; the heat dissipation module and the mainboard are respectively arranged in the host bracket, and the heat dissipation module is connected with the mainboard; the mainboard comprises a CPU module and a GPU module, wherein the CPU module and the GPU module are respectively arranged on two sides of the mainboard and arranged at one end of the mainboard close to the heat dissipation module.

The utility model discloses a further improvement lies in, the mainboard includes 12 integrated circuit board layers.

The utility model discloses a further improvement lies in, mainboard top-down's integrated circuit board layer includes top layer, first ground plane, first signal layer, second ground plane, second signal layer, power plane, third ground plane, third signal layer, fourth ground plane, fourth signal layer, fifth ground plane and bottom.

The utility model discloses a further improvement lies in, the heat dissipation module set up in the upper end of host computer support.

The utility model discloses a further improvement lies in, the lower extreme of host computer support is provided with the power module, the power module set up in the below of mainboard, and with the mainboard is connected.

The utility model discloses a further improvement lies in, the casing side of host computer support is provided with heat dissipation window, heat dissipation window's position with power module's position is corresponding.

The utility model discloses a further improvement lies in, still be provided with the interface module on the mainboard, the interface module set up in the mainboard is close to the one end of power module.

The utility model discloses a further improvement lies in, be provided with the baffle between power module and the mainboard.

The utility model discloses a further improvement lies in, still pops out the module, pop out the module set up in display device is directly over.

The utility model discloses a further improvement lies in, pop out and be provided with camera and voice module on the module.

Compared with the prior art, the beneficial effects of the utility model reside in that: the heat dissipation module and the mainboard are respectively arranged in the host bracket, the CPU module and the GPU module are integrated on the mainboard, the CPU module and the GPU module are respectively arranged on two sides of the mainboard, the integral structural design is optimized, and the CPU module and the GPU module are arranged at one end, close to the heat dissipation module, of the mainboard, so that the high-efficiency heat dissipation requirement of the host bracket with small size is met. The utility model has the advantages of reasonable design and high efficiency, integrated degree is high, can satisfy the all-in-one well to the demand of performance upgrading in limited size and space, need not to insert extra display card or GPU module again.

Drawings

Fig. 1 is a schematic perspective view of an embodiment of the present invention;

fig. 2 is an exploded view of a mainframe support according to an embodiment of the present invention;

fig. 3 is a schematic front view of a motherboard according to an embodiment of the present invention;

fig. 4 is a schematic back structural diagram of a main board according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of an integrated circuit board layer of a motherboard according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of the host bracket according to an embodiment of the present invention after the back shell is removed.

The attached drawings are as follows: 1-a display device; 2-a host bracket; 3-a heat dissipation module; 4, a main board; 401-top layer; 402-a first ground plane; 403-a first signal layer; 404-a second ground plane; 405-a second signal layer; 406-power plane; 407-a third ground plane; 408-a third signal layer; 409-a fourth ground plane; 410-a fourth signal layer; 411 — fifth ground plane; 412-a bottom layer; 5-a base; 6-CPU module; 7-GPU module; 8, a power supply module; 9-a heat dissipation window; 10-an interface module; 11-a baffle plate; 12-Ejection module.

Detailed Description

Preferred embodiments of the present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1 to 6, the present embodiment provides a compact all-in-one motherboard including: the display device comprises a display device 1, a host bracket 2, a heat dissipation module 3, a mainboard 4 and a base 5, wherein the display device 1 is arranged on the base 5 through the host bracket 2; the heat dissipation module 3 and the mainboard 4 are respectively arranged in the host bracket 2, and the heat dissipation module 3 is connected with the mainboard 4; the mainboard 4 comprises a CPU module 6 and a GPU module 7, wherein the CPU module 6 and the GPU module 7 are respectively arranged at two sides of the mainboard 4 and at one end of the mainboard 4 close to the heat dissipation module 3.

As shown in fig. 3, fig. 4 and fig. 6, this embodiment the CPU module 6 and the GPU module 7 are arranged in a staggered manner on the left and right sides of the motherboard 4, and are arranged in the motherboard 4 is close to one end of the heat dissipation module 3, so as to make full use of the space of the motherboard 4, and the space far away from one end of the heat dissipation module 3 is reserved for setting other peripheral matching circuits, and meanwhile, the distance between the heat dissipation modules 3 can be effectively shortened, so that the efficient heat dissipation requirement of the small-sized host bracket 2 is met.

As shown in fig. 5, the main board 4 of the present embodiment preferably includes 12 integrated circuit board layers; the integrated circuit board layer of the motherboard 4 from top to bottom preferably includes a top layer 401, a first ground layer 402, a first signal layer 403, a second ground layer 404, a second signal layer 405, a power layer 406, a third ground layer 407, a third signal layer 408, a fourth ground layer 409, a fourth signal layer 410, a fifth ground layer 411, and a bottom layer 412; the signal layer refers to an ART layer for signal connection, and the present embodiment can better realize the connection of circuits on different circuit board layers through a plurality of different ground layers (GND) and signal layers (ART) to reduce the area of the main board 4. The 12-layer integrated circuit board layer replaces an 8-layer structure commonly adopted in the prior art, the size can be well controlled, and if the size of the all-in-one machine reaches the design requirement and the performance is not changed, the area of the mainboard 4 can be reduced to about 70% of the original area. Therefore, under the condition of unchanged size or even slightly reduced size, the present embodiment can fully integrate the CPU module 6 and the GPU module 7, and simultaneously meets the dual requirements of the all-in-one machine on size limitation and performance upgrading.

As shown in fig. 2 and fig. 6, the heat dissipation module 3 of the present embodiment is disposed at the upper end of the host bracket 2. Correspondingly, this embodiment the lower extreme of host computer support 2 is provided with power module 8, power module 8 set up in the below of mainboard 4, and with mainboard 4 is connected, promptly mainboard 4 is even in the middle of heat dissipation module 3 and power module 8, such design can enough be favorable to the wiring, improves assembly efficiency, also can reduce the focus of product effectively simultaneously, improves its structural stability. Further, the present embodiment can also add a counterweight in the base 5 according to actual conditions and requirements to further lower the center of gravity of the product.

As shown in fig. 1 and fig. 2, in this embodiment, a heat dissipation window 9 is disposed on a side edge of the housing of the host bracket 2, and a position of the heat dissipation window 9 corresponds to a position of the power module 8, so as to improve a heat dissipation efficiency of the power module 8. More preferably, a baffle 11 is arranged between the power module 8 and the main board 4, so that hot air of the power module 8 is blocked conveniently, and the stability of the product in the operation process is improved.

As shown in fig. 1 and fig. 6, in this embodiment, an interface module 10 is further disposed on the motherboard 4, and the interface module 10 is disposed at one end of the motherboard 4 close to the power module 8, so as to facilitate fast assembly of a product and insertion and extraction of an interface.

As shown in fig. 1, the present embodiment further includes an ejection module 12, where the ejection module 12 is disposed right above the display device 1, and is pushed to eject and store; the pop-up module 12 is provided with a camera and a voice module, so that a better basis is provided for video, camera and voice functions, and the personalized design degree of the product is improved.

In summary, in this embodiment, the heat dissipation module 3 and the motherboard 4 are respectively disposed in the host bracket 2, and the CPU module 6 and the GPU module 7 are integrated on the motherboard 4, and the CPU module 6 and the GPU module 7 are respectively disposed on two sides of the motherboard 4, so as to optimize the overall structural design, and the CPU module 6 and the GPU module 7 are disposed on one end of the motherboard 4 close to the heat dissipation module 3, so as to meet the requirement of efficient heat dissipation of the small-sized host bracket 2. This embodiment structural design is reasonable and high-efficient, and integrated degree is high, can satisfy the all-in-one well to the demand of performance upgrading in limited size and space, need not to insert extra display card or GPU module 7 again.

The above-mentioned embodiments are the preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-mentioned embodiments, and the scope of the present invention includes and is not limited to the above-mentioned embodiments, and all equivalent changes made according to the shape and structure of the present invention are within the protection scope of the present invention.

Claims (10)

1. A compact all-in-one motherboard characterized in that includes: the display device is arranged on the base through the host bracket; the heat dissipation module and the mainboard are respectively arranged in the host bracket, and the heat dissipation module is connected with the mainboard; the mainboard comprises a CPU module and a GPU module, wherein the CPU module and the GPU module are respectively arranged on two sides of the mainboard and arranged at one end of the mainboard close to the heat dissipation module.

2. The compact all-in-one motherboard of claim 1, wherein said motherboard comprises a 12 level integrated circuit board layer.

3. The compact all-in-one motherboard of claim 2, wherein the integrated circuit board layers of the motherboard from top to bottom comprise a top layer, a first ground layer, a first signal layer, a second ground layer, a second signal layer, a power layer, a third ground layer, a third signal layer, a fourth ground layer, a fourth signal layer, a fifth ground layer, and a bottom layer.

4. The compact all-in-one machine mainboard of any one of claims 1 to 3, wherein the heat dissipation module is arranged at the upper end of the host bracket.

5. The compact all-in-one machine mainboard of claim 4, wherein a power module is arranged at the lower end of the host bracket, and the power module is arranged below the mainboard and connected with the mainboard.

6. The compact all-in-one machine mainboard of claim 5, wherein a heat dissipation window is arranged on the side of the shell of the host bracket, and the position of the heat dissipation window corresponds to the position of the power module.

7. The compact all-in-one machine mainboard of claim 5, wherein an interface module is further arranged on the mainboard, and the interface module is arranged at one end of the mainboard, which is close to the power supply module.

8. The compact all-in-one machine mainboard of claim 5, wherein a baffle is arranged between the power module and the mainboard.

9. The compact all-in-one machine mainboard of any one of claims 1 to 3, further comprising a pop-up module, wherein the pop-up module is arranged right above the display device.

10. The compact all-in-one machine mainboard of claim 9, wherein a camera and a voice module are arranged on the pop-up module.

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