CN218672736U

CN218672736U - Household rapid ice making device based on semiconductor refrigeration sheet

Info

Publication number: CN218672736U
Application number: CN202221715808.4U
Authority: CN
Inventors: 桑彧; 章于道; 刘宏
Original assignee: Suzhou Narrowband Semiconductor Technology Co ltd
Current assignee: Suzhou Narrowband Semiconductor Technology Co ltd
Priority date: 2022-07-05
Filing date: 2022-07-05
Publication date: 2023-03-21
Anticipated expiration: 2032-07-05

Abstract

The utility model belongs to the technical field of the semiconductor system ice, a domestic quick system ice device based on semiconductor refrigeration piece is disclosed, include: the ice groove and upper jaw support frame is internally provided with an ice groove and upper jaw liner, the upper wall of the ice groove and upper jaw liner is provided with an upper semiconductor refrigeration module, and a copper needle is arranged inside the ice groove and upper jaw liner; the ice groove upper jaw support frame is embedded in the lower jaw main body, a lower jaw liner bottom plate is embedded at the bottom of the lower jaw main body, and a lower layer semiconductor refrigeration module is arranged below the lower jaw liner bottom plate. The utility model discloses a semiconductor refrigeration module system ice, than adopting the compressor environmental protection more, the speed of system ice also has very big promotion, makes the ice-cube required time of length of side 2cm about 2 min.

Description

Household rapid ice making device based on semiconductor refrigeration sheet

Technical Field

The utility model belongs to the technical field of the semiconductor system ice, concretely relates to domestic quick system ice device based on semiconductor refrigeration piece.

Background

Most of the ice makers in the market currently adopt a compressor refrigeration mode, and the shape of ice is bullet and square. The bullet head shape uses the metal evaporation stand, and rivers can condense into ice on the stand, and the high temperature gas in with the compressor during the deicing is on drainage to the evaporimeter, makes to form the water film between ice-cube and evaporimeter, realizes the deicing. The square evaporating pan is used, and water flows to form ice, so that water flows on the evaporating pan and is cooled into ice in a short time. An ice maker with the power of about 150W is used for making ice with the size of about 2-3 cm, the bullet shape needs 6-12 minutes, the square hollow needs 5-9 minutes, and the square solid needs 13-18 minutes. The bullet shape makes ice quickly but the ice melts quickly. The square shape has a high hardness but a slow ice making speed. And the use of a compressor to make ice pollutes the environment. Therefore, it is desirable to design an ice maker that can make ice quickly and well without environmental pollution.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a domestic quick ice making device based on semiconductor refrigeration piece to solve the current ice maker ice-making speed that provides in the above-mentioned background art slow, use compressor ice-making to have the problem of pollution to the environment.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

a household rapid ice making device based on a semiconductor refrigeration sheet comprises:

the ice groove and upper jaw support frame is internally provided with an ice groove and upper jaw liner, the upper wall of the ice groove and upper jaw liner is provided with an upper semiconductor refrigeration module, and a copper needle is arranged inside the ice groove and upper jaw liner;

the ice groove upper jaw support frame is embedded in the lower jaw main body, a lower jaw liner bottom plate is embedded at the bottom of the lower jaw main body, and a lower layer semiconductor refrigeration module is arranged below the lower jaw liner bottom plate.

As right the utility model discloses a further improvement, ice groove palace support frame is connected with upper aluminium system water tank through the fastener, upper semiconductor refrigeration module is located the lower surface of upper aluminium system water tank.

As right the utility model discloses a further improvement, the chin main part is connected with lower floor's aluminium system water tank through the fastener, lower floor's semiconductor refrigeration module is located lower floor's aluminium system water tank upper surface.

As right the utility model discloses a further improvement, the both sides of upper semiconductor refrigeration module with the both sides of lower floor's semiconductor refrigeration module all scribble the heat conduction and glue.

As a further improvement, the upper aluminum water tank and the lower aluminum water tank are provided with water inlets and water outlets.

As right the utility model discloses a further improvement, the below of lower floor's aluminium system water tank is provided with the bottom plate, the bottom plate through first lead screw subassembly with the connection is spared to the bottom of lower floor's aluminium system water tank, the bottom plate with lower floor's aluminium system water tank still is provided with second lead screw subassembly.

Through the technical scheme, the utility model discloses technical scheme's beneficial effect is:

the utility model discloses a semiconductor refrigeration module system ice, than adopting the compressor environmental protection more, the speed of system ice also has very big promotion, makes the required time of length of side 2 cm's ice-cube about 2 min.

The copper needle is designed in the inner container, so that the contact area between water and copper can be increased, the ice making speed is accelerated, after the copper needle is added, the icing process can be simultaneously carried out on the inner part and the peripheral wall surface, and the condition of hollow ice can be effectively reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the overall three-dimensional structure of the present invention.

Fig. 2 is a schematic diagram of the explosion state of the present invention.

Fig. 3 is a schematic view of the three-dimensional structure of the middle ice groove and palate inner container of the present invention.

Fig. 4 is a schematic perspective view of the middle and lower jaw body of the present invention.

The reference numerals in the schematic drawings illustrate:

1. an upper aluminum water tank; 2. an upper semiconductor refrigeration module; 3. an ice chute palace support frame; 4. an ice groove palate inner container; 41. a copper needle; 5. a chin body; 6. a lower jaw inner container bottom plate; 7. a lower aluminum water tank; 8. a lower semiconductor refrigeration module; 9. a base plate; 10. a first lead screw assembly; 11. a second lead screw assembly.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides the following embodiments:

the utility model provides a domestic quick ice making device based on semiconductor refrigeration piece, including upper semiconductor refrigeration module 2, ice groove palate support frame 3, ice groove palate inner bag 4, chin main part 5, chin inner bag bottom plate 6 and lower floor semiconductor refrigeration module 8, ice groove palate support frame 3 comprises ABS plastics, have certain isolated external heat transfer's effect when playing supporting role, be provided with ice groove palate inner bag 4 in ice groove palate support frame 3, the upper wall of ice groove palate inner bag 4 is provided with upper semiconductor refrigeration module 2, upper semiconductor refrigeration module 2 is used for extracting the heat of ice groove palate inner bag 4, ice groove palate inner bag 4 is used for adorning water ice, the upper plate of ice groove palate inner bag 4 contacts with upper semiconductor refrigeration piece 2, make water freeze through heat-conduction, refer to figure 1 and figure 3, the inside of ice groove palate inner bag 4 is provided with copper needle 41, copper needle 41 can increase the ice-making speed, can also reduce the hollow ice making speed.

The ice groove upper jaw support frame 3 is embedded into an ice groove upper jaw main body 5, the periphery of the lower jaw main body 5 is made of ABS (acrylonitrile butadiene styrene) plastics, the lower jaw main body 5 is used for containing an ice groove upper jaw inner container 4 and the ice groove upper jaw support frame 3, a lower jaw inner container bottom plate 6 is embedded into the bottom of the lower jaw main body 5, a lower semiconductor refrigeration module 8 is arranged below the lower jaw inner container bottom plate 6, the lower semiconductor refrigeration module 8 is used for extracting heat of the lower jaw inner container bottom plate 6, water is made into ice through heat conduction, water is injected into the lower jaw main body 5, the ice groove upper jaw support frame 3 with the ice groove upper jaw inner container 4 is placed into the lower jaw main body 5, the upper semiconductor refrigeration module 2 and the lower semiconductor refrigeration module 8 are controlled to work, the water is made into ice, then the lower jaw main body 5 is separated from the ice groove upper jaw support frame 3, and the lower jaw main body 5 is used for containing the ice.

As the utility model discloses a another preferred scheme, ice groove palace support frame 3 is connected with upper aluminium system water tank 1 through the fastener, and upper semiconductor refrigeration module 2 is located upper aluminium system water tank 1's lower surface, and upper semiconductor refrigeration module 2 is located between upper aluminium system water tank 1 and the ice groove palace support frame 3, and upper aluminium system water tank 1 is used for evacuating upper semiconductor refrigeration module 2's hot junction heat.

As the utility model discloses a another preferred scheme, chin main part 5 is connected with lower floor's aluminium system water tank 7 through the fastener, and lower floor's semiconductor refrigeration module 8 is located lower floor's aluminium system water tank 7 upper surface, and lower floor's semiconductor refrigeration module 8 is located between chin inner bag bottom plate 6 and lower floor's aluminium system water tank 7, and lower floor's aluminium system water tank 7 is used for sparse lower floor's semiconductor refrigeration module 8 hot junction heat.

As the utility model discloses a another preferred scheme, the two sides of upper semiconductor refrigeration module 2 and the two sides of lower floor's semiconductor refrigeration module 8 all scribble the heat conduction and glue, strengthen the heat conduction, promote to connect.

As the utility model discloses a another preferred scheme all is equipped with the inlet outlet on upper aluminium system water tank 1 and the aluminium system water tank 7 of lower floor, takes hot water out by the water pump, sends cold water into upper aluminium system water tank 1 and lower floor's aluminium system water tank 7, maintains the hot face temperature of upper semiconductor refrigeration module 2 and lower floor's semiconductor refrigeration module 8 at a lower level, guarantees refrigeration efficiency.

As the utility model discloses a another preferred scheme, the below of lower floor's aluminium system water tank 7 is provided with bottom plate 9, bottom plate 9 is practised with the bottom of lower floor's aluminium system water tank 7 through first lead screw subassembly 10 and is connected, there is the first lead screw subassembly 10 of motor drive, control lower floor's aluminium system water tank 7 reciprocates, can move down after the ice-making, the ice-cube drops into in lower jaw main part 5, bottom plate 9 and lower floor's aluminium system water tank 7 still are provided with second lead screw subassembly 11, second lead screw subassembly 11 is by another motor drive, can control lower floor's aluminium system water tank 7 and carry out the back-and-forth movement, thereby make lower jaw main part 5 carry out the back-and-forth movement, the ice-cube in the convenient lower jaw main part 5 takes out.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A household rapid ice making device based on a semiconductor refrigeration sheet is characterized by comprising:

the refrigerator comprises an ice groove upper jaw supporting frame (3), an ice groove upper jaw liner (4) is arranged in the ice groove upper jaw supporting frame (3), an upper layer semiconductor refrigeration module (2) is arranged on the upper wall of the ice groove upper jaw liner (4), and a copper needle (41) is arranged inside the ice groove upper jaw liner (4);

the ice-making tray comprises a lower jaw main body (5), wherein the ice groove upper jaw supporting frame (3) is embedded into the lower jaw main body (5), a lower jaw liner bottom plate (6) is embedded into the bottom of the lower jaw main body (5), and a lower semiconductor refrigeration module (8) is arranged below the lower jaw liner bottom plate (6).

2. The household rapid ice making device based on the semiconductor refrigeration sheet as claimed in claim 1, wherein the ice groove upper jaw support frame (3) is connected with an upper layer aluminum water tank (1) through a fastener, and the upper layer semiconductor refrigeration module (2) is positioned on the lower surface of the upper layer aluminum water tank (1).

3. A household rapid ice making apparatus based on semiconductor chilling plates as claimed in claim 2, characterized in that the lower jaw body (5) is connected with a lower aluminum water tank (7) by a fastener, and the lower semiconductor chilling module (8) is located on the upper surface of the lower aluminum water tank (7).

4. A household rapid ice-making device based on semiconductor refrigeration sheets as claimed in claim 3, characterized in that both sides of the upper semiconductor refrigeration module (2) and both sides of the lower semiconductor refrigeration module (8) are coated with heat-conducting glue.

5. A household rapid ice making apparatus based on semiconductor refrigeration plate as claimed in claim 3, characterized in that the upper layer aluminum water tank (1) and the lower layer aluminum water tank (7) are provided with water inlet and outlet.

6. A household rapid ice-making device based on semiconductor chilling plates according to claim 3, characterized in that a bottom plate (9) is arranged below the lower layer aluminum water tank (7), the bottom plate (9) is connected with the bottom of the lower layer aluminum water tank (7) through a first screw assembly (10), and the bottom plate (9) and the lower layer aluminum water tank (7) are further provided with a second screw assembly (11).