CN218660178U - High-density power device packaging mold - Google Patents
High-density power device packaging mold Download PDFInfo
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- CN218660178U CN218660178U CN202222363434.0U CN202222363434U CN218660178U CN 218660178 U CN218660178 U CN 218660178U CN 202222363434 U CN202222363434 U CN 202222363434U CN 218660178 U CN218660178 U CN 218660178U
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- power device
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Abstract
The utility model relates to the technical field of power devices, in particular to a high-density power device packaging mold, which comprises an upper mold and a lower mold, wherein the upper end surface of the upper mold is regularly provided with avoidance holes, and the bottom end of the lower mold is provided with an injection molding port; the utility model discloses in set up a shaping circle through the inboard at the lower mould, after last mould and lower mould compound die, because the shaping circle is to the peripheral fender that encloses of power device, can guarantee that power device its global can integrated into one piece after the encapsulation, for the mode of moulding plastics among the prior art, can avoid producing the compound die arch or burr global at power device, very big reinforcing the fashioned aesthetic property of power device, and the operating strength of follow-up processing has been reduced, the ejector pin that the cooperation set up can be with power device jack-up upwards, so that realize the all-round encapsulation to power device, avoid its bottom because the encapsulation leads exposed condition totally.
Description
Technical Field
The utility model relates to a power device technical field especially relates to a high density power device packaging mold.
Background
Chinese patent publication No. CN113437038a discloses a pin, a power device, a method for manufacturing the power device, and a packaging mold, wherein the packaging mold has an avoiding hole capable of cooperating with the pin of the power device, especially a rotator of the pin, and preventing a plastic packaging material from overflowing from the packaging mold through the avoiding hole in the packaging process of the power device;
during specific operation, when the upper die and the lower die are assembled, joint bulges or burrs are easily generated at the joint of the upper die and the lower die during injection molding, so that the attractiveness of a power device is reduced, and the workload of subsequent processes is increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the above-mentioned shortcoming of existing among the prior art, and the encapsulation mould of a high density power device that proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
designing a high-density power device packaging mold, which comprises an upper mold and a lower mold, wherein the upper end surface of the upper mold is regularly provided with avoidance holes, and the bottom end of the lower mold is provided with an injection molding port;
the inner side of the lower die is provided with a forming ring, and the forming ring extends towards the opening side of the lower die, so that when the lower die and the upper die are closed, the top of the forming ring can be abutted against the top of the inner side of the upper die;
and a locking assembly is arranged between the upper die and the lower die.
Preferably, at least one group of ejector rods is arranged on the inner side of the lower die, so that the power device is ejected upwards through the ejector rods.
Preferably, the ejector rods are symmetrically provided with two groups along the injection molding opening, and the ejector rods are in threaded connection with the inner wall of the lower die.
Preferably, the locking subassembly is including being located the card frame of mould side, the side of lower mould is provided with the elasticity card, and the elasticity card can be in card frame looks joint.
Preferably, the forming ring is fixedly installed on the inner side of the lower die through welding, and a wear-resistant layer is arranged on the outer wall of the forming ring.
The utility model provides a pair of high density power device packaging mold, beneficial effect lies in: the utility model discloses in set up a shaping circle through the inboard at the lower mould, after last mould and lower mould compound die, because the shaping circle is to the peripheral fender that encloses of power device, can guarantee that power device its global can integrated into one piece after the encapsulation, for the mode of moulding plastics among the prior art, can avoid producing the compound die arch or burr global at power device, very big reinforcing the fashioned aesthetic property of power device, and the operating strength of follow-up processing has been reduced, the ejector pin that the cooperation set up can be with power device jack-up upwards, so that realize the all-round encapsulation to power device, avoid its bottom because the encapsulation leads exposed condition totally.
Drawings
Fig. 1 is a schematic structural diagram of a high-density power device packaging mold according to the present invention;
fig. 2 is an enlarged schematic structural diagram of an area a of the high-density power device package mold according to the present invention.
In the figure: 1. an upper die; 11. avoiding holes; 12. clamping a frame; 2. a lower die; 21. forming a ring; 22. a top rod; 23. an elastic card.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-2, a high-density power device packaging mold comprises an upper mold 1 and a lower mold 2, wherein the upper end surface of the upper mold 1 is regularly provided with avoidance holes 11, and the bottom end of the lower mold 2 is provided with an injection molding port;
a forming ring 21 is arranged on the inner side of the lower die 2, the forming ring 21 extends towards the opening side of the lower die 2, so that when the lower die 2 and the upper die 1 are closed, the top of the forming ring 21 can be abutted against the top of the inner side of the upper die 1;
a locking assembly is arranged between the upper die 1 and the lower die 2.
Further, the utility model discloses the inboard of well lower mould 2 is provided with a set of ejector pin 22 at least to through ejector pin 22 with the power device jack-up that makes progress, so that realize avoiding its bottom because the encapsulation leads to the exerted condition incompletely.
Still further say, the utility model discloses well ejector pin 22 is provided with two sets ofly along moulding plastics a mouthful symmetry, the inner wall threaded connection of ejector pin 22 and lower mould 2, and threaded connection's mode can be convenient for the user highly adjusts ejector pin 22 according to the jack-up of actual demand to strengthen the device's adaptability.
Still be said, the utility model discloses well locking subassembly is including being located the card frame 12 of mould 1 side, and the side of lower mould 2 is provided with elasticity card 23, and elasticity card 23 can be in card frame 12 looks joint.
It should be noted that the forming ring 21 is fixedly installed inside the lower die 2 by welding, a wear-resistant layer is provided on the outer wall of the forming ring 21, and when the forming ring 21 guides and closes the upper die 1, the wear-resistant capability of the surface of the forming ring 21 can be enhanced by the wear-resistant layer, so that the practical life of the forming ring 21 can be enhanced.
The utility model discloses in set up one shaping circle 21 through the inboard at lower mould 2, after the compound die of upper mould 1 and lower mould 2, because the shaping circle 21 is to the peripheral fender that encloses of power device, can guarantee that power device its global can integrated into one piece after the encapsulation, for the mode of moulding plastics among the prior art, can avoid the global compound die arch or burr that produces at power device, very big reinforcing the fashioned aesthetic property of power device, and the operating strength of follow-up processing has been reduced, the ejector pin 22 that the cooperation set up can upwards jack-up power device, so that realize the all-round encapsulation to power device, avoid its bottom because the encapsulation leads exposed condition not all the time.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. The utility model provides a high density power device packaging mold, includes mould (1) and lower mould (2), its characterized in that: the upper end face of the upper die (1) is regularly provided with avoidance holes (11), and the bottom end of the lower die (2) is provided with an injection molding port;
a forming ring (21) is arranged on the inner side of the lower die (2), the forming ring (21) extends towards the opening side of the lower die (2), so that when the lower die (2) and the upper die (1) are closed, the top of the forming ring (21) can be abutted to the top of the inner side of the upper die (1);
and a locking assembly is arranged between the upper die (1) and the lower die (2).
2. The high-density power device packaging mold according to claim 1, wherein: the inner side of the lower die (2) is at least provided with a group of ejector rods (22) so as to jack up the power device upwards through the ejector rods (22).
3. The high-density power device package mold of claim 2, wherein: two groups of ejector rods (22) are symmetrically arranged along the injection molding opening, and the ejector rods (22) are in threaded connection with the inner wall of the lower die (2).
4. The high-density power device packaging mold according to claim 1, wherein: the locking subassembly is including card frame (12) that are located mould (1) side, the side of lower mould (2) is provided with elasticity card (23), and elasticity card (23) can be in card frame (12) looks joint.
5. The high-density power device packaging mold according to claim 1, wherein: the forming ring (21) is fixedly installed on the inner side of the lower die (2) through welding, and a wear-resistant layer is arranged on the outer wall of the forming ring (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222363434.0U CN218660178U (en) | 2022-09-06 | 2022-09-06 | High-density power device packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222363434.0U CN218660178U (en) | 2022-09-06 | 2022-09-06 | High-density power device packaging mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218660178U true CN218660178U (en) | 2023-03-21 |
Family
ID=85558714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222363434.0U Active CN218660178U (en) | 2022-09-06 | 2022-09-06 | High-density power device packaging mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218660178U (en) |
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2022
- 2022-09-06 CN CN202222363434.0U patent/CN218660178U/en active Active
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