CN218659041U

CN218659041U - Flat edge wafer engraving jig

Info

Publication number: CN218659041U
Application number: CN202223220671.8U
Authority: CN
Inventors: 王鑫; 刘磊; 黄金良; 袁强; 胡永超
Original assignee: Jiangsu Union Semiconductor Co Ltd
Current assignee: Jiangsu Union Semiconductor Co Ltd
Priority date: 2022-12-02
Filing date: 2022-12-02
Publication date: 2023-03-21
Anticipated expiration: 2032-12-02

Abstract

The utility model discloses a plain edge wafer portrayal tool in the semiconductor manufacturing field, including the chuck workstation, the test wafer has been placed on the chuck workstation, corresponds test wafer top is provided with the setting-out device, the center of setting-out device and the longitudinal distance between the test wafer top are 8mm, the setting-out device rear side is connected with the slider, the slider can be followed about the deflector level, the both ends of deflector are provided with the support, support lower extreme and chuck workstation fixed connection. The utility model discloses improve the accuracy nature of carving the flat limit scale mark in the time of can reducing the factory cost.

Description

Flat edge wafer engraving jig

Technical Field

The utility model belongs to the semiconductor manufacture field, in particular to plain edge wafer engraving tool.

Background

Before actual production, each process needs to be monitored to ensure that the quality is fine, equipment and other production conditions in the whole production line need to be evaluated and tested, and in order to improve the stability, the Test Wafer/Dummy Wafer is used for testing in advance, which is different from Prime Wafer.

In the prior art, because the test wafer needs to be cut into the flat edge test wafer and then used for production, directly purchasing the flat edge test wafer or overlapping the purchased flat edge test wafer on the wafer test wafer to carve a flat edge line and then cutting the flat edge test wafer is a common production means at present, and the defects are that: the flat edge test wafer is purchased, so that the production cost is increased; errors exist in the scribing process, so that the machine cannot identify and position, the test wafer cannot be used, and only scrapping treatment can be performed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a plain edge wafer engraving jig improves the accuracy nature of engraving plain edge scale mark when can reducing the cost in the factory.

The purpose of the utility model is realized like this: the utility model provides a plain edge wafer drawing tool, includes the chuck workstation, placed test wafer on the chuck workstation, correspond test wafer top is provided with the setting-out device, the longitudinal distance between the center of setting-out device and the test wafer top is 8mm, drawing device rear side and slider are connected, the slider can be followed the deflector level and removed about, the both ends of deflector are provided with the support, support lower extreme and chuck workstation fixed connection.

The utility model discloses during the use, get the test wafer and place on the chuck workstation, ensure that the center of setting-out device and the longitudinal distance between the test wafer top are 8mm, remove the setting-out device from a left side right side and can compare with prior art at the accurate scale mark that carves of test wafer, the beneficial effects of the utility model reside in that: need not to purchase the plain edge test wafer, effectively practiced thrift manufacturing cost, use the tool to depict the plain edge scale mark has also improved the precision.

As a further improvement of the utility model, the setting-out device includes the oily pen and the fixed block of vertical setting, oily pen is located the center of fixed block along axial direction's projection, oily pen is including contact segment and extrusion section, extrusion section outer wall interval cover is equipped with the holding ring that corresponds about two, two be provided with compression spring between the holding ring, the fixed block corresponds the holding ring and is provided with and holds the chamber with compression spring, it corresponds contact segment and extrusion section and is provided with respectively and holds the passageway to hold the chamber, fixed block rear side and slider fixed connection.

As a further improvement, the periphery that corresponds the test wafer on the chuck workstation is provided with two bilateral symmetry's location arch, the location arch is the cylinder structure, test wafer respectively with two the bellied outer wall in location is tangent.

As a further improvement, the slider cross section is "protruding" style of calligraphy structure, the deflector corresponds the slider and is provided with the guide way along length direction, slider and guide way sliding connection.

As a further improvement of the utility model, the top of test wafer is provided with V type breach.

As a further improvement of the utility model, the test wafer uses the centre of a circle to be provided with four symmetrical vacuum holes of each other as the center, the diameter in vacuum hole is 10mm.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a top view of the present invention.

Fig. 3 is a front view of the present invention.

Fig. 4 is a left side view of the present invention.

Fig. 5 is a cross-sectional view of the fixing block of the present invention.

Fig. 6 is a cross-sectional view of the slider and the guide plate of the present invention.

The automatic test device comprises a chuck workbench 1, a 101 positioning protrusion, a 2 test wafer, a 201V type notch, a 202 vacuum hole, a 3 line drawing device, a 301 oil pen, a 302 fixing block, a 303 contact segment, a 304 extrusion segment, a 305 positioning ring, a 306 compression spring, a 307 accommodating cavity, a 308 accommodating channel, a 4 sliding block, a 5 guide plate, a 501 guide groove, a 6 support and a 7 flat edge scale mark.

Detailed Description

As shown in fig. 1-6, a flat-edge wafer scribing jig includes a chuck table 1, two positioning protrusions 101 that are bilaterally symmetrical are disposed on the chuck table 1 at intervals, the positioning protrusions 101 are preferably cylindrical, and a test wafer 2 is placed on the chuck table 1 and is tangent to outer walls of the two positioning protrusions 101; a line drawing device 3 is arranged above the test wafer 2 correspondingly, the line drawing device 3 comprises an oil pen 301 and a fixed block 302 which are vertically arranged, the projection of the oil pen 301 along the axial direction is positioned at the center of the fixed block 302, the oil pen 301 comprises a contact section 303 and an extrusion section 304, two positioning rings 305 which correspond up and down are sleeved on the outer wall of the extrusion section 304 at intervals, a compression spring 306 is arranged between the two positioning rings 305, the fixed block 302 is provided with an accommodating cavity 307 corresponding to the positioning rings 305 and the compression spring 306, the accommodating cavity 307 is respectively provided with an accommodating channel 308 corresponding to the contact section 303 and the extrusion section 304, and the radius of each accommodating channel 308 is smaller than that of the accommodating cavity 307; the longitudinal distance between the center of the line drawing device 3 and the top end of the test wafer 2 is 8mm, the rear side of the fixed block 302 is fixedly connected with the sliding block 4, the cross section of the sliding block 4 is preferably in a convex structure, a horizontal guide groove 501 is formed in the length direction of the guide plate 5 corresponding to the sliding block 4, and the sliding block 4 is in sliding connection with the guide groove 501; two ends of the guide plate 5 are provided with brackets 6, and the lower end of each bracket 6 is fixedly connected with the chuck workbench 1 to support the line drawing device 3 above the test wafer 2.

As shown in fig. 2, in order to help the subsequent process to determine the placement position of the test wafer 2, a V-shaped notch is formed at the top end of the test wafer 2, so that the positioning is facilitated, the crystal orientation of the single crystal growth is marked, and the subsequent cutting and testing are greatly facilitated; in order to facilitate the handling of the test wafer 2, four vacuum holes 202 are symmetrically arranged around the center of the test wafer 2, and the diameter of each vacuum hole 202 is preferably 10mm.

The utility model discloses when using, use vacuum suction pen to aim at vacuum hole 202 and absorb test wafer 2 and place on chuck table 1, adjust test wafer 2 and make its V type breach direction align with the microscope carrier and withstand two location archs 101, make test wafer 2 and chuck table 1 align the back through a circle of three point location, the oily pen 301 of setting-out device 3 is pressed downwards to the personnel, make oily pen 301 nib can with test wafer 2 contact and from a left side right slip setting-out device 3, can carve out plain noodles scale mark 7 on test wafer 2, loose oily pen 301 after the operation finishes, treat that compression spring 306 kick-backs and lift up oily pen 301 after, remove setting-out device 3 to 5 leftmost ends of deflector and reset again, send the test wafer 2 that has carved well at last to the cutting machine and cut and make it become plain noodles test wafer 2. The utility model has the advantages that: the flat edge test wafer 2 does not need to be purchased additionally, the production cost in a factory is reduced, meanwhile, the accuracy of the flat edge scale line 7 is improved, the operation of engraving is simple and convenient, and the working efficiency of personnel is improved.

The present invention is not limited to the above embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some replacements and transformations for some technical features without creative labor according to the disclosed technical contents, and these replacements and transformations are all within the protection scope of the present invention.

Claims

1. The utility model provides a plain edge wafer drawing tool, includes chuck workstation, its characterized in that, placed test wafer on the chuck workstation, correspond test wafer top is provided with the setting-out device, the center of setting-out device and the longitudinal distance between the test wafer top are 8mm, drawing device rear side is connected with the slider, the slider can be followed about the deflector level and moved, the both ends of deflector are provided with the support, support lower extreme and chuck workstation fixed connection.

2. The flat edge wafer engraving jig according to claim 1, wherein the line drawing device comprises an oil pen and a fixed block which are vertically arranged, the projection of the oil pen along the axial direction is located at the center of the fixed block, the oil pen comprises a contact section and an extrusion section, two positioning rings which correspond up and down are sleeved on the outer wall of the extrusion section at intervals, a compression spring is arranged between the two positioning rings, the fixed block corresponds to the positioning rings and is provided with an accommodating cavity, the accommodating cavity corresponds to the contact section and is provided with an accommodating channel respectively with the extrusion section, and the rear side of the fixed block is fixedly connected with the sliding block.

3. The flat-edge wafer etching jig according to claim 2, wherein two positioning protrusions are symmetrically arranged on the chuck table corresponding to the periphery of the test wafer, the positioning protrusions are cylindrical, and the outer walls of the two positioning protrusions are tangent to the test wafer.

4. The flat-edge wafer etching jig according to claim 3, wherein the cross section of the slider is in a convex structure, the guide plate is provided with a guide groove along a length direction corresponding to the slider, and the slider is slidably connected with the guide groove.

5. The flat-edge wafer etching jig according to any one of claims 1 to 4, wherein a V-shaped notch is formed at the top end of the test wafer.

6. The flat edge wafer etching jig according to claim 5, wherein the test wafer is provided with four vacuum holes symmetrical to each other with a center of a circle as a center, and the diameter of the vacuum hole is 10mm.