CN218648839U - Mobile phone motherboard who possesses double-deck resistance to compression protection - Google Patents
Mobile phone motherboard who possesses double-deck resistance to compression protection Download PDFInfo
- Publication number
- CN218648839U CN218648839U CN202221743383.8U CN202221743383U CN218648839U CN 218648839 U CN218648839 U CN 218648839U CN 202221743383 U CN202221743383 U CN 202221743383U CN 218648839 U CN218648839 U CN 218648839U
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- Prior art keywords
- mobile phone
- strip
- rubber strip
- protection
- tractive
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- Expired - Fee Related
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- 230000006835 compression Effects 0.000 title claims abstract description 18
- 238000007906 compression Methods 0.000 title claims abstract description 18
- 230000001681 protective effect Effects 0.000 claims abstract description 20
- 230000003139 buffering effect Effects 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
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Abstract
The utility model discloses a mobile phone mainboard with double-layer compression protection, which comprises a mobile phone mainboard main body, wherein a memory chip is arranged on the mobile phone mainboard main body, protective sleeve blocks are sleeved at four corners of the mobile phone mainboard main body, a first traction bar block is arranged between the longitudinal directions of the two protective sleeve blocks, and a second traction bar block is arranged between the transverse directions of the two protective sleeve blocks; the utility model discloses a buffering subassembly on the protective sleeve piece respectively with first tractive stick, second tractive stick forms the buffer structure that both sides are strengthened, simultaneously respectively with first rubber strip, cooperation between second rubber strip and the third rubber strip, form the compressive protection structure that the structure is strengthened on the mobile phone motherboard is whole, reduce the mobile phone motherboard to the thinner structure in middle thick both sides when the installation with dismantle difficult exemption can receive the collision and the thinner department in both sides produces deformation or fracture easily, the possibility that middle thick components and parts became invalid.
Description
Technical Field
The utility model relates to a mobile phone motherboard's technical field specifically is the mobile phone motherboard who possesses double-deck resistance to compression protection.
Background
The mobile phone mainboard is a control center system of the whole mobile phone and is also a control center of a logic part. The microprocessor achieves the control purpose by operating the software in the memory and calling the database in the memory.
At the in-process of cell-phone mainboard installation and dismantlement, because the middle part of mainboard is provided with electronic components such as chip, forms the thicker thinner structure in both sides in the middle, and difficult exempting from can receiving the collision and the thinner department in both sides produces deformation or fracture easily when installation and dismantlement, further leads to middle thicker components and parts to become invalid.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a mobile phone motherboard who possesses double-deck resistance to compression protection to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: cell-phone mainboard that possesses double-deck resistance to compression protection, including the cell-phone mainboard main part, be provided with the memory chip in the cell-phone mainboard main part, four corners whereabouts of cell-phone mainboard main part have cup jointed the protective sleeve piece, be provided with first tractive strip piece between two protective sleeve pieces vertically, be provided with second tractive strip piece between two protective sleeve pieces transversely, the vertical and horizontal first buffer assembly and the second buffer assembly who is convenient for the resistance to compression that are provided with respectively of protective sleeve piece, be provided with first rubber strip in the middle of the top of cell-phone mainboard main part, the both sides that lie in first rubber strip in the cell-phone mainboard main part are provided with second rubber strip and third rubber strip respectively.
Preferably, the first drawing bar block and the second drawing bar block are arranged in two groups, and the two groups of the first drawing bar block and the second drawing bar block are symmetrically distributed on the upper side and the lower side of the main board body of the mobile phone.
Preferably, first buffering subassembly includes first guide bar, and first spout has all been seted up to the upper and lower both sides of protection cover piece, and the opening part of first spout is provided with first supporting block, and first guide bar is fixed to be pegged graft on first supporting block, and the one end of first tractive strip piece slides and cup joints on first guide bar, has cup jointed first buffer spring on the first guide bar.
Preferably, the second buffer assembly comprises a second guide rod, second chutes are formed in the upper side and the lower side of the protective sleeve block, a second supporting block is arranged at an opening of each second chute, the second guide rod is fixedly inserted into the second supporting block, one end of the second traction strip block is slidably sleeved on the second guide rod, and a second buffer spring is sleeved on the second guide rod.
Preferably, first recess has all been seted up to the both sides of first rubber strip, and second tractive stick runs through first recess setting, and the side of first rubber strip is provided with first extension strip, and first extension strip sets up along memory chip terminal surface.
Preferably, a second groove is formed in one end of the second rubber strip, the first traction strip block penetrates through the second groove, a second extension strip is arranged on the side face of the second rubber strip, and the second extension strip is arranged along the end face of the memory chip.
Preferably, a third groove is formed in one end of the third rubber strip, the first traction strip block penetrates through the third groove, a third extension strip is arranged on the side face of the third rubber strip, and the third extension strip is arranged along the end face of the memory chip.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a four corners of mobile phone motherboard main part are equipped with the protective sheath piece with, buffering subassembly on the protective sheath piece respectively with first tractive strip piece, second tractive strip piece forms the buffer structure that both sides are strengthened, simultaneously respectively with first rubber strip, cooperation between second rubber strip and the third rubber strip, form the compressive protection structure that the structure is strengthened on the whole of mobile phone motherboard, reduce the mobile phone motherboard of the thinner structure in middle thick both sides when the installation with dismantle difficult exemption can receive the collision and the thinner department in both sides produces deformation or fracture easily, the possibility that middle thick components and parts became invalid.
Drawings
FIG. 1 is a schematic view of the present invention;
fig. 2 is a schematic structural diagram of a first buffer assembly according to the present invention;
fig. 3 is a schematic structural diagram of a second buffer assembly according to the present invention.
In the figure: 1. a mobile phone mainboard main body; 2. a memory chip; 3. a protective sleeve block; 4. a first pulling bar; 5. a second pulling bar; 6. a first guide bar; 61. a first chute; 62. a first support block; 63. a first buffer spring; 7. a second guide bar; 71. a second chute; 72. a second support block; 73. a second buffer spring; 8. a first rubber strip; 81. a first groove; 82. a first extension bar; 9. a second rubber strip; 91. a second groove; 92. a second extension bar; 10. a third rubber strip; 101. a third groove; 102. a third extension bar.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a technical solution: the mobile phone mainboard with double-layer compression protection comprises a mobile phone mainboard main body 1, wherein a memory chip 2 is embedded in the mobile phone mainboard main body 1, protective sleeve blocks 3 are fixedly sleeved at four corners of the mobile phone mainboard main body 1, a first traction bar block 4 is arranged between the two protective sleeve blocks 3 in the longitudinal direction, and a second traction bar block 5 is arranged between the two protective sleeve blocks 3 in the transverse direction;
the first drawing strips 4 and the second drawing strips 5 are arranged in two groups, the two groups of the first drawing strips 4 and the two groups of the second drawing strips 5 are symmetrically distributed on the upper side and the lower side of the mobile phone mainboard main body 1, the top heights of the first drawing strips 4 and the second drawing strips 5 are both larger than the height of the memory chip 2, the first drawing strips 4 and the second drawing strips 5 positioned at the bottom of the mobile phone mainboard main body 1 do not influence the connection of the mobile phone mainboard on the mobile phone, the connection of the bottom of the mobile phone mainboard main body 1 can be designed according to actual working conditions, and the first drawing strips 4 and the second drawing strips 5 on the upper side and the lower side form an upper layer structure and a lower layer structure to protect the edge of the mobile phone mainboard main body 1;
a first buffer component and a second buffer component which are convenient for compression resistance are respectively arranged in the longitudinal direction and the transverse direction of the protective sleeve block 3, the first buffer component comprises a first guide rod 6, first sliding grooves 61 are respectively formed in the upper side and the lower side of the protective sleeve block 3, a first supporting block 62 is welded at the opening of each first sliding groove 61, the first guide rod 6 is fixedly inserted on the first supporting block 62, one end of a first traction strip block 4 is slidably sleeved on the first guide rod 6, a first buffer spring 63 is sleeved on the first guide rod 6, and the first guide rod 6 and the first buffer spring 63 in the first buffer component are matched to form a guide buffer protection structure for the first traction strip block 4;
the second buffer component comprises a second guide rod 7, the upper side and the lower side of the protective sleeve block 3 are both provided with second sliding grooves 71, the opening of the second sliding groove 71 is provided with a second supporting block 72, the second guide rod 7 is fixedly inserted on the second supporting block 72, one end of the second traction bar block 5 is slidably sleeved on the second guide rod 7, the second guide rod 7 is sleeved with a second buffer spring 73, and the second guide rod 7 and the second buffer spring 73 in the second buffer component are matched to form a guide buffer protective structure for the second traction bar block 5;
the middle of the top of the mobile phone mainboard main body 1 is bonded with a first rubber strip 8, two sides of the first rubber strip 8 are respectively provided with a first groove 81, the second traction strip block 5 penetrates through the first grooves 81 to be arranged, so that the longitudinal limiting protection of the second traction strip block 5 is facilitated, a first extension strip 82 is integrally formed on the side surface of the first rubber strip 8, the first extension strip 82 is arranged along the end surface of the memory chip 2, and the first extension strip 82 is matched with the first rubber strip 8 to position and protect the memory chip 2 and prevent the memory chip from being offset after collision; a second rubber strip 9 and a third rubber strip 10 are respectively bonded on two sides of the first rubber strip 8 on the main body 1 of the mobile phone mainboard;
a second groove 91 is formed in one end of the second rubber strip 9, the first traction strip block 4 penetrates through the second groove 91, the longitudinal limiting protection of the first traction strip block 4 is facilitated, a second extension strip 92 is integrally formed on the side face of the second rubber strip 9, the second extension strip 92 is arranged along the end face of the memory chip 2, the second rubber strip 9 is matched with the second extension strip 92, the memory chip 2 on the left side is positioned and protected, and the memory chip 2 is prevented from shifting after collision;
a third groove 101 is formed in one end of the third rubber strip 10, the first traction strip block 4 penetrates through the third groove 101, the longitudinal limiting protection of the first traction strip block 4 is facilitated, a third extension strip 102 is arranged on the side face of the third rubber strip 10, the third extension strip 102 is arranged along the end face of the memory chip 2, the third rubber strip 10 is matched with the third extension strip 102, the memory chip 2 on the right side is positioned and protected, and deviation after collision is prevented;
in summary, the cooperation between the first guide rod 6 and the first buffer spring 63 in the first buffer assembly forms a guide buffer protection structure for the first pulling strip 4, the cooperation between the second guide rod 7 and the second buffer spring 73 in the second buffer assembly forms a guide buffer protection structure for the second pulling strip 5, and further the cooperation forms a buffer structure reinforced at the edge of the main body of the mobile phone motherboard, and simultaneously forms a compression-resistant protection structure reinforced on the whole mobile phone motherboard with the cooperation between the first rubber strip 8, the second rubber strip 9 and the third rubber strip 10, so that the possibility that the mobile phone motherboard with a thicker middle and thinner structure is difficult to avoid collision and the thinner parts at both sides are easy to deform or break and the thicker components in the middle are ineffective is reduced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. Cell-phone mainboard that possesses double-deck resistance to compression protection, including cell-phone mainboard main part (1), its characterized in that: be provided with memory chip (2) on mobile phone motherboard main part (1), protection nested piece (3) have been cup jointed to four angles departments of mobile phone motherboard main part (1), be provided with first tractive strip piece (4) between the vertically of two protection nested piece (3), be provided with second tractive strip piece (5) between the horizontal of two protection nested piece (3), the vertically and horizontal first buffer assembly and the second buffer assembly that are convenient for the resistance to compression that are provided with of protection nested piece (3) respectively, be provided with first rubber strip (8) in the middle of the top of mobile phone motherboard main part (1), the both sides that lie in first rubber strip (8) on mobile phone motherboard main part (1) are provided with second rubber strip (9) and third rubber strip (10) respectively.
2. The mobile phone motherboard with double-layer compression protection of claim 1, wherein: the mobile phone mainboard comprises a mobile phone mainboard body (1), and is characterized in that two groups of first drawing strips (4) and two groups of second drawing strips (5) are arranged on the first drawing strips (4) and the second drawing strips (5), and the two groups of first drawing strips (4) and the two groups of second drawing strips (5) are symmetrically distributed on the upper side and the lower side of the mobile phone mainboard body (1).
3. The mobile phone motherboard with double-layer compression protection of claim 1, wherein: first buffering subassembly includes first guide bar (6), and first spout (61) have all been seted up to the upper and lower both sides of protection cover piece (3), and the opening part of first spout (61) is provided with first supporting block (62), and fixed the pegging graft on first supporting block (62) of first guide bar (6), and the one end of first tractive strip piece (4) slides and cup joints on first guide bar (6), has cup jointed first buffer spring (63) on first guide bar (6).
4. The mobile phone motherboard with double-layer compression protection of claim 1, wherein: the second buffer assembly comprises a second guide rod (7), second sliding grooves (71) are formed in the upper side and the lower side of the protective sleeve block (3), a second supporting block (72) is arranged at an opening of each second sliding groove (71), the second guide rods (7) are fixedly connected to the second supporting blocks (72) in an inserting mode, one ends of second traction strip blocks (5) are connected to the second guide rod (7) in a sliding and sleeved mode, and second buffer springs (73) are connected to the second guide rod (7) in a sleeved mode.
5. The mobile phone motherboard with double-layer compression-resistant protection of claim 1, characterized in that: first recess (81) have all been seted up to the both sides of first rubber strip (8), and second tractive strip piece (5) run through first recess (81) and set up, and the side of first rubber strip (8) is provided with first extension strip (82), and first extension strip (82) set up along memory chip (2) terminal surface.
6. The mobile phone motherboard with double-layer compression-resistant protection of claim 1, characterized in that: second recess (91) have been seted up to the one end of second rubber strip (9), and first tractive stick (4) run through second recess (91) and set up, and the side of second rubber strip (9) is provided with second extension strip (92), and second extension strip (92) set up along memory chip (2) terminal surface.
7. The mobile phone motherboard with double-layer compression-resistant protection of claim 1, characterized in that: third recess (101) have been seted up to the one end of third rubber strip (10), and first tractive stick (4) run through third recess (101) and set up, and the side of third rubber strip (10) is provided with third extension strip (102), and third extension strip (102) set up along memory chip (2) terminal surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221743383.8U CN218648839U (en) | 2022-07-07 | 2022-07-07 | Mobile phone motherboard who possesses double-deck resistance to compression protection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221743383.8U CN218648839U (en) | 2022-07-07 | 2022-07-07 | Mobile phone motherboard who possesses double-deck resistance to compression protection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218648839U true CN218648839U (en) | 2023-03-17 |
Family
ID=85489458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221743383.8U Expired - Fee Related CN218648839U (en) | 2022-07-07 | 2022-07-07 | Mobile phone motherboard who possesses double-deck resistance to compression protection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218648839U (en) |
-
2022
- 2022-07-07 CN CN202221743383.8U patent/CN218648839U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20230317 |