CN218645838U - Semiconductor constant temperature tank - Google Patents
Semiconductor constant temperature tank Download PDFInfo
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- CN218645838U CN218645838U CN202223244873.6U CN202223244873U CN218645838U CN 218645838 U CN218645838 U CN 218645838U CN 202223244873 U CN202223244873 U CN 202223244873U CN 218645838 U CN218645838 U CN 218645838U
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Abstract
The utility model relates to a semiconductor thermoelectric technology field especially relates to a semiconductor constant temperature jar. A semiconductor constant temperature tank comprises a shell, a sealing cover assembly, a tank body arranged in the shell, a bottom refrigeration heat dissipation assembly and at least two side refrigeration heat dissipation assemblies; a first sealing through hole is formed in the top surface of the shell in a penetrating mode, the tank body is arranged in an open mode, the opening of the tank body is arranged corresponding to the first sealing through hole, and the sealing cover assembly is arranged on the first sealing through hole in a covering mode; the lateral wall of the tank body is provided with the side refrigerating heat dissipation assembly, and the side refrigerating heat dissipation assembly comprises a first radiator and at least one first semiconductor refrigerating device. Semiconductor constant temperature jar, the temperature homogeneity of jar internal portion is good, and cooling speed is fast, receives environmental impact little, and it is relatively poor to have solved the internal portion temperature homogeneity of current constant temperature jar, and cooling speed is slow, receives the problem of ambient temperature influence easily.
Description
Technical Field
The utility model relates to a semiconductor thermoelectric technology field especially relates to a semiconductor constant temperature jar.
Background
Meets the culture requirements of microorganisms, animals, plants and the like. In modern livestock and poultry breeding, brooding work is more important content. In the current breeding industry, the hatching of poultry needs to provide energy through other energy sources such as electricity and the like to maintain the hatching temperature, but different biological hatching temperatures have certain differences. With the development of thermoelectric technology, products using thermoelectric technology are becoming more and more widespread. The semiconductor refrigerating device is applied to a constant temperature tank at present, but the temperature uniformity inside the semiconductor refrigerating device is poor, the cooling speed is low, and the semiconductor refrigerating device is easily influenced by the environmental temperature.
SUMMERY OF THE UTILITY MODEL
Problem to the background art provides, the utility model aims to provide a semiconductor constant temperature jar, the temperature homogeneity of jar internal portion is good, and the cooling rate is fast, receives environmental impact little, and it is relatively poor to have solved the internal portion temperature homogeneity of current constant temperature jar, and the cooling rate is slow, receives the problem of environmental temperature influence easily.
To achieve the purpose, the utility model adopts the following technical proposal:
a semiconductor constant temperature tank comprises a shell, a sealing cover assembly, a tank body arranged in the shell, a bottom refrigeration heat dissipation assembly and at least two side refrigeration heat dissipation assemblies;
a first sealing through hole is formed in the top surface of the shell in a penetrating mode, the tank body is arranged in an open mode, the opening of the tank body is arranged corresponding to the first sealing through hole, and the sealing cover assembly is arranged on the first sealing through hole in a covering mode;
the lateral wall of the tank body is provided with the lateral refrigeration heat dissipation assembly, the lateral refrigeration heat dissipation assembly comprises a first radiator and at least one first semiconductor refrigeration device, the cold end surface of the first semiconductor refrigeration device is attached to the lateral wall of the tank body, and the hot end surface of the first semiconductor refrigeration device is attached to the first radiator;
the bottom refrigeration radiating assembly comprises a cold guide boss, a second radiator and a second semiconductor refrigerating device, the cold end face of the second semiconductor refrigerating device is attached to the bottom face of the cold guide boss, the hot end face of the second semiconductor refrigerating device is attached to the second radiator, an inner boss is arranged at the middle of the tank body, a cold guide cavity is formed in the inner boss, the cold guide boss is arranged in the cold guide cavity, and the outer side wall of the cold guide boss is attached to the cavity wall of the cold guide cavity.
In a further aspect, the side refrigeration heat sink assembly further includes a first heat shield and a first heat dissipation fan;
first heat insulating sheet is equipped with at least one first installation opening, first semiconductor refrigeration device card is located first installation opening, first heat insulating sheet set up in first radiator with between the lateral wall of the jar body, first radiator is kept away from one side of first heat insulating sheet is equipped with first radiator fan.
Further, two side refrigerating and heat dissipating assemblies are arranged, and the two side refrigerating and heat dissipating assemblies are symmetrically arranged on the outer side wall of the tank body;
the number of the first semiconductor refrigeration devices is two, the first heat insulation sheet is provided with two first installation through openings, and the first semiconductor refrigeration devices are clamped in the corresponding first installation through openings;
the number of the first cooling fans is two, and the first cooling fans correspond to the first semiconductor refrigeration devices one to one.
Further, the outer side wall of the tank body is provided with first heat insulation cotton, and the first heat insulation cotton is connected with the first heat insulation sheet.
Further, the shape of the tank body is circular, oval, rectangular or polygonal.
Further, the bottom refrigeration heat dissipation assembly comprises a second heat insulation sheet, second heat preservation cotton and a second heat dissipation fan;
the second heat insulation sheet is provided with a second installation through hole, and the second semiconductor refrigerating device is clamped in the second installation through hole;
lead the bottom of cold boss and be equipped with the contact station, the second keeps warm cotton and is equipped with third installation opening, the contact station card is located third installation opening, the contact station with the cold junction face of second semiconductor refrigeration device laminates mutually, the second heat insulating sheet set up in the second keep warm cotton with between the second radiator, the second radiator is kept away from one side of second heat insulating sheet is equipped with second radiator fan.
Further, the shell comprises a shell, a bottom shell, a supporting seat and a supporting frame, wherein the top surface of the shell is provided with the first sealing through hole in a penetrating manner, the bottom of the shell is provided with the bottom shell, a first heat exchange air dissipation hole is formed in the position, corresponding to the side refrigeration heat dissipation assembly, of the shell, and a second heat exchange air dissipation hole is formed in the position, corresponding to the bottom refrigeration heat dissipation assembly, of the bottom shell;
the top surface of the supporting seat is provided with the side refrigerating and heat radiating assembly, the bottom surface of the tank body is provided with a plurality of supporting columns, the supporting seat is provided with a first through hole for the second heat insulating sheet to pass through and a second through hole for the supporting columns to pass through, and the supporting columns are connected with the bottom shell after passing through the second through holes;
the bottom surface symmetry of drain pan is provided with the support frame, just the support frame dodges the setting of second heat transfer scattered gas pocket.
Furthermore, a rotating bracket and a lock catch are respectively arranged on the top surface of the housing on two sides of the first sealing through hole, and the rotating bracket and the lock catch are oppositely arranged on two sides of the first sealing through hole;
the sealed lid subassembly includes lid, linking bridge and rotatory handle, the linking bridge with rotatory handle set up relatively in the both sides of the top surface of lid, the linking bridge with it is articulated to rotate the support, rotatory handle rotate set up in the lid, rotatory handle with the lid is articulated, rotatory handle is close to one side of hasp is equipped with the spring bolt, when the lid locks, the top surface of spring bolt with the bottom surface of hasp offsets.
Further, the sealing cover assembly further includes a sealing gasket disposed on a side of the cover body close to the first sealing port, and the sealing gasket is adapted to the shape of the cover body.
In a further description, the semiconductor constant temperature tank further comprises a plurality of temperature control probes, and the plurality of temperature control probes are distributed in the tank body.
Compared with the prior art, the embodiment of the utility model has following beneficial effect:
1. the inner boss is arranged in the middle of the tank body, the cold end surface of the second semiconductor refrigerating device is attached to the bottom surface of the cold guide boss, cold energy is transmitted to the inner boss through the cold guide boss, and then the cold energy is transmitted into the tank body through the inner boss, so that the temperature uniformity in the tank body can be effectively improved and the cooling speed is increased by the inner boss, the rapid cooling of the surface of the tank body is facilitated, the uniform distribution of the surface temperature of the tank body is facilitated, and the temperature influence caused by the environment is effectively reduced;
2. the lateral surface of the tank body can be quickly cooled by being attached to the first semiconductor refrigerating device by arranging the lateral surface refrigerating and radiating assembly on the outer lateral wall of the tank body, so that the cooling speed of the tank body is further improved, and the distribution uniformity of the surface temperature of the tank body is better;
3. through setting up the casing, the casing is protected the jar body of inside, bottom refrigeration radiator unit and side refrigeration radiator unit, and through setting up the gland subassembly, avoids jar internal portion to receive the pollution, and can further avoid external environment temperature's influence.
Drawings
Fig. 1 is a schematic perspective view of a semiconductor constant temperature tank according to an embodiment of the present invention;
fig. 2 is a schematic perspective view (with the outer shell removed) of a semiconductor constant temperature tank according to an embodiment of the present invention;
fig. 3 is an exploded view (with the outer shell removed) of the semiconductor constant temperature tank according to an embodiment of the present invention;
fig. 4 is a schematic perspective view of a semiconductor constant temperature tank according to an embodiment of the present invention (with the outer shell removed and the first heat insulation cotton disposed);
fig. 5 is a schematic perspective view of a tank body of a semiconductor constant temperature tank according to an embodiment of the present invention;
fig. 6 is a schematic perspective view of a tank body of a semiconductor constant temperature tank according to an embodiment of the present invention;
fig. 7 is a schematic perspective view of a housing of a semiconductor constant temperature tank according to an embodiment of the present invention;
fig. 8 is a schematic perspective view of a housing of a semiconductor constant temperature tank according to an embodiment of the present invention;
in the drawings: the heat exchanger comprises a shell 1, a shell 11, a first sealing through hole 111, a first heat exchange air dissipation hole 112, a sealing plate 113, a second sealing through hole 1131, a rotating support 114, a latch 115, a bottom shell 12, a second heat exchange air dissipation hole 121, a support base 13, a first through hole 131, a second through hole 132, a support frame 14, a sealing cover assembly 2, a cover body 21, a connecting support 22, a rotating handle 23, a latch 231, a sealing gasket 24, a tank body 3, an inner boss 31, a cold conducting cavity 311, first insulating cotton 32, a support column 33, a bottom refrigeration heat dissipation assembly 4, a cold conducting boss 41, a contact platform 411, a second radiator 42, a second semiconductor refrigeration device 43, a second heat insulation sheet 44, a second installation through hole 441, second insulating cotton 45, a third installation through hole 451, a second heat dissipation fan 46, a side refrigeration heat dissipation assembly 5, a first radiator 51, a first semiconductor refrigeration device 52, a first heat insulation sheet 53, a first installation through hole 531 and a first heat dissipation fan 54.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial.
In the description of the present invention, "a plurality" means two or more unless otherwise specified.
As shown in fig. 1 to 8, a semiconductor constant temperature tank comprises a housing 1, a sealing cover assembly 2, a tank body 3 arranged in the housing 1, a bottom refrigeration heat dissipation assembly 4 and at least two side refrigeration heat dissipation assemblies 5;
a first sealing through hole 111 is formed in the top surface of the shell 1 in a penetrating manner, the tank 3 is provided with an opening, the opening of the tank 3 is arranged corresponding to the first sealing through hole 111, and the sealing cover assembly 2 is arranged on the first sealing through hole 111 in a covering manner;
the lateral refrigeration heat dissipation assembly 5 is arranged on the outer lateral wall of the tank 3, the lateral refrigeration heat dissipation assembly 5 comprises a first radiator 51 and at least one first semiconductor refrigeration device 52, the cold end face of the first semiconductor refrigeration device 52 is attached to the outer lateral wall of the tank 3, and the hot end face of the first semiconductor refrigeration device 52 is attached to the first radiator 51;
the bottom refrigeration heat dissipation assembly 4 comprises a cold guide boss 41, a second radiator 42 and a second semiconductor refrigeration device 43, the cold end face of the second semiconductor refrigeration device 43 is attached to the bottom face of the cold guide boss 41, the hot end face of the second semiconductor refrigeration device 43 is attached to the second radiator 42, an inner boss 31 is arranged in the middle of the tank body 3, a cold guide cavity 311 is formed in the inner boss 31, the cold guide boss 41 is arranged in the cold guide cavity 311, and the outer side wall of the cold guide boss 41 is attached to the cavity wall of the cold guide cavity 311.
By arranging the inner boss 31 in the middle of the tank body 3, because the cold end surface of the second semiconductor refrigeration device 43 is attached to the bottom surface of the cold guide boss 41, cold is transmitted to the inner boss 31 through the cold guide boss 41, and then the cold is transmitted to the tank body 3 through the inner boss 31, the inner boss 31 can effectively improve the temperature uniformity inside the tank body 3 and improve the cooling speed, which is not only beneficial to the rapid cooling of the surface of the tank body 3, but also beneficial to the uniform distribution of the surface temperature of the tank body 3, and effectively reduces the temperature influence caused by the environment. In addition, through the lateral wall setting of the jar body 3 the side refrigeration radiator unit 5 makes the side of the jar body 3 also can be through with the laminating of first semiconductor refrigeration device 52 and rapid cooling, further improves the cooling rate of the jar body 3 to and make the distribution homogeneity of jar body 3 surface temperature is better.
The casing 1 is to inside jar body 3 bottom refrigeration radiator unit 4 with side refrigeration radiator unit 5 protects, and through setting up seal cover subassembly 2 avoids jar body 3 is inside to be polluted, and can further avoid external environment temperature's influence.
Semiconductor constant temperature jar, the temperature homogeneity of the 3 inside of jar bodies is good, and the cooling rate is fast, receives environmental impact little, and it only needs several minutes time to set for the temperature from original temperature cooling, and it is relatively poor to have solved the internal temperature homogeneity of current constant temperature jar, and the cooling rate is slow, receives the problem of environmental temperature influence easily, can satisfy domestic/enterprise's incubation, microorganism, animal, plant, medicine like market demands such as the scientific research culture of different cells.
To explain further, the side cooling heat sink assembly 5 further includes a first heat insulating plate 53 and a first heat dissipating fan 54;
the first heat insulating sheet 53 is provided with at least one first mounting port 531, the first semiconductor refrigeration device 52 is clamped in the first mounting port 531, the first heat insulating sheet 53 is arranged between the first heat radiator 51 and the outer side wall of the tank 3, and one side of the first heat radiator 51, which is far away from the first heat insulating sheet 53, is provided with the first cooling fan 54.
Through setting up first heat shield 53 can play thermal-insulated effect, avoids the heat that first radiator 51 gived off influences first semiconductor refrigeration device 52 is right the cold volume conduction of the jar body 3, thereby it is right to guarantee the refrigeration effect of the jar body 3, specifically, first heat shield 53 can set up two, just first heat shield 53 can be thermal-insulated sponge, two-layer thermal-insulated material, and is thermal-insulated effectual. By providing the first heat dissipation fan 54, the first heat sink 51 can be helped to blow away heat dissipation, so as to realize rapid heat dissipation.
Specifically, two side refrigerating and heat dissipating assemblies 5 are arranged, and the two side refrigerating and heat dissipating assemblies 5 are symmetrically arranged on the outer side wall of the tank 3;
the number of the first semiconductor refrigeration devices 52 is two, the first heat insulating sheet 53 is provided with two first installation through holes 531, and the first semiconductor refrigeration devices 52 are clamped in the corresponding first installation through holes 531;
the number of the first heat dissipation fans 54 is two, and the first heat dissipation fans 54 are arranged in one-to-one correspondence with the first semiconductor cooling devices 52.
The total number of the first semiconductor refrigeration devices 52 and the second semiconductor refrigeration devices 43 is at least three, preferably, two side refrigeration heat dissipation assemblies 5 are provided, two first semiconductor refrigeration devices 52 are provided, one bottom refrigeration heat dissipation assembly 4 is provided, and one second semiconductor refrigeration device 43 is provided, that is, the number of the semiconductor refrigeration devices is five in total, and the semiconductor refrigeration devices are distributed on the outer side wall of the tank body 3 and the bottom of the tank body 3 corresponding to the inner boss 31, so that the uniformity of the temperature inside the tank body 3 is ensured.
In addition, because side refrigeration radiator unit 5 is provided with two, and two side refrigeration radiator unit 5 symmetry set up in the lateral wall of the jar body 3, and bottom refrigeration radiator unit 4 set up in when the temperature homogeneity is guaranteed to the bottom of the jar body 3, make the whole exquisite small and exquisite of semiconductor constant temperature jar, portable avoids directly being in the whole face of lateral wall of the jar body 3 sets up side refrigeration radiator unit 5 and lead to the increase in size of semiconductor constant temperature jar.
Preferably, the outer side wall of the tank body 3 is provided with first heat insulation cotton 32, and the first heat insulation cotton 32 is connected with the first heat insulation sheet 53.
Through setting up first heat preservation cotton 32, first heat preservation cotton 32 can be right the jar body 3 plays the heat preservation effect, and it is effectual to keep warm, effectively avoids the cold volume in the jar body 3 runs off to improve the samming effect, in order to guarantee the temperature homogeneity in the jar body 3.
More specifically, the shape of the can 3 is circular, oval, rectangular or polygonal.
Preferably, the shape of the tank 3 is regular hexagon, the tank 3 is made of aluminum, and the cold conducting/heat conducting performance is good, so that the tank 3 can rapidly transmit the cold energy of the first semiconductor refrigeration device 52 and the second semiconductor refrigeration device 43 to the inside of the tank 3, the cooling speed is increased, and the temperature uniformity inside the tank 3 is ensured. By adopting the tank structure with the external shape of the regular hexagon and the cooperation of the inner boss 31, the tank structure with the external shape of the regular hexagon facilitates the installation of the side refrigerating and heat dissipating assembly 5, and the temperature conduction efficiency is effectively improved.
Further, the bottom refrigeration heat dissipation assembly 4 comprises a second heat insulation sheet 44, second heat preservation cotton 45 and a second heat dissipation fan 46;
the second heat insulating sheet 44 is provided with a second mounting through hole 441, and the second semiconductor refrigeration device 43 is clamped in the second mounting through hole 441;
lead the bottom of cold-proof boss 41 and be equipped with contact station 411, second heat preservation cotton 45 is equipped with third installation opening 451, contact station card 411 is located third installation opening 451, contact station 411 with the cold terminal surface of second semiconductor refrigeration device 43 laminates mutually, second heat insulating sheet 44 set up in second heat preservation cotton 45 with between the second radiator 42, second radiator 42 is kept away from one side of second heat insulating sheet 44 is equipped with second radiator fan 46.
The bottom of the cold guide boss 41 is provided with the contact table 411, the contact table 411 can facilitate the contact between the cold guide boss 41 and the second semiconductor refrigerating device 43, and the cold quantity transmission effect is ensured. Through setting up second heat insulating sheet 44 can play thermal-insulated effect, avoids the heat that second radiator 42 gived off influences lead cold boss 41 to the cold volume conduction of jar body 3, thereby it is right to guarantee the refrigeration effect of jar body 3, specifically, second heat insulating sheet 44 can be thermal-insulated sponge, and is thermal-insulated effectual. By providing the second heat dissipation fan 46, the second heat sink 42 can be helped to blow away heat dissipation, so as to achieve rapid heat dissipation.
Further, the housing 1 includes a shell 11, a bottom shell 12, a supporting seat 13 and a supporting frame 14, the first sealing through hole 111 is formed through the top surface of the shell 11, the bottom of the shell 11 is provided with the bottom shell 12, a first heat exchanging and dissipating air hole 112 is formed in the position of the shell 11 corresponding to the side cooling and dissipating assembly 5, and a second heat exchanging and dissipating air hole 121 is formed in the position of the bottom shell 12 corresponding to the bottom cooling and dissipating assembly 4;
the top surface of the supporting seat 13 is provided with the side refrigerating and heat dissipating assembly 5, the bottom surface of the tank 3 is provided with a plurality of supporting columns 33, the supporting seat 13 is provided with a first through hole 131 for the second heat insulating sheet 44 to pass through and a second through hole 132 for the supporting column 33 to pass through, and the supporting column 33 is connected with the bottom shell 12 after passing through the second through hole 132;
the support frames 14 are symmetrically arranged on the bottom surface of the bottom shell 12, and the support frames 14 avoid the second heat exchanging air dispersing holes 121.
Through shell 11 sets up first heat transfer scattered gas pocket 112, and drain pan 12 sets up second heat transfer scattered gas pocket 121 can realize the heat dissipation of side refrigeration radiator unit 5 and the heat dissipation of bottom refrigeration radiator unit 4 makes things convenient for the heat to follow the inside of casing 1 distributes out, guarantees the cooling effect of jar body 3, first heat transfer scattered gas pocket 112 can also set up in another lateral wall of shell 11 to improve the radiating effect. Through setting up supporting seat 13, supporting seat 13 can make things convenient for the installation of side refrigeration radiator unit 5, pillar 33 can reserve installation space for bottom refrigeration radiator unit 4. Through setting up support frame 14 makes semiconductor constant temperature jar is when placing, drain pan 12 can not contact ground or mesa, can completely cut off water pollution, can reserve the heat dissipation space simultaneously and supply to follow the heat dissipation of second heat transfer gas dissipation hole 121.
Further, a sealing plate 113 is further disposed on the inner wall of the top of the outer shell 11, a second sealing through hole 1131 is formed in the sealing plate 113, the second sealing through hole 1131 is disposed corresponding to the first sealing through hole 111, and by disposing the sealing plate 113 on the top of the outer shell 11, the sealing plate 113 can isolate the environment inside the housing 1 from the opening of the tank 3, thereby further preventing the tank 3 from being affected by the ambient temperature inside the housing 1.
Specifically, the top surface of the housing 11 is provided with a rotating bracket 114 and a latch 115 on two sides of the first sealing through hole 111, respectively, and the rotating bracket 114 and the latch 115 are disposed on two sides of the first sealing through hole 111 opposite to each other;
the sealing cover assembly 2 comprises a cover body 21, a connecting support 22 and a rotating handle 23, the connecting support 22 and the rotating handle 23 are oppositely arranged on two sides of the top surface of the cover body 21, the connecting support 22 is hinged to the rotating support 114, the rotating handle 23 is rotatably arranged on the cover body 21, the rotating handle 23 is hinged to the cover body 21, a lock tongue 231 is arranged on one side, close to the lock catch 115, of the rotating handle 23, and when the cover body 21 is locked, the top surface of the lock tongue 231 abuts against the bottom surface of the lock catch 115.
By arranging the rotating bracket 114 and the connecting bracket 22, the connecting bracket 22 is hinged to the rotating bracket 114, so that the cover 21 can rotate around the fulcrum of the rotating bracket 114 to be turned upwards or closed downwards, after the cover 21 is closed at the first sealing through hole 111, as the rotating handle 23 is rotatably arranged on the cover 21, the rotating handle 23 is hinged to the cover 21, the latch bolt 231 is fixed on the latch 115 by rotating the rotating handle 23, the top surface of the latch bolt 231 abuts against the bottom surface of the latch 115, and the cover 21 is subjected to locking pressure to form the sealing of the tank 3 downwards.
Preferably, the sealing cover assembly 2 further includes a sealing gasket 24, the sealing gasket 24 is disposed on one side of the cover 21 close to the first sealing through opening 111, and the sealing gasket 24 is adapted to the shape of the cover 21.
Through setting up sealed pad 24, specifically, sealed pad 24 can be for sealed cushion, because sealed pad 24 set up in being close to of lid 21 one side of first sealed opening 111, the top surface of spring bolt 231 with when the bottom surface of hasp 115 offsets, sealed pad 24 receives locking pressure and forms downwards the sealed of jar body 3, specifically, sealed pad 24 with the cross sectional shape of lid 21 is circular, and is sealed convenient, and is sealed effectual.
Preferably, the semiconductor constant temperature tank further comprises a plurality of temperature control probes, and the plurality of temperature control probes are distributed on the tank body 3.
By arranging the plurality of temperature control probes distributed on the tank body 3, the temperature control probes can acquire temperature data of the surface of the tank body 3, specifically, the temperature control probes can be arranged on any side wall of the tank body 3, the bottom wall of the tank body 3 or the cavity wall of the inner boss 31, the on-off of the first semiconductor refrigerating device 52 and the second semiconductor refrigerating device 43 can be controlled by a processor according to the temperature data detected by the temperature control probes in a PID (proportion integration differentiation) adjusting mode, so that accurate temperature control inside the tank body 3 is realized, the temperature stability of the center of the tank body 3 is ensured, a high-precision temperature adjusting effect is achieved, the surface temperature difference of the tank body 3 is controlled within +/-0.1 ℃, and the semiconductor constant temperature tank is suitable for being used in an environment at-10-50 ℃.
The technical principle of the present invention has been described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and is not to be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A semiconductor constant temperature tank is characterized by comprising a shell, a sealing cover component, a tank body arranged in the shell, a bottom refrigeration heat dissipation component and at least two side refrigeration heat dissipation components;
a first sealing through hole is formed in the top surface of the shell in a penetrating mode, the tank body is arranged in an open mode, the opening of the tank body is arranged corresponding to the first sealing through hole, and the sealing cover assembly is arranged on the first sealing through hole in a covering mode;
the lateral wall of the tank body is provided with the lateral refrigeration heat dissipation assembly, the lateral refrigeration heat dissipation assembly comprises a first radiator and at least one first semiconductor refrigeration device, the cold end surface of the first semiconductor refrigeration device is attached to the lateral wall of the tank body, and the hot end surface of the first semiconductor refrigeration device is attached to the first radiator;
the bottom refrigeration radiating assembly comprises a cold guide boss, a second radiator and a second semiconductor refrigeration device, the cold end face of the second semiconductor refrigeration device is attached to the bottom face of the cold guide boss, the hot end face of the second semiconductor refrigeration device is attached to the second radiator, an inner boss is arranged in the middle of the tank body, a cold guide cavity is formed in the inner boss, the cold guide boss is arranged in the cold guide cavity, and the outer side wall of the cold guide boss is attached to the cavity wall of the cold guide cavity.
2. The semiconductor thermostatic tank of claim 1, wherein the side refrigeration heat sink assembly further comprises a first thermally insulating sheet and a first heat sink fan;
first heat insulating sheet is equipped with at least one first installation opening, first semiconductor refrigeration device card is located first installation opening, first heat insulating sheet set up in first radiator with between the lateral wall of the jar body, first radiator is kept away from one side of first heat insulating sheet is equipped with first radiator fan.
3. The semiconductor constant-temperature tank as claimed in claim 2, wherein the number of the side refrigerating and heat dissipating assemblies is two, and the two side refrigerating and heat dissipating assemblies are symmetrically arranged on the outer side wall of the tank body;
the number of the first semiconductor refrigeration devices is two, the first heat insulation sheet is provided with two first installation through holes, and the first semiconductor refrigeration devices are clamped in the corresponding first installation through holes;
the number of the first cooling fans is two, and the first cooling fans correspond to the first semiconductor refrigeration devices one to one.
4. The semiconductor constant-temperature tank as claimed in claim 2, wherein the outer side wall of the tank body is provided with first heat-insulating cotton, and the first heat-insulating cotton is connected with the first heat-insulating sheet.
5. The semiconductor thermostatic tank of claim 1, wherein the tank body is circular, elliptical, rectangular, or polygonal in shape.
6. The semiconductor thermostatic tank of claim 1, wherein the bottom refrigeration heat dissipation assembly comprises a second heat shield, second heat insulation cotton, and a second heat dissipation fan;
the second heat insulation sheet is provided with a second installation port, and the second semiconductor refrigeration device is clamped in the second installation port;
lead the bottom of cold boss and be equipped with the contact station, the second keeps warm cotton and is equipped with third installation opening, the contact station card is located third installation opening, the contact station with the cold junction face of second semiconductor refrigeration device laminates mutually, the second heat insulating sheet set up in the second keep warm cotton with between the second radiator, the second radiator is kept away from one side of second heat insulating sheet is equipped with second radiator fan.
7. The semiconductor constant temperature tank according to claim 6, wherein the housing comprises a shell, a bottom shell, a supporting seat and a supporting frame, the top surface of the shell is provided with the first sealing through hole in a penetrating manner, the bottom of the shell is provided with the bottom shell, the shell is provided with a first heat exchange air dissipation hole corresponding to the side surface refrigeration heat dissipation assembly, and the bottom shell is provided with a second heat exchange air dissipation hole corresponding to the bottom refrigeration heat dissipation assembly;
the top surface of the supporting seat is provided with the side refrigerating and heat radiating assembly, the bottom surface of the tank body is provided with a plurality of supporting columns, the supporting seat is provided with a first through hole for the second heat insulating sheet to pass through and a second through hole for the supporting columns to pass through, and the supporting columns are connected with the bottom shell after passing through the second through holes;
the bottom surface symmetry of drain pan is provided with the support frame, just the support frame dodges the setting of second heat transfer scattered gas pocket.
8. The semiconductor constant-temperature tank as claimed in claim 7, wherein the top surface of the housing is provided with a rotating bracket and a latch on both sides of the first sealing port, respectively, and the rotating bracket and the latch are disposed on both sides of the first sealing port opposite to each other;
the sealing cover assembly comprises a cover body, a connecting support and a rotating handle, the connecting support and the rotating handle are arranged on two sides of the top surface of the cover body relatively, the connecting support is hinged to the rotating support, the rotating handle is rotatably arranged on the cover body, the rotating handle is hinged to the cover body, a spring bolt is arranged on one side, close to the lock catch, of the rotating handle, and when the cover body is locked, the top surface of the spring bolt is abutted to the bottom surface of the lock catch.
9. The semiconductor thermostatic tank of claim 8, wherein the sealing cover assembly further comprises a sealing gasket disposed on a side of the cover body proximate to the first sealing port, the sealing gasket conforming to the shape of the cover body.
10. The semiconductor thermostat tank of claim 8, further comprising a plurality of temperature control probes distributed over the tank body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223244873.6U CN218645838U (en) | 2022-12-05 | 2022-12-05 | Semiconductor constant temperature tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223244873.6U CN218645838U (en) | 2022-12-05 | 2022-12-05 | Semiconductor constant temperature tank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218645838U true CN218645838U (en) | 2023-03-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223244873.6U Active CN218645838U (en) | 2022-12-05 | 2022-12-05 | Semiconductor constant temperature tank |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218645838U (en) |
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2022
- 2022-12-05 CN CN202223244873.6U patent/CN218645838U/en active Active
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