CN218633999U - Electronic device - Google Patents

Abstract

The embodiment of the application provides electronic equipment. The electronic equipment at least comprises a mainboard, a camera module, a frame-shaped support and a mainboard support. The main board includes a first connection terminal. The camera module comprises a camera shooting assembly and a flexible circuit board. The camera shooting assembly is electrically connected with the flexible circuit board. The flexible circuit board is located on one side of the camera shooting assembly. The flexible circuit board includes a second connection terminal. The second connecting terminal sets up in the tip that the subassembly of making a video recording was kept away from to the flexible circuit board. The first connection terminal is electrically connected to the second connection terminal. The frame-shaped bracket is connected with the camera shooting assembly. The frame bracket includes a receiving hole. At least part of the camera shooting assembly is arranged in the accommodating hole. The main board support comprises a body part and a metal elastic arm which are connected. The main body part is connected with the main board. The body portion includes a relief hole. The frame-shaped support is arranged in the avoiding hole in a penetrating mode. The metal elastic arm faces the outer side wall of the frame-shaped support and is back to the flexible circuit board. The electronic equipment provided by the embodiment of the application can effectively improve the assembly work efficiency of the electronic equipment.

Description

Electronic device

Technical Field

The embodiment of the application relates to the technical field of terminals, in particular to an electronic device.

Background

With the explosive growth of electronic devices such as smart phones or tablet computers, the functions of the electronic devices are more and more. As people expect that electronic devices can meet more functional requirements, more and more functions can be realized by the electronic devices themselves. For example, the electronic apparatus includes a camera module. The image capturing performance of electronic apparatuses is expected to be higher and higher to obtain high-resolution images. The camera module comprises a camera component. In the process of assembling the camera module, the positioning piece on the battery cover can position the camera assembly, so that the camera assembly is ensured to correspond to the light hole of the battery cover. However, before the positioning element of the battery cover is assembled with the camera module, the camera module may be greatly deviated from the positioning element during the assembly process, so that the positioning element is not easily assembled with the camera module, and the assembly efficiency of the electronic device is affected.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an electronic device, and the assembling work efficiency of the electronic device can be effectively improved.

The present application provides an electronic device, which at least includes a main board, a camera module, a frame bracket and a main board bracket.

The main board includes a first connection terminal. The camera module comprises a camera shooting assembly and a flexible circuit board. The camera shooting assembly is electrically connected with the flexible circuit board. The flexible circuit board is located on one side of the camera shooting assembly. The flexible circuit board includes a second connection terminal. The second connecting terminal sets up in the tip that the subassembly of making a video recording was kept away from to the flexible circuit board. The first connection terminal is electrically connected to the second connection terminal. The frame-shaped bracket is connected with the camera shooting assembly. The frame bracket includes a receiving hole. At least part of the camera shooting assembly is arranged in the accommodating hole. The main board support comprises a body part and a metal elastic arm which are connected. The body part is connected with the main board. The body portion includes an avoidance hole. The frame-shaped bracket is arranged in the avoiding hole in a penetrating way. The metal elastic arm faces the outer side wall of the frame-shaped support and is back to the flexible circuit board.

The electronic equipment of this application embodiment, to make a video recording the module and accomplish the equipment back with frame shape support, will make a video recording module, frame shape support and mainboard and assemble. After the camera module, the frame-shaped support and the mainboard are assembled, the mainboard support and the mainboard are assembled. The avoidance hole on the main board support is aligned with the frame-shaped support so as to avoid the frame-shaped support. After the mainboard support and the mainboard are assembled, the frame-shaped support penetrates through the avoiding hole, and the metal elastic arm is positioned on one side of the frame-shaped support, which is back to the outer side wall of the flexible circuit board. The metal elastic arm and the flexible circuit board are respectively positioned on two sides of the frame-shaped bracket. When the flexible circuit board on one side applies acting force to the frame-shaped support, the metal elastic arm on the other side can apply reverse acting force to the frame-shaped support, so that the frame-shaped support is limited, the pre-positioning of the frame-shaped support and the camera shooting assembly is realized, the possibility of large deviation of the position of the camera shooting assembly is reduced, the difficulty in accurate positioning between the subsequent camera shooting assembly and the battery cover is favorably reduced, the camera shooting assembly and the battery cover are quickly positioned and assembled, and the assembly working efficiency of the electronic equipment is effectively improved.

In one possible embodiment, the body portion includes an insulating layer and a metal substrate. The insulating layer is arranged on the outer surface of the metal substrate. The metal substrate is connected with the main board. The metal elastic arm is connected with the metal substrate.

In one possible embodiment, the metal elastic arm and the metal substrate are of an integrally molded structure.

In one possible embodiment, the frame-shaped support is an electrically conductive structure. The main board includes a ground terminal. The frame-shaped bracket and the grounding terminal are electrically connected through the metal elastic arm and the metal substrate.

In one possible embodiment, the metal base plate includes a connection protrusion. The connection projection is disposed facing the ground terminal. The connection projection abuts against the ground terminal.

In one possible embodiment, the metal spring arm comprises a first bending section, a second bending section and a third bending section. The first bending section is connected with the body part. The second bending section is connected with the first bending section and the third bending section. The first bending section and the third bending section are respectively arranged on two sides of the second bending section. The third bending section is arranged facing the outer side wall of the frame-shaped support.

In one possible embodiment, the metal spring arm comprises a first recess and a second recess. The first recess and the second recess communicate. The first bending section is provided with a first concave part. The second bending section is provided with a second concave part.

In a possible embodiment, the metal elastic arm further comprises a fourth bending section and a fifth bending section. The third bending section is connected with the fourth bending section. The fourth bending section is connected with the fifth bending section. The fourth bending section is inclined towards the direction close to the second bending section. The fifth bending section inclines towards the direction far away from the second bending section. The connecting area of the third bending section and the fourth bending section is arranged facing the outer side wall of the frame-shaped support.

In a possible embodiment, the metal elastic arm further comprises a fourth bending section and a fifth bending section. The third bending section is connected with the fourth bending section. The fourth bending section is connected with the fifth bending section. The fourth bending section is inclined towards the second bending section. The fifth bending section is positioned on one side of the first bending section back to the second bending section. The connecting area of the third bending section and the fourth bending section is arranged facing the outer side wall of the frame-shaped support.

In a possible embodiment, the main board support further includes a stopper. The limiting part is connected with the body part. Along the axial direction of the accommodating hole, the limiting part is positioned above the end surface of the frame-shaped support.

In one possible embodiment, a gap is provided between the limiting part and the end face of the frame-shaped holder in the axial direction of the receiving opening.

In a possible embodiment, the number of metal elastic arms is more than two. More than two metal elastic arms are arranged facing the outer side wall of the frame-shaped bracket.

In one possible embodiment, the main plate comprises a hollowed-out hole. The frame-shaped bracket is arranged in the hollow hole in a penetrating way.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic partial exploded view of an electronic device according to an embodiment of the present disclosure;

fig. 3 is a schematic partial structure diagram of a camera module according to an embodiment of the present disclosure;

fig. 4 is a schematic partial cross-sectional structural diagram of an electronic device according to an embodiment of the present application;

fig. 5 is a schematic partial cross-sectional structural diagram of an electronic device according to another embodiment of the present application;

fig. 6 is a partial schematic structural view of a motherboard bracket according to an embodiment of the present application;

fig. 7 is a partial schematic structural view of a motherboard bracket according to another embodiment of the present application;

fig. 8 is a partial schematic structural view of a motherboard bracket according to still another embodiment of the present application;

fig. 9 is a schematic partial cross-sectional structural diagram of an electronic device according to yet another embodiment of the present application.

Reference numerals:

10. an electronic device;

20. a display component;

30. a shell assembly;

31. a middle frame;

32. a battery cover;

40. a main board; 40a, hollowing out holes;

41. a first connection terminal;

42. a ground terminal;

50. an electronic device;

60. a camera module;

61. a camera assembly;

62. a flexible circuit board; 621. a second connection terminal;

70. a frame-shaped support; 70a, a receiving hole; 70b, an outer side wall;

80. a main board support; 80a, avoiding holes;

81. a body portion;

811. an insulating layer;

812. a metal substrate; 812a, a connection convex part;

82. a metal spring arm; 82a, a first recess; 82b, a second recess;

821. a first bending section;

822. a second bending section;

823. a third bending section;

824. a fourth bending section;

825. a fifth bending section;

83. a limiting part;

z, thickness direction.

Detailed Description

The electronic device in the embodiment of the present application may be referred to as a User Equipment (UE) or a terminal (terminal), for example, the electronic device may be a tablet computer (PAD), a Personal Digital Assistant (PDA), a handheld device with a wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a Virtual Reality (VR) terminal device, an Augmented Reality (AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in unmanned driving (self driving), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in city (smart city), a wireless terminal in smart home (smart home), or a fixed wireless terminal. The form of the terminal device is not particularly limited in the embodiment of the present application.

In the embodiment of the present application, fig. 1 schematically shows a structure of an electronic device 10 according to an embodiment. Referring to fig. 1, an electronic device 10 is taken as an example of a handheld device with a wireless communication function. The wireless communication enabled handset may be, for example, a cell phone.

Fig. 2 schematically shows a partially exploded structure of the electronic device 10. Referring to fig. 2, an electronic device 10 of an embodiment of the present application may include a display assembly 20 and a housing assembly 30. Display assembly 20 is coupled to housing assembly 30. The exposed display area on the display assembly 20 may be used to present image information to a user.

The electronic device 10 may include a motherboard 40 and electronics 50. The main Board 40 may be a Printed Circuit Board (PCB). The electronic device 50 is provided on the main board 40. The electronic device 50 is soldered to the main board 40 through a soldering process. The electronic device 50 may include, but is not limited to, a Central Processing Unit (CPU), a smart algorithm chip, or a Power Management IC (PMIC).

The electronic device 10 may include a camera module 60. The camera module 60 includes a camera module 61 and a Flexible Printed Circuit (FPC) 62. The camera module 61 is used for taking a picture of the selected object and forming corresponding image information. The camera module 61 includes a light inlet portion for receiving light. The external light can enter the camera module 61 through the light inlet portion. The camera module 61 can be electrically connected to the motherboard 40, for example, the camera module 60 can be electrically connected to the motherboard 40 through the flexible circuit board 62, so as to realize signal interaction.

The case assembly 30 may include a middle frame 31 and a battery cover 32. The battery cover 32 may be connected to the middle frame 31. The battery cover 32 has a light-transmitting hole. The light-transmitting hole penetrates through both opposite surfaces of the battery cover 32. Along the axial direction of the light transmission hole, the light inlet part of the camera module 61 is arranged corresponding to the light transmission hole. It should be noted that the axial direction of the light transmission hole may be the extending direction of the light transmission hole. Illustratively, the cross-sectional shape of the light-transmitting hole may be circular, elliptical, or polygonal, which is not limited in the present application.

In the related art, the fixed main board 40 is mounted on the case assembly 30, for example, the fixed main board 40 is mounted on the center frame 31. The camera module 60 is connected to the main board 40. The battery cover 32 is provided with a positioning member. When the battery cover 32 and the camera module 60 are assembled, the positioning member of the battery cover 32 can position the camera module 61, so that the light inlet portion of the camera module 61 is aligned with the light hole of the battery cover 32, and thus external light can smoothly pass through the light hole to reach the light inlet portion. The camera module 61 can be electrically connected with the main board 40 through the flexible circuit board 62 to realize signal interaction. Because the flexible circuit board 62 has elasticity, there is a possibility that the flexible circuit board 62 applies a force to the image pickup assembly 61 to cause a large displacement of the position of the image pickup assembly 61, so that the positioning member of the battery cover 32 is not easily positioned and assembled with the image pickup assembly 61, and the assembly efficiency of the electronic device 10 is affected.

The electronic device 10 provided by the embodiment of the application can be abutted with the frame-shaped support connected with the camera shooting component 61 through the metal elastic arm on the main board support, so that the camera shooting component 61 can be pre-positioned, the possibility of large deviation of the position of the camera shooting component 61 is reduced, smooth assembly of the battery cover 32 and the camera shooting component 61 is facilitated, and the assembly efficiency is improved.

The following explains an implementation of the electronic device 10 provided in the embodiment of the present application.

Referring to fig. 2, the electronic device 10 according to the embodiment of the present disclosure includes a main board 40, a camera module 60, a frame bracket 70, and a main board bracket 80.

Fig. 3 schematically shows a partial structure of the camera module 60 of the present application. Referring to fig. 3, the camera module 60 includes a camera module 61 and a flexible circuit board 62. The camera module 61 is electrically connected to the flexible circuit board 62. The flexible circuit board 62 may be located on one side of the camera assembly 61. The flexible circuit board 62 includes a second connection terminal 621. The second connection terminal 621 is disposed at an end of the flexible circuit board 62 away from the camera module 61. Fig. 4 schematically shows a partially cut-away structure of the electronic device 10 of the present application. Referring to fig. 3 and 4, the main board 40 of the embodiment of the present application includes a first connection terminal 41. The first connection terminal 41 of the main board 40 is electrically connected to the second connection terminal 621 of the flexible circuit board 62. Illustratively, the first connection terminal 41 of the main board 40 and the second connection terminal 621 of the flexible circuit board 62 may be electrically connected using a Board To Board (BTB) connector.

The frame support 70 of the present embodiment is attached to the camera module 61. The frame bracket 70 includes a receiving hole 70a. At least a part of the camera module 61 is disposed in the accommodation hole 70a. The frame bracket 70 is sleeved outside the camera module 61. The frame support 70 may provide a stop or guard for the camera assembly 61. Illustratively, the camera module 61 and the frame bracket 70 may be connected by bonding. For example, glue is applied between the camera assembly 61 and the frame support 70. After the glue is cured, the camera assembly 61 is fixed to the frame support 70. Illustratively, the second connection end of the flexible circuit board 62 may be located outside the frame bracket 70.

The main board bracket 80 of the embodiment of the present application may be connected to the main board 40. The motherboard bracket 80 may be disposed above the motherboard 40, i.e. the motherboard bracket 80 is located at a side of the motherboard 40 facing the battery cover 32. The motherboard bracket 80 may provide shielding for the underlying structural components. The motherboard bracket 80 includes a body portion 81 and a metal spring arm 82 connected. The main body 81 of the main board bracket 80 may be connected to the main board 40. Illustratively, the body portion 81 may be coupled to the main plate 40 by fasteners, such as screws.

The body portion 81 includes an escape hole 80a. The frame-shaped bracket 70 is inserted through the escape hole 80a. The metal elastic arm 82 of the main board bracket 80 is disposed facing the outer side wall 70b of the frame bracket 70 away from the flexible circuit board 62. Illustratively, the metal elastic arm 82 of the motherboard bracket 80 may abut against the outer side wall 70b of the frame-shaped bracket 70 facing away from the flexible circuit board 62. The metal elastic arm 82 of the motherboard bracket 80 and the flexible circuit board 62 are respectively disposed on two sides of the frame bracket 70. Illustratively, the metal spring arm 82 itself has elastic deformability. The material of the metal elastic arm 82 may be steel, iron, aluminum, or aluminum alloy.

The electronic device 10 according to the embodiment of the present application assembles the camera module 60 and the frame bracket 70, and then assembles the camera module 60, the frame bracket 70, and the main board 40. After the camera module 60, the frame bracket 70 and the main board 40 are assembled, the main board bracket 80 is assembled with the main board 40. The escape hole 80a of the main board support 80 is aligned with the frame support 70 to escape the frame support 70. After the motherboard bracket 80 and the motherboard 40 are assembled, the frame bracket 70 is inserted into the avoiding hole 80a, and the metal elastic arm 82 is located on a side of the frame bracket 70 opposite to the outer sidewall 70b of the flexible circuit board 62. The metal spring arm 82 and the flexible circuit board 62 are located on both sides of the frame-shaped bracket 70, respectively. When the flexible circuit board 62 on one side applies an acting force to the frame-shaped support 70, the metal elastic arm 82 on the other side can apply a reverse acting force to the frame-shaped support 70, so that the frame-shaped support 70 is limited, the pre-positioning of the frame-shaped support 70 and the camera shooting component 61 is realized, the possibility that the position of the camera shooting component 61 is greatly deviated is reduced, the difficulty of accurate positioning between the subsequent camera shooting component 61 and the battery cover 32 is favorably reduced, the camera shooting component 61 and the battery cover 32 are quickly positioned and assembled, and the assembly working efficiency of the electronic device 10 is effectively improved.

In addition, the metal elastic arm 82 has high mechanical strength, so that on the premise of ensuring the mechanical strength meeting the deformation resistance, the thickness of the metal elastic arm 82 can be relatively reduced, the space occupancy rate of the metal elastic arm 82 is favorably reduced, and more space can be relatively saved. The saved space position may be used to arrange the electronic device 50 on the main board 40, for example, the electronic device 50 stacked along the thickness direction Z of the electronic device 10 on the main board 40 in the related art may be moved to the saved space position, thereby being beneficial to reducing the thickness of the main board 40, further being beneficial to reducing the thickness of the electronic device 10, and realizing the light and thin design of the electronic device 10. Meanwhile, if the metal elastic arm 82 is accidentally deformed during the assembly process, the metal elastic arm 82 can be reshaped to restore the shape of the metal elastic arm 82 which can be normally used, so that the possibility of scrapping the whole main board bracket 80 due to poor deformation of the elastic arm is reduced.

In some realizable manners, as shown in fig. 4, the thickness D of the metal spring arm 82 may range from 0.15 millimeters (mm) to 0.25 mm. Illustratively, the thickness of the metal spring arm 82 may be 0.2 millimeters (mm).

In some realizable manners, the metal elastic arm 82 abuts against the outer side wall 70b of the frame-shaped bracket 70 facing away from the flexible circuit board 62, i.e., the metal elastic arm 82 is in contact with the outer side wall 70b of the frame-shaped bracket 70. A gap can be formed between the outer side wall 70b of the frame bracket 70 facing the flexible circuit board 62 and the inner wall of the avoiding hole 80a of the motherboard bracket 80, so that a movable space can be reserved for the frame bracket 70, and the subsequent precise positioning operation between the battery cover 32 and the camera assembly 61 is facilitated.

In some realizable manners, the body portion 81 includes an insulating layer 811 and a metal substrate 812. The insulating layer 811 is disposed on the outer surface of the metal substrate 812. The insulating layer 811 covers at least part of the outer surface of the metal substrate 812. The metal substrate 812 has high mechanical strength, so that the thickness of the metal substrate 812 can be reduced on the premise of meeting the mechanical strength of the supporting requirement, the whole thickness of the main board support 80 is reduced, and the whole thickness of the electronic device 10 is reduced. The insulating layer 811 may be used to isolate the metal substrate 812 from the electronic device 50 on the motherboard 40.

Illustratively, the material of the insulating layer 811 may be plastic or plastic. The material of the metal substrate 812 may be steel, iron, aluminum, or an aluminum alloy. The metal substrate 812 may be connected to the main board 40.

Illustratively, the metal substrate 812 may be coupled to the main plate 40 by fasteners, such as screws. The metal spring arm 82 is connected to a metal base 812. The avoiding hole 80a of the motherboard bracket 80 penetrates the metal substrate 812.

In some examples, the material of the metal spring arm 82 may be the same as the material of the metal substrate 812. The metal elastic arm 82 and the metal substrate 812 can be in an integrated structure, so that the connection strength of the metal elastic arm 82 and the metal substrate 812 is high, and when the metal elastic arm 82 receives external acting force, the metal elastic arm 82 and the metal substrate 812 are not easy to separate, or the joint of the metal elastic arm 82 and the metal substrate 812 is not easy to break.

In some examples, the frame support 70 is a conductive structure. The frame bracket 70 may be a metal bracket. Illustratively, the material of the frame bracket 70 may be steel, iron, aluminum, or an aluminum alloy. Fig. 5 schematically shows a partially cut-away structure of the electronic device 10 of the present application. Referring to fig. 5, the main board 40 may include a ground terminal 42. The frame bracket 70 and the ground terminal 42 are electrically connected through the metal elastic arm 82 and the metal substrate 812. The frame bracket 70 is electrically connected to the ground terminal 42 through the metal elastic arm 82 and the metal substrate 812, so as to ground the camera module 60, and thus, it is not necessary to additionally provide a ground spring on the frame bracket 70, which is beneficial to simplifying the structure of the frame bracket 70, reducing the number of parts used, and saving more space relatively.

In some examples, the metal substrate 812 includes a connection boss 812a. The connection convex portion 812a is disposed facing the ground terminal 42. The connection convex portion 812a may abut against the ground terminal 42. After the main board bracket 80 is connected to the main board 40, the connection convex portion 812a of the metal substrate 812 contacts the ground terminal 42. For example, the connecting protrusion 812a and the main board 40 may be connected by using a fastener to further improve the stability and reliability of the electrical connection state of the connecting protrusion 812a and the ground terminal 42. Illustratively, the fastener may be a screw.

In some realizable ways, FIG. 6 schematically shows a partial structure of the motherboard bracket 80 of the present application. Referring to fig. 6, the metal elastic arm 82 includes a first bending section 821, a second bending section 822, and a third bending section 823. The first bent section 821 is connected to the body portion 81. Illustratively, the first bending section 821 is connected to the metal substrate 812 of the body portion 81. The second bending section 822 connects the first bending section 821 and the third bending section 823. The first bending section 821 and the third bending section 823 are respectively disposed at both sides of the second bending section 822. The first bending section 821 and the third bending section 823 intersect with the second bending section 822. The second bending section 822 is located at a side of the first bending section 821 facing the main board 40. The third bend section 823 is provided facing the outer side wall 70b of the frame bracket 70. The third bending section 823 can abut against the outer sidewall 70b of the frame bracket 70 to limit the frame bracket 70.

In some examples, the first bent section 821 is connected to one end of the second bent section 822, and the third bent section 823 is connected to the other end of the second bent section 822. The first bending section 821 is located on a side of the second bending section 822 facing away from the frame support 70. The third bending section 823 is located on a side of the second bending section 822 facing the frame bracket 70. The third bending section 823 is disposed obliquely with respect to the second bending section 822. The third bending section 823 is inclined away from the second bending section 822. The end of the third bent section 823 distal from the second bent section 822 may be used to abut the outer sidewall 70b of the frame bracket 70.

In some examples, the first, second, and third bent segments 821, 822, 823 are integrally formed structures.

In some examples, the metal spring arm 82 includes a first recess 82a and a second recess 82b. The first recess 82a and the second recess 82b communicate. The first bent section 821 provides the first recess 82a. The second bending section 822 is provided with a second recess 82b. The first concave portion 82a and the second concave portion 82b are respectively located at the connection transition position of the first bending section 821 and the second bending section 822, so that the strength of the first bending section 821 and the second bending section 822 can be effectively improved, the deformation resistance can be improved, and the possibility that the first bending section 821 and the second bending section 822 are easily deformed due to the action of external force can be reduced.

Illustratively, the first and second recesses 82a, 82b include openings in the surfaces of the metal spring arms 82 facing the frame bracket 70.

Illustratively, the metal spring arm 82 is formed with a ridge in an area corresponding to the first recess 82a and the second recess 82b. For example, the regions of the metal elastic arms 82 corresponding to the first recess 82a and the second recess 82b are raised in a direction away from the frame bracket 70.

In some examples, fig. 7 schematically illustrates a partial structure of the main board bracket 80 of the present application. Referring to fig. 7, the metal spring arm 82 further includes a fourth bent section 824 and a fifth bent section 825. The third bend section 823 is connected to the fourth bend section 824. The fourth folded section 824 and the fifth folded section 825 are connected. The fourth bending section 824 is inclined toward a direction close to the second bending section 822. The fifth bending section 825 is inclined away from the second bending section 822. The connection area of the third and fourth bent sections 823, 824 is disposed facing the outer side wall 70b of the frame bracket 70. The connection area of the third and fourth folded sections 823, 824 may be used to abut the outer side wall 70b of the frame bracket 70 to form a stop for the frame bracket 70.

The fourth bending section 824 and the fifth bending section 825 can effectively improve the strength of the metal limiting arm and improve the deformation resistance, so that when the connection region of the third bending section 823 and the fourth bending section 824 abuts against the outer sidewall 70b of the frame-shaped bracket 70, the fourth bending section 824 and the fifth bending section 825 can be used for dispersing acting force, thereby reducing the possibility that the first bending section 821 and the second bending section 822 are easy to deform due to the action of external force.

In some examples, the fourth and fifth bent segments 824, 825 are both located on a side of the second bent segment 822 facing the frame support 70. The fourth bend section 824 is connected to the end of the third bend section 823 remote from the second bend section 822. Through holes are formed among the third bending section 823, the fourth bending section 824, and the second bending section 822. One end of the fifth bending section 825 is connected to the end of the fourth bending section 824 near the second bending section 822, and the other end of the fifth bending section 825 is far from the second bending section 822.

Illustratively, the location where the fourth and fifth bending sections 824 and 825 are connected to each other may abut against the surface of the second bending section 822 facing the frame support 70.

Illustratively, the fourth bending section 824 and the fifth bending section 825 may be connected to each other at a position having a gap with a surface of the second bending section 822 facing the frame bracket 70. When the connection region of the third and fourth bending sections 823 and 824 abuts against the outer sidewall 70b of the frame-shaped support 70, the connection position of the fourth and fifth bending sections 824 and 825 with each other may abut against the surface of the second bending section 822 facing the frame-shaped support 70.

In some examples, the first 821, second 822, third 823, fourth 824, and fifth 825 folded sections are integrally formed structures.

In other examples, FIG. 8 schematically illustrates a partial structure of the motherboard bracket 80 of the present application. Referring to fig. 8, the metal spring arm 82 further includes a fourth bent section 824 and a fifth bent section 825. The third bend section 823 is connected to the fourth bend section 824. The fourth folded section 824 and the fifth folded section 825 are connected. The fourth bending section 824 is inclined toward the second bending section 822. The fifth bending section 825 is located at a side of the first bending section 821 facing away from the second bending section 822. The connection area of the third and fourth bent sections 823, 824 is disposed facing the outer side wall 70b of the frame bracket 70. The connection area of the third and fourth folded sections 823, 824 may be used to abut the outer side wall 70b of the frame bracket 70 to form a stop for the frame bracket 70.

The fourth bending section 824 and the fifth bending section 825 can effectively improve the strength of the metal limiting arm and improve the deformation resistance, so that when the connection region of the third bending section 823 and the fourth bending section 824 abuts against the outer sidewall 70b of the frame-shaped bracket 70, the fourth bending section 824 and the fifth bending section 825 can be used for dispersing acting force, thereby reducing the possibility that the first bending section 821 and the second bending section 822 are easy to deform due to the action of external force.

Illustratively, the fourth and fifth bent segments 824 and 825 are each located on a side of the second bent segment 822 facing the frame support 70. The fourth bend section 824 is connected to the end of the third bend section 823 remote from the second bend section 822. Through holes are formed among the third bending section 823, the fourth bending section 824 and the second bending section 822. One end of the fifth bend 825 is connected to the end of the fourth bend 824 distal to the third bend 823.

Illustratively, the first bending section 821 and the fifth bending section 825 are disposed on top of each other. Surfaces of the first bending section 821 and the fifth bending section 825 opposite to each other may be attached to each other. The position where the fourth bending section 824 and the fifth bending section 825 are connected to each other may correspond to the position where the first bending section 821 and the second bending section 822 are connected to each other.

In some examples, the connection area of the third bending section 823 and the fourth bending section 824 is arc-shaped, so that when the connection area of the third bending section 823 and the fourth bending section 824 abuts against the outer sidewall 70b of the frame-shaped bracket 70, the connection area is not easy to scratch the frame-shaped bracket 70 and does not cause local stress concentration on the frame-shaped bracket 70 to cause dents.

In some realizable manners, fig. 9 schematically shows a partial cross-sectional structure of the electronic device 10 of the present application. Referring to fig. 9, the main plate bracket 80 further includes a stopper portion 83. The stopper 83 is connected to the body 81. The stopper portion 83 is located above the end surface of the frame bracket 70 in the axial direction of the receiving hole 70a. The end surface of the frame-shaped bracket 70 refers to the surface facing the battery cover 32. After the motherboard bracket 80 is connected to the motherboard 40, the limiting portion 83 can limit the frame bracket 70 along the thickness direction Z of the electronic device 10, so that the possibility that the frame bracket 70 is tilted due to the action force of the flexible circuit board 62 on the frame bracket 70 along the thickness direction Z is reduced, and the possibility that the camera module 61 connected to the frame bracket 70 is tilted is reduced.

Illustratively, the material of the stopper portion 83 is the same as the material of the insulating layer 811. The limiting portion 83 and the insulating layer 811 may be integrally formed.

In some examples, the stop portion 83 corresponds to a metal stop arm along the thickness direction Z of the electronic device 10. The stopper 83 may be located above the metal stopper arm. Illustratively, the frame bracket 70 may be rectangular. The limiting portion 83 and the metal limiting arm correspond to the same frame of the frame-shaped bracket 70, that is, the metal limiting arm can abut against the outer sidewall 70b of the frame far away from the flexible circuit board 62, and the limiting portion 83 corresponds to the end surface of the frame. Illustratively, the metal spring arm 82 may be disposed facing a middle region of the frame bracket 70.

In some examples, a gap may be provided between the limiting portion 83 and the end surface of the frame-shaped bracket 70 along the axial direction of the accommodating hole 70a, so as to reserve a movable space for the frame-shaped bracket 70, and facilitate a subsequent fine positioning operation between the battery cover 32 and the image capturing assembly 61.

In some realizable manners, the number of metal spring arms 82 is more than two. Two or more metal spring arms 82 are provided facing the outer side wall 70b of the frame bracket 70. The more than two metal elastic arms 82 can abut against the outer side wall 70b of the frame-shaped support 70 at the same time, so that acting force can be effectively dispersed, the possibility of accidental deformation of the single metal elastic arm 82 is reduced, and the more than two metal elastic arms 82 can limit the frame-shaped support 70 more stably.

In some implementations, the main plate 40 includes a hollowed-out hole 40a. The through hole 40a penetrates through two opposite surfaces of the main board 40 in the thickness direction Z of the electronic device 10. The hollow hole 40a can escape the frame bracket 70. Frame support 70 wears to locate fretwork hole 40a to mainboard 40 and frame support 70 need not follow the range upon range of setting of thickness direction Z of electronic equipment 10, are favorable to reducing the shared space of mainboard 40 and frame support 70 along thickness direction Z of electronic equipment 10, and then are favorable to reducing the thickness of electronic equipment 10, realize the frivolous design of electronic equipment 10.

In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

Reference throughout this specification to apparatus or components, in embodiments or applications, means or components must be constructed and operated in a particular orientation and therefore should not be construed as limiting the present embodiments. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically stated otherwise. The terms "first," "second," "third," "fourth," and the like in the description and claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The term "plurality" herein refers to two or more. The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship; in the formula, the character "/" indicates that the preceding and following related objects are in a relationship of "division".

It is to be understood that the various numerical references referred to in the embodiments of the present application are merely for convenience of description and distinction and are not intended to limit the scope of the embodiments of the present application. It should be understood that, in the embodiment of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiment of the present application.

Claims (13)

1. An electronic device, characterized in that it comprises at least:

a main board including a first connection terminal;

the camera shooting module comprises a camera shooting assembly and a flexible circuit board, the camera shooting assembly is electrically connected with the flexible circuit board, the flexible circuit board is positioned on one side of the camera shooting assembly, the flexible circuit board comprises a second connecting terminal, the second connecting terminal is arranged at the end part, far away from the camera shooting assembly, of the flexible circuit board, and the first connecting terminal is electrically connected with the second connecting terminal;

the frame-shaped support is connected with the camera shooting assembly and comprises a containing hole, and at least part of the camera shooting assembly is arranged in the containing hole;

the main board support comprises a main body portion and a metal elastic arm, wherein the main body portion is connected with the main board, the main body portion comprises an avoiding hole, the frame-shaped support is arranged in the avoiding hole in a penetrating mode, and the metal elastic arm faces the outer side wall of the flexible circuit board and faces away from the frame-shaped support.

2. The electronic device of claim 1, wherein the body portion comprises an insulating layer and a metal substrate, the insulating layer is disposed on an outer surface of the metal substrate, the metal substrate is connected to the main board, and the metal elastic arm is connected to the metal substrate.

3. The electronic device of claim 2, wherein the metal elastic arm and the metal substrate are of an integrally formed structure.

4. The electronic device according to claim 2, wherein the frame-shaped support is a conductive structure, the main board includes a ground terminal, and the frame-shaped support and the ground terminal are electrically connected through the metal elastic arm and the metal substrate.

5. The electronic apparatus according to claim 4, wherein the metal substrate includes a connection projection provided facing the ground terminal, the connection projection abutting against the ground terminal.

6. The electronic device of claim 1, wherein the metal elastic arm includes a first bending section, a second bending section, and a third bending section, the first bending section is connected to the body portion, the second bending section is connected to the first bending section and the third bending section, the first bending section and the third bending section are respectively disposed on two sides of the second bending section, and the third bending section is disposed facing the outer sidewall of the frame-shaped support.

7. The electronic device of claim 6, wherein the metal spring arm includes a first recess and a second recess, the first recess and the second recess being in communication, the first bent section providing the first recess, the second bent section providing the second recess.

8. The electronic device of claim 6, wherein the metal elastic arm further comprises a fourth bending section and a fifth bending section, the third bending section is connected with the fourth bending section, the fourth bending section is connected with the fifth bending section, the fourth bending section is inclined towards a direction close to the second bending section, the fifth bending section is inclined towards a direction far away from the second bending section, and a connection region of the third bending section and the fourth bending section is disposed facing the outer sidewall of the frame-shaped bracket.

9. The electronic device of claim 6, wherein the metal elastic arm further comprises a fourth bending section and a fifth bending section, the third bending section is connected with the fourth bending section, the fourth bending section is connected with the fifth bending section, the fourth bending section is inclined towards the second bending section, the fifth bending section is located on a side of the first bending section facing away from the second bending section, and a connection region of the third bending section and the fourth bending section is disposed facing the outer sidewall of the frame-shaped support.

10. The electronic device according to any one of claims 1 to 9, wherein the main board holder further includes a stopper portion that is connected to the main body portion, and is located above an end surface of the frame-shaped holder in an axial direction of the accommodation hole.

11. The electronic device according to claim 10, wherein a gap is provided between the stopper portion and an end surface of the frame bracket in an axial direction of the accommodation hole.

12. The electronic device according to any one of claims 1 to 9, wherein the number of the metal elastic arms is two or more, and the two or more metal elastic arms are disposed facing the outer side wall of the frame-shaped bracket.

13. The electronic device according to any one of claims 1 to 9, wherein the main board includes a hollow hole, and the frame-shaped support is disposed through the hollow hole.

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