CN218632538U - Conduction assembly - Google Patents

Abstract

The utility model discloses a conduction assembly, which comprises a plastic base, wherein a conductive circuit is arranged on the plastic base, the conduction assembly also comprises a contact probe, a hole groove is arranged on the plastic base, one end of the contact probe extends into the hole groove and is connected with the plastic base in a hot melting way, solder paste is filled in the hole groove, and the contact probe and the conductive circuit are conducted by the solder paste; the other end of the contact probe extends out of the aperture slot. The conduction assembly is novel in structure, a contact elastic sheet is omitted, the contact probe is connected with the plastic base in a hot melting mode, the bonding strength of the contact probe and the plastic base is high, the risk of accidental separation of the contact probe and the plastic base is greatly reduced, and the structural stability of the conduction assembly is improved; the solder paste can not only conduct the contact probes and the conducting circuits, but also effectively fill the holes and grooves, so that the yield of the conducting components is ensured; the existence of the hole groove not only can position the contact probe and facilitate the insertion of the contact probe, but also can collect hot melting excess materials and solder paste, thereby realizing multiple purposes.

Description

Conduction assembly

Technical Field

The utility model relates to an electrical property conduction structure technical field especially relates to a conduction assembly.

Background

In the prior art, the conduction assembly comprises a plastic base and a contact elastic sheet, a conductive circuit is arranged on the plastic base, the contact elastic sheet is welded on a bonding pad of the plastic base and is electrically conducted with the conductive circuit, and the conductive circuit is electrically connected with an external device through a contact part of the contact elastic sheet. In this subassembly that switches on, the bonding force is guaranteed only to the area of welding by the contact shell fragment, appears the rosin joint badly easily and does not discover, leads to losing efficacy in the product use. That is, the conventional conductive device has a problem of poor structural stability.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: a conduction assembly with stable structure is provided.

In order to solve the technical problem, the utility model discloses a technical scheme be: a conducting assembly comprises a plastic base, a conductive circuit and a contact probe, wherein a hole groove is formed in the plastic base, one end of the contact probe extends into the hole groove and is in hot-melt connection with the plastic base, solder paste is filled in the hole groove, and the contact probe and the conductive circuit are conducted through the solder paste; the other end of the contact probe extends out of the hole groove.

Furthermore, the hole groove comprises a hot melting section and a tin containing section which are communicated, one end of the contact probe penetrates through the tin containing section to be inserted into the hot melting section, the hot melting section is in hot melting connection with the plastic base, and the tin containing section is used for containing tin paste.

Furthermore, the solder paste does not protrude from the end face of one end of the solder accommodating section far away from the hot melting section.

Furthermore, the whole tin containing section is in an inverted round table shape.

Furthermore, the included angle between the circular truncated cone generatrix of the tin containing section and the rotating central shaft is 20-40 degrees.

Further, the solder paste is low-temperature solder paste.

Further, the conductive circuit is an antenna.

Further, the contact probe is a spring type probe.

Furthermore, a wiring groove is formed in the surface of the plastic base, and at least part of the area of the conductive circuit is arranged in the wiring groove.

Further, all areas of the conductive circuit are located in the wiring groove.

The beneficial effects of the utility model reside in that: the conduction assembly is novel in structure, a contact elastic sheet is omitted, the contact probe is connected with the plastic base in a hot melting mode, the bonding strength of the contact probe and the plastic base is high, the risk of accidental separation of the contact probe and the plastic base is greatly reduced, and the structural stability of the conduction assembly is improved; the solder paste not only can conduct the contact probes and the conducting circuits, but also can effectively fill the holes and the grooves, and the yield of the conducted components is ensured; the existence of the hole groove not only can position the contact probe and facilitate the insertion of the contact probe, but also can collect hot melting excess materials and solder paste, thereby realizing multiple purposes.

Drawings

Fig. 1 is a schematic structural diagram of a conduction assembly according to a first embodiment of the present invention;

fig. 2 is a cross-sectional view of a conduction assembly according to a first embodiment of the present invention.

Description of reference numerals:

1. a plastic base; 11. a conductive circuit; 12. a hole groove; 121. a hot melting section; 122. a tin accommodating section;

2. contacting the probe;

3. and (7) solder paste.

Detailed Description

In order to explain the technical contents, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1 and 2, a conducting assembly includes a plastic base 1, a conductive circuit 11 is disposed on the plastic base 1, and a contact probe 2 is further included, a hole groove 12 is disposed on the plastic base 1, one end of the contact probe 2 extends into the hole groove 12 and is connected to the plastic base 1 in a hot-melting manner, a solder paste 3 is further filled in the hole groove 12, and the solder paste 3 conducts the contact probe 2 and the conductive circuit 11; the other end of the contact probe 2 protrudes out of the aperture 12.

From the above description, the beneficial effects of the utility model reside in that: the conduction assembly is novel in structure, a contact elastic sheet is omitted, the contact probe 2 is in hot-melt connection with the plastic base 1, the bonding strength of the contact probe 2 and the plastic base 1 is high, the risk of accidental separation of the contact probe 2 and the plastic base 1 is greatly reduced, and the structural stability of the conduction assembly is improved; the solder paste 3 can not only conduct the contact probe 2 and the conductive circuit 11, but also effectively fill the hole groove 12, thereby ensuring the yield of the conducted components; the existence of the hole grooves 12 not only can position the contact probes 2 and facilitate the insertion of the contact probes 2, but also can collect hot-melt excess materials and solder paste 3, thereby realizing multiple purposes.

Further, the hole 12 includes a heat melting section 121 and a tin containing section 122 that are communicated with each other, one end of the contact probe 2 passes through the tin containing section 122 and is inserted into the heat melting section 121, and is connected with the plastic base 1 in the heat melting section 121 through heat melting, and the tin containing section 122 is used for containing the solder paste 3.

As can be seen from the above description, when being gushed on by the plastic material of hot melt, hold tin section 122 and can play the effect of holding by the plastic material of hot melt to a certain extent, do benefit to the outward appearance yields of guaranteeing to switch on the subassembly.

Further, the solder paste 3 is not protruded from an end surface of one end of the solder accommodating section 122 away from the heat melting section 121.

From the above description, the size of the pass-through module is consistent.

Further, the tin containing section 122 is in a shape of an inverted truncated cone as a whole.

As can be seen from the above description, the solder paste 3 can be better accommodated by the solder accommodating section 122 having an inverted truncated cone shape.

Further, an included angle between a truncated cone generatrix of the tin containing section 122 and the rotating central shaft is 20-40 degrees.

As can be seen from the above description, the liquid solder paste 3 can smoothly enter the solder accommodating section 122, which is beneficial to improving the phenomenon of bubbling inside the solder paste 3.

Further, the solder paste 3 is a low temperature solder paste.

As can be seen from the above description, the low temperature solder paste does not damage the conductive traces 11 and the plastic substrate 1.

Further, the conductive line 11 is an antenna.

As can be seen from the above description, the conducting component may be an antenna component.

Further, the contact probe 2 is a spring type probe.

As can be seen from the above description, the spring type probe has good conduction stability with the external structure.

Furthermore, a wiring groove is formed in the surface of the plastic base 1, and at least a partial region of the conductive circuit 11 is arranged in the wiring groove.

As can be seen from the above description, the presence of the wiring groove facilitates the arrangement of the conductive circuit 11, and at the same time, can play a certain role in protecting the conductive circuit 11.

Further, all areas of the conductive traces 11 are located in the wiring groove.

As can be seen from the above description, the wiring groove can sufficiently protect the conductive line 11.

Example one

Referring to fig. 1 and fig. 2, a first embodiment of the present invention is: a conduction assembly comprises a plastic base 1 and a contact probe 2, wherein a conductive circuit 11 is arranged on the plastic base 1, a hole groove 12 is formed in the plastic base 1, one end of the contact probe 2 extends into the hole groove 12 and is in hot-melt connection with the plastic base 1, a solder paste 3 is filled in the hole groove 12, and the contact probe 2 and the conductive circuit 11 are conducted by the solder paste 3; the other end of the contact probe 2 protrudes out of the aperture 12. Optionally, the contact probe 2 is a spring-type probe; the solder paste 3 is low-temperature solder paste.

Preferably, the hole 12 includes a heat melting section 121 and a tin containing section 122 that are communicated with each other, one end of the contact probe 2 passes through the tin containing section 122 and is inserted into the heat melting section 121, and is connected with the plastic base 1 in the heat melting section 121 in a heat melting manner, and the tin containing section 122 is used for containing the solder paste 3. The presence of the hole 12 prevents the plastic base 1 from bulging during the insertion of the contact probe 2 into the plastic base 1, while the presence of the heat-fusible section 121 facilitates the insertion of the contact probe 2. Before the contact probe 2 is inserted into the plastic base 1, the contact probe 2 needs to be heated to a temperature that can melt the plastic material of the plastic base 1 contacting the contact probe. In addition, when the contact probe 2 is not inserted into the plastic base 1, the diameter of the hot-melting section 121 is slightly smaller than the diameter of the contact probe 2, so that the heated contact probe 2 can be smoothly inserted into the hot-melting section 121, and the contact probe 2 can be firmly hot-melt connected with the plastic base 1.

The solder paste 3 is not protruded from the end surface of the end of the solder accommodating section 122 far away from the hot melting section 121.

In detail, the tin containing section 122 is in an inverted truncated cone shape as a whole; the included angle between the circular truncated cone generatrix of the tin containing section 122 and the rotating central shaft is 20-40 degrees.

In this embodiment, the conductive circuit 11 is an antenna. In other words, the conductive circuit 11 serves as an antenna, and in other embodiments, the conductive circuit 11 may be only an electrical connection structure for connecting conduction.

For convenience of manufacturing, the conductive circuit 11 is formed on the plastic base 1 through a laser etching process, that is, a wiring groove is formed on the surface of the plastic base 1, at least a partial region of the conductive circuit 11 is disposed in the wiring groove, and preferably, all regions of the conductive circuit 11 are located in the wiring groove. I.e. the depth of the wiring groove is greater than or equal to the thickness of the conductive line 11.

In summary, the conduction assembly provided by the utility model has a novel structure, the contact elastic sheet is cancelled, the contact probe is connected with the plastic base in a hot melting way, the bonding strength between the contact probe and the plastic base is high, the risk of accidental separation between the contact probe and the plastic base is greatly reduced, and the structural stability of the conduction assembly is favorably improved; the solder paste can not only conduct the contact probes and the conducting circuits, but also effectively fill the holes and grooves, so that the yield of the conducting components is ensured; due to the existence of the hole grooves, the contact probes can be positioned and conveniently inserted, hot melting excess materials and solder paste can be collected, and one object is multifunctional.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims (10)

1. The utility model provides a switch-on assembly, includes the plastic base, be equipped with conducting wire on the plastic base, its characterized in that: the circuit board is characterized by further comprising a contact probe, wherein a hole groove is formed in the plastic base, one end of the contact probe extends into the hole groove and is in hot-melt connection with the plastic base, and solder paste is filled in the hole groove and conducts the contact probe and the conducting circuit; the other end of the contact probe extends out of the hole groove.

2. The pass-through assembly of claim 1, wherein: the hole groove comprises a hot melting section and a tin containing section which are communicated, one end of the contact probe penetrates through the tin containing section to be inserted into the hot melting section and is in hot melting connection with the plastic base through the hot melting section, and the tin containing section is used for containing tin paste.

3. A pass module as claimed in claim 2, wherein: the solder paste does not protrude from the end face of one end of the solder accommodating section far away from the hot melting section.

4. A pass module as claimed in claim 2, wherein: the tin containing section is integrally in an inverted round table shape.

5. The pass-through assembly of claim 4, wherein: the included angle between the circular truncated cone generatrix of the tin containing section and the rotating central shaft is 20-40 degrees.

6. A pass-through assembly as claimed in claim 1, wherein: the solder paste is low-temperature solder paste.

7. A pass-through assembly as claimed in claim 1, wherein: the conductive circuit is an antenna.

8. The pass-through assembly of claim 1, wherein: the contact probe is a spring type probe.

9. The pass-through assembly of claim 1, wherein: a wiring groove is formed in the surface of the plastic base, and at least part of area of the conductive circuit is arranged in the wiring groove.

10. A pass device according to claim 9, wherein: all areas of the conducting circuits are located in the wiring grooves.

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