CN218630556U

CN218630556U - X-ray machine circuit board testing arrangement based on STM32 and FPGA

Info

Publication number: CN218630556U
Application number: CN202222586075.5U
Authority: CN
Inventors: 高健; 谭志宇
Original assignee: Broad Teng Beijing Medical Instruments Co ltd
Current assignee: Broad Teng Beijing Medical Instruments Co ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-03-14
Anticipated expiration: 2032-09-29

Abstract

The utility model relates to an X-ray machine circuit board testing arrangement based on STM32 and FPGA, include: the core control module and respectively rather than power module, AD DA module, the display module who is connected, core control module, power module and AD DA module all link to each other with the circuit board that awaits measuring, still include the input signal module and the output signal detection module that link to each other with the circuit board that awaits measuring respectively, the core control module comprises the STM32 chip and the FPGA chip that link to each other. The STM32 chip is connected with the FPGA chip through an SPI bus, the STM32 chip is connected with a circuit board to be tested through a CAN bus, the STM32 chip is connected with a display module through an FSMC bus, and the FPGA chip is connected with an AD/DA module. The testing device adopts the cooperation of STM32 and FPGA, has high modularization degree and strong real-time data processing performance, and fully exerts the advantages of the respective modules.

Description

X-ray machine circuit board testing arrangement based on STM32 and FPGA

Technical Field

The utility model relates to the field of medical equipment, in particular to X-ray machine circuit board testing arrangement based on STM32 and FPGA.

Background

The circuit board integrated level is high in X-ray machine equipment, the distribution positions are not concentrated, the test items of each circuit board are not complete in the production process, and after the circuit board is installed on an X-ray machine, the system integration test failure rate is high and the problem is inconvenient to solve. Therefore, the independent system integration test of each circuit board is important, so that the fault rate of each circuit board is effectively reduced, the fault rate of the system integration test is further reduced, and the stability of the system and the timeliness of problem handling can be improved.

SUMMERY OF THE UTILITY MODEL

In view of the above existing problem, the utility model aims at providing an X-ray machine circuit board integrated test device based on STM32 and FPGA control carries out the system integration test to solitary circuit board in the X-ray machine, and every test unit modularization degree is higher, and core control module uses STM32 and FPGA cooperation to carry out the high-speed acquisition processing of logic program control and data in coordination.

The utility model discloses a realize that the technical scheme that above-mentioned purpose adopted is:

an X-ray machine circuit board testing arrangement based on STM32 and FPGA includes: the core control module and respectively rather than power module, AD DA module, the display module who is connected, core control module, power module and AD DA module all link to each other with the circuit board that awaits measuring, still include the input signal module and the output signal detection module that link to each other with the circuit board that awaits measuring respectively, the core control module comprises the STM32 chip and the FPGA chip that link to each other.

The STM32 chip is connected with the FPGA chip through an SPI bus, the STM32 chip is connected with a circuit board to be tested through a CAN bus, the STM32 chip is connected with a display module through an FSMC bus, and the FPGA chip is connected with an AD/DA module.

The AD/DA module comprises an AD circuit and a DA circuit which are respectively connected with the FPGA chip in the core control module.

The AD circuit comprises an ADS822 chip and a first peripheral circuit connected with the ADS822 chip, the signal input end of the ADS822 chip is connected with the first peripheral circuit, and the signal output end of the ADS822 chip is connected with the FPGA chip.

The first peripheral circuit is composed of a plurality of resistors, two operational amplifiers and a sliding rheostat, wherein: the positive input end of the operational amplifier U312A is connected with a reference voltage source through a resistor R912, the negative input end of the operational amplifier U312A is connected with the output end of the operational amplifier U312A through a resistor R1012, the output end of the operational amplifier U312A is connected with the positive input end of the operational amplifier U312B through a resistor R812 and a sliding rheostat respectively, the positive input end of the operational amplifier U312B is grounded through a resistor R712, the negative input end of the operational amplifier U312B is connected with the signal input end through a resistor R612, the negative input end of the operational amplifier U312B is connected with the output end of the operational amplifier U312B through a resistor R512, and the output end of the operational amplifier U312B is connected with the signal input end of the ADS822 chip through a resistor R112.

The DA circuit comprises a DAC900E chip and a second peripheral circuit connected with the DAC900E chip, the signal input end of the DAC900E chip is connected with the FPGA chip, and two differential signal output ends of the ADS822 chip are connected with the second peripheral circuit.

The second peripheral circuit is composed of a plurality of resistors and an operational amplifier, wherein: the first differential signal output end of the ADS822 chip is grounded through a resistor R313, the first differential signal output end of the ADS822 chip is connected with the reverse input end of the differential amplifier U213 through a resistor R413, the second differential signal output end of the ADS822 chip is grounded through a resistor R613, the second differential signal output end of the ADS822 chip is connected with the forward input end of the differential amplifier U213 through a resistor R513, the reverse input end of the differential amplifier U213 is connected with the output end thereof through a resistor R813, the forward input end of the differential amplifier U213 is grounded through a resistor R713, and the output end of the differential amplifier U213 is used as the output end of the second peripheral circuit through a resistor R913 and a resistor R1013 respectively.

The input signal module comprises a plurality of groups of switching value analog input detection circuits, each group of switching value analog input detection circuits comprises a switch key, and the circuit board to be detected is grounded through the switch key.

The output signal detection module comprises a plurality of groups of execution device simulation state circuits, each group of execution device simulation state circuits comprises a current-limiting resistor and a light-emitting diode, and the circuit board to be detected is grounded sequentially through the current-limiting resistors and the light-emitting diodes.

The display module is a liquid crystal display screen.

The utility model has the advantages of it is following:

1. the core control is composed of an STM32 and an FPGA, logic program control is realized through the STM32, system sequence work flow can be better carried out, high-speed data acquisition and processing are realized through the FPGA, and the real-time performance and the accuracy of system acquisition data can be improved.

2. Each detection function unit is modularized, and most of circuit boards of an X-ray machine can be compatible.

3. The CAN bus communication state of the circuit board to be detected CAN be detected.

Drawings

Fig. 1 is a block diagram of a comprehensive test device for an X-ray machine circuit board based on STM32 and FPGA control according to the present invention;

FIG. 2 is a circuit diagram of an input signal module according to an embodiment of the present invention;

fig. 3 is a circuit diagram of an output signal module in accordance with an embodiment of the present invention;

FIG. 4 is a circuit diagram of a high speed AD/DA module ADS822 according to the present invention;

fig. 5a is a DAC900E circuit diagram of a high-speed AD/DA module according to the present invention;

fig. 5b is a DAC900E circuit diagram of a high-speed AD/DA module according to the present invention;

fig. 6 is a block diagram of a core control module in accordance with the present invention.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of systems and methods consistent with certain aspects of the application, as set forth in the claims below.

The terminology used in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

To make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the corresponding drawings.

The utility model provides an X-ray machine circuit board integrated test device based on STM32 and FPGA control which characterized in that: the device comprises an input signal module, an output signal module, a power supply module, a high-speed AD/DA module, a core control module and a liquid crystal display module.

And the input signal module is used for detecting the switching value.

And the output signal module is used for indicating the action condition of the executive device.

And the power supply module is used for providing power supplies for the core control module and the circuit board to be tested.

And the high-speed AD/DA module is used for acquiring AD data at high speed and outputting a high-precision DA signal.

And the core control module is used for controlling the logic program of the testing device and acquiring and processing data at a high speed.

And the liquid crystal display module is used for displaying the operation steps and key data of the test.

And the input signal module is mutually connected with the circuit board to be tested through interfaces XI1 to XI 28.

The output signal module is connected with the circuit board to be tested through the XO 1-XO 25 interfaces.

The power supply module is mutually connected with the circuit board to be tested through XP 1-XP 7 interfaces.

The high-speed AD/DA module is mutually connected with the circuit board to be tested through the XD 1-XD 2 interfaces.

And the input signal module is used for detecting the switching value. The input signal module can simulate the input of the switching value of the circuit board to be tested. When the test key is not pressed, the signal is disconnected, and after the test key is pressed, the signal is grounded.

The output signal module is used for indicating the action condition of the executive device. The output module can simulate an executive device controlled by the circuit board to be tested and indicate the action condition of the executive device. The executive device consists of a light-emitting diode and a current-limiting resistor, and the working state of the executive device is simulated by the on and off of the light-emitting diode.

And the power supply module is used for providing power supplies for the core control module and the circuit board to be tested. A 24V dc power supply, a 12V dc power supply, a 5V dc power supply, and a 3.3V dc power supply may be provided.

The high-speed AD/DA module is used for acquiring AD data at high speed and outputting high-precision DA signals. The voltage, the current and the analog quantity output of the circuit board to be tested are collected, and a high-precision DA signal, a microphone input and the like can also be output. The high-speed AD circuit is realized by taking ADS822 as a core device, and the high-precision DA circuit is realized by taking DAC900E as a core device.

The core control module is used for controlling the logic program of the testing device and acquiring and processing data at a high speed. STM32 is used for logic program control, and FPGA is used for fast-speed data acquisition to handle, and the two divides the worker cooperation, and STM32 and FPGA pass through SPI bus communication connection, and communication speed is fast, and the real-time is high.

The liquid crystal display module is used for displaying the operation steps and key data of the test. The liquid crystal display module is convenient for man-machine interaction operation of testing.

According to the embodiment of the application, the comprehensive test device for the X-ray machine circuit board based on STM32 and FPGA control comprises an input signal module, an output signal module, a power supply module, a high-speed AD/DA module, a core control module and a liquid crystal display module, wherein the input signal module, the output signal module, the power supply module, the high-speed AD/DA module, the core control module and the liquid crystal display module are shown in figure 1. The input signal module comprises a key input and a dial switch input and is used for detecting the switching value. The output signal module comprises a key working indication and an electromagnetic brake working indication and is used for indicating the action condition of the executive device. The power supply module comprises a 24V direct-current power supply, a 12V direct-current power supply, a 5V direct-current power supply and a 3.3V direct-current power supply and is used for providing power supplies for the core control module and the circuit board to be tested. And the high-speed AD/DA module is used for acquiring AD data at high speed and outputting a high-precision DA signal. The core control module comprises an STM32 module and an FPGA module and is used for controlling logic programs of the testing device and acquiring and processing data at a high speed. And the liquid crystal display module is used for displaying the operation steps and key data of the test.

Fig. 2 shows an embodiment of the input signal module, which has 8 sets of switching value analog input detection circuits, each set of analog input detection circuits is grounded after passing through one set of key switches, and is connected to the circuit board to be tested through the connector IDC20 to simulate the required switching value input.

FIG. 3 shows an embodiment of an output signal module, which has 5 sets of execution device simulation status circuits. Each group of executive device simulation state circuits are connected with a light emitting diode in series to be grounded through a current limiting resistor of 10K, and the light emitting diode is lightened when the simulated executive device action is needed.

Fig. 4 is an implementation example of the high-speed AD/DA module ADs822 circuit, in which the high-speed AD acquisition circuit takes an ADs822 chip as a core, an analog signal to be acquired is input from PADC1, a reference voltage is first increased for the input analog signal through the operational amplifiers OPA2690A and OPA2690B, and an input amplification at the inverting terminal is performed. The supply voltage of the OPA2690 is +5V. And then the data enters the input end of an ADS822 chip, and the acquired data is sent to the FPGA from the output ends AD _ D0-AD _ D9 after being subjected to primary processing. And collecting the working voltage and the working current of the circuit board to be tested. And detecting the input AD input signal and testing the performance of the microphone of the circuit board to be tested.

Fig. 5a and 5b are implementation examples of a DAC900E circuit of a high-speed AD/DA module, where the high-precision DA output signal circuit takes a DAC900E chip as a core, the FPGA sends data to the DAC900E chip through DAC _ D0 to DAC _ D9, and the DAC900E chip outputs a high-precision DA signal through a differential operational amplifier circuit composed of an operational amplifier OPA 690. PDAC0 is the signal output port. And outputting a high-precision DA sine wave signal, and testing the performance of the circuit board loudspeaker to be tested.

FIG. 6 is a core control module block diagram, and STM32 is used for logic program control, and FPGA is used for high-speed data acquisition and processing, and the two divides worker's cooperation, and STM32 and FPGA pass through SPI bus communication connection, and communication speed is fast, and the real-time is high. The STM32 communicates with the circuit board to be tested through the CAN bus, meets the communication function requirements of most circuit boards of the X-ray machine, simultaneously displays real-time key test data to the liquid crystal screen through FSMC communication, and indicates an operator to test the flow steps, so that convenient human-computer interaction is carried out. The high-speed AD acquisition data is processed by the FPGA at a high speed and high in real-time performance, and meanwhile, a high-precision DA signal can be output and used for testing signals for a circuit board to be tested.

According to the above embodiments, the utility model discloses an X-ray machine circuit board integrated test device based on STM32 and FPGA control.

An X-ray machine circuit board integrated test device based on STM32 and FPGA control according to the present invention has been described above by way of example with reference to the accompanying drawings. However, it should be understood by those skilled in the art that, for the above-mentioned X-ray machine circuit board comprehensive testing device based on STM32 and FPGA control of the present invention, various improvements can be made without departing from the present novel concept. Therefore, the scope of the present invention should be determined by the content of the appended claims.

Claims

1. The utility model provides an X-ray machine circuit board testing arrangement based on STM32 and FPGA which characterized in that includes: the core control module and respectively rather than power module, AD DA module, the display module who is connected, core control module, power module and AD DA module all link to each other with the circuit board that awaits measuring, still include the input signal module and the output signal detection module that link to each other with the circuit board that awaits measuring respectively, the core control module comprises the STM32 chip and the FPGA chip that link to each other.

2. The X-ray machine circuit board testing device based on STM32 and FPGA of claim 1, characterized in that, link to each other through the SPI bus between STM32 chip and the FPGA chip, the STM32 chip passes through the CAN bus and links to each other with the circuit board that awaits measuring, the STM32 chip passes through the FSMC bus and links to each other with the display module, the FPGA chip links to each other with AD/DA module.

3. The STM32 and FPGA-based X-ray machine circuit board testing device according to claim 1, wherein the AD/DA module comprises an AD circuit and a DA circuit which are respectively connected with an FPGA chip in the core control module.

4. An X-ray machine circuit board testing device based on STM32 and FPGA as claimed in claim 3, wherein the AD circuit comprises an ADS822 chip and a first peripheral circuit connected with the ADS822 chip, a signal input end of the ADS822 chip is connected with the first peripheral circuit, and a signal output end of the ADS822 chip is connected with the FPGA chip.

5. An X-ray machine circuit board testing device based on STM32 and FPGA according to claim 4, characterized in that the first peripheral circuit is composed of a plurality of resistors, two operational amplifiers and a slide rheostat, wherein: the positive input end of the operational amplifier U312A is connected with a reference voltage source through a resistor R912, the negative input end of the operational amplifier U312A is connected with the output end of the operational amplifier U312A through a resistor R1012, the output end of the operational amplifier U312A is connected with the positive input end of the operational amplifier U312B through a resistor R812 and a sliding rheostat respectively, the positive input end of the operational amplifier U312B is grounded through a resistor R712, the negative input end of the operational amplifier U312B is connected with the signal input end through a resistor R612, the negative input end of the operational amplifier U312B is connected with the output end of the operational amplifier U312B through a resistor R512, and the output end of the operational amplifier U312B is connected with the signal input end of the ADS822 chip through a resistor R112.

6. The STM32 and FPGA-based X-ray machine circuit board testing device according to claim 3, characterized in that the DA circuit comprises a DAC900E chip and a second peripheral circuit connected thereto, a signal input end of the DAC900E chip is connected with the FPGA chip, and two differential signal output ends of the DAC900E chip are connected with the second peripheral circuit.

7. An X-ray machine circuit board testing device based on STM32 and FPGA according to claim 6, characterized in that, the second peripheral circuit is composed of a plurality of resistors and an operational amplifier, wherein: the first differential signal output end of the ADS822 chip is grounded through a resistor R313, the first differential signal output end of the ADS822 chip is connected with the reverse input end of the differential amplifier U213 through a resistor R413, the second differential signal output end of the ADS822 chip is grounded through a resistor R613, the second differential signal output end of the ADS822 chip is connected with the forward input end of the differential amplifier U213 through a resistor R513, the reverse input end of the differential amplifier U213 is connected with the output end thereof through a resistor R813, the forward input end of the differential amplifier U213 is grounded through a resistor R713, and the output end of the differential amplifier U213 is used as the output end of the second peripheral circuit through a resistor R913 and a resistor R1013 respectively.

8. The test device of the X-ray machine circuit board based on STM32 and FPGA according to claim 1, characterized in that the input signal module comprises a plurality of groups of switching value analog input detection circuits, each group of switching value analog input detection circuits comprises a switch key, and the circuit board to be tested is grounded through the switch key.

9. The STM32 and FPGA-based X-ray machine circuit board testing device as defined in claim 1, wherein the output signal detection module comprises a plurality of sets of executive component analog state circuits, each set of executive component analog state circuit comprises a current-limiting resistor and a light-emitting diode, and the circuit board to be tested is grounded sequentially through the current-limiting resistor and the light-emitting diode.

10. The STM32 and FPGA-based X-ray machine circuit board testing device according to claim 1, wherein the display module is a liquid crystal display.