CN218630095U

CN218630095U - Anti-sticking testing device for chip low-temperature testing

Info

Publication number: CN218630095U
Application number: CN202223075839.0U
Authority: CN
Inventors: 牟春乔; 沈焱; 张改侠; 谢根长
Original assignee: Shenzhen Easebell Technology Co ltd
Current assignee: Shenzhen Easebell Technology Co ltd
Priority date: 2022-11-21
Filing date: 2022-11-21
Publication date: 2023-03-14
Anticipated expiration: 2032-11-21

Abstract

The utility model belongs to the field of chip testing, in particular to an anti-sticking testing device for chip low-temperature testing, aiming at the problems that the existing cold plate has low surface temperature, and can frost when encountering water vapor in the air, the chip can be stuck on the cold plate and can not fall off after the chip is tested on the cold plate, and the chip also needs to be taken down by a tester by using a tool, thereby affecting the testing efficiency, the utility model provides a following scheme which comprises an equipment main body, wherein the equipment main body comprises an air exhaust filter screen, a sealing plate, a control panel, a refrigerator, a liquid storage tank, a box body and a cold plate, and the top of the cold plate is provided with two grooves; the anti-sticking mechanism is arranged at the top of the cold plate and used for preventing the chip from being stuck on the cold plate; the pressing mechanism can prevent the chip from being stuck on the cold plate through the anti-sticking mechanism, the chip is not required to be taken down by other tools, the testing efficiency is improved, the pressing mechanism can be convenient for pressing the chip down through the rotating mechanism, the chip can be stuck on the cold plate through the pressing mechanism, and the low-temperature test is more accurate.

Description

Anti-sticking testing device for chip low-temperature testing

Technical Field

The utility model relates to a chip test technical field especially relates to an antiseized testing arrangement of chip low temperature test.

Background

Electronic chips are widely used in the field of industrial automatic control, so the quality of the electronic chips is concerned with the smooth work of industrial production lines. The electronic chips have complex and various working environments and sometimes need low temperature resistance, so that the electronic chips need to be tested at low temperature before being shipped out of a factory.

The publication number CN 114545207A discloses an electronic chip low-temperature testing device, which comprises an insulation box, wherein a liquid storage box, a pump, a refrigerator, a fixed cold plate and a movable cold plate are arranged in the insulation box. The liquid storage tank is internally stored with cooling liquid, the liquid inlet of the pump is communicated with the liquid storage tank, and the fixed cold plate and the movable cold plate are both internally provided with cooling pipelines. The liquid inlet end of the cooling pipeline of the movable cold plate is communicated with the liquid outlet end of the cooling pipeline of the fixed cold plate through a corrugated hose, and the liquid outlet end of the cooling pipeline of the movable cold plate is communicated with the liquid storage tank through a corrugated hose. An accommodating opening is formed in the top of the heat preservation box, and the movable cold plate can penetrate out of the heat preservation box from the accommodating opening. The technical scheme has the following problems:

because the surface temperature of the cold plate is low, the frost is generated when water vapor in the air meets, the chip can be stuck on the cold plate and cannot fall off after the chip is tested on the cold plate, and the chip can be taken down by a tester by using a tool, so that the testing efficiency is influenced;

to the above problem, the utility model discloses the file provides an antiseized testing arrangement of chip low temperature test.

SUMMERY OF THE UTILITY MODEL

The utility model provides an antiseized testing arrangement of chip low temperature test has solved and has existed among the prior art because cold drawing surface temperature is low, meets the steam in the air then can frost, and the chip can be stained with on the cold drawing and can't drop after the test is accomplished on the cold drawing, still needs the tester to take off it with the instrument, influences the efficiency of software testing shortcoming.

The utility model provides a following technical scheme:

an anti-sticking test device for chip low-temperature test comprises an equipment main body, wherein the equipment main body comprises an exhaust filter screen, a sealing plate, a control panel, a refrigerator, a liquid storage tank, a box body and a cold plate, and the top of the cold plate is provided with two grooves;

the anti-sticking mechanism is arranged at the top of the cold plate and used for preventing the chip from being stuck on the cold plate;

the pressing mechanism is arranged at the top of the box body so that the chip is more attached to the cold plate;

and the rotating mechanism is arranged at the top of the box body and is used for rotating the pressing mechanism.

In a possible design, antiseized mechanism is including two springs and slide, two the bottom of spring all with the bottom inner wall fixed connection of recess, two the top of spring all with the bottom fixed connection of slide, the both sides of slide respectively with the both sides inner wall sliding connection of recess, antiseized mechanism is two sets of.

In a possible design, slewing mechanism is including two square plates, cylinder, ring and L template, two the bottom of square plate all with the top fixed connection of box, the cylindrical both ends rotate with one side that two square plates are close to each other respectively and are connected, the fixed cover of ring is established on the cylinder, one side fixed connection of the bottom of L template and ring, two one side fixedly connected with that the square plate is close to each other is used for spacing same spacing.

In a possible design, the pressing mechanism comprises a screw rod and a circular plate, the screw rod is in threaded connection with the L-shaped plate, the top of the circular plate is rotatably connected with the bottom end of the screw rod, and the circular plate is made of rubber.

In a possible design, elongated grooves are formed in the inner walls of the two sides of each groove, sliders are fixedly connected to the two sides of each sliding plate, and one sides of the sliders are connected with the inner walls of the two elongated grooves in a sliding mode respectively.

In one possible design, a bolt for fixing the circular ring is screwed to one side of the square plate.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

The utility model discloses in, owing to set up the spring, the power of spring can make the slide up the top, and the removal of slide has driven the chip and has left the top of cold drawing to can prevent that the chip from gluing on the cold drawing, improve efficiency of software testing.

In the utility model, the screw rod and the circular plate are arranged, the rotation of the screw rod drives the circular plate to move longitudinally, the circular plate is made of rubber, so that the surface of the chip can be better protected, and then the circular plate is tightly attached to the chip to press down, so that the chip can be attached to a cold plate;

in the utility model, the L-shaped plate can be rotated by the cylinder due to the arrangement of the cylinder, so that the screw rod and the circular plate can be pressed down conveniently;

the utility model discloses in, rational in infrastructure, can prevent through antiseized mechanism that the chip from gluing on the cold drawing, just do not need other instruments to take off the chip, improve efficiency of software testing, can be convenient for push down the mechanism through slewing mechanism and push down the chip, can make chip laminating cold drawing through pushing down the mechanism for low temperature test is more accurate.

Drawings

Fig. 1 is a schematic structural view of an anti-sticking testing apparatus for low-temperature testing of a chip according to an embodiment of the present invention;

fig. 2 is a schematic side view of an anti-sticking testing apparatus for low-temperature testing of a chip according to an embodiment of the present invention;

fig. 3 is a schematic structural view of an anti-sticking mechanism and a pressing mechanism of an anti-sticking testing apparatus for low-temperature testing of chips according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a rotating mechanism of an anti-sticking testing apparatus for testing chip at low temperature according to an embodiment of the present invention.

Reference numerals are as follows:

1. an apparatus main body; 2. a cold plate; 3. a screw; 4. a slide plate; 5. an L-shaped plate; 6. a square plate; 7. a bolt; 8. a spring; 9. a slider; 10. a groove; 11. a circular plate; 12. a circular ring; 13. a cylinder; 14. and (4) a box body.

Detailed Description

The embodiments of the present invention will be described below with reference to the drawings in the embodiments of the present invention.

In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "mounted" are to be interpreted broadly, for example, the terms "connected" may or may not be detachably connected; may be directly connected or may be indirectly connected through an intermediate. Further, "communication" may be direct communication or indirect communication through an intermediary. The term "fixed" means that they are connected to each other and the relative positional relationship after the connection is not changed. The directional terms used in the embodiments of the present invention, such as "inner", "outer", "top", "bottom", etc., are merely directions referring to the drawings, and therefore, the directional terms used are intended to better and more clearly illustrate and understand the embodiments of the present invention, rather than to indicate or imply that the device or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the embodiments of the present invention.

In the embodiments of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

In the embodiment of the present invention, "and/or" is only an association relationship describing an associated object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

Reference throughout this specification to "one embodiment," "some embodiments," or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present invention. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.

Example 1

Referring to fig. 1-4, an anti-sticking test device for chip low-temperature testing comprises an equipment main body 1, wherein the equipment main body 1 comprises an air exhaust filter screen, a sealing plate, a control panel, a refrigerator, a liquid storage tank, a box body 14 and a cold plate 2, and two grooves 10 are formed in the top of the cold plate 2;

the anti-sticking mechanism is arranged at the top of the cold plate 2 and used for preventing the chip from being stuck on the cold plate 2;

the pressing mechanism is arranged at the top of the box body 14, so that the chip is more attached to the cold plate 2;

and the rotating mechanism is arranged at the top of the box body 14 and is used for rotating the pressing mechanism.

Above-mentioned technical scheme can prevent through antiseized mechanism that the chip from gluing on cold drawing 2, just does not need other instruments to take off the chip, improves efficiency of software testing, can be convenient for push down the mechanism through slewing mechanism and push down the chip, can make chip laminating cold drawing 2 through pushing down the mechanism for low temperature test is more accurate.

Referring to fig. 1, 2 and 3, anti-sticking mechanism includes two springs 8 and slide 4, and the bottom of two springs 8 all with the bottom inner wall fixed connection of recess 10, the top of two springs 8 all with the bottom fixed connection of slide 4, the both sides of slide 4 respectively with the both sides inner wall sliding connection of recess 10, anti-sticking mechanism is two sets ofly.

Above-mentioned technical scheme spring 8's power can make slide 4 up push up, and slide 4's removal has driven the chip and has left the top of cold drawing 2 to can prevent that the chip from gluing on cold drawing 2, just do not need other instruments to take off the chip, improve efficiency of software testing.

Referring to fig. 1-4, slewing mechanism includes two square plates 6, cylinder 13, ring 12 and L template 5, the bottom of two square plates 6 all with the top fixed connection of box 14, the both ends of cylinder 13 rotate with one side that two square plates 6 are close to each other respectively and are connected, ring 12 fixed cover is established on cylinder 13, one side fixed connection of bottom and ring 12 of L template 5, one side fixedly connected with that two square plates 6 are close to each other is used for spacing same spacing.

Above-mentioned technical scheme cylinder 13 can make L type board 5 rotate to be convenient for screw rod 3 and plectane 11 to push down the chip.

Referring to fig. 3, the pressing mechanism comprises a screw rod 3 and a circular plate 11, the screw rod 3 is in threaded connection with the L-shaped plate 5, the top of the circular plate 11 is rotatably connected with the bottom end of the screw rod 3, and the circular plate 11 is made of rubber.

Above-mentioned technical scheme screw rod 3's rotation has driven the longitudinal movement of plectane 11, because the material of plectane 11 is the rubber material, can be better protect the chip surface, the plectane 11 hugs closely the chip afterwards and pushes down to can make chip laminating cold drawing 2, make low temperature test more accurate.

Example 2

Referring to fig. 3, the pressing mechanism includes a screw rod 3 and a circular plate 11, the screw rod 3 is in threaded connection with the L-shaped plate 5, the top of the circular plate 11 is rotatably connected with the bottom end of the screw rod 3, and the circular plate 11 is made of rubber.

Referring to fig. 3, elongated grooves are formed in inner walls of two sides of each groove 10, sliders 9 are fixedly connected to two sides of each sliding plate 4, and one side of each slider 9 is slidably connected with the inner walls of the two elongated grooves.

Above-mentioned technical scheme makes slide 4 reduce frictional force when removing through elongated recess and slider 9, removes more smoothly.

Referring to fig. 4, a bolt 7 for fixing a ring 12 is screwed to one side of the square plate 6.

Above-mentioned technical scheme bolt 7's one end laminating ring 12 to can fix ring 12 and prevent that cylinder 13 from rotating.

The working principle and the using process of the technical scheme are as follows: when the device is used, a chip to be tested at low temperature is firstly placed on the two sliding plates 4 of the cold plate 2, then the L-shaped plate 5 is rotated, the L-shaped plate 5 can be rotated due to the arrangement of the cylinder 13, the L-shaped plate 5 is attached to the limit strip, then the L-shaped plate 5 is positioned above the chip, then the bolt 7 is screwed inwards, one end of the bolt 7 is attached to the ring 12, so that the ring 12 can be fixed to prevent the cylinder 13 from rotating, then the screw 3 is screwed inwards, the rotation of the screw 3 drives the circular plate 11 to move longitudinally, and the circular plate 11 is made of rubber, so that the surface of the chip can be better protected, subsequently, the circular plate 11 is tightly attached to the chip to be pressed down, the spring 8 can be compressed in the pressing-down process, the sliding plate 4 is contracted into the groove 10, thereby the chip can be attached to the cold plate 2, the low-temperature test is performed subsequently, after the test is completed, the screw rod 3 is twisted outwards, the rotation of the screw rod 3 drives the longitudinal movement of the circular plate 11, the circular plate 11 is enabled to be separated from the chip to be fixed, because the spring 8 is arranged, the force of the spring 8 can enable the sliding plate 4 to be pushed upwards, the sliding plate 4 is moved to drive the chip to be separated from the top of the cold plate 2, thereby the chip can be prevented from being adhered to the cold plate 2, the chip can be conveniently taken down, the chip can be taken down without other tools, and the test efficiency is improved.

The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention; without conflict, embodiments of the present invention and features of the embodiments may be combined with each other. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An anti-sticking test device for low-temperature testing of a chip comprises:

the air conditioner comprises an equipment main body (1), wherein the equipment main body (1) comprises an air exhaust filter screen, a sealing plate, a control panel, a refrigerator, a liquid storage box, a box body (14) and a cold plate (2);

the cold plate is characterized in that the top of the cold plate (2) is provided with two grooves (10);

the anti-sticking mechanism is arranged at the top of the cold plate (2) and is used for preventing the chip from being stuck on the cold plate (2);

the pressing mechanism is arranged at the top of the box body (14) to enable the chip to be more attached to the cold plate (2);

and the rotating mechanism is arranged at the top of the box body (14) and is used for rotating the pressing mechanism.

2. The anti-sticking test device for the low-temperature test of the chip according to claim 1, wherein the anti-sticking mechanism comprises two springs (8) and two sliding plates (4), the bottoms of the two springs (8) are fixedly connected with the inner wall of the bottom of the groove (10), the top ends of the two springs (8) are fixedly connected with the bottom of the sliding plate (4), the two sides of the sliding plate (4) are respectively connected with the inner walls of the two sides of the groove (10) in a sliding manner, and the anti-sticking mechanism is divided into two groups.

3. The anti-sticking test device for the low-temperature test of the chip according to claim 1, wherein the rotating mechanism comprises two square plates (6), a cylinder (13), a ring (12) and an L-shaped plate (5), the bottoms of the two square plates (6) are fixedly connected with the top of the box body (14), the two ends of the cylinder (13) are respectively rotatably connected with one side of the two square plates (6) close to each other, the ring (12) is fixedly sleeved on the cylinder (13), the bottom of the L-shaped plate (5) is fixedly connected with one side of the ring (12), and one side of the two square plates (6) close to each other is fixedly connected with the same limiting bar for limiting.

4. The anti-sticking testing device for low-temperature testing of chips according to any one of claims 1 to 3, wherein the pressing mechanism comprises a screw (3) and a circular plate (11), the screw (3) is in threaded connection with the L-shaped plate (5), the top of the circular plate (11) is rotatably connected with the bottom end of the screw (3), and the circular plate (11) is made of rubber.

5. The anti-sticking test device for the low-temperature test of the chip as claimed in claim 2, wherein the inner walls of the two sides of the groove (10) are both provided with elongated grooves, the two sides of the sliding plate (4) are both fixedly connected with sliding blocks (9), and one side of each of the two sliding blocks (9) is respectively connected with the inner walls of the two elongated grooves in a sliding manner.

6. The anti-sticking test device for low-temperature chip test according to claim 3, wherein a bolt (7) for fixing the circular ring (12) is screwed on one side of the square plate (6).