CN218629890U - Semiconductor test fixing device convenient to installation - Google Patents
Semiconductor test fixing device convenient to installation Download PDFInfo
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- CN218629890U CN218629890U CN202221903329.5U CN202221903329U CN218629890U CN 218629890 U CN218629890 U CN 218629890U CN 202221903329 U CN202221903329 U CN 202221903329U CN 218629890 U CN218629890 U CN 218629890U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 238000012360 testing method Methods 0.000 title claims abstract description 28
- 238000009434 installation Methods 0.000 title claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 238000001514 detection method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a semiconductor test fixing device convenient to installation. Semiconductor test fixing device convenient to installation includes: the bottom plate, the top of bottom plate is provided with the rotor plate, the rotor plate is rotatable, be provided with first cardboard and second cardboard on the rotor plate, first cardboard with the rotor plate is fixed, the bottom of second cardboard and the top virtual joint of rotor plate, the second cardboard can move on the rotor plate, the mounting groove has been seted up on the rotor plate, be provided with actuating mechanism in the mounting groove, actuating mechanism is used for driving the second cardboard removes. The utility model provides a semiconductor test fixing device convenient to installation makes first cardboard and second cardboard can keep at suitable scope to the clamping-force of semiconductor through setting up actuating mechanism, pressure sensor and controller, has avoided the phenomenon of centre gripping too big or undersize, and simultaneously, its easy operation is convenient, requires to personnel's experience.
Description
Technical Field
The utility model relates to a semiconductor test technical field especially relates to a semiconductor test fixing device convenient to installation.
Background
A semiconductor refers to a material having a conductivity between that of a conductor and an insulator at normal temperature. The semiconductor is widely applied to radio, television and temperature measurement, the semiconductor needs to be detected after being produced, and various detection items are provided, wherein one is to lead a corresponding signal into a pin and then receive the signal through another corresponding pin, so that whether the semiconductor meets the requirements or not is detected.
Through retrieval, the patent of application number 202122063486.3 discloses a semiconductor laser chip test fixing device, which can drive a second clamping plate to move towards the front side through an adjusting mechanism so as to clamp a semiconductor laser chip, and can avoid the damage to the semiconductor laser chip caused by overlarge clamping force of a traditional clamp through an elastic clamping mode; however, the above designs still have disadvantages, although the chip is clamped by using the elastic clamping method, the clamping force is still uncertain, and there is no standard, and people with shallow experience may still hurt the chip by completely relying on experience and feeling.
Therefore, it is necessary to provide a semiconductor test fixture that is easy to install to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
To the above situation, for overcoming the prior art defect, the utility model provides a semiconductor test fixing device convenient to installation makes first cardboard and second cardboard can keep at suitable scope to the clamping-force of semiconductor through setting up actuating mechanism, pressure sensor and controller, has avoided the phenomenon of centre gripping too big or undersize, and simultaneously, its easy operation is convenient, requires to personnel's experience.
In order to achieve the above object, the utility model adopts the following technical scheme:
semiconductor test fixing device convenient to installation includes: the semiconductor testing and fixing device comprises a base plate, wherein a rotating plate is arranged above the base plate and can rotate, a first clamping plate and a second clamping plate are arranged on the rotating plate and are fixed to the rotating plate, the bottom of the second clamping plate is connected with the top of the rotating plate in a virtual mode, the second clamping plate can move on the rotating plate, a mounting groove is formed in the rotating plate, a driving mechanism is arranged in the mounting groove and is used for driving the second clamping plate to move so as to clamp and fix a semiconductor, a pressure sensor is arranged on the driving mechanism and is in contact with the second clamping plate, the pressure sensor can detect the pressure P of the driving mechanism on the second clamping plate, the semiconductor testing and fixing device convenient to install further comprises a controller, the pressure sensor is electrically connected with the controller, the pressure value detected by the pressure sensor is transmitted to the controller in the form of an electric signal, and the controller receives the signal and processes the signal so as to control the driving mechanism to stop running.
Preferably, actuating mechanism includes movable plate and motor, the controller with the motor electricity is connected, the motor is installed in the mounting groove, be provided with the lead screw on the motor, the lead screw runs through the movable plate slides on the movable plate and is provided with two gag lever posts, two the gag lever post all with the second cardboard is fixed, two all install the spring on the gag lever post, two all install limit baffle on the gag lever post, limit baffle's setting can be placed the second cardboard and break away from with the movable plate.
Preferably, two guide rods are arranged on one side of the moving plate, two guide grooves are formed in one side of the mounting groove, the guide rods are arranged in the guide grooves and can move, and the guide grooves are matched with the guide rods, so that the moving plate can be guaranteed to stably move.
Preferably, a rotatable rotating shaft is arranged on the bottom plate and connected with the rotating plate.
Preferably, four fixing grooves are formed in the rotating shaft and distributed in an annular array, an elastic sheet fixed with the bottom plate is arranged on one side of the rotating shaft, a pin rod is mounted on one side of the elastic sheet, the end of the pin rod is hemispherical, and the end of the pin rod is located in the corresponding fixing groove.
Compared with the prior art, the utility model discloses following beneficial effect has:
(1) The utility model has the advantages that the clamping force of the first clamping plate and the second clamping plate to the semiconductor can be kept in a proper range by arranging the driving mechanism, the pressure sensor and the controller, the phenomenon of too large or too small clamping is avoided, and meanwhile, the operation is simple and convenient, and the requirements on the experience of personnel are met;
(2) The utility model can rotate the semiconductor by a proper angle for personnel to detect by arranging the rotating shaft;
(3) The utility model discloses a set up the fixed slot and cooperate shell fragment and pin bar in the pivot, make the semiconductor rotate can be fixed after certain angle to be convenient for detect.
Drawings
Fig. 1 is a schematic structural view of a semiconductor test fixture convenient for installation according to the present invention;
fig. 2 is an exploded view of the semiconductor test fixture of the present invention for easy installation;
FIG. 3 is a schematic view of a portion of the structure of FIG. 2;
FIG. 4 is a partial schematic view of the structure of FIG. 2;
FIG. 5 is a schematic view of an embodiment of a semiconductor test fixture for easy mounting according to the present invention;
fig. 6 is a schematic connection diagram of the controller, the motor and the pressure sensor in the semiconductor testing fixing device convenient for installation.
Wherein, the names corresponding to the reference numbers are: 1-bottom plate, 2-rotating plate, 3-first clamping plate, 4-second clamping plate, 5-mounting groove, 6-moving plate, 7-motor, 8-screw rod, 9-limiting rod, 10-pressure sensor, 11-spring, 12-limiting baffle, 13-guide rod, 14-guide groove, 15-rotating shaft, 16-fixing groove, 17-elastic sheet, and 18-pin rod.
Detailed Description
The present invention will be further described with reference to the following description and examples, which include but are not limited to the following examples.
Example 1
As shown in fig. 1-6, for the utility model provides a semiconductor test fixing device convenient to installation, include: the semiconductor testing and fixing device comprises a base plate 1 installed on a testing device, wherein a rotating plate 2 is arranged above the base plate 1, the rotating plate 2 can rotate, a semiconductor is installed on the rotating plate 2 during detection, a first clamping plate 3 and a second clamping plate 4 are arranged on the rotating plate 2, the first clamping plate 3 is fixed with the rotating plate 2, the bottom of the second clamping plate 4 is connected with the top of the rotating plate 2 in a virtual mode, the second clamping plate 4 can move on the rotating plate 2, a mounting groove 5 is formed in the rotating plate 2, a driving mechanism is arranged in the mounting groove 5 and used for driving the second clamping plate 4 to move so as to clamp and fix the semiconductor, a pressure sensor 10 is arranged on the driving mechanism and is in contact with the second clamping plate 4, the pressure sensor 10 can detect the pressure P (the pressure of the driving mechanism on the second clamping plate 4 is equal to the clamping force of the second clamping plate 4 on the semiconductor), the semiconductor testing and fixing device convenient to install further comprises a controller (not shown in the figure), the pressure sensor 10 is electrically connected with the controller, the pressure sensor 10 detects the pressure of the second clamping mechanism and transmits an electric signal to the controller, so as to control the controller, the controller to stop the operation of the semiconductor, and control the second clamping mechanism, and the semiconductor clamping mechanism, so as to prevent damage to the semiconductor clamping force of the second clamping mechanism 3.
Example 2
As shown in fig. 3, the driving mechanism includes a moving plate 6 and a motor 7 disposed in an installation slot 5, the controller is electrically connected to the motor 7, the motor 7 is installed in the installation slot 5, a lead screw 8 is disposed on the motor 7, the lead screw 8 penetrates through the moving plate 6, the lead screw 8 can be rotated by starting the motor 7, the moving plate 6 can be moved by rotating the lead screw 8, two limit rods 9 are slidably disposed on the moving plate 6, both the limit rods 9 are fixed to the second clamping plate 4, a spring 11 is disposed on each of the limit rods 9, when the second clamping plate 4 does not need to clamp a semiconductor, the spring 11 is in a loose state, at this time, the second clamping plate 4 is not in contact with the pressure sensor 10, when the semiconductor needs to be clamped, the semiconductor is first placed on the first clamping plate 3, then the motor 7 is started, the lead screw 8 is rotated to move the moving plate 6, the moving plate 6 drives the second clamping plate 4 to move, until the second clamping plate 4 completely contacts the semiconductor, the moving plate 4 continues to move, thereby compressing the spring 11, the pressure contacts the second clamping plate 10, the second clamping plate 6 gradually contacts the stop moving, and the stop moving the stop the pressure sensor 12 when the limit rods 9 and the second clamping plate 4 is contacted with the second clamping plate 4, and the limit rods 12 is applied to control the limiting rod 12, and the limiting rod 12, so that the limiting rod 4 can be applied to the limiting rod 12, and the limiting rod 12 is disposed on the limiting rod 4.
Example 3
As shown in fig. 3, two guide rods 13 are disposed on one side of the moving plate 6, two guide grooves 14 are disposed on one side of the mounting groove 5, the guide rods 13 are movably disposed in the guide grooves 14, and the guide grooves 14 and the guide rods 13 are matched to ensure stable movement of the moving plate 6.
Example 4
As shown in fig. 2, a rotatable rotating shaft 15 is disposed on the bottom plate 1, the rotating shaft 15 is connected to the rotating plate 2, the rotating plate 2 rotates around the rotating shaft 15, and the rotating plate 2 rotates to rotate the semiconductor fixed thereon, so as to detect communication signals of the pins of different angles of the semiconductor.
Example 5
As shown in fig. 4, four fixing grooves 16 are formed in the rotating shaft 15, the four fixing grooves 16 are distributed in an annular array, an elastic sheet 17 fixed to the bottom plate 1 is arranged on one side of the rotating shaft 15, a pin rod 18 is installed on one side of the elastic sheet 17, the end of the pin rod 18 is hemispherical, the end of the pin rod 18 is located in the corresponding fixing groove 16, the rotating shaft 15 is fixed under the action of the pin rod 18 and the elastic sheet 17, and therefore rotation cannot easily occur, so that the semiconductor can be kept in a fixed direction for detection of personnel, when the semiconductor needs to rotate, the rotating plate 2 is rotated with force to rotate the rotating shaft 15, the pin rod 18 is pushed out after the rotating shaft 15 rotates, at the moment, the elastic sheet 17 is elastically deformed, and when the rotating shaft 15 rotates 90 degrees, the elastic sheet 17 releases elasticity to push the pin rod 18 into the corresponding fixing groove 16, so that the rotating shaft 15 is fixed.
Still be provided with the switch in this device, the switch is connected with the controller electricity, when needs are fixed to the semiconductor, place the semiconductor on first cardboard 3 earlier, open the switch again, make the controller, motor 7 and pressure sensor 10 circular telegram, this moment, motor 7 starts, after motor 7 starts, make the movable plate drive second cardboard 4 and remove and make second cardboard 4 carry out the centre gripping to the semiconductor, simultaneously movable plate 6 removes and also drives pressure sensor 10 and remove, after pressure sensor 10 and second cardboard 4 contact, pressure sensor 10 can give the controller with pressure signal transmission, after pressure reaches the setting value, the controller makes motor 7 stall, thereby make first cardboard 3 and second cardboard 4 can carry out the centre gripping to the semiconductor with comparatively suitable dynamics.
The above embodiment is only one of the preferred embodiments of the present invention, and should not be used to limit the protection scope of the present invention, but all the insubstantial changes or color modifications made in the main body design concept and spirit of the present invention, the technical problems solved by the embodiments are still consistent with the present invention, and all should be included in the protection scope of the present invention.
Claims (5)
1. A semiconductor test fixture for ease of installation, comprising:
the semiconductor testing and fixing device comprises a base plate, a rotating plate is arranged above the base plate, a first clamping plate and a second clamping plate are arranged on the rotating plate, the first clamping plate is fixed to the rotating plate, the bottom of the second clamping plate is connected with the top of the rotating plate in a virtual mode, a mounting groove is formed in the rotating plate, a driving mechanism is arranged in the mounting groove and used for driving the second clamping plate to move, a pressure sensor is arranged on the driving mechanism and in contact with the second clamping plate, the semiconductor testing and fixing device convenient to mount further comprises a controller, and the pressure sensor is electrically connected with the controller.
2. The semiconductor test fixing device convenient to mount of claim 1, wherein the driving mechanism comprises a moving plate and a motor, the controller is electrically connected with the motor, the motor is mounted in the mounting groove, a screw rod is arranged on the motor, the screw rod penetrates through the moving plate, two limiting rods are arranged on the moving plate, the two limiting rods are both fixed with the second clamping plate, springs are mounted on the two limiting rods, and limiting baffles are mounted on the two limiting rods.
3. The semiconductor test fixture convenient to mount of claim 2, wherein two guide rods are arranged on one side of the moving plate, two guide grooves are arranged on one side of the mounting groove, and the guide rods are matched with the guide grooves.
4. The semiconductor test fixture of claim 1, wherein the base plate is provided with a pivot, and the pivot is connected to the pivotal plate.
5. The semiconductor test fixing device convenient to mount as claimed in claim 4, wherein the rotating shaft is provided with four fixing grooves, one side of the rotating shaft is provided with a spring plate fixed with the bottom plate, one side of the spring plate is provided with a pin rod, the end of the pin rod is hemispherical, and the end of the pin rod is positioned in the corresponding fixing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221903329.5U CN218629890U (en) | 2022-07-22 | 2022-07-22 | Semiconductor test fixing device convenient to installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221903329.5U CN218629890U (en) | 2022-07-22 | 2022-07-22 | Semiconductor test fixing device convenient to installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218629890U true CN218629890U (en) | 2023-03-14 |
Family
ID=85458069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221903329.5U Active CN218629890U (en) | 2022-07-22 | 2022-07-22 | Semiconductor test fixing device convenient to installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218629890U (en) |
-
2022
- 2022-07-22 CN CN202221903329.5U patent/CN218629890U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 629000 No. 2 Suharitao Science and Technology Park, 73 Chunxiao Road, East of Rose Avenue, Chuanshan Logistics Port, Suining City, Sichuan Province Patentee after: Sichuan Xinhe Microelectronics Co.,Ltd. Address before: 629000 No. 2 Suharitao Science and Technology Park, 73 Chunxiao Road, East of Rose Avenue, Chuanshan Logistics Port, Suining City, Sichuan Province Patentee before: Suining Hexin Semiconductor Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |