CN218621109U - Anode assembly for immersion plating operation - Google Patents

Anode assembly for immersion plating operation Download PDF

Info

Publication number
CN218621109U
CN218621109U CN202222981516.1U CN202222981516U CN218621109U CN 218621109 U CN218621109 U CN 218621109U CN 202222981516 U CN202222981516 U CN 202222981516U CN 218621109 U CN218621109 U CN 218621109U
Authority
CN
China
Prior art keywords
anode
immersion plating
plating operation
plating
anode assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202222981516.1U
Other languages
Chinese (zh)
Inventor
夏娟
陈亮
马元杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Xuguang Electronics Co ltd
Original Assignee
Chengdu Xuguang Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Xuguang Electronics Co ltd filed Critical Chengdu Xuguang Electronics Co ltd
Priority to CN202222981516.1U priority Critical patent/CN218621109U/en
Application granted granted Critical
Publication of CN218621109U publication Critical patent/CN218621109U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

Abstract

The utility model discloses an anode assembly for immersion plating operation, including positive pole, fixed plate, the positive pole is the cylindric, and the centre is equipped with the immersion plating passageway, and the immersion plating passageway link up positive pole upper end, lower extreme, and the positive pole upper end is equipped with the fixed plate. The utility model discloses with wait to plate each position distance and match, make and wait to plate each position current density distribution of piece even, the cladding material quality is better.

Description

Anode assembly for immersion plating operation
Technical Field
The utility model relates to a dip-plating technical field, concretely relates to anode assembly for dip-plating operation.
Background
Immersion plating (immersion plating), a process of generating a firm metal deposition layer on the metal surface by a displacement reaction of one metal from a solution to another metal, using a plated base metal as a cathode, and depositing cations to be plated in a plating solution on the surface of the base metal through electrolysis to form a plating layer. The existing dip plating equipment is of a tank body type, a metal plate serving as an anode is arranged in a dip plating tank, a part to be plated extends into the dip plating tank, and a wire is connected with the part to be plated and the metal plate.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problems, the utility model provides an anode assembly for dip plating operation, which has a similar distance with each part of the part to be plated, so that the current density of each part of the part to be plated is uniformly distributed, and the plating quality is better.
In order to realize the technical purpose, the utility model adopts the technical scheme that:
an anode assembly for immersion plating operation comprises an anode and a fixing plate, wherein the anode is cylindrical, an immersion plating channel is arranged in the middle of the anode, the immersion plating channel penetrates through the upper end and the lower end of the anode, and the fixing plate is arranged at the upper end of the anode.
Furthermore, the side wall of the anode is provided with a filtering hole.
Furthermore, the lower end of the anode is connected with a bottom plate, and the bottom plate is provided with a filtering hole.
Furthermore, the anode material is insoluble metal.
Furthermore, the anode is made of copper.
Furthermore, the fixing plate is annular and perpendicular to the anode, a limiting groove is formed in the fixing plate along the circumferential direction, and the limiting groove is matched with a lug at the notch of the immersion plating groove of the immersion plating device.
Further, the anode is cylindrical.
Further, the anode is rectangular.
Furthermore, the anode is in the shape which is the same as or similar to the shape of the piece to be plated.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model adopts the annular anode to surround the whole part of the piece to be plated, the piece to be plated is positioned in the middle of the anode, the distance between each part and the anode is close, the current density of each part of the piece to be plated is relatively consistent, and the plating quality is improved; the anode of the utility model is provided with the filtering holes, and the whole anode is in a filtering tube shape, so that the impurities remained on the anode metal plate can be taken away in time by the flowing liquid, and the impurities are prevented from being accumulated to influence the coating purity of the piece to be plated; the utility model discloses simple structure, it is convenient to install, makes things convenient for daily washing.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the present invention during immersion plating operation;
in the figure: 1-anode, 2-to-be-plated part, 3-fixing plate, 4-filtering hole, 5-limiting groove, 6-dip plating groove, 7-bump and 8-lead.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations.
In the description of the embodiments of the present application, it should be noted that the indication of orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship which is usually placed when the product of the application is used, or the orientation or positional relationship which is conventionally understood by those skilled in the art, is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application.
In the description of the embodiments of the present application, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, and may for example be fixedly connected, detachably connected, or integrally connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in this application will be understood to be a specific case for those of ordinary skill in the art.
As shown in fig. 1, an anode assembly for immersion plating operation comprises an anode 1 and a fixing plate 3, wherein the anode 1 is cylindrical, an immersion plating passage is arranged in the middle of the anode 1, the immersion plating passage penetrates through the upper end and the lower end of the anode 1, and the fixing plate 3 is arranged at the upper end of the anode 1. As shown in figure 2, when the anode plating device is used, the anode 1 is inserted into the dip plating tank 6, the fixing plate 3 is installed at the notch, the piece to be plated 2 is inserted into the dip plating channel from top to bottom, the upper end of the piece to be plated is connected with the clamping end of the dip plating device, the piece to be plated 2 is connected with the anode 1 through the lead 8, the power supply is switched on, the dip plating is started, and because the piece to be plated 2 is positioned in the middle of the anode 1, the distance between each part and the anode 1 is close, the current density of each part of the piece to be plated 2 is relatively consistent, and the plating quality is high.
Preferably, the anode 1 is cylindrical, rectangular and similar to or identical to the shape of the workpiece 2, and keeps a close distance with each part of the workpiece 2.
Impurities exist in the plating solution, the side wall of the anode 1 is provided with the filtering holes 4, so that the flowing liquid can take away the impurities remained on the anode 1 in time, and the impurities are prevented from being accumulated to influence the plating purity of the piece to be plated.
Further, the bottom plate is connected to positive pole 1 lower extreme, has seted up filtration pore 4 on the bottom plate, will wait to plate 2 and surround entirely, filters the impurity that gets into plating bath in the dip-plating passageway, and impurity can adsorb gradually on positive pole 1 in the dip-plating in-process simultaneously, prevents that impurity from blockking up equipment, causes the operation unusual.
Furthermore, the anode is made of insoluble metal, substances on the surface of the anode are not dissolved in an ionic state, the allowed current density is high, a passivation film is not generated, and the electroplating effect is good. Preferably, the anode 1 is made of copper.
General immersion plating equipment is equipped with lug 7 in immersion plating 6 notch departments of groove, fixed plate 3 is cyclic annular, and perpendicular to positive pole 1, fixed plate 3 are equipped with spacing groove 5 along circumference, and the lug 7 adaptation of 6 notch departments of immersion plating groove of spacing groove 5 and immersion plating equipment prevents that the positive pole subassembly from rocking.
Of course, the present invention may have other embodiments, and those skilled in the art may make various corresponding changes and modifications according to the present invention without departing from the spirit and the essence of the present invention, and these corresponding changes and modifications should fall within the protection scope of the appended claims.

Claims (9)

1. An anode assembly for use in an immersion plating operation, comprising: the anode comprises an anode (1) and a fixing plate (3), wherein the anode (1) is cylindrical, a dip-plating channel is arranged in the middle of the anode, the dip-plating channel penetrates through the upper end and the lower end of the anode (1), and the fixing plate (3) is arranged at the upper end of the anode (1).
2. The anode assembly for use in an immersion plating operation of claim 1, wherein: the side wall of the anode (1) is provided with a filtering hole (4).
3. An anode assembly for use in an immersion plating operation according to claim 2, wherein: the lower end of the anode (1) is connected with a bottom plate, and the bottom plate is provided with a filter hole (4).
4. The anode assembly for use in an immersion plating operation of claim 1, wherein: the anode (1) is made of insoluble metal.
5. An anode assembly for use in an immersion plating operation according to claim 1, wherein: the anode (1) is made of copper.
6. An anode assembly for use in an immersion plating operation according to claim 1, wherein: the fixed plate (3) is annular and is perpendicular to the anode (1), a limiting groove (5) is formed in the fixed plate (3) along the circumferential direction, and the limiting groove (5) is matched with a lug (7) at the notch of a dip-plating groove (6) of dip-plating equipment.
7. An anode assembly for use in an immersion plating operation according to claim 1, wherein: the anode (1) is cylindrical.
8. An anode assembly for use in an immersion plating operation according to claim 1, wherein: the anode (1) is rectangular.
9. An anode assembly for use in an immersion plating operation according to claim 1, wherein: the anode (1) is in the shape which is the same as or similar to the shape of the piece to be plated.
CN202222981516.1U 2022-11-09 2022-11-09 Anode assembly for immersion plating operation Active CN218621109U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222981516.1U CN218621109U (en) 2022-11-09 2022-11-09 Anode assembly for immersion plating operation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222981516.1U CN218621109U (en) 2022-11-09 2022-11-09 Anode assembly for immersion plating operation

Publications (1)

Publication Number Publication Date
CN218621109U true CN218621109U (en) 2023-03-14

Family

ID=85423164

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222981516.1U Active CN218621109U (en) 2022-11-09 2022-11-09 Anode assembly for immersion plating operation

Country Status (1)

Country Link
CN (1) CN218621109U (en)

Similar Documents

Publication Publication Date Title
US8784618B2 (en) Working electrode design for electrochemical processing of electronic components
US20120292195A1 (en) Apparatus and method for electroplating for semiconductor substrate
US20140332393A1 (en) Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD
CN218621109U (en) Anode assembly for immersion plating operation
CN215163246U (en) Sand feeding device for electroplated diamond wire
US2104812A (en) Nickel anode and container
CN1047540A (en) Electroplating system
ITTO20070704A1 (en) SYSTEM AND METHOD OF PLATING METAL ALLOYS BY GALVANIC TECHNOLOGY
CN204661847U (en) A kind of strong current cathode rotary formula electroplanting device
CN217973475U (en) Anode assembly is electroplated to battery piece, battery piece plating bath and electroplating equipment
NO164670B (en) ELECTRODE, ELECTROCHEMICAL CELLE CONTAINING ELECTRODE, AND PROCEDURE FOR MANUFACTURING THE ELECTRODE.
CN216107306U (en) Shape-variable electroplated titanium basket
CN214271077U (en) Novel electroplating pool with uniform electroplating
CN213739734U (en) Be used for axle sleeve part outside selectivity to electroplate tool
US4045303A (en) Process of electroplating porous substrates
CN112391668A (en) Electroplating device for hollow parts
CN211311664U (en) Electrolysis equipment for cleaning silver plating and chromium plating clamp
CN220767220U (en) Plating tank
CN209798153U (en) Device capable of enabling electroplating cathode to be in contact with upper part and lower part
CN219280080U (en) Silver plating device for waveguide inner cavity
CN218539874U (en) Novel titanium blue and coating film device
CN218621094U (en) Independent electroplating device for hardware workpiece
CN215209687U (en) Electroplating bath for novel nickel wire mesh for spinning
CN116397291A (en) Electroplating process and automatic electroplating equipment for semiconductor wafer
CN217026115U (en) High-efficient nickel plating anchor clamps

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant