CN218603818U - Heat dissipation assembly, display module and display device - Google Patents

Abstract

The embodiment of the utility model discloses a radiator unit, display module assembly and display device relates to and shows technical field, can solve current SCF subassembly thick, leads to display module assembly and the equal thick problem of display device who contains display module assembly. The heat dissipation assembly comprises a heat conduction layer, an adhesive layer and a first buffer layer; the bonding layer is arranged on one side of the heat conduction layer in a laminated mode; the first buffer layer is arranged on the side of the heat conduction layer far away from the bonding layer in a strippable and laminated manner.

Description

Heat dissipation assembly, display module and display device

Technical Field

The utility model relates to a show technical field, especially relate to a radiator unit, display module assembly and display device.

Background

At present, display devices (such as mobile phones or flat panels) are developed to be light and thin. The main component of the display device is a display module, and the thickness of the display device is greatly dependent on the thickness of the display module. The conventional display module includes a display panel and an ultra Clean Foam (SCF) module attached to a non-display side (i.e., a back side) of the display panel. The SCF component comprises grid glue, a foam layer, a Polyimide (PI for short) layer and a copper foil which are sequentially stacked. However, such SCF assemblies are relatively thick, resulting in a relatively thick display module, which may not achieve the goal of thinning the display device.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a radiator unit, display module assembly and display device for it is thick to solve current SCF subassembly, and the display device who leads to display module assembly and contain display module assembly is the problem that is all thick.

In order to achieve the above object, the embodiments of the present invention adopt the following technical solutions:

in a first aspect, a heat dissipation assembly is provided; the heat dissipation assembly includes a thermally conductive layer, an adhesive layer, and a first buffer layer. The adhesive layer is stacked on one side of the heat conducting layer. The first buffer layer is arranged on the side of the heat conduction layer far away from the bonding layer in a strippable stacking mode.

For current SCF subassembly, heat radiation component's bond line can play and glue the similar effect with the net, and the heat-conducting layer can play and the similar effect of copper foil, consequently installs heat radiation component behind the non-display side of display panel, can peel off first buffer layer, has attenuate heat radiation component's thickness. In the process of bonding the heat dissipation assembly to the non-display side of the display panel, the first buffer layer can absorb the mounting external force acting on one side, away from the bonding layer, of the heat conduction layer, so that when the heat dissipation assembly is bonded to the non-display side of the display panel, the display side of the display panel is not prone to generating die marks.

Optionally, the first buffer layer is bonded to a side of the thermally conductive layer remote from the adhesive layer.

Optionally, the heat dissipation assembly further includes a protective film disposed on a side of the first buffer layer away from the heat conduction layer; the adhesive force between the protective film and the first buffer layer is larger than the adhesive force between the first buffer layer and the heat conduction layer.

Optionally, the heat dissipation assembly has a through hole, the through hole penetrating through the adhesive layer and the heat conductive layer; the first buffer layer comprises a first protruding part which is convexly arranged on the first surface, and the first surface is the surface of the first buffer layer, which is close to the heat conduction layer; the first projection is embedded in the through hole.

Optionally, the heat dissipation assembly further includes a support pad disposed between the first buffer layer and the heat conductive layer.

Optionally, the adhesive layer is in contact with the thermally conductive layer. Or, the heat dissipation assembly further comprises: the reinforcing layer is arranged between the bonding layer and the heat conduction layer, and the Young modulus of the reinforcing layer is larger than that of the first buffer layer.

Optionally, the thickness of the thermally conductive layer is less than 0.05mm.

Optionally, the heat dissipation assembly further includes a second buffer layer stacked on the side of the heat conduction layer away from the adhesive layer, and the second buffer layer and the first buffer layer are located on the same plane.

In a second aspect, a display module is provided; the display module comprises a display panel and a heat dissipation structure; the heat dissipation structure comprises a heat conduction layer and an adhesive layer which are arranged in a stacked mode, and the adhesive layer is adhered to the non-display side of the display panel; wherein the heat conducting layer is in contact with the adhesive layer; or the heat radiation structure also comprises a reinforcing layer arranged between the heat conduction layer and the bonding layer, and the reinforcing layer is in contact with both the heat conduction layer and the bonding layer.

Compared with a display module comprising the conventional SCF assembly, the display device peels off the first buffer layer to achieve the purpose of thinning the display module.

Optionally, the thickness of the thermally conductive layer is less than 0.05mm.

Optionally, the heat dissipation structure further includes a second buffer layer stacked on one side of the heat conduction layer away from the adhesive layer; the orthographic projection of the second buffer layer on the heat conduction layer covers a part of area of the heat conduction layer; and the Young modulus of the reinforcing layer is larger than that of the second buffer layer.

Optionally, the display module further includes a connector and a circuit board, the circuit board is connected between the connector and the display panel, and the circuit board and the connector are both disposed on one side of the heat conduction layer away from the display panel; the second buffer layer includes: at least one of the first buffer portion, the second buffer portion, and the third buffer portion; the first buffer part is positioned between the circuit board and the heat conduction layer; the second buffer part is positioned between the connector and the heat conduction layer; the orthographic projection of the third buffer part on the heat conduction layer is not overlapped with the orthographic projection of the circuit board and the connector on the heat conduction layer.

Optionally, the display module further comprises a conductive layer; the circuit board includes: the main body part and the wiring part connected with the main body part; the first buffer part is positioned between the routing part and the heat conduction layer; the conductive layer is located between the main body portion and the heat conductive layer and couples the main body portion and the heat conductive layer.

Optionally, the conductive layer is made of conductive foam or conductive adhesive.

In a third aspect, a display device is provided; the display device comprises a display module.

The beneficial effects of the fourth aspect: since the display module is thinned, the display device including the display module is also thinned correspondingly; thereby making the display device favorable for developing towards the direction of light and thin.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following descriptions are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a side view of a display module according to some embodiments;

FIG. 2 is an enlarged view of FIG. 1 at A-A;

FIG. 3A is a block diagram of a heat dissipation assembly according to some embodiments, shown in a front view;

FIG. 3B is a block diagram illustrating the heat dissipation assembly of some embodiments after being mounted on a display panel;

FIG. 4 is a side view of one of the heat dissipation assemblies provided in some embodiments;

FIG. 5 is another side view of a heat dissipation assembly provided in some embodiments;

FIG. 6 is a top view, fig. 4, with the carrier film removed, or the heat dissipation assembly of FIG. 1;

FIG. 7 is a cross-sectional view taken along line B-B of FIG. 6;

FIG. 8 is a cross-sectional view taken along line C-C of FIG. 6;

FIG. 9A is an alternative top view of the heat sink assembly of FIG. 1;

FIG. 9B is a cross-sectional view taken along line D-D of FIG. 9A;

FIG. 10A is another alternative top view of the heat sink assembly of FIG. 1;

FIG. 10B is a cross-sectional view taken along line E-E of FIG. 10A;

FIG. 11A is another alternative top view of the heat sink assembly of FIG. 1;

FIG. 11B is a cross-sectional view taken along line F-F of FIG. 11A;

FIG. 12 is a side view of a display module according to some embodiments;

FIG. 13 is an enlarged view of FIG. 12 at G-G;

FIG. 14A is another side view of a display module according to some embodiments;

FIG. 14B is an enlarged view of FIG. 14A at P-P;

FIG. 15 is a further side view of a display module according to some embodiments;

FIG. 16 is a top view of a display module according to some embodiments;

FIG. 17 is a cross-sectional view taken along line H-H of FIG. 16;

FIG. 18 is another top view of a display module according to some embodiments;

FIG. 19 is a cross-sectional view taken along line I-I of FIG. 18;

fig. 20 is a frame diagram of a display device according to some embodiments.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships that are based on the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "at least one of A, B or C" and includes combinations of the following A, B and C: a alone, B alone, C alone, a combination of A and B, A and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

"plurality" means at least two.

The use of "adapted to" or "configured to" herein means open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

Additionally, the use of "based on" means open and inclusive, as a process, step, calculation, or other action that is "based on" one or more stated conditions or values may in practice be based on additional conditions or values beyond those stated.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

Example embodiments are described herein with reference to cross-sectional and/or plan views as idealized example figures. In the drawings, the thickness of layers and regions are exaggerated for clarity. Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

Embodiments of the present disclosure provide a display module (hereinafter, referred to as a first display module for distinguishing from the following concept). Referring to fig. 1 and 2, the first display module includes a display panel 3 and a heat dissipation assembly 1.

The display panel 3 may be any one of self-luminous display panels 3 such as an Organic Light Emitting Diode (OLED) display panel 3, a quantum dot light emitting diode (QLED) display panel 3, a micro light emitting diode (miniLED or micro led) display panel 3, and a Liquid Crystal Display (LCD) panel, according to different display principles. The display panel 3 may be a flexible display panel 3 or a rigid (also referred to as rigid) display panel 3 depending on whether the display panel 3 can be bent or not.

Illustratively, the display panel 3 may have a display side 301 and a non-display side 302. The display side 301 of the display panel 3 is a side capable of displaying an image, and the non-display side 302 is an opposite side capable of displaying an image.

The heat sink assembly 1 is attached to the non-display side 302 of the display panel 3 for dissipating heat from the display panel 3. Exemplarily, the heat dissipation assembly 1 and the display panel 3 may be in direct contact, i.e., no other layer is disposed therebetween. As another example, the non-display side 302 of the display panel 3 may be provided with a back plate, and the heat dissipation assembly 1 is adhered on the surface of the back plate away from the display panel 3.

With continued reference to fig. 1 and 2, the heat dissipation assembly 1 can include a thermally conductive layer 102, an adhesive layer 101, and a first buffer layer 103.

Wherein the thermally conductive layer 102 may comprise a material having thermal conductivity (hereinafter simply referred to as thermally conductive material), the thermally conductive material is intended to mean what is commonly referred to as a good thermal conductor or a material known to have a heat transfer effect. In one example, the thermally conductive layer 102 may include a metallic material having thermal conductivity; for example, a metal such as copper (Cu), gold (Au), silver (Ag), aluminum (Al), magnesium (Mg), or nickel (Ni) may be included, and an alloy including at least one of the above metals may also be included. In another example, the thermally conductive layer 102 may include a carbon-based material having thermal conductivity; for example, graphite, diamond, carbon fiber, and the like may be included. In addition, the thermally conductive layer 102 may include a polymer material having thermal conductivity, such as thermally conductive silicone grease. However, the thermally conductive layer 102 is not limited to the above materials and may include combinations of the above materials or include other materials not mentioned above.

Illustratively, the thermally conductive layer 102 may be one layer that may be formed from one or a combination of the thermally conductive materials listed above.

By way of further example, the thermally conductive layer 102 may also be a component having thermal conductivity properties similar to thermally conductive materials. For example, the thermally conductive layer 102 may include multiple layers arranged in a stack; at least one (e.g., one or each) of the layers may be formed from one or a combination of the thermally conductive materials listed above. As an example, the heat conductive layer 102 includes a main body layer made of a metal material, and a blackening layer on a surface of the main body layer, which is advantageous for improving heat radiation capability of the layer. For example, a metal material layer may be formed first, and a blackening layer may be obtained by performing blackening treatment on the surface of the metal material layer; the blackening layer can be positioned on part of the surface of the main body layer, and the main body layer can also be wrapped. For example, the surface of the metal material layer may be carburized, in which case a blackened layer is formed in a portion of the metal material layer close to the surface, and the remaining portion serves as a main body layer. For another example, carbon black may be sprayed or electroplated on the surface of the metal material layer, where the metal material layer is a main layer and the layer formed by carbon black is a blackened layer.

Illustratively, the thickness of the thermally conductive layer 102 is less than 0.05mm. For example, the thickness of the heat conductive layer 102 may be 0.01mm,0.02mm,0.03mm, 0.04mm, or the like, thereby thinning the thickness of the heat dissipation assembly 1.

With continued reference to fig. 1 and 2, the adhesive layer 101 may illustratively be a grid glue (Embo) that has a conformable venting function and is flexible without affecting the flexibility of the product in which it is incorporated. Further illustratively, the adhesive layer 101 may be composed of a first adhesive (may also be referred to as an adhesive), or may be a double-sided tape including the first adhesive. Wherein the first adhesive may include: rubber adhesives, acrylic adhesives, urethane adhesives, silicone adhesives, olefin adhesives, resins, epoxy adhesives, and the like.

Illustratively, the thickness of the adhesive layer 101 is less than 1mm. For example, the thickness of the adhesive layer 101 may be 0.01mm,0.2mm,0.3mm,0.4mm, 0.9mm, or the like, thereby thinning the thickness of the heat dissipation assembly 1.

The adhesive layer 101 is stacked on one side of the heat conductive layer 102. The adhesive layer 101 is adhered to the non-display side 302 of the display panel 3. For example, the adhesive layer 101 may be bonded to the display panel 3. As another example, to a back plate provided on the non-display side 302 of the display panel 3.

With continued reference to fig. 1 and 2, the first buffer layer 103 may include a material having a buffer property (hereinafter simply referred to as a buffer material), which is intended to mean what is commonly referred to as a good buffer or a material known to have a buffering effect. The buffer material may include buffer foam or buffer tape with buffer property. The buffer foam is at least one of PU foam, EVA foam, XPE foam and IXPE foam or any combination thereof. The buffer tape may include a heat conductive resin layer (e.g., a synthetic heat conductive resin layer) and the like.

The thickness of the first buffer layer 103 may be set as needed, but is usually about 0.01 to 5mm in terms of strength, thin film properties, and the like. The thickness of the first buffer layer 103 is, for example, 0.01mm, 0.05mm, 0.1mm, 0.4mm, 1mm, 3mm, 4mm, or the like.

The first buffer layer 103 is releasably stacked on the side of the heat conductive layer 102 away from the adhesive layer 101. Illustratively, the first buffer layer 103 may be electrostatically adsorbed on a side of the heat conductive layer 102 away from the adhesive layer 101. As another example, the first buffer layer 103 may be laminated with the heat conductive layer 102 by a hot press or the like. Further illustratively, the first buffer layer 103 may also be adhered to a side of the heat conductive layer 102 away from the adhesive layer 101. In some examples, the first buffer layer 103 is adhered to the side of the heat conductive layer 102 away from the adhesive layer 101 by a second adhesive or a double-sided tape containing the second adhesive, or the like. The material of the second adhesive can refer to the relevant description of the first adhesive. Since the first buffer layer 103 needs to be peeled off, the second adhesive may exhibit weak adhesiveness. Further, the second adhesive may also be a hot melt so as to be peelable by heating. The second adhesive may also be a photosensitive glue to be peeled off by means of, for example, ultraviolet light irradiation or the like.

The process of installing the heat sink assembly 1 on the non-display side of the display panel 3 to form the first display module may include: referring to fig. 3A and 3B, the heat dissipation assembly 1 shown in fig. 3A is attached to the non-display side of the display panel 3 shown in fig. 3A along, for example, the width direction (i.e., the rolling direction) of the display panel 3, so as to obtain the first display module shown in fig. 3B. In this process, the first buffer layer in the heat dissipation assembly 1 can absorb the external installation force acting on the side of the heat conduction layer away from the adhesive layer, so that when the heat dissipation assembly 1 is bonded on the non-display side of the display panel 3, the display side of the display panel 3 is not easy to generate die marks.

After the first display module is manufactured, the first buffer layer can be stripped off to obtain a new display module because the installation external force is not directly applied to the non-display side of the display panel 3 any more. Hereinafter, the new display module is referred to as a second display module. Thereby thinned second display module assembly and contain the display device of second display module assembly through peeling off first buffer layer. Further, hereinafter, a structure obtained by peeling off the first buffer layer from the heat dissipation assembly 1 is referred to as a heat dissipation structure.

In some embodiments, with continued reference to fig. 1 and 2, the adhesive layer 101 is in contact with the thermally conductive layer 102. For example, no other film layer is provided between the adhesive layer 101 and the heat conductive layer 102. For the SCF module in the prior art, with continued reference to fig. 1 and 2, in the heat dissipation assembly 1 of the present embodiment, the adhesive layer 101 may function similar to a grid adhesive, and the heat conductive layer 102 may function similar to a copper foil, and a PI layer and a foam layer are reduced, so that after the first buffer layer 103 is peeled off, the thickness of the obtained heat dissipation structure and the thickness of the second display module including the heat dissipation structure are both reduced.

In some embodiments, with continued reference to fig. 1 and 2, the heat dissipation assembly 1 further comprises a protective film 105.

Illustratively, the protective film 105 may include a thermoplastic resin having one or more characteristics of transparency, mechanical strength, thermal stability, moisture barrier property, isotropy, and the like. The thermoplastic resin is, for example, any one of or a combination of at least two of cellulose resins such as cellulose triacetate, polyester resins, polyethersulfone resins, polysulfone resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, (meth) acrylic resins, cyclic polyolefin resins (norbornene resins), polyarylate resins, polystyrene resins, polyvinyl alcohol resins, and polyester resins (PET). The protective film 105 may also be a thermoplastic resin containing one or more additives. Examples of the additives include ultraviolet absorbers, antioxidants, lubricants, plasticizers, mold release agents, coloring inhibitors, flame retardants, nucleating agents, antistatic agents, pigments, and coloring agents.

The thickness of the protective film 105 may be set as needed, but is usually about 0.1 to 5mm in terms of strength, thin film property, and the like. The thickness of the protective film 105 is, for example, 0.1mm, 0.2mm,0.3mm, 1mm, 2mm, 3mm, 5mm, or the like.

The protective film 105 is provided on a side of the first buffer layer 103 away from the heat conductive layer 102, thereby preventing the first buffer layer 103 from being damaged or contaminated, or the like. For example, the protective film 105 may be adhered to the first buffer layer 103 by a third adhesive, a double-sided tape including the third adhesive, or the like. The third adhesive may be selected as described above in relation to the first adhesive. The third adhesive and the first adhesive may be the same or different in material.

Illustratively, the adhesive force between the protective film 105 and the first buffer layer 103 (hereinafter referred to as a first adhesive force) is greater than the adhesive force between the first buffer layer 103 and the thermally conductive layer 102 (hereinafter referred to as a second adhesive force); that is, the first adhesive force is larger than the second adhesive force, that is, when the protective film 105 is peeled off from the first buffer layer 103, the first buffer layer 103 can be peeled off from the heat conductive layer 102 together, thereby facilitating easy peeling of the first buffer layer 103.

The adhesive force refers to the static adhesion of two objects together, and the force required to apply an external force to separate the two objects is the adhesive force.

Illustratively, the first buffer layer 103 is adhered to the side of the heat conductive layer 102 away from the adhesive layer 101 with a second adhesive, thereby creating a second adhesive force; the protective film 105 may be adhered to a side of the first buffer layer 103 away from the adhesive layer 101 using a third adhesive, thereby generating a first adhesive force. In some examples, the third adhesive and the second adhesive are different materials. For example, the third adhesive may be selected to be a relatively strong adhesive and the second adhesive may be selected to be a relatively weak adhesive to achieve a first adhesion force greater than a second adhesion force.

In other examples, the third adhesive is applied at a thickness greater than the first adhesive to achieve a first adhesive force greater than the second adhesive force.

In still other examples, the third adhesive is applied over an area greater than the first adhesive. For example, the third adhesive forms a full-face structure having a closed contour. The first adhesive may form a discrete plurality of bond points to achieve a first adhesive force greater than a second adhesive force.

In some embodiments, with continued reference to fig. 4 and 5, the heat dissipation assembly 1 may be provided as a stand-alone product. The heat dissipation assembly 1 further comprises a carrier film 104. The bottom film 104 is arranged on the side of the adhesive layer 101 remote from the heat conductive layer 102. The bottom film 104 may be made of the same material as the protective film 105, and serves to protect the adhesive layer 101, and when the adhesive layer 101 of the heat dissipation assembly 1 is adhered to the heat conductive layer 102, the bottom film 104 needs to be peeled off.

The thickness of the base film 104 may be set as needed, but is usually about 0.01 to 5mm in terms of strength, film properties, and the like. The thickness of the base film 104 is, for example, 0.01mm, 0.05mm, 0.1mm, 1mm, 2mm, 3mm, 5mm, or the like.

In other embodiments, referring to fig. 5, the heat dissipation assembly 1 further includes a stiffening layer 106. For example, the material of the stiffening layer 106 may include one or a combination of two or more of Polyimide (PI), polyethylene terephthalate (PET) plastic, graphite, and silicon.

The stiffening layer 106 is disposed between the adhesive layer 101 and the thermally conductive layer 102, and the young's modulus of the stiffening layer 106 is greater than the young's modulus of the first buffer layer 103. Where young's modulus is a physical quantity describing the ability of a solid material to resist deformation. The greater the young's modulus, the greater the stress that causes the material to deform elastically to some extent, i.e. the greater the stiffness of the material. This enables the stiffening layer 106 to enhance the reliability of the heat dissipation assembly 1. Compared with the prior art, the foam layer is reduced, so that the thickness of the heat dissipation structure obtained after the first buffer layer 103 is stripped and the thickness of the second display module comprising the heat dissipation structure are reduced.

The thickness of the reinforcing layer 106 may be set according to actual needs, but is usually about 0.1 to 5mm in terms of strength, thin film properties, and the like. The thickness of the reinforcing layer 106 is, for example, 0.1mm, 0.2mm,0.3mm, 1mm, 2mm, 3mm, 5mm, or the like.

In some embodiments, referring to fig. 6 and 7, heat dissipation assembly 1 has at least one (e.g., one, as well as a plurality of) through-holes 107. At least one (e.g., one, and as well as a plurality of) through-holes 107 each extend through both the adhesive layer 101 and the thermally conductive layer 102. The first buffer layer 103 includes a first protrusion 103a protruding from a first surface 130b, where the first surface 130b is a surface of the first buffer layer 103 close to the heat conductive layer 102. The first projection 103a is embedded in the through hole 107; this prevents the through-hole 107 from being damaged or contaminated during transportation of the first display module, etc.

Illustratively, with continued reference to fig. 6 and 7, a through hole 107 may be a mounting hole for a front camera, a front microphone, a front speaker, a front exposure light, or a front fingerprint recognizer. In the case where the heat dissipating component 1 includes a plurality of through holes 107, the types of front components mounted by different through holes 107 may be the same or different. Therefore, the second display module and the front component are assembled into the display device conveniently.

The first protrusions 103a can be disposed on the first surface 130b of the first buffer layer 103 according to the number and positions of the through holes 107, so as to ensure that the first protrusions 103a are matched with the through holes 107.

When the heat sink 1 includes the reinforcing layer 106 (for example, the structure shown in fig. 5), the at least one through hole 107 penetrates the adhesive layer 101, the reinforcing layer 106, and the heat conductive layer 102.

In some embodiments, referring to fig. 6 and 8, heat dissipation assembly 1 further includes a support pad 108. For example, the support pad 108 may include a material having a hardness (hereinafter referred to as a hard material). The hard material may include, for example, any one or a combination of plural kinds of resin and silicon or the like. The resin may include, among others, phenolic amine, alicyclic amine cured epoxy resin, polyamide, aliphatic amine, polyether amine, or the like.

The support pad 108 is disposed between the first buffer layer 103 and the thermally conductive layer 102. Wherein the support pad 108 may include a first side 108a and a second side 108b opposite each other. For example, the second side 108b of the support pad 108 and the thermally conductive layer 102 may be bonded together by, for example, a fourth adhesive or a double-sided tape including a fourth adhesive. Wherein, the material of the fourth adhesive can refer to the related description of the first adhesive. The first surface 108a of the support pad 108 may be bonded to the first cushioning layer 103 or may be in direct contact (i.e., there is no adhesive between the two). Wherein the adhesive force between the first side 108a of the support pad 108 and the first buffer layer 103 may be less than the adhesive force between the second side 108b of the support pad 108 and the thermally conductive layer 102. Thus, when the first buffer layer 103 is peeled off from the heat conductive layer 102, the supporting pad 108 is not peeled off from the heat conductive layer 102 along with the first buffer layer 103, which reduces the number of process steps and saves time and cost.

In some embodiments, referring to fig. 9A and 9B, the heat dissipation assembly 1 further includes a second buffer layer 109. For example, the material of the second buffer layer 109 may refer to the description of the first buffer layer 103, and is not described herein again. The second buffer layer 109 and the first buffer layer 103 may be made of the same material or different materials.

With continued reference to fig. 9A and 9B, the second buffer layer 109 is stacked on the side of the heat conductive layer 102 away from the adhesive layer 101, and the second buffer layer 109 and the first buffer layer 103 are located on the same plane. Illustratively, the first buffer layer 103 may be integrally disposed with the second buffer layer 109, i.e., there may be a breakable connecting line, such as a score line, between the two. After the first buffer layer 103 is peeled off by peeling the first buffer layer 103, the second buffer layer 109 remains on the heat conductive layer 102. Further illustratively, the first buffer layer 103 and the second buffer layer 109 are separately provided on the heat conductive layer 102, i.e., a gap may be provided therebetween; the second buffer layer 109 remains on the second buffer layer 109 when the first buffer layer 103 is stripped.

In the process of assembling the second display module and other members into the display device, the second buffer layer 109 may be connected to the other members to reduce stress applied to the second display module by the other members. The actual shape and position of the second buffer layer 109 may be determined as desired. Exemplarily, the second buffer layer 109 in fig. 9A and 9B includes a third buffer portion 109A; the structure of the third buffer portion 109a is a ring structure; may be located in the middle of the thermally conductive layer 102. Still exemplarily, the second buffer layer 109 in reference to fig. 10A and 10B includes a first buffer portion 109B; the first buffer portion 109b may have a straight line structure or a curved line structure; between the trace portion 402 of the circuit board 4 and the heat conductive layer 102. Still further exemplarily, the second buffer layer 109 in reference to fig. 11A and 11B includes a second buffer portion 109c; the second buffer portion 109c may be a block structure; between the connectors 6 and the heat conductive layer 102. Also exemplarily, the second buffer layer 109 may be a combination of the first buffer portion 109B in fig. 10A and 10B and the first buffer portion 109B in fig. 11A and 11B.

Some embodiments of the present disclosure also provide a display module. The display module is obtained by peeling off the first buffer layer 103 from the first display module, and therefore the display module is called as a second display module. The same technical features of the second display module and the first display module can be referred to the above description, and are not described again in this embodiment.

FIG. 12 is a side view of a first display module according to some embodiments; fig. 13 is an enlarged view of fig. 12 at G-G. Fig. 14A is a side view of a second display module according to some embodiments. The first display module in fig. 12 includes the first buffer layer 103 that is not peeled off, so that the display panel is not easily stamped when the first display module is formed. The first buffer layer 103 is stripped based on fig. 12 to form the second display module shown in fig. 14A, so that the second display module has the same effect as the first display module, and the thickness of the second display module is reduced.

Referring to fig. 14A and 14B, the second display module includes a display panel 3 and a heat dissipation structure 5. The heat dissipation structure 5 in this embodiment is obtained by peeling off the first buffer layer 103 from the heat dissipation assembly 1.

In some embodiments, with continued reference to fig. 14A and 14B, the heat dissipation structure 5 includes a heat conductive layer 102 and an adhesive layer 101 disposed in a stack, the adhesive layer 101 being adhered to the non-display side 302 of the display panel 3.

Illustratively, the thermally conductive layer 102 and the adhesive layer 101 are in contact. Compared with the prior art, the embodiment removes the foam layer and the PI layer, thereby reducing the thickness of the second display module.

Also illustratively, the heat dissipation structure 5 further includes a reinforcing layer 106 disposed between the thermally conductive layer 102 and the adhesive layer 101, and the reinforcing layer 106 may be in contact with both the thermally conductive layer 102 and the adhesive layer 101. Compared with the prior art, the foam layer is removed, so that the thickness of the second display module is reduced.

In one possible implementation, the display panel 3 in fig. 14A and 14B may be a flexible display panel, and the edge portion thereof may be bent to the back of the display panel 3, resulting in the structure shown in fig. 15.

Referring to fig. 15, the flexible display panel exemplarily includes a display portion 311, a bending portion 312, and a flap portion 313, and the flap portion 313 may be folded to a rear surface of the display portion 311 by the bending portion 312. The first surface 108a of the supporting pad 108 is connected to the folded portion 313, so that a gap between the display portion 311 and the folded portion 313 of the flexible display panel 3 is filled, the display portion 311 and the folded portion 313 of the flexible display panel are ensured to be parallel, and cracks and the like at the bending portion 312 are avoided.

In some embodiments, with continued reference to fig. 14A and 14B, the thickness of the thermally conductive layer 102 is less than 0.05mm. For example, the thickness of the heat conductive layer 102 may be 0.01mm,0.02mm,0.03mm, 0.04mm, or the like, thereby thinning the thickness of the heat dissipation member 1.

In some embodiments, with continued reference to fig. 14A, 14B, and 15, the second display module further comprises a connector 6 and a circuit board 4.

The Circuit board 4 may be, for example, a Printed Circuit board 4 (PCB), a Flexible Circuit board 4 (FPC), or the like.

Illustratively, the connectors 6 are, for example, board-to-Board connectors 6 (Board to Board connectors, BTB connectors), so that different circuit boards 4 can be electrically connected by the connectors 6 for signal transmission. In some embodiments, referring to fig. 15, the circuit board 4 includes a main body portion 401 and a trace portion 402 connected to the main body portion 401. The main body portion 401 of the circuit board 4 is coupled with the display panel 3, and the wire portion 402 of the circuit board 4 is coupled with the connector 6, so that the connector 6 is coupled with the display panel 3. The wire traces 402 of the circuit board 4 and the connector 6 are disposed on a side of the heat conductive layer 102 away from the display panel 3. The main body 401 of the circuit board 4 may be disposed on the side of the heat conductive layer 102 away from the display panel 3.

In some embodiments, with continued reference to fig. 14A and 14B, the heat dissipation structure further comprises an electrically conductive layer 2, the electrically conductive layer 2 being located between the main portion 401 and the thermally conductive layer 102 and coupling the main portion 401 and the thermally conductive layer 102. The conductive layer 2 serves to electrically connect the conductive layer 102 and the ground in the main body portion 401, and thus can be grounded. The material of the conductive layer 2 is, for example, conductive foam or conductive adhesive.

In some embodiments, the heat dissipation structure 5 further includes a second buffer layer 109. The second buffer layer 109 is stacked on the side of the heat conductive layer 102 away from the adhesive layer 101. An orthographic projection of the second buffer layer 109 on the heat conductive layer 102 covers a part of the area (area a) of the heat conductive layer 102. The region other than the region a in the heat conductive layer 102 is referred to as a region B. Since the above first buffer layer 103 covers the region B of the heat conductive layer 102, the second buffer layer 109 does not cover the entire region of the heat conductive layer 102.

The second buffer layer 109 includes: at least one (for example, one, such as a plurality) of the first buffer portion 109B shown in fig. 9A and 9B, the second buffer portion 109c shown in fig. 10A and 10B, and the third buffer portion 109A shown in fig. 11A and 11B.

Illustratively, the first buffer 109b is located between the wire traces 402 and the heat conductive layer 102. Abnormal noise generated by friction or collision between the trace portion 402 of the circuit board 4 and the heat conductive layer 102 is reduced by the first buffer portion 109 b.

Exemplarily, the second buffer portion 109c is located between the connector 6 and the heat conductive layer 102. Abnormal noise caused by friction or collision between the connector 6 and the heat conductive layer 102 is eliminated by the second buffer portion 109 c.

Illustratively, the orthographic projection of the third buffer portion 109a on the heat conductive layer 102 does not overlap with the orthographic projection of the circuit board 4 and the connector 6 on the heat conductive layer 102.

In some embodiments, the Young's modulus of the stiffening layer is greater than the Young's modulus of the second buffer layer. The materials of the stiffening layer and the second buffer layer in this embodiment may be selected as described above with reference to the materials of the stiffening layer and the first buffer layer.

Referring to fig. 16 and 17, the first buffer portion 109b and the second buffer portion 109c may be integrally formed, so that the number of process steps such as cutting is reduced. Referring to fig. 18 and 19, the first buffer portion 109b and the second buffer portion 109c may be separately provided, so that a damaged portion or a stuck portion may be replaced at any one of the first buffer portion 109b and the second buffer portion 109c, thereby relatively reducing material waste.

Some embodiments of the present disclosure also provide a display device, which may include, for example, a mobile phone (mobile phone), a tablet computer (pad), a notebook computer, a television, a Personal Digital Assistant (PDA), an ultra-mobile personal computer (UMPC), a netbook, a wearable device (e.g., a smart watch), a Virtual Reality (VR) display device, an Augmented Reality (AR) display device, or an in-vehicle display device, and the like, and the present embodiment does not limit the type of the display device.

Fig. 20 is a block diagram of a display device.

Referring to fig. 20, the display device may include the main board 20 and the display module 10 (the display module 10 is the second display module), and the main board 20 is electrically connected to the display module 10. The main board 20 is configured to provide image data to the display module 10. The display module 10 is configured to display a corresponding image based on the image data. Because the thickness of the display module 10 is reduced, the thickness of the display device can be correspondingly reduced. The display module 10 can refer to the structure in fig. 15.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (14)

1. A heat sink assembly, comprising:

a heat conductive layer;

the bonding layer is arranged on one side of the heat conduction layer in a laminated mode; and (c) a second step of,

and the first buffer layer is arranged on one side of the heat conduction layer far away from the adhesive layer in a peelable and laminated mode.

2. The heat sink assembly of claim 1,

the first buffer layer is bonded on one side, far away from the bonding layer, of the heat conduction layer.

3. The heat dissipation assembly of claim 2, further comprising:

the protective film is arranged on one side, away from the heat conducting layer, of the first buffer layer; the adhesive force between the protective film and the first buffer layer is larger than the adhesive force between the first buffer layer and the heat conduction layer.

4. The heat sink assembly of claim 1,

the heat dissipation assembly is provided with a through hole which penetrates through the bonding layer and the heat conduction layer; the first buffer layer comprises a first protruding part protruding from a first surface, and the first surface is a surface of the first buffer layer close to the heat conduction layer; the first projection is embedded in the through hole.

5. The heat dissipation assembly of claim 1, further comprising:

the supporting pad is arranged between the first buffer layer and the heat conduction layer.

6. The heat dissipation assembly of claim 1,

the adhesive layer is in contact with the heat conducting layer;

alternatively, the first and second liquid crystal display panels may be,

the heat dissipation assembly further includes: the reinforcing layer is arranged between the bonding layer and the heat conduction layer, and the Young modulus of the reinforcing layer is larger than that of the first buffer layer.

7. The heat dissipation assembly of claim 1, further comprising:

and the second buffer layer is stacked on one side of the heat conduction layer, which is far away from the bonding layer, and the second buffer layer and the first buffer layer are positioned on the same plane.

8. A display module, comprising:

a display panel; and the number of the first and second groups,

the heat dissipation structure comprises a heat conduction layer and an adhesive layer which are arranged in a stacked mode, and the adhesive layer is bonded to the non-display side of the display panel;

wherein the thermally conductive layer and the adhesive layer are in contact; or, the heat radiation structure further comprises a reinforcing layer arranged between the heat conduction layer and the bonding layer, and the reinforcing layer is in contact with the heat conduction layer and the bonding layer.

9. The display module of claim 8,

the thickness of the heat conduction layer is less than 0.05mm.

10. The display module assembly of claim 8, wherein the heat dissipation structure further comprises:

the second buffer layer is stacked on one side, away from the bonding layer, of the heat conduction layer; an orthographic projection of the second buffer layer on the heat conduction layer covers a part of area of the heat conduction layer; and the Young modulus of the reinforcing layer is larger than that of the second buffer layer.

11. The display module of claim 10, further comprising:

the circuit board is connected between the connector and the display panel, and both the circuit board and the connector are arranged on one side, far away from the display panel, of the heat conduction layer;

the second buffer layer includes: at least one of the first buffer portion, the second buffer portion, and the third buffer portion; wherein the first buffer portion is located between the circuit board and the heat conduction layer; the second buffer is positioned between the connector and the heat conducting layer; the orthographic projection of the third buffer part on the heat conduction layer is not overlapped with the orthographic projection of the circuit board and the orthographic projection of the connector on the heat conduction layer.

12. The display module of claim 11, further comprising:

a conductive layer;

the circuit board includes: a main body portion and a routing portion connected to the main body portion;

the first buffer part is positioned between the routing part and the heat conduction layer;

the conductive layer is positioned between the main body portion and the thermally conductive layer and couples the main body portion and the thermally conductive layer.

13. The display module of claim 12, wherein the conductive layer is made of conductive foam or conductive adhesive.

14. A display device, comprising:

a display module according to any one of claims 8 to 13.

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