CN218601775U

CN218601775U - Computer heat dissipation module

Info

Publication number: CN218601775U
Application number: CN202223087820.8U
Authority: CN
Inventors: 江海滨; 杨公昌; 汪海云
Original assignee: Fuxianxun Electronic Technology Nantong Co ltd
Current assignee: Fuxianxun Electronic Technology Nantong Co ltd
Priority date: 2022-11-17
Filing date: 2022-11-17
Publication date: 2023-03-10
Anticipated expiration: 2032-11-17

Abstract

The utility model discloses a computer heat dissipation module, which comprises a base plate, wherein a heat dissipation assembly is arranged on the base plate, the heat dissipation assembly comprises a circular main core and a fan mounting rack, the outer wall of the main core is provided with a plurality of heat dissipation sheets, two of the heat dissipation sheets are provided with first small holes, and the inner wall of the upper end of the main core is provided with a circle of internal threads; the fan mounting frame is characterized in that external threads are arranged on the outer wall of the bottom of the fan mounting frame, the fan mounting frame is arranged at the upper end of the main heart bone, the external threads and the internal threads are screwed up mutually, a fan is arranged in the fan mounting frame, and the specially-designed heat dissipation assembly is detachably designed and is convenient to detach and clean dust.

Description

Computer heat dissipation module

Technical Field

The utility model relates to a heat dissipation module technical field specifically is a computer heat dissipation module.

Background

The heat dissipation module is an indispensable part on a computer and is used for cooling the CPU, the working principle is that the heat of the CPU is led out through a heat transfer pipe and then is dissipated by fins in the heat dissipation module, and a fan is further arranged in the heat dissipation module and exchanges heat between external cold air and the heat dissipation fins, so that the cooling of the CPU is realized; the existing heat dissipation module has poor heat dissipation performance, which affects the normal use of the computer, and most heat dissipation modules are integrally formed and are inconvenient to disassemble and clean dust.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a computer heat dissipation module to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a computer heat dissipation module comprises a bottom plate, wherein a heat dissipation assembly is arranged on the bottom plate, the heat dissipation assembly comprises a circular main core and a fan mounting frame, a plurality of heat dissipation fins are arranged on the outer wall of the main core, first small holes are formed in two of the heat dissipation fins, and a circle of internal threads are arranged on the inner wall of the upper end of the main core;

the fan mounting rack is characterized in that external threads are arranged on the outer wall of the bottom of the fan mounting rack, the fan mounting rack is arranged at the upper end of a main central bone, the external threads and the internal threads are screwed up, and a fan is arranged in the fan mounting rack.

Preferably, mounting holes are formed in the periphery of the bottom plate, a through hole is formed in the bottom plate, a plurality of slots are formed in the edge of the through hole, the number of the slots is equal to that of the radiating fins, limiting plates are arranged beside the two slots, and second small holes are formed in the limiting plates;

the radiating assembly is aligned to the through hole, the radiating fins are inserted into the corresponding slots, the second small holes in the limiting plates are attached to the first small holes in the radiating fins, and the first small holes and the second small holes are fixed through bolts.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses simple structure, the modern design through the cooperation of fin and fan, can dispel the heat fast, improves the radiating efficiency, realizes then that the specially-designed radiator unit is detachable design, conveniently dismantles the clearance dust for CPU's high-efficient heat dissipation.

Drawings

FIG. 1 is a schematic sectional view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of the main heart bone of the present invention;

fig. 3 is a schematic structural view of the fan mounting bracket of the present invention;

fig. 4 is a schematic top view of the base of the present invention;

fig. 5 is a schematic side view of the base of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, the present invention provides a technical solution: a computer heat dissipation module comprises a bottom plate 1, and a CPU is efficiently dissipated by arranging a heat dissipation assembly 2 on the bottom plate 1.

In this embodiment, the heat dissipation assembly 2 includes a circular main core 21 and a fan mounting frame 22, a plurality of heat dissipation fins 211 are disposed on the outer wall of the main core 21, two of the heat dissipation fins 211 are provided with first small holes 212, and then a circle of internal threads are disposed on the inner wall of the upper end of the main core 21;

set up the external screw thread on fan mounting bracket 22's the bottom outer wall, will fan mounting bracket 22 sets up in the upper end of main arbor 21, then screws up each other through external screw thread and internal thread to be connected fan mounting bracket and main arbor, this simultaneously be equipped with fan 221 in the fan mounting bracket 22 for the heat dissipation.

In this embodiment, mounting holes 11 are formed around the bottom plate 1 for mounting the bottom plate on the upper end of the CPU, in addition, a through hole 12 is formed in the bottom plate 1, a plurality of slots 13 are formed in the edge of the through hole 12, the number of the slots 13 is equal to the number of the heat dissipation fins 211, wherein a limiting plate 14 is arranged beside two slots 13, and a second small hole 141 is formed in the limiting plate 14;

during the equipment, behind the through-hole 12 was aimed at to radiator unit 2, will again in the fin 211 inserts corresponding slot 13, and have the fin 211 that has first aperture 212 can laminate mutually with limiting plate 14, just so can let first aperture and second aperture 141 laminate each other, pass through the bolt fastening again between with first aperture 212 and the second aperture 141 at last, can be connected between radiator unit and the bottom plate.

Similarly, the disassembly can be completed only by disassembling the bolt between the first small hole and the second small hole, then pulling the radiating fin out of the slot, and finally unscrewing the fan mounting frame from the upper part of the main core frame.

In conclusion, after the assembly, the heat sink and the fan are matched, so that the heat can be quickly dissipated, the heat dissipation efficiency is improved, and the efficient heat dissipation of the CPU is realized; the disassembled heat dissipation assembly is more convenient for cleaning dust.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a computer heat dissipation module, includes bottom plate (1), be equipped with radiator unit (2) on bottom plate (1), its characterized in that: the radiating assembly (2) comprises a circular main arbor (21) and a fan mounting rack (22), a plurality of radiating fins (211) are arranged on the outer wall of the main arbor (21), first small holes (212) are formed in two radiating fins (211), and a circle of internal threads are formed in the inner wall of the upper end of the main arbor (21);

the fan mounting structure is characterized in that external threads are arranged on the outer wall of the bottom of the fan mounting frame (22), the fan mounting frame (22) is arranged at the upper end of the main heart bone (21), the external threads and the internal threads are screwed up, and a fan (221) is arranged in the fan mounting frame (22).

2. The heat dissipation module of claim 1, wherein: mounting holes (11) are formed in the periphery of the bottom plate (1), a through hole (12) is formed in the bottom plate (1), a plurality of slots (13) are formed in the edge of the through hole (12), the number of the slots (13) is equal to that of the radiating fins (211), limiting plates (14) are arranged beside the two slots (13), and second small holes (141) are formed in the limiting plates (14);

through-hole (12) are aimed at in radiator unit (2), in slot (13) that corresponding is inserted in fin (211), second aperture (141) on limiting plate (14) and first aperture (212) on fin (211) laminate mutually, pass through the bolt fastening between first aperture (212) and second aperture (141).