CN218591299U - System for cleaning machine automatically regulated inside cleanliness factor of cavity - Google Patents

Abstract

The utility model discloses a system for inside cleanliness factor of cleaning machine automatically regulated cavity, including the cleaning machine body, inject the formation cavity in the cleaning machine body, separate through a plurality of baffle intervals in the cavity and form a plurality of cavities, a plurality of cavities are the material loading room according to the cleaning process order in proper order, SC1 room, deionized water room one, SC2 room, deionized water room two, carry the room slowly, infrared drying chamber and play piece room, fan filter unit one and fan filter group two are installed to the top of each cavity, anemometer one and anemometer two are installed respectively to the below of fan filter unit one and fan filter group two, the gas vent has been seted up to one side lower part of each cavity, the gas vent passes through main exhaust pipe and plant end negative pressure pipeline intercommunication, install anemometer three and electronic blast gate one in the main exhaust pipe; an air particle counter is arranged in each cavity; and chemical gas detectors are arranged in the SC1 chamber and the SC2 chamber.

Description

System for cleaning machine automatically regulated inside cleanliness factor of cavity

Technical Field

The utility model belongs to the technical field of the wafer washs and specifically relates to a system of inside cleanliness factor of cleaning machine automatically regulated cavity is related to.

Background

The wafer processing and manufacturing process is complex and has many processing procedures, and the procedures usually leave impurities such as chemical agents, particles, metals and the like on the surface of the wafer, so that the wafer needs to be cleaned in time so as to avoid influencing the surface quality of the silicon wafer and the subsequent processing procedures and influencing the quality of the wafer. At present, two types of common wafer cleaning machines exist, one type is single-wafer cleaning, and the other type is groove type cleaning. Compared with single-chip cleaning, the cleaning agent has the advantages of more cleaning sheets in one time of groove type cleaning, strong cleaning capability, reusability of chemical liquid and the like, and is widely used.

However, when the tank type cleaning machine is used for cleaning the wafer, if the laminar flow adjustment is not good, the following disadvantages are also existed:

(1) The chemical liquid in the cleaning tank is high in temperature and is easy to volatilize, if the volatilized chemical gas cannot be discharged in time, the chemical gas can diffuse into a cavity above the tank body, and when the acid gas meets the alkaline gas, the chemical gas can be crystallized to generate particles in the cavity to pollute the wafer; if the cleaned wafer is adhered with the acid/alkali gas, the wafer is corroded to different degrees, and the surface quality of the wafer is influenced during subsequent measurement;

(2) Fan Filter Unit (FFU) and exhaust above the cell body all need handheld anemograph of operating personnel to detect, manual regulation again, and the size of FFU air input and displacement after the regulation can't quantify, so it is difficult to confirm whether the collocation of air inlet and displacement is suitable, if exhaust too big, because of the difficult complete airtight of accomplishing of cavity, so easily introduce the cavity with the outside ambient air of board, cause the pollution of the inside cavity of board. If the exhaust is too small, NH diffused in the cavity ₃ Such as chemical gas, cannot be exhausted in time, and is liable to contaminate the chip and corrode the machine.

(3) For chemical gas such as NH remaining inside the chamber ₃ And the like, without effective detection means, chemical gas in the cavity is easy to remain unknown.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a system of inside cleanliness factor of cleaning machine automatically regulated cavity.

According to the utility model discloses a system for inside cleanliness factor of cleaning machine automatically regulated cavity, include: the cleaning machine comprises a cleaning machine body, wherein a cavity is defined in the cleaning machine body, a plurality of cavities are formed in the cavity at intervals by a plurality of partition plates, and the cavities sequentially comprise a feeding chamber, an SC1 chamber, a first deionized water chamber, an SC2 chamber, a second deionized water chamber, a slow pulling chamber, an infrared drying chamber and a sheet discharging chamber according to a cleaning process sequence;

a first fan filter unit and a second fan filter unit are mounted above each cavity, a first anemometer and a second anemometer are mounted below the first fan filter unit and the second fan filter unit respectively, an exhaust port is formed in the lower portion of one side of each cavity and communicated with a plant end negative pressure pipeline through a main exhaust pipe, and a third anemometer and a first electric air valve are mounted in the main exhaust pipe;

an air particle counter is arranged in each cavity;

and chemical gas detectors are arranged in the SC1 chamber and the SC2 chamber.

In some embodiments of the present invention, each of the outside of the chamber is further provided with an auxiliary exhaust pipe, one end of the auxiliary exhaust pipe is connected to the exhaust port and the main exhaust pipe between the first anemometers.

In some embodiments of the utility model, install anemograph four and electronic blast gate two in the auxiliary exhaust pipe, still install the pneumatic valve on the auxiliary exhaust pipe.

The utility model discloses an in some embodiments, every the cavity still includes regulation and control module, regulation and control module is used for control fan filter group one with the fan operation amount of wind of fan filter group two still is used for adjusting the electronic blast gate of supplying gas with electronic blast gate one with the amount of wind is adjusted to electronic blast gate two's aperture.

The utility model discloses an in some embodiments, fan filter group one with fan filter group two all adopts inverter motor.

In some embodiments of the present invention, the plurality of partition boards are movable between a first position and a second position, when the partition boards are in the first position, the partition boards are in a closed state, and the adjacent chambers where the partition boards are located are respectively independent to form a closed space; when the partition plate is at the second position, the partition plate is in an open state, and the adjacent chambers where the partition plate is located are communicated.

In some embodiments of the utility model, adjacent two the top of cavity junction is equipped with the inductor, the inductor is located two adjacent between the cavity directly over the baffle, the inductor is used for detecting that the baffle is in open mode or closed condition, and when the baffle was in closed condition, the inductor was in by the baffle is long to be pressed down the state.

The utility model discloses an in some embodiments, every all be equipped with pressure sensor in the cavity, pressure sensor is used for detecting the cavity internal pressure at place to judge whether balanced this cavity intake and the volume of airing exhaust.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. the utility model discloses every fan filter unit two has been newly-increased in the top of cavity, and fan filter unit one with anemograph one and anemograph two are installed respectively to the below of fan filter unit two to install anemograph three in main blast pipe, can calculate the volume of circulation gas in the unit interval according to fan filter unit one and main blast pipe cross-sectional area, make the big or small quantization of air input and displacement, and then set for suitable admitting air and exhaust size. Meanwhile, the newly added fan filter unit II further improves the air intake, and simultaneously increases the exhaust air speed, so that the chemical gas concentration or particle concentration is quickly reduced, and the pollution to wafers and a machine table is avoided;

2. through at SC1 room with all install chemical gas detector in the SC2 room, when chemical gas concentration is higher than a certain setting value in the cavity, according to the out-of-specification scope of chemical gas concentration, selectively improve fan filter unit one air input, increase the displacement of main exhaust pipe or when improving fan filter unit one air input, open fan filter unit two, supplementary blast pipe simultaneously, avoid causing wafer pollution and board damage because of no detection, adjustment means.

3. The first anemometer and the second anemometer are respectively arranged below the first fan filter unit and the second fan filter unit, the third anemometer is arranged in the main exhaust pipe, the fourth anemometer is arranged in the auxiliary exhaust pipe, the wind speed change of the first anemometer and the second anemometer is automatically detected, when the air inlet speed or the air exhaust speed is lower than a set value, the system can automatically adjust the motor rotating speed and the air exhaust size of the first fan filter unit and the second fan filter unit, and the machine table is ensured not to be prolonged in service time, so that the replacement rate of air in a cavity is continuously reduced.

4. Because all install the air particle counter in every cavity, the change of cleanliness factor in the real time monitoring cavity when taking place to arouse that the cavity produces the particle size and surpass the rule because of the circumstances such as exhaust too big, fan filter unit filter screen is dirty, chemical reaction crystallization, cavity are opened, the regulation and control module can in time improve admit air and exhaust size, accelerates the replacement of cavity internal environment, avoids causing wafer and board to pollute.

Drawings

Fig. 1 is a schematic view of a system for automatically adjusting the cleanliness of the interior of a chamber for a cleaning machine according to one embodiment of the present invention;

FIG. 2 is a schematic structural view of the washer body of FIG. 1;

FIG. 3 is an enlarged view of the SC1 chamber of the present invention;

fig. 4 is a schematic diagram of the mechanism of the cleaning machine body when the partition plate between the SC1 chamber and the first deionized water chamber of the present invention is opened.

Reference numerals:

a cleaning machine body 100, a containing tank 110;

a chamber 10, a partition plate 11, a feeding chamber 12, an SC1 chamber 13, a first deionized water chamber 14, an SC2 chamber 15, a second deionized water chamber 16, a slow lifting chamber 17, an infrared drying chamber 18, a sheet discharging chamber 19,

a first fan filter unit 21, a second fan filter unit 22 and a variable frequency motor 211;

a first anemometer 31, a second anemometer 32; a main exhaust pipe 40, a third anemometer 41, a first electric air valve 42, an auxiliary exhaust pipe 43, a fourth anemometer 44, a second electric air valve 45 and a pneumatic valve 46;

an air particle counter 50;

a chemical gas detector 60;

a regulation module 70;

an inductor 80;

a pressure sensor 90;

an exhaust port 101;

SC1 tank 131, seal cover one 132;

a water tank 141;

an SC2 tank 151, a second sealing cover 152;

an infrared lamp 181;

wafer cassette 191.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the applicability of other processes and/or the use of other materials.

The following describes a system for automatically adjusting the internal cleanliness of a cavity of a cleaning machine according to an embodiment of the present invention with reference to fig. 1 to 4, including: the cleaning machine body 100 defines a cavity (not shown in the figure) in the cleaning machine body 100, a plurality of chambers 10 are formed in the cavity at intervals by a plurality of partition plates 11, the plurality of chambers 10 are sequentially a feeding chamber 12, an SC1 chamber 13, a first deionized water chamber 14, an SC2 chamber 15, a first deionized water chamber 16, a slow-pulling chamber 17, an infrared drying chamber 18 and a sheet discharging chamber 19 according to a cleaning process sequence, and the feeding chamber 12, the SC1 chamber 13, the first deionized water chamber 14, the SC2 chamber 15, the first deionized water chamber 16, the slow-pulling chamber 17, the infrared drying chamber 18 and the sheet discharging chamber 19 are sequentially arranged in the cavity, for example, the cavities can be arranged in a straight line and in a row, or in a ring shape, and can be specifically adjusted according to the shape of the cavity, in the embodiment, the cavities are arranged in a straight line and a row, wherein,

the loading chamber 12 is used for placing a wafer to be processed;

an SC1 groove 131 is arranged in the SC1 chamber 13, a first sealing cover 132 is rotatably connected above the SC1 groove 131, NH is contained in the SC1 groove 131 ₄ OH、H ₂ O ₂ And an SC1 solution mixed with ultrapure water according to a certain proportion, holding the wafer into an SC1 chamber 13 by a mechanical arm, and then cleaning the wafer in the SC1 solution to remove particle impurities on the surface of the wafer.

The first deionized water chamber 14 is also provided with a water tank 141, and the water tank 141 is filled with deionized water to clean the chemical reagents remained on the wafer in the previous step.

An SC2 groove 151 is arranged in the SC2 chamber 15, a second sealing cover 152 is rotatably connected above the SC2 groove 151, HCl and H are contained in the SC2 groove 151 ₂ O ₂ And an SC2 solution mixed with ultrapure water according to a certain proportion, holding the wafer into an SC2 chamber 15 by a mechanical arm, and then cleaning the wafer in the SC2 solution to remove metal on the surface of the wafer.

The second deionized water chamber 16 is also provided with a water tank 141, and the water tank 141 is filled with deionized water to clean the chemical reagents remained on the wafer in the previous step.

The slow pulling chamber 17 is also provided with a water tank 141 and a bearing support 171, deionized water is contained in the water tank 141, the bearing support 171 is provided with a plurality of grooves for partially containing wafers, the grooves are arranged at equal intervals, the plurality of wafers are vertically arranged on the grooves of the bearing support 171, the bearing support 171 is clamped by a mechanical arm and enters the deionized water, then the wafer is slowly pulled, so that water on the wafer is remained in the water tank 141 under the action of interface tension, and the wafer is drained.

The infrared drying chamber 18 is provided therein with an infrared lamp 181, and further dries the wafer to remove water vapor from the surface thereof.

The wafer box 191 is placed in the wafer discharging chamber 19, and the wafer after being cleaned and dried is placed in the wafer box 191 and then discharged.

Referring to fig. 1, 2 and 4, the plurality of partition plates 11 are movable between a first position and a second position, when the partition plates 11 are at the first position, the partition plates 11 are in a closed state, and the adjacent chambers 10 where the partition plates 11 are located are respectively independent to form a closed space; when the partition 11 is in the second position, the partition 11 is in an open state, and the adjacent chambers 10 in which the partitions 11 are located communicate with each other. In the first position, the top of the partition 11 is located at the top of the adjacent chamber 10; in the second position, the top of the partition 11 is located at the bottom of the adjacent chamber 10. In other words, the partition plate 11 is a plate capable of moving up and down, the cleaning machine body 100 is provided with a receiving groove 110 for receiving the partition plate 11 below the partition plate 11, and the partition plate 11 between the adjacent chambers 10 can vertically move downwards to the top of the partition plate 11 to be located at the bottom of the chamber 10 or move back upwards to the top of the chamber 10, so that the adjacent chambers 10 are communicated or independently form two closed spaces, that is, the adjacent chambers 10 are opened and closed. For example, referring to FIG. 4, when a wafer is to be transferred from the SC1 chamber 13 to the first DI water chamber 14, the partition 11 between the SC1 chamber 13 and the first DI water chamber 14 moves downward into the receiving groove 110 therebelow, the SC1 chamber 13 communicates with the first DI water chamber 14, and the robot arm holds the wafer and transfers the wafer to the first DI water chamber 14. After the transfer is complete, the partition 11 slides up to the top of the chamber 10, thereby separating the SC1 chamber 13 from the di water chamber one 14. Further, the partition 11 may be an electric partition.

A first fan filter unit 21 and a second fan filter unit 22 are installed above each chamber 10, a first anemometer 31 and a second anemometer 32 are installed below each first fan filter unit 21 and each second fan filter unit 22 respectively, each first anemometer 31 and each second anemometer 32 are used for monitoring the wind speeds of each first fan filter unit 21 and each second fan filter unit 22 respectively, an exhaust port 101 is formed in the lower portion of one side of each chamber 10, each exhaust port 101 is communicated with a plant service end negative pressure pipeline through a main exhaust pipe 40, the pressure of the plant service end negative pressure pipeline is maintained at 0.3-0.5 kpa, a third anemometer 41 and a first electric air valve 42 are installed in the main exhaust pipe 40, each third anemometer 41 is used for monitoring the exhaust wind speed of the main exhaust pipe 40, and each first electric air valve 42 is used for controlling the exhaust speed by controlling the opening degree of each electric air valve;

each chamber 10 is provided with an air particle counter 50 for detecting the content of particles with different sizes in the air in the chamber 10;

the SC1 chamber 13 and the SC2 chamber 15 are provided with chemical gas detectors 60. Chemical gas detector 60 in SC1 chamber 13 for detecting NH ₃ And a chemical gas detector 60 in the SC2 chamber 15 is used to detect HCl gas.

When the chemical gas detector 60 and the air particle counter 50 detect that any one of the chemical gas concentration and the particle concentration in the cavity slightly exceeds a set value, the original wind speed of the first fan filter unit 21 is V1, the wind speed of the main exhaust pipe 40 is V3, the wind speed of the first fan filter unit 21 is increased, when the wind speed detected by the first anemometer 31 is increased to V2, the wind speed maintains V2 unchanged, meanwhile, the opening of the first electric air valve 42 is automatically increased, and when the wind speed detected by the third anemometer 41 is increased to V4, the opening is unchanged, and the wind speed also maintains V4 unchanged. Because the air inlet speed and the air exhaust speed are increased simultaneously, the gas replacement speed in the cavity is increased, the chemical gas concentration or the particle concentration is reduced rapidly, and the pollution to the wafer and the machine is avoided. When the chemical gas concentration/particle level in the cavity is reduced below the set value, the regulation module 70 and the valve start automatic control module automatically adjust to the corresponding wind speeds of V1 and V3 respectively, so that the system is restored to the original level.

When the chemical gas detector 60 and the air particle counter 50 detect that any one of the chemical gas concentration and the particle concentration in the cavity exceeds a set value, the wind speed of the first fan filter unit 21 is maintained to be increased from V1 to V3, the second fan filter unit 22 is opened, meanwhile, the opening degree of the first electric air valve 42 is further increased, and when the second anemometer 32 detects that the wind speed of the main exhaust pipe 40 is V5 (V5 is more than V4 is more than V3), the opening degree is unchanged, and the wind speed is also maintained to be V5. Because the first fan filter unit 21 and the second fan filter unit 22 are opened simultaneously, the air intake is further increased, and the exhaust air speed is increased simultaneously, so that the chemical gas concentration or the particle concentration is reduced rapidly, and the pollution to the wafer and the machine is avoided.

The inventor finds that the FFU filter screen and the exhaust pipeline can be gradually blocked along with the continuous extension of the service time, if the FFU filter screen and the exhaust pipeline can not be adjusted in time, the gas replacement rate in the cavity can be gradually reduced, and the chemical gas can not be discharged in time. That is, when the service time of the system is prolonged and the wind speed detected by the corresponding anemometer one 31 is smaller than the wind speed V3 detected by the anemometer one 31 and the wind speed detected by the anemometer three 41 due to the occurrence of the fan filter unit one 21 or the exhaust blockage, the control module 70 may automatically increase the frequency of the variable frequency motor 211 so that the wind speed of the anemometer one 31 is increased to V1, and increase the opening degree of the electric air valve one 42 until the wind speed detected by the anemometer three 41 reaches V3, thereby always ensuring the relative stability of the system.

Referring to fig. 1, in some embodiments of the present invention, an auxiliary exhaust pipe 43 is further disposed outside each chamber 10, and one end of the auxiliary exhaust pipe 43 is connected to a primary exhaust pipe 40 between the exhaust port 101 and the first anemometer 31. The auxiliary exhaust pipe 43 is provided to assist the exhaust when the chemical gas content in the chamber 10 is too high or the particles in the air are too much, and one main exhaust pipe 40 cannot be exhausted in time.

The auxiliary exhaust pipe 43 is internally provided with a fourth anemometer 44 and a second electric air valve 45, the auxiliary exhaust pipe 43 is also provided with a pneumatic valve 46, the fourth anemometer 44 is used for monitoring the exhaust air speed of the auxiliary exhaust pipe 43, and the second electric air valve 45 is used for controlling the exhaust air speed by controlling the opening degree of the fourth anemometer. The air-operated valve 46 is used to control opening and closing of the secondary exhaust pipe 43.

The inventor finds that as the service life of the system is prolonged, the first fan filter unit 21 or the main exhaust pipe 40 is gradually blocked, and then the problems of mismatching of the air intake amount and the air exhaust amount and the like are caused, and the problems can not be effectively solved. Therefore, in some embodiments of the present invention, referring to fig. 1, each of the chambers 10 is further provided with a control module 70 outside, the control module 70 is configured to control the fan operation air volume of the first fan filter set 21 and the second fan filter set 22, and is further configured to adjust the air volume exhausted by the air supply electric air valve and the opening of the first electric air valve 42 and the opening of the second electric air valve 45. The conditioning module 70 includes, but is not limited to, a controller, and the conditioning module 70 is located outside the washer body 100. The regulation and control module 70 is connected with the fan filter unit I21, the fan filter unit II 22, the anemometer I31, the anemometer II 32, the anemometer III 41, the anemometer IV 44, the electric air valve I42, the electric air valve II 45, the pneumatic valve 46, the air particle counter 50 and the chemical gas detector 6. The regulation and control module 70 is used for controlling the operation of the air inlet machine filter unit I21, the fan filter unit II 22, the electric air valve I42 and the electric air valve II 45 according to the monitoring values of the anemometer I31, the anemometer II 32, the anemometer III 41 and the anemometer IV 44.

The utility model discloses an in some embodiments, refer to fig. 1 and show, fan filter unit one 21 with fan filter unit two 22 all adopt inverter motor 211, and when inverter motor 211's frequency became high, inverter motor 211 rotational speed grow, and the intake grow, inverter motor 211's frequency became small, and inverter motor 211 rotational speed becomes little, and the intake diminishes.

In some embodiments of the present invention, two adjacent sensors 80 are disposed at the top of the junction of the chambers 10, the sensors 80 are located two adjacent chambers 10 between the partition plates 11, the sensors 80 are used for detecting whether the partition plates 11 are in the open state or the closed state, and when the partition plates 11 are in the closed state, the sensors 80 are in the state where the partition plates 11 are pressed for a long time. The sensor 80 is in communication with the control module 70.

When a wafer enters or leaves the chamber 10, the partition plate 11 on the left side or the right side of the chamber 10 is in an open state, the sensor 80 above the partition plate 11 detects that the partition plate 11 is in the open state, and transmits the signal to the control module 70, and the control module 70 controls the chemical gas detector 60 and the air particle counter 50 in the chamber 10 to stop detecting, that is, the air inlet/exhaust speed is not changed due to the imbalance of the air inlet or exhaust amount caused by the instantaneous opening and closing of the partition plate 11 or the turbulence caused by the movement of the robot, and the stability of the system is improved. The chemical gas detector 60 and the air particle counter 50 are only activated by the control module 70 when the sensors 80 on the two partitions 11 of the chamber 10 detect that both partitions 11 are closed. The partition plates 11 on the two sides of the cavity are closed, when the system is in a normal stable state, the fan filter unit I21 and the main exhaust pipe 40 work normally, the wind speed detected by the anemometer is kept at a certain fixed value all the time through the frequency conversion of the variable frequency motor 211, the wind speed cannot be changed due to the blockage of the filter screen, and similarly, the wind speed of the anemometer III 41 is also kept at a certain fixed value all the time.

In some embodiments of the present invention, each pressure sensor 90 is disposed in the chamber 10, and the pressure sensor 90 is used to detect the pressure in the chamber 10 at the position to determine whether the intake and exhaust of the chamber 10 are balanced. Under normal conditions, the air intake volume and the air exhaust volume of the chamber 10 are equal, and at the moment, the pressure sensor 90 detects that the pressure of the chamber 10 is 0; when the air intake is larger than the air exhaust, the pressure sensor 90 detects that the pressure of the chamber 10 is larger than 0; when the intake air amount is smaller than the exhaust air amount, the pressure sensor 90 detects that the pressure in the chamber 10 is smaller than 0. When the anemometer is damaged, for example, the wind speed of the anemometer-31 shows normal, but the fan of the actual fan filter unit-21 does not rotate or has low rotation speed, at this time, the inside of the chamber 10 is in a negative pressure state, the pressure sensor 90 can effectively monitor and feed back, the pressure sensor 90 sends the abnormal information to the regulation and control module 70, the regulation and control module 70 sends a signal to the electric air valve-42 after processing, the exhaust air volume is controlled, the opening degree of the electric air valve-42 is automatically adjusted to compensate to the zero point, meanwhile, the signal is sent to the fan filter unit-21, the frequency of the variable frequency motor 211 is increased to enable the intake air volume to be equal to the exhaust air volume, the pressure of the chamber 10 is enabled to be zero and to be kept balanced, when the pressure value is zero and the conditions of the intake air volume and the exhaust air volume are equal, the stability of the system can be ensured, the content of particles in the environment is reduced, and the cleanliness of the environment inside the machine is further maintained.

The working process is as follows: referring to fig. 3, taking SC1 slot 131 as an example,

(1) Before the cleaning machine equipment is operated, according to the display values of the first anemometer 31 and the third anemometer 41, the air inflow and the air exhaust quantity are calculated according to the cross sections of the first fan filter unit 21 and the main exhaust pipe 40, the first fan filter unit 22 and the auxiliary exhaust pipe 43 can be adjusted to be equal to each other, and pollution of wafers and machines caused by mismatching is avoided.

(2) In the operation process of the machine table, the first fan filter unit 21 above the cavity continuously blows clean filtered gas at the speed V1, the main exhaust pipe 40 is continuously opened, and the gas in the cavity is extracted at the speed V3.

(3) Taking the SC1 tank 131 as an example, the wafer is about to enter the SC1 tank 131 for cleaning, the first sealing cover 132 on the SC1 tank 131 is opened, the wafer is held by the robot arm to enter the SC1 tank 131, the robot arm is withdrawn, and the first sealing cover 132 is closed.

(4) Due to higher temperature in SC1 tank 131 and NH ₄ OH is volatile, so the seal cap 132 is opened and the chemical gas (NH) inside ₃ ) And the chemical gas volatilized into the SC1 chamber 13 is exhausted through the main exhaust pipe 40 under the combined action of the fan filter unit I21 and the exhaust of the main exhaust pipe 40.

(5) If the chemical gas detector 60 or the air particle counter 50 detects that the concentration of the chemical gas or the particles in the SC1 chamber 13 is too high, the chemical gas detector 60 or the air particle counter 50 transmits the information to the control module, and the control module controls the first fan filter unit 22 and the auxiliary exhaust pipe 43 to be simultaneously opened, so that the gas replacement in the SC1 chamber 13 is accelerated.

(6) When the gas concentration in the SC1 chamber 13 is reduced to a certain set value, the second fan filter unit 22 and the auxiliary exhaust pipe 43 are simultaneously closed.

(7) After the wafer cleaning is completed, the first sealing cover 132 on the SC1 tank 131 is opened, the robot grips the wafer and takes out the wafer, and the first sealing cover 132 is closed.

(8) After cleaning, the chemicals inside the tank body are volatilized into the cavity body in the opening process of the first sealing cover 132, and the chemicals entering the SC1 chamber 13 are exhausted through the main exhaust pipe 40 under the combined action of the first fan filter unit 21 and the exhaust of the main exhaust pipe 40. The partition 11 between the SC1 chamber 13 and the first DI water chamber 14 is opened, and the robot holds the wafer into the first DI water chamber 14 for cleaning.

(9) If the chemical gas detector 60 or the air particle counter 50 detects that the concentration of the chemical gas/particles in the SC1 chamber 13 is too high, repeating the step 5-6; steps 5-6 can also be repeated when excessive gas/particle concentrations are detected at any other stage.

If the wind speed and the pressure are abnormal, the measured particle content is continuously high and cannot be reduced, for example, the filter screen is damaged or dirty and needs to be replaced, other pollution sources exist in the cavity, external pollution is introduced due to poor air tightness of the cavity, and the like, the anemometer I31, the anemometer II 32, the anemometer III 41, the anemometer IV 44 and the pressure sensor 90 can timely send abnormal information to the regulation and control module 70, and the regulation and control module 70 gives an alarm to prompt that the machine is in an abnormal state and needs to check the machine. Similarly, the detection concentration of the chemical gas is continuously higher, the abnormal information of the chemical gas detector 60 is sent to the regulation and control module 70, and the regulation and control module 70 gives an alarm to prompt that the machine is in an abnormal state and needs to be checked.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (8)

1. The utility model provides a system for inside cleanliness factor of cleaning machine automatically regulated cavity which characterized in that includes: the cleaning machine comprises a cleaning machine body, wherein a cavity is defined in the cleaning machine body, a plurality of cavities are formed in the cavity at intervals by a plurality of partition plates, and the cavities sequentially comprise a feeding chamber, an SC1 chamber, a first deionized water chamber, an SC2 chamber, a second deionized water chamber, a slow pulling chamber, an infrared drying chamber and a sheet discharging chamber according to a cleaning process sequence;

a first fan filter unit and a second fan filter unit are mounted above each cavity, a first anemometer and a second anemometer are mounted below the first fan filter unit and the second fan filter unit respectively, an exhaust port is formed in the lower portion of one side of each cavity and communicated with a plant end negative pressure pipeline through a main exhaust pipe, and a third anemometer and a first electric air valve are mounted in the main exhaust pipe;

an air particle counter is arranged in each cavity;

and chemical gas detectors are arranged in the SC1 chamber and the SC2 chamber.

2. The system for automatically adjusting the cleanliness of the interior of a cavity of a cleaning machine according to claim 1, wherein an auxiliary exhaust pipe is further arranged on the outer side of each cavity, and one end of each auxiliary exhaust pipe is connected to the main exhaust pipe between the exhaust port and the first anemometer.

3. The system for automatically adjusting the cleanliness of the interior of the cavity of the cleaning machine according to claim 2, wherein a fourth anemometer and a second electric air valve are installed in the auxiliary exhaust pipe, and a pneumatic valve is further installed on the auxiliary exhaust pipe.

4. The system for automatically adjusting the cleanliness of the interior of a cavity of a cleaning machine according to claim 3, wherein each chamber further comprises a control module, and the control module is used for controlling the fan operation air volume of the first fan filter unit and the second fan filter unit and adjusting the opening degree of the first electric air valve and the second electric air valve to adjust the air volume.

5. The system for automatically adjusting the cleanliness of the interior of a cavity of a cleaning machine according to claim 3, wherein the first fan filter unit and the second fan filter unit both adopt variable frequency motors.

6. The system for automatically adjusting the cleanliness of the interior of a cavity of a cleaning machine according to claim 1, wherein a plurality of the partition plates are movable between a first position and a second position, when the partition plates are in the first position, the partition plates are in a closed state, and the adjacent chambers in which the partition plates are located are respectively independent of each other to form a closed space; when the partition plate is at the second position, the partition plate is in an open state, and the adjacent chambers where the partition plate is located are communicated.

7. The system for automatically adjusting the cleanliness of the interior of a cavity of a cleaning machine according to claim 6, wherein a sensor is arranged at the top of the junction between two adjacent chambers, the sensor is positioned right above the partition between the two adjacent chambers, the sensor is used for detecting whether the partition is in an open state or a closed state, and when the partition is in the closed state, the sensor is in a state of being pressed by the partition for a long time.

8. The system for automatically adjusting the cleanliness of the interior of a cavity of a cleaning machine according to claim 1, wherein a pressure sensor is disposed in each cavity, and the pressure sensors are used for detecting the pressure in the cavities to determine whether the intake air volume and the exhaust air volume of the cavities are balanced.

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