CN218587517U - High-stability audio power amplifier - Google Patents
High-stability audio power amplifier Download PDFInfo
- Publication number
- CN218587517U CN218587517U CN202221920337.0U CN202221920337U CN218587517U CN 218587517 U CN218587517 U CN 218587517U CN 202221920337 U CN202221920337 U CN 202221920337U CN 218587517 U CN218587517 U CN 218587517U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- audio power
- power amplifier
- stability
- patch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Landscapes
- Amplifiers (AREA)
Abstract
The utility model relates to the technical field of audio power amplifiers, in particular to a high-stability audio power amplifier; the heat dissipation device comprises a case, a heat dissipation ratchet sheet, an amplification circuit assembly and an auxiliary cooling piece, wherein the auxiliary cooling piece comprises a plurality of heat dissipation patches, and a liquid cavity, a vaporization cavity, a conveying channel and grooves formed in two sides of each heat dissipation patch are formed in each heat dissipation patch; the tail end and the heat dissipation thorn piece laminating of heat dissipation paster, the sap cavity sets up inside the head end of heat dissipation paster, the vaporization chamber sets up inside the tail end of heat dissipation paster, and the sap cavity passes through transfer passage intercommunication with the vaporization chamber, improve audio power amplifier's structure on prior art's basis, through addding the heat dissipation paster, make the gap of heat dissipation thorn piece can be sealed, and do not influence the heat-sinking capability, thereby avoid the dust to get into quick-witted case through the gap and influence the amplifier performance, effectively promote audio power amplifier's stability.
Description
Technical Field
The utility model relates to an audio power amplifier technical field especially relates to a high stable audio power amplifier.
Background
The audio power amplifier is the largest family of various sound equipment, and has the functions of mainly amplifying a weak signal input by a sound source equipment and generating enough current to push a loudspeaker to replay sound, but because an amplifying circuit component can generate a large amount of heat, the use of the audio power amplifier is influenced;
in the prior art, in order to improve the heat dissipation problem of the audio power amplifier, a heat dissipation ratchet sheet is arranged on the outer side of a case for placing an amplifying circuit assembly, so that the heat dissipation of the amplifying circuit assembly is realized;
however, when the audio power amplifier is used, it is found that although the heat dissipation of the amplifying circuit assembly can be realized, the heat dissipation of the ratchet pieces can cause dust to enter the chassis through the gaps between the ratchet pieces, which causes interference on the circuit elements and affects the stability of the circuit elements.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high stable audio power amplifier to the thorn piece that sets up for realizing the heat dissipation among the solution prior art can lead to the dust to get into the problem that back stability is influenced.
In order to achieve the above object, the utility model provides a high-stability audio power amplifier, which comprises a case, a heat dissipation ratchet piece, an amplifying circuit assembly and an auxiliary cooling piece, wherein the auxiliary cooling piece comprises a plurality of heat dissipation patches, and a liquid cavity, a vaporization cavity, a conveying channel and grooves arranged at two sides of each heat dissipation patch are arranged in each heat dissipation patch;
the auxiliary cooling piece is arranged on the inner side of the case and matched with the heat dissipation ratchet piece, the heat dissipation patch is of a convex structure, the head end of the heat dissipation patch is inserted into a gap of the heat dissipation ratchet piece, the tail end of the heat dissipation patch is attached to the heat dissipation ratchet piece, the liquid cavity is formed inside the head end of the heat dissipation patch, the vaporization cavity is formed inside the tail end of the heat dissipation patch, and the liquid cavity is communicated with the vaporization cavity through the conveying channel.
The auxiliary cooling part further comprises a spoiler, and the spoiler is arranged in the case to uniformly disperse air in the case.
The auxiliary cooling piece further comprises auxiliary adhesive tapes, and the auxiliary adhesive tapes are embedded in the grooves on the two sides of the heat dissipation patch so as to improve the installation stability of a gap between the heat dissipation patch and the heat dissipation ratchet piece.
The spoiler comprises a placement frame and a spoiler fan, the placement frame is fixedly connected with the inside of the case, and the spoiler fan is rotatably connected with the placement frame to homogenize air in the case.
The auxiliary adhesive tape comprises a plurality of placement particles and a base, wherein the placement particles are made of rubber, the base is embedded at two sides of the head end of the heat dissipation patch, and the placement particles are uniformly distributed on the base so as to improve the placement stability of a gap between the heat dissipation patch and the heat dissipation ratchet piece.
The high-stability audio power amplifier further comprises a liquid cooling pipe, wherein the liquid cooling pipe comprises a cooling pipe and an external pump, and the liquid cooling pipe is arranged around the amplifying circuit assembly so as to cool the amplifying circuit assembly;
the cooling pipe with the built-in cooling liquid is arranged around the amplifying circuit assembly, and the external pump is arranged on the outer side of the case and communicated with the cooling pipe so as to circulate the cooling liquid in the cooling pipe.
The utility model discloses a high stable audio power amplifier improves audio power amplifier's structure on prior art's basis, through addding the heat dissipation paster makes the gap of heat dissipation thorn piece can be sealed, and does not influence the heat-sinking capability to avoid the dust to get into through the gap the machine case influences the amplifier performance, effectively promotes audio power amplifier's stability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of an axial measurement structure of a first embodiment of a high-stability audio power amplifier provided by the present invention.
Fig. 2 is a schematic diagram of the axial measurement structure of the heat dissipation patch according to the first embodiment of the high-stability audio power amplifier provided by the present invention.
Fig. 3 is a schematic cross-sectional structural diagram of a heat dissipation patch according to a first embodiment of the high-stability audio power amplifier provided by the present invention.
Fig. 4 is a schematic axial view of a second embodiment of a high-stability audio power amplifier according to the present invention.
101-case, 102-heat dissipation ratchet sheet, 103-amplifying circuit component, 104-heat dissipation patch, 105-liquid cavity, 106-vaporization cavity, 107-conveying channel, 108-groove, 109-arrangement frame, 110-turbulent fan, 111-arrangement particle, 112-base, 201-cooling pipe and 202-external pump.
Detailed Description
The first embodiment:
referring to fig. 1 to 3, fig. 1 is an axial structure diagram of a first embodiment of a high-stability audio power amplifier, fig. 2 is an axial structure diagram of a heat dissipation patch of the first embodiment of the high-stability audio power amplifier, and fig. 3 is a schematic cross-sectional structure diagram of the heat dissipation patch of the first embodiment of the high-stability audio power amplifier.
The utility model provides a high-stability audio power amplifier, which comprises a case 101, a heat dissipation ratchet sheet 102, an amplifying circuit component 103 and an auxiliary cooling part, wherein the auxiliary cooling part comprises a plurality of heat dissipation patches 104, and a liquid cavity 105, a vaporization cavity 106, a conveying channel 107 and grooves 108 arranged at two sides of the heat dissipation patches 104 are arranged in each heat dissipation patch 104;
the auxiliary cooling element is disposed inside the chassis 101 and is matched with the heat dissipation ratchet piece 102, the heat dissipation patch 104 is in a convex structure, a head end of the heat dissipation patch 104 is inserted into a gap of the heat dissipation ratchet piece 102, a tail end of the heat dissipation patch 104 is attached to the heat dissipation ratchet piece 102, the liquid cavity 105 is disposed inside the head end of the heat dissipation patch 104, the vaporization cavity 106 is disposed inside the tail end of the heat dissipation patch 104, and the liquid cavity 105 is communicated with the vaporization cavity 106 through the conveying channel 107.
The case 101 is provided with various electrical elements and is filled with inert protective gas, compared with the prior art, the air inside and outside the whole amplifier is not communicated, so that dust is prevented from entering, the whole audio power amplifier is in a high stable state, the heat dissipation ratchet sheet 102 is arranged on the outer side of the case 101, so that heat dissipation of the case 101 is realized, the amplifying circuit assembly 103 is arranged on the inner side of the case 101, the amplifying circuit assembly 103 realizes audio amplification through a power transistor, the heat dissipation patch 104 is inserted between the gaps of the heat dissipation ratchet sheet 102, so that dust is prevented from entering the gap of the heat dissipation ratchet sheet 102, meanwhile, the heat dissipation patch 104 is matched with the vaporization chamber 106 through the liquid chamber 105, cooling liquid is arranged in the liquid chamber 105, when the temperature of the case 101 rises, the cooling liquid is heated and vaporized, enters the vaporization chamber 106 along the conveying channel 107, after the heat is dissipated to the outside in the vaporization chamber 106, the cooling liquid is liquefied again and returns to the liquid chamber 105 through the conveying channel 107, so that heat dissipation is completed.
The auxiliary cooling element further comprises a spoiler, and the spoiler is arranged inside the case 101 to diffuse air inside the case 101.
The spoiler serves to disperse air within the cabinet 101 so that the internal temperature of the entire cabinet 101 is maintained uniform.
Secondly, the auxiliary cooling element further comprises auxiliary adhesive tapes embedded in the grooves 108 on both sides of the heat dissipation patch 104, so as to improve the stability of the arrangement of the gap between the heat dissipation patch 104 and the heat dissipation ratchet piece 102.
The auxiliary adhesive tape improves the installation stability of the heat dissipation patch 104 inserted into the gap of the heat dissipation ratchet piece 102, and prevents the heat dissipation patch 104 from separating from the gap of the heat dissipation ratchet piece 102 to cause dust to enter.
Then, the spoiler includes a mounting frame 109 and a spoiler 110, the mounting frame 109 is fixedly connected with the inside of the cabinet 101, and the spoiler 110 is rotatably connected with the mounting frame 109 to homogenize the air inside the cabinet 101.
The placement frame 109 is disposed inside the chassis 101, and the turbulent fan 110 is disposed to uniformly disperse the air inside the chassis 101, so that the temperature inside the chassis 101 can be kept consistent, and the temperature of the air is reduced by the heat dissipation patches 104 and the heat dissipation ratchet pieces 102.
Finally, the auxiliary adhesive tape comprises a plurality of mounting particles 111 and a base 112 made of rubber, the base 112 is embedded at two sides of the head end of the heat dissipation patch 104, and the plurality of mounting particles 111 are uniformly distributed on the base 112, so as to improve the mounting stability of the gap between the heat dissipation patch 104 and the heat dissipation thorn sheet 102.
The base 112 is disposed in the groove 108, and a plurality of the mounting particles 111 made of the rubber are used to improve the mounting stability of the heat dissipation patch 104.
Second embodiment:
referring to fig. 4 based on the first embodiment, fig. 4 is a schematic diagram of an axial structure of a high-stability audio power amplifier according to a second embodiment.
The high-stability audio power amplifier further comprises a liquid cooling pipe fitting, wherein the liquid cooling pipe fitting comprises a cooling pipe 201 and an external pump 202, and the liquid cooling pipe fitting is arranged around the amplifying circuit assembly 103 so as to realize the cooling of the amplifying circuit assembly 103;
the cooling pipe 201 with the cooling liquid inside is disposed around the amplifying circuit assembly 103, and the external pump 202 is disposed outside the casing 101 and is communicated with the cooling pipe 201 to circulate the cooling liquid inside the cooling pipe 201.
The liquid cooling pipe is used for further improving the heat dissipation of the amplifying circuit assembly 103, and the external pump 202 circulates cooling liquid in the cooling pipe 201 to take away the heat on the surface of the amplifying circuit assembly 103, so that the heat dissipation capacity is further improved, and the problem that the working performance of the audio power amplifier is reduced due to the insufficient heat dissipation capacity of the heat dissipation ratchet piece 102 and the heat dissipation patch 104 is solved.
The utility model discloses a high stable audio power amplifier improves audio power amplifier's structure on prior art's basis, through addding heat dissipation paster 104 makes heat dissipation thorn piece 102's gap can be sealed, and does not influence the heat-sinking capability, thereby avoids the dust to get into through the gap machine case 101 influences the amplifier performance, effectively promotes audio power amplifier's stability.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (7)
1. A high-stability audio power amplifier comprises a case, a heat dissipation ratchet sheet and an amplifying circuit component,
the auxiliary cooling piece is arranged on the inner side of the case and matched with the heat dissipation ratchet piece;
the auxiliary cooling piece comprises a plurality of heat dissipation patches, wherein each heat dissipation patch is internally provided with a liquid cavity, a vaporization cavity and a conveying channel, the liquid cavity, the vaporization cavity and the conveying channel are arranged in grooves on two sides of the heat dissipation patch, the heat dissipation patches are of a convex structure, the head ends of the heat dissipation patches are inserted in gaps of heat dissipation ratchet pieces, the tail ends of the heat dissipation patches are attached to the heat dissipation ratchet pieces, the liquid cavities are arranged in the head ends of the heat dissipation patches, the vaporization cavities are arranged in the tail ends of the heat dissipation patches, and the liquid cavities are communicated with the vaporization cavities through the conveying channels.
2. The high stability audio power amplifier of claim 1,
the auxiliary cooling part also comprises a spoiler, and the spoiler is arranged in the case to uniformly disperse the air in the case.
3. A highly stable audio power amplifier as in claim 2,
the auxiliary cooling piece further comprises auxiliary adhesive tapes which are embedded in the grooves on the two sides of the heat dissipation patch so as to improve the installation stability of a gap between the heat dissipation patch and the heat dissipation ratchet piece.
4. A highly stable audio power amplifier as in claim 3,
the spoiler comprises a placement frame and a spoiler fan, the placement frame is fixedly connected with the inside of the case, and the spoiler fan is rotatably connected with the placement frame to homogenize air in the case.
5. The high stability audio power amplifier of claim 4,
the auxiliary adhesive tape comprises a plurality of placement particles and a base, wherein the placement particles are made of rubber, the base is embedded at two sides of the head end of the heat dissipation patch, and the placement particles are uniformly distributed on the base so as to improve the placement stability of a gap between the heat dissipation patch and the heat dissipation ratchet piece.
6. A highly stable audio power amplifier according to claim 5,
the high-stability audio power amplifier further comprises a liquid cooling pipe fitting, wherein the liquid cooling pipe fitting surrounds the amplifying circuit assembly to realize cooling of the amplifying circuit assembly.
7. The high stability audio power amplifier of claim 6,
the liquid cooling pipe fitting includes cooling tube and external pump, and built-in coolant liquid the cooling tube encircles amplifier circuit subassembly sets up, external pump sets up the outside of quick-witted case, and with the cooling tube intercommunication, with the circulation the coolant liquid in the cooling tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221920337.0U CN218587517U (en) | 2022-07-25 | 2022-07-25 | High-stability audio power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221920337.0U CN218587517U (en) | 2022-07-25 | 2022-07-25 | High-stability audio power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218587517U true CN218587517U (en) | 2023-03-07 |
Family
ID=85361700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221920337.0U Active CN218587517U (en) | 2022-07-25 | 2022-07-25 | High-stability audio power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218587517U (en) |
-
2022
- 2022-07-25 CN CN202221920337.0U patent/CN218587517U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210693870U (en) | 6-14GHz dual-channel solid-state power amplifier | |
| CN218587517U (en) | High-stability audio power amplifier | |
| CN109874281B (en) | Communication equipment and optical module with heat radiation structure thereof | |
| CN202839585U (en) | Heat radiation structure for power amplification module | |
| US9887438B2 (en) | Electronic device thermal management system | |
| JP2017511643A (en) | Holder and mobile terminal | |
| CN218602560U (en) | Battery module heat radiation structure | |
| CN215647962U (en) | Mobile phone heat dissipation mainboard based on copper material | |
| CN207235341U (en) | Radiator structure and terminal based on terminal | |
| CN208538824U (en) | A kind of anti-static type amplifier tube | |
| CN212231971U (en) | Switching power supply radiator and switching power supply | |
| CN210326061U (en) | Passive heat dissipation superconducting filter system shell structure | |
| JP6591013B2 (en) | mobile computer | |
| CN209768054U (en) | IP stereo set power amplifier | |
| CN213485423U (en) | Machine case internal structure | |
| CN212649666U (en) | Multichannel power amplifier | |
| CN207927121U (en) | A kind of low-noise amplifier amplifier tube radiator structure | |
| CN218587152U (en) | Low-energy-consumption audio power amplifier | |
| CN206564574U (en) | A kind of power amplifier component of 2~6GHz frequency ranges | |
| CN216389382U (en) | Low-dropout high-power planar voltage-stabilizing triode | |
| CN211182452U (en) | Heat radiation structure of lithium battery | |
| CN104518424A (en) | Package structure of high-power semiconductor laser | |
| CN219612413U (en) | Heat radiation structure of mobile phone shielding case | |
| CN221264298U (en) | High-power radio frequency power amplifying unit | |
| CN210693875U (en) | Ku wave band solid-state power amplifier device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |