CN218580130U - Plating solution industrial chemicals and temperature control device are added in succession on line - Google Patents
Plating solution industrial chemicals and temperature control device are added in succession on line Download PDFInfo
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- CN218580130U CN218580130U CN202222893251.XU CN202222893251U CN218580130U CN 218580130 U CN218580130 U CN 218580130U CN 202222893251 U CN202222893251 U CN 202222893251U CN 218580130 U CN218580130 U CN 218580130U
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Abstract
The utility model provides an on-line continuous replenishment plating solution chemical raw material and temperature control device, the plating solution of a plurality of coating baths overflows and circulates to the off-line dosing agitator tank through the overflow pipe, wherein can add chemical raw materials to the dosing agitator tank, the electronic mixer stirs and dissolves chemical raw materials, the dosing agitator tank plating solution overflows to the inside of temperature control tank through the overflow pipe, the plating solution of temperature control tank overflows to the inside of fluid infusion tank through the overflow pipe, the fluid infusion tank plating solution overflows to the water storage tank through the overflow pipe, the plating solution in fluid infusion tank and water storage tank returns to a plurality of coating baths through the circulating pump, realize on-line continuous replenishment plating solution chemical raw material; the electric stirrer is used for stirring and dissolving the chemical materials, so that the chemical materials are uniformly dissolved in water, and the problem of uneven electroplating on the surface of a part is avoided; cooling water or steam is circularly input into the cooling titanium pipe through the cooling water inlet and the cooling water outlet, so that the plating solution is cooled and heated, and the temperature control of the plating solution is realized.
Description
Technical Field
The utility model belongs to the technical field of electroplating equipment, especially, relate to an on-line continuous supplement plating bath industrial chemicals and temperature control device.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. During electroplating, the metal or other insoluble material of the coating is used as an anode, the workpiece to be plated is used as a cathode, and cations of the metal of the coating are reduced on the surface of the workpiece to be plated to form the coating.
When the existing electroplating equipment needs to add electroplating chemical raw materials in the process of electroplating parts, the electroplating equipment needs to stop production, thus delaying production and reducing productivity; the newly added chemical raw materials cannot be quickly and uniformly dissolved in water, and partial precipitates are separated out to cause waste, so that the condition of uneven electroplating on the surface of a part is easy to occur after the chemical raw materials are added; when chemical raw materials are dissolved in water, the chemical raw materials can be insufficiently dissolved due to the temperature problem, so that the plating solution needs to be heated or cooled, and the chemical raw materials are better dissolved; therefore, the utility model provides an on-line continuous adding plating solution chemical raw material and temperature control device to solve the problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides an on-line continuous adding plating solution chemical raw material and temperature control device, which aims at solving the problem provided by the background technology.
The utility model is realized in such a way that the device for continuously replenishing the chemical raw materials and the temperature control device of the plating solution on line comprises a dosing stirring tank, a temperature control tank, a liquid replenishing tank, a water storage tank and a plating tank;
a plurality of plating tanks are uniformly distributed at intervals along the horizontal direction and overflow through an overflow pipe to circulate to the inside of the chemical adding stirring tank outside the line;
the dosing stirring tank, the temperature control tank, the liquid supplementing tank and the water storage tank are sequentially distributed along the horizontal direction, plating solution in the dosing stirring tank overflows into the temperature control tank through the overflow pipe, plating solution in the temperature control tank overflows into the liquid supplementing tank through the overflow pipe, and the liquid supplementing tank overflows into the water storage tank through the overflow pipe;
a dosing inlet is formed in one side of the top surface of the dosing stirring tank, an electric stirrer is fixedly arranged in the middle of the top surface of the dosing stirring tank, the output end of the electric stirrer is fixedly connected with a stirring blade, and the stirring blade is positioned in the inner space of the dosing stirring tank;
cooling titanium pipes are arranged on the periphery of the inner wall of the temperature control tank, two ends of each cooling titanium pipe are respectively communicated with a cooling water inlet and a cooling water outlet, a double-barrel active carbon filter is arranged on the outer side of the temperature control tank, and the double-barrel active carbon filter is communicated with the inner space of the temperature control tank;
a first liquid level switch is fixedly arranged on the upper position of the solution supplementing groove, a first circulating pump is fixedly arranged on the top surface of the solution supplementing groove, the first circulating pump is communicated with the solution supplementing groove through a first circulating pump solution pumping port, and the first circulating pump is used for communicating the solution supplementing groove with the plating grooves;
the water storage tank is fixedly provided with a second liquid level switch, the top surface of the water storage tank is fixedly provided with a second circulating pump, and the second circulating pump is communicated with the water storage tank through a second circulating pump liquid pumping port.
Preferably, a total overflow outlet and a second circulating pump liquid outlet are fixedly arranged on one side of the top surface of the dosing stirring tank, the total overflow outlet is communicated with the plating tank, and the second circulating pump liquid outlet is communicated with the second circulating pump.
Preferably, the first circulating pump is communicated with a first circulating pump main pipe, a first circulating pump protection liquid containing hopper is fixedly arranged on the first circulating pump main pipe, a plurality of first circulating pump branch pipe inlets are fixedly connected to the first circulating pump main pipe, and each first circulating pump branch pipe inlet is communicated with one plating tank.
Preferably, a ball valve switch is fixedly arranged at the joint of the main pipe of the first circulating pump and the inlet of the branch pipe of the first circulating pump.
Preferably, the cooling water inlet can be used as a steam heating inlet, and the cooling water outlet can be used as a steam heating outlet.
Preferably, the double-barrel activated carbon filter is used for purifying the plating solution.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model is suitable for an acid zinc plating, alkaline zinc plating, zinc-nickel alloy, copper plating, plating seeds such as nickel plating use, the plating bath of a plurality of coating baths circulates to the line through the overflow pipe overflow and adds the medicine agitator tank, wherein can add chemical raw materials to adding the medicine agitator tank, electronic mixer stirring dissolves chemical raw materials, add medicine agitator tank plating bath and overflow to the control by temperature change inslot portion through the overflow pipe, the control by temperature change inslot plating bath overflows to the fluid infusion inslot portion through the overflow pipe, fluid infusion tank plating bath overflows to the catch basin through the overflow pipe, fluid infusion tank and the plating bath in the catch basin return to a plurality of coating baths through the circulating pump, realized adding plating bath chemical raw materials on line in succession;
2. the electric stirrer arranged in the dosing stirring tank of the utility model stirs and dissolves chemical raw materials, so that the chemical raw materials are uniformly dissolved in water, and the problem that the chemical raw materials cannot be rapidly and uniformly dissolved in water and the electroplating on the surface of a part is not uniform is avoided;
3. the utility model is provided with the temperature control tank, when the temperature of the plating solution in the temperature control tank is too high, cooling water is input into the titanium cooling pipe through the cooling water inlet and the cooling water outlet, thus the plating solution in the temperature control tank can be cooled; when the temperature of the plating solution in the temperature control tank is too low, steam is input into the titanium cooling pipe through the cooling water inlet and the cooling water outlet, so that the plating solution in the temperature control tank can be heated, and the temperature control of the plating solution is realized;
4. the utility model is provided with a double-barrel active carbon filter which can be used for purifying plating solution.
Drawings
Fig. 1 is a front view of the overall structure of the present invention;
fig. 2 is a top view of the overall structure of the present invention;
FIG. 3 is a front view of the temperature control tank of the present invention;
fig. 4 is a front view of a plating tank of the present invention.
In the figure:
1. a dosing stirring tank; 11. a dosing inlet; 12. an electric mixer; 13. a total overflow outlet; 14. a second circulating pump liquid outlet; 15. an overflow pipe;
2. a temperature control tank; 21. cooling the titanium tube; 22. a cooling water inlet; 23. a cooling water outlet; 24. a double-barrel active carbon filter;
3. a liquid supplementing groove; 31. a first liquid level switch; 32. a first circulation pump; 321. the first circulating pump protects the liquid containing hopper; 322. a first circulation pump main pipe; 323. a first circulation pump leg inlet; 33. a first circulating pump liquid suction port;
4. a water storage tank; 41. a second liquid level switch; 42. a second circulation pump; 43. a second circulating pump liquid suction port;
5. plating a tank; 51. a ball valve switch.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention.
The components of the embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 and fig. 2, the present invention provides a technical solution: an online continuous replenishing plating solution chemical raw material and temperature control device comprises a dosing stirring tank 1, a temperature control tank 2, a replenishing tank 3, a water storage tank 4 and a plating tank 5;
a plurality of plating tanks 5 are arranged, the plating tanks 5 are uniformly distributed at intervals along the horizontal direction, and the plating tanks 5 overflow through an overflow pipe 15 and circulate to the inside of the chemical adding stirring tank 1 outside the line;
the dosing stirring tank 1, the temperature control tank 2, the liquid supplementing tank 3 and the water storage tank 4 are sequentially distributed along the horizontal direction, plating solution in the dosing stirring tank 1 overflows into the temperature control tank 2 through an overflow pipe 15, plating solution in the temperature control tank 2 overflows into the liquid supplementing tank 3 through the overflow pipe 15, and the liquid supplementing tank 3 overflows into the water storage tank 4 through the overflow pipe 15;
a dosing inlet 11 is formed in one side of the top surface of the dosing stirring tank 1, an electric stirrer 12 is fixedly arranged in the middle of the top surface of the dosing stirring tank 1, and the output end of the electric stirrer 12 is fixedly connected with a stirring blade which is positioned in the inner space of the dosing stirring tank 1;
a cooling titanium pipe 21 is arranged around the inner wall of the temperature control tank 2, two ends of the cooling titanium pipe 21 are respectively communicated with a cooling water inlet 22 and a cooling water outlet 23, a double-barrel active carbon filter 24 is arranged outside the temperature control tank 2, and the double-barrel active carbon filter 24 is communicated with the inner space of the temperature control tank 2;
a first liquid level switch 31 is fixedly arranged on the upper part of the liquid supplementing tank 3, a first circulating pump 32 is fixedly arranged on the top surface of the liquid supplementing tank 3, the first circulating pump 32 is communicated with the liquid supplementing tank 3 through a first circulating pump liquid pumping port 33, and the liquid supplementing tank 3 is communicated with the plating tanks 5 through the first circulating pump 32;
the upper position of the water storage tank 4 is fixedly provided with a second liquid level switch 41, the top surface of the water storage tank 4 is fixedly provided with a second circulating pump 42, and the second circulating pump 42 is communicated with the water storage tank 4 through a second circulating pump liquid pumping port 43.
In this embodiment, the utility model is suitable for an acid zinc plating, alkaline zinc plating, zinc-nickel alloy, copper plating, plating seeds such as nickel plating use, the plating bath of a plurality of coating baths 5 overflows circulation to the off-line and adds medicine agitator tank 1 through overflow pipe 15, wherein can add the chemical raw materials to adding medicine agitator tank 1, electric mixer 12 stirs and dissolves the chemical raw materials, add medicine agitator tank 1 plating bath and overflow to the inside of temperature control tank 2 through overflow pipe 15, the inside of temperature control tank 2 plating bath overflow to fluid infusion groove 3 through overflow pipe 15, fluid infusion groove 3 plating bath overflows to catch basin 4 through overflow pipe 15, the plating bath in fluid infusion groove 3 and catch basin 4 returns to a plurality of coating baths 5 through the circulating pump, realized supplementing the plating bath chemical raw materials on line in succession; an electric stirrer 12 arranged in the dosing and stirring tank 1 stirs and dissolves chemical raw materials, so that the chemical raw materials are uniformly dissolved in water, and the problem that the chemical raw materials cannot be rapidly and uniformly dissolved in the water and the electroplating on the surface of a part is not uniform is solved; when the temperature of the plating solution in the temperature control tank 2 is too high, cooling water is circularly input into the cooling titanium tube 21 through the cooling water inlet 22 and the cooling water outlet 23, so that the plating solution in the temperature control tank 2 can be cooled; when the temperature of the plating solution in the temperature control tank 2 is too low, steam is circularly input into the cooling titanium tube 21 through the cooling water inlet 22 and the cooling water outlet 23, so that the plating solution in the temperature control tank 2 can be heated; when the first liquid level switch 31 is in a position, the first circulating pump 32 stops working, so that the first circulating pump 32 is prevented from being damaged, and meanwhile, an alarm is given to prompt that the plating solution is replenished to the required amount; when the second liquid level switch 41 is at a high position, an alarm is given to prompt that the plating solution is full, the second circulating pump 42 is automatically started to circulate the plating solution to the inside of the dosing stirring tank 1, and when the second liquid level switch 41 is at a low position, the second circulating pump 42 stops working to avoid damaging the second circulating pump 42; the two-tub activated carbon filter 24 may be used to purify the plating solution.
Further, referring to fig. 1 and 2, a total overflow outlet 13 and a second circulation pump liquid outlet 14 are fixedly arranged on one side of the top surface of the dosing and stirring tank 1, the total overflow outlet 13 is communicated with the plurality of coating tanks 5, and the second circulation pump liquid outlet 14 is communicated with a second circulation pump 42.
In the present embodiment, the plating solution in the plurality of plating tanks 5 is circulated to the outside-line chemical feeding agitation tank 1 via the overflow pipe 15 and the total overflow outlet 13; when the second liquid level switch 41 is at a high level, an alarm is given to prompt that the plating solution is full, the second circulating pump 42 is automatically started to circulate the plating solution, and the plating solution passes through the liquid outlet 14 of the second circulating pump to the inside of the dosing stirring tank 1.
Further, referring to fig. 1 and fig. 2, the first circulation pump 32 is connected to a first circulation pump main pipe 322, a first circulation pump protection liquid containing hopper 321 is fixedly disposed on the first circulation pump main pipe 322, a plurality of first circulation pump branch pipe inlets 323 are fixedly connected to the first circulation pump main pipe 322, and each first circulation pump branch pipe inlet 323 is connected to one plating tank 5.
In the present embodiment, the first circulation pump 32 is activated to pump the plating solution in the fluid replacement tank 3 back into the plurality of plating tanks 5 via the first circulation pump main pipe 322 and the first circulation pump branch pipe inlet 323.
Further, referring to fig. 2, a ball valve switch 51 is fixedly disposed at a connection position of the first circulation pump main pipe 322 and the first circulation pump branch pipe inlet 323.
In this embodiment, the ball valve switch 51 is turned on, and the first circulation pump 32 is started to pump the plating solution in the fluid replacement tank 3 back into the plating tanks 5 through the first circulation pump main pipe 322 and the first circulation pump branch pipe inlet 323.
Further, referring to fig. 1 and 2, the cooling water inlet 22 may be used as a steam heating inlet, and the cooling water outlet 23 may be used as a steam heating outlet.
In the present embodiment, when the temperature of the plating solution in the temperature control tank 2 is too high, cooling water is circulated and input into the titanium cooling pipe 21 through the cooling water inlet 22 and the cooling water outlet 23, so that the temperature of the plating solution in the temperature control tank 2 can be reduced; when the temperature of the plating solution in the temperature control tank 2 is too low, steam is circularly input into the cooling titanium tube 21 through the cooling water inlet 22 and the cooling water outlet 23, so that the plating solution in the temperature control tank 2 can be heated, and the temperature control effect on the plating solution is realized.
Further, referring to FIG. 2, a two-tub activated carbon filter 24 is used to purify the plating solution.
In this embodiment, the double-barrel activated carbon filter 24 can absorb impurities and activated carbon in the plating solution, so that the plating solution is more pure and is beneficial to electroplating.
The utility model discloses a theory of operation and use flow: the utility model is suitable for an acid zinc plating, alkaline zinc plating, zinc-nickel alloy, copper plating, plating seeds such as nickel plating use, the plating bath of a plurality of coating baths 5 overflows through overflow pipe 15 and circulates to the off-line and adds medicine stirred tank 1, wherein can add the chemical raw material to adding medicine stirred tank 1, electric mixer 12 stirs and dissolves the chemical raw material, it overflows to the inside of temperature control tank 2 through overflow pipe 15 to add medicine stirred tank 1 plating bath, the inside of temperature control tank 2 plating bath through overflow pipe 15 overflow groove 3, mend liquid tank 3 plating bath and overflow to catch basin 4 through overflow pipe 15, the plating bath in mend liquid tank 3 and catch basin 4 returns to a plurality of coating baths 5 through the circulating pump, realized that the plating bath is supplemented with the chemical raw material in succession on line; when the temperature of the plating solution in the temperature control tank 2 is too high, cooling water is circularly input into the cooling titanium tube 21 through the cooling water inlet 22 and the cooling water outlet 23, so that the plating solution in the temperature control tank 2 can be cooled; when the temperature of the plating solution in the temperature control tank 2 is too low, steam is circularly input into the cooling titanium tube 21 through the cooling water inlet 22 and the cooling water outlet 23, so that the plating solution in the temperature control tank 2 can be heated, and the temperature control effect on the plating solution is realized; the double-barrel active carbon filter 24 can absorb impurities and active carbon in the plating solution, so that the plating solution is purer and is beneficial to electroplating work.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. The utility model provides an online plating bath industrial chemicals and temperature control device of supplementing in succession which characterized in that: comprises a dosing stirring tank (1), a temperature control tank (2), a liquid supplementing tank (3), a water storage tank (4) and a plating tank (5);
a plurality of plating tanks (5) are arranged, the plating tanks (5) are uniformly distributed at intervals along the horizontal direction, and the plating tanks (5) overflow through overflow pipes (15) and circulate to the outside of the chemical adding stirring tank (1);
the dosing stirring tank (1), the temperature control tank (2), the liquid supplementing tank (3) and the water storage tank (4) are sequentially distributed along the horizontal direction, plating solution in the dosing stirring tank (1) overflows into the temperature control tank (2) through the overflow pipe (15), plating solution in the temperature control tank (2) overflows into the liquid supplementing tank (3) through the overflow pipe (15), and the liquid supplementing tank (3) overflows into the water storage tank (4) through the overflow pipe (15);
a dosing inlet (11) is formed in one side of the top surface of the dosing stirring tank (1), an electric stirrer (12) is fixedly arranged in the middle of the top surface of the dosing stirring tank (1), and the output end of the electric stirrer (12) is fixedly connected with a stirring blade which is positioned in the inner space of the dosing stirring tank (1);
a cooling titanium pipe (21) is arranged on the periphery of the inner wall of the temperature control tank (2), two ends of the cooling titanium pipe (21) are respectively communicated with a cooling water inlet (22) and a cooling water outlet (23), a double-barrel active carbon filter (24) is arranged on the outer side of the temperature control tank (2), and the double-barrel active carbon filter (24) is communicated with the inner space of the temperature control tank (2);
a first liquid level switch (31) is fixedly arranged on the liquid replenishing tank (3), a first circulating pump (32) is fixedly arranged on the top surface of the liquid replenishing tank (3), the first circulating pump (32) is communicated with the liquid replenishing tank (3) through a first circulating pump liquid pumping port (33), and the first circulating pump (32) is used for communicating the liquid replenishing tank (3) with the plating tanks (5);
the water storage tank (4) is fixedly provided with a second liquid level switch (41) on the upper part, the top surface of the water storage tank (4) is fixedly provided with a second circulating pump (42), and the second circulating pump (42) is communicated with the water storage tank (4) through a second circulating pump liquid pumping port (43).
2. The device for continuously replenishing plating solution chemical raw material and controlling temperature on line as claimed in claim 1, wherein: add medicine stirred tank (1) top surface one side and fixedly be equipped with total overflow outlet (13) and second circulating pump liquid outlet (14), total overflow outlet (13) intercommunication is a plurality of coating bath (5), second circulating pump liquid outlet (14) intercommunication second circulating pump (42).
3. The device for continuously replenishing plating solution chemical raw material and controlling temperature on line as claimed in claim 1, wherein: first circulating pump (32) intercommunication first circulating pump is responsible for (322), first circulating pump is responsible for (322) and is gone up the fixed flourishing liquid fill (321) of first circulating pump protection that is equipped with, a plurality of first circulating pump branch pipe entry of fixed connection (323), every on the first circulating pump is responsible for (322) first circulating pump branch pipe entry (323) intercommunication one coating bath (5).
4. The device for continuously replenishing plating solution chemical raw material and controlling temperature on line as claimed in claim 3, wherein: and a ball valve switch (51) is fixedly arranged at the joint of the first circulating pump main pipe (322) and the first circulating pump branch pipe inlet (323).
5. The device for continuously replenishing plating solution chemical raw material and controlling temperature on line as claimed in claim 1, wherein: the cooling water inlet (22) can be used as a steam heating inlet, and the cooling water outlet (23) can be used as a steam heating outlet.
6. The device for continuously replenishing plating solution chemical raw material and controlling temperature on line as claimed in claim 1, wherein: the double-barrel active carbon filter (24) is used for purifying plating solution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202222893251.XU CN218580130U (en) | 2022-10-31 | 2022-10-31 | Plating solution industrial chemicals and temperature control device are added in succession on line |
Applications Claiming Priority (1)
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CN202222893251.XU CN218580130U (en) | 2022-10-31 | 2022-10-31 | Plating solution industrial chemicals and temperature control device are added in succession on line |
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CN218580130U true CN218580130U (en) | 2023-03-07 |
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CN202222893251.XU Active CN218580130U (en) | 2022-10-31 | 2022-10-31 | Plating solution industrial chemicals and temperature control device are added in succession on line |
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2022
- 2022-10-31 CN CN202222893251.XU patent/CN218580130U/en active Active
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Address after: In the courtyard of Wuhu Longfeng Electrical and Electronic Co., Ltd., No. 3088, Expressway, Wanzhou District, Wuhu City, Anhui Province, 241000 Patentee after: Anhui Fenjin Environmental Protection Technology Co.,Ltd. Address before: 241000 Anhui New Wuhu Economic Development Zone, Wuhu County, Wuhu City, Anhui Province Patentee before: Anhui Fenjin Environmental Protection Technology Co.,Ltd. |
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