CN218568810U

CN218568810U - Vacuum suction pen

Info

Publication number: CN218568810U
Application number: CN202222776427.3U
Authority: CN
Inventors: 马爽; 邱树杰; 丁雄傑; 种涞源; 韩景瑞; 杨旭腾
Original assignee: Dongguan Tianyu Semiconductor Technology Co ltd
Current assignee: Guangdong Tianyu Semiconductor Co ltd
Priority date: 2022-10-20
Filing date: 2022-10-20
Publication date: 2023-03-03
Anticipated expiration: 2032-10-20

Abstract

The utility model discloses a vacuum suction pen, which comprises a shell, a suction pipeline and a blowing pipeline, wherein the suction pipeline and the blowing pipeline are arranged in the shell, the suction pipeline is provided with a first suction end and a second suction end, the blowing pipeline is provided with a first blowing end and a second blowing end, the first suction end is communicated with a vacuumizing device, the second suction end is connected with a sucker for adsorbing a wafer, the first blowing end is communicated with a gas feeding device, and the second blowing end is provided with a blowing port corresponding to the wafer; the blowing pipeline and the suction pipeline are respectively connected with the linkage device, the linkage device is driven by air pressure in the suction pipeline to enable the linkage device to have a first state and a second state, the blowing pipeline is opened by the linkage device to blow air to the wafer in the first state, and the blowing pipeline is closed by the linkage device in the second state. The utility model discloses the vacuum suction pen reduces the automatic pipeline of blowing of opening of drive aggregate unit through the atmospheric pressure in the pipeline of breathing in when absorbing the wafer, clears up the thing granule that drops on the wafer, has effectively improved the processing yield.

Description

Vacuum suction pen

Technical Field

The utility model relates to a semiconductor manufacturing field especially relates to a vacuum suction pen.

Background

With the continuous development of power electronic technology, the requirements for control, transmission and conversion of electric energy are continuously increased, and the development of the whole semiconductor industry is promoted. In the semiconductor processing industry, most of the working sections are directed to processing wafers, and vacuum suction pens for transferring wafers are widely used. The currently adopted vacuum suction pen has a single function, and a sucker at the head of the suction pen is communicated with an air suction passage and is adsorbed on the back of a wafer. In the processes of picking, transferring and placing, falling object pollution is easy to generate, negative effects are generated on subsequent processes, the yield is reduced, and the cost is increased.

Disclosure of Invention

An object of the utility model is to provide a vacuum suction pen to when adsorbing the wafer clear up the thing granule that drops on the wafer, thereby improve yield, the reduce cost of processing.

In order to achieve the above object, the utility model provides a vacuum suction pen, include the shell and locate aspiration channel and the gas blowing pipeline in the shell, the aspiration channel has the first end of breathing in of protrusion in shell one side and the second end of breathing in of protrusion in the shell opposite side, the gas blowing pipeline has the first end of blowing of protrusion in shell one side and the second end of blowing of protrusion in the shell opposite side, the first end of breathing in communicates vacuum extractor, the second end of breathing in is connected with the sucking disc and is used for adsorbing the wafer, the first end of blowing communicates gas supply equipment, the second end of blowing is equipped with the gas blowing mouth that corresponds the wafer setting that the sucking disc adsorbs, the gas blowing mouth is located the side top that the sucking disc adsorbs the wafer; the blowing pipeline and the suction pipeline are further respectively connected with a linkage device, air pressure in the suction pipeline drives the linkage device to enable the linkage device to be in a first state and a second state, in the first state, the blowing pipeline is opened by the linkage device to blow air to the wafer, and in the second state, the blowing pipeline is closed by the linkage device to stop blowing air to the wafer.

Preferably, the aggregate unit includes elastic membrane, slider and connecting rod, the elastic membrane set up in breathe in on the pipeline, the slider corresponds the elastic membrane sets up on the pipeline of blowing, the slider inlays to be located blow and can follow the perpendicular to on the pipeline the direction of pipeline of blowing is relative the pipeline motion of blowing, a connecting rod is connected towards one side of elastic membrane to the slider, the connecting rod connect in on the elastic membrane, the air pressure drive in the pipeline of breathing in the elastic membrane motion is so that the aggregate unit has first state and second state.

Preferably, the aggregate unit is pneumatic film valve, pneumatic film valve has membrane chamber and disk seat, the indoor diaphragm that has of membrane, the diaphragm will the membrane chamber is separated for last cavity and cavity of resorption, be equipped with the air inlet on the last cavity, the air inlet intercommunication the pipeline of breathing in, the disk seat connect in on the pipeline of blowing, the valve rod is connected to the diaphragm, the one end that the valve rod is located the disk seat is equipped with the case, the case is used for the switch passageway in the disk seat.

Preferably, the blowing port is an inwardly constricted opening.

Preferably, the upper part of the air blowing opening is an inclined plane, and an included angle of the inclined plane relative to the length direction of the air blowing pipeline is greater than or equal to 0.5 degrees and less than or equal to 5 degrees.

Preferably, the blowing opening is a flat structure, and the length-width ratio of the cross section of the blowing opening is more than 1.

Preferably, the air suction pipeline is further provided with an air suction control valve, and the air suction control valve is arranged between the linkage device and the second end of the air suction pipeline and used for opening or closing the air suction pipeline.

Preferably, the material of the elastic membrane is rubber or plastic.

Compared with the prior art, the utility model discloses vacuum suction pen when absorbing the wafer, reduces the automatic pipeline of blowing of opening of drive aggregate unit through the atmospheric pressure in the pipeline of breathing in, clears up the thing granule that drops on the wafer, has effectively improved the processing yield, the cost is reduced.

Drawings

Fig. 1 is a schematic structural view of a vacuum suction pen according to an embodiment of the present invention.

Fig. 2 is an enlarged view at a in fig. 1, showing a second state of the linkage mechanism.

Fig. 3 is a first state diagram of a linkage mechanism of a vacuum suction pen according to an embodiment of the present invention.

Fig. 4 is an enlarged view at B in fig. 1.

Fig. 5 is a structural diagram of a pneumatic diaphragm valve as a linkage mechanism according to another embodiment of the present invention.

Fig. 6 is a structural diagram of a link mechanism according to still another embodiment of the present invention.

Detailed Description

In order to explain technical contents, structural features, and effects achieved by the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.

As shown in fig. 1 to 4, the present invention provides a vacuum suction pen, including a housing 1, and a suction pipe 2 and a blowing pipe 3 disposed in the housing 1, wherein the suction pipe 2 has a first suction end 21 protruding from one side of the housing 1 and a second suction end 22 protruding from the other side of the housing 1, the blowing pipe 3 has a first blowing end 31 protruding from one side of the housing 1 and a second blowing end 32 protruding from the other side of the housing 1, the first suction end 21 is connected to a vacuum pumping device, the second suction end 22 is connected to a suction cup 6 for adsorbing a wafer 7, the first blowing end 31 is connected to a blowing device, the second blowing end 32 is provided with a blowing port 33 corresponding to the wafer 7 adsorbed by the suction cup 6, and the blowing port 33 is disposed above the side of the wafer 7 adsorbed by the suction cup 6 for blowing gas to the wafer 7; the blowing duct 3 and the suction duct 2 are further connected to a linkage 4, respectively, and the air pressure in the suction duct 2 drives the linkage 4 so that the linkage 4 has a first state in which the linkage 4 opens the blowing duct 3 to blow air to the wafer 7 as shown in fig. 3 and a second state in which the linkage 4 closes the blowing duct 3 to stop blowing air to the wafer 7 as shown in fig. 2.

Specifically, the air blowing pipeline 3 is located above the air suction pipeline 2, the suction cup 6 is provided with an adsorption hole communicated with the air suction pipeline 2, the suction cup 6 adsorbs the back surface of the wafer 7 through the adsorption hole to transfer the wafer 7, the air supply device is used for supplying compressed air to the air blowing pipeline 3 so that the air blown out from the air blowing port 33 is the compressed air to more easily clean falling particles on the wafer 7, the air suction pipeline 2 is further provided with an air suction control valve 5, the air suction control valve 5 is arranged between the linkage device 4 and the second end 22 of the air suction pipeline 2 to be used for opening or closing the air suction pipeline 2, the air suction pipeline 2 is closed by pressing down a switch of the air suction control valve 5, and the air suction pipeline 2 is opened by loosening the switch of the air suction control valve 5, so that the operation is simple.

The embodiment of the utility model provides a theory of operation of vacuum suction pen does: after the wafer 7 is picked up by the suction cup 6 of the vacuum suction pen, because the air suction device is continuously vacuumized, the pressure in the air suction pipeline 2 is reduced, so that the linkage device 4 is driven to open the air blowing pipeline 3, compressed air is blown to the surface of the wafer 7 to blow off falling object particles on the surface of the wafer 7, when the wafer 7 needs to be put down by the suction pen, the air flow of the air suction pipeline 2 is manually blocked, for example, the vacuum suction device is closed or the air suction control valve 5 is pressed down, the suction cup 6 is separated from the back surface of the wafer 7, after the wafer 7 is released, the air suction control valve 5 is loosened to open the air suction pipeline 2, because the air suction channel 2 is communicated with the external air pressure, the pressure in the air suction pipeline 2 rises, so that the linkage device 4 is driven to close the air blowing pipeline 3 to stop blowing air to the wafer 7. Of course, in the case of turning off the vacuum-pumping device to shut off the air flow of the suction duct 2, after the wafer 7 is released, the suction duct 2 is directly communicated with the external air pressure, and the air pressure in the suction duct is raised back, thereby driving the link 4 to close the air blowing duct 3 to stop blowing the wafer 7.

The embodiment of the utility model provides a vacuum suction pen reduces drive linkage 4 through the atmospheric pressure in the pipeline of breathing in 2 and opens the pipeline of blowing 3 automatically when absorbing wafer 7, and the junk on the clearance wafer 7 has effectively improved the processing yield, the cost is reduced.

In the embodiment of the present invention, the linkage device 4 includes an elastic membrane 41, a slider 42 and a connecting rod 43, the elastic membrane 41 is disposed on the air suction pipe 2, the slider 42 is disposed on the air blowing pipe 3 corresponding to the elastic membrane 41, the slider 42 is embedded on the air blowing pipe 3 and can move relative to the air blowing pipe 3 along a direction perpendicular to the air blowing pipe 3, one side of the slider 42 facing the elastic membrane 41 is connected to one end of the connecting rod 43, the other end of the connecting rod 43 is connected to the elastic membrane 41, and the air pressure in the air suction pipe 2 drives the elastic membrane 41 to move so that the linkage device 4 has a first state and a second state.

Specifically, the elastic membrane 41 is made of rubber or plastic, the elastic membrane 41 with high elasticity can be obtained by adjusting elastic parameters of the rubber or plastic, a mounting hole is reserved on the position, corresponding to the elastic membrane 41, of the air suction pipeline, the elastic membrane is hermetically mounted in the mounting hole, for example, the air suction pipeline 2 is made of plastic, the elastic membrane 41 can be in sealing connection with the air suction pipeline 2 in an interfusion manner, when the air suction pipeline 2 is made of metal, surface pretreatment can be performed on the metal at the joint, then the sealing connection is achieved through an adhesive, the specific connection mode of the elastic membrane 41 and the air suction pipeline 2 is not limited, and the connection mode can be selected according to actual needs; the slide block 42 is connected with the air blowing pipe 3 in a sealing and sliding manner, for example, the slide block 42 is connected with the air blowing pipe 3 in a sealing and sliding manner by using a sealing and guiding mechanism, a second elastic film 44 covering the slide block 42 can be further arranged on the air blowing pipe 3, the elasticity of the second elastic film 44 is larger than that of the elastic film 41, the second elastic film 44 is connected with the air blowing pipe 3 and seals the air blowing pipe 3, and the second elastic film 44 ensures the sealing performance of the air blowing pipe 3 and does not influence the movement of the slide block 42, as shown in fig. 6. When the linkage 4 including the elastic film 41, the slider 42, and the link 43 is used, the operating principle is as follows: after the wafer 7 is adsorbed by the chuck 6, the back surface of the wafer 7 is adsorbed on the chuck 6, the pressure in the air suction pipe 2 is reduced, the elastic membrane 41 is deformed by the pressure stress from top to bottom, the connecting rod 43 drives the sliding block 42 to move downwards, so that the air blowing pipe 3 and the air blowing port 33 are communicated, compressed air is blown to the surface of the wafer 7, and falling object particles on the surface of the wafer 7 are cleaned, as shown in fig. 3; when the wafer 7 needs to be put down by the suction pen, the air flow of the air suction pipe 2 is manually blocked, that is, the switch of the air suction control valve 5 can be pressed down, when the suction cup 6 is separated from the back surface of the wafer 7, the switch of the air suction control valve 5 is released, the pressure in the air suction pipe 2 rises, the elastic membrane 41 gradually returns to the non-deformation state, the slide block 42 is driven by the connecting rod 43 to generate upward displacement, and the air blowing pipe 3 is closed to stop blowing air to the wafer 7, as shown in fig. 2.

In other embodiments of the present invention, as shown in fig. 5, the linkage device 4 is a pneumatic diaphragm valve 400, such as a high precision micro flow pneumatic diaphragm regulating valve of MILLER, usa, the pneumatic diaphragm valve 400 has a diaphragm chamber 10 and a valve seat 20, the diaphragm chamber 10 has a diaphragm 30 therein, the diaphragm 30 divides the diaphragm chamber 10 into an upper chamber 101 and a lower chamber 102, the upper chamber 101 has an air inlet 103, the air inlet 103 is communicated with the air suction pipe 2, a first end 202 and a second end 203 of the valve seat 20 are both connected to the air blowing pipe 3, the diaphragm 30 is connected to the valve stem 50, one end of the valve stem 50 located in the valve seat 20 is provided with a valve core 40, and the valve core 40 is used for opening and closing a passage in the valve seat 20.

Specifically, a channel blocking opening 201 is formed in the valve seat 20, when the valve core 40 is located in the channel blocking opening 201, the air blowing pipe 3 is closed, that is, the air flow in the air blowing pipe 3 is not conducted, when the valve core 40 leaves the channel blocking opening 201, the air blowing pipe 3 is opened, that is, the air flow in the air blowing pipe 2 is conducted, and the air blowing opening 33 is blown out by compressed air. The working principle when the linkage 4 is a pneumatic diaphragm valve 400 is: after the wafer 7 is adsorbed by the sucker 6, the back surface of the wafer 7 is adsorbed on the sucker 6, the pressure in the air suction pipeline 2 is reduced, the membrane 30 is deformed by the adsorbed pressure stress and moves towards the air inlet 103, the valve core 40 is driven by the valve rod 50 to move, so that the channel blocking port 201 is opened, the air blowing pipeline 3 is communicated with the air blowing port 33, compressed air is blown to the surface of the wafer 7, the falling object particles on the surface of the wafer 7 are cleaned, when the wafer 7 needs to be put down by a suction pen, the air flow of the air suction pipeline 2 is blocked manually, the switch of the air suction control valve 5 can be pressed, the switch of the air suction control valve 5 is released after the sucker 6 is separated from the back surface of the wafer 7, the pressure in the air suction pipeline 2 rises, the membrane 30 gradually returns to a non-deformation state, the valve core 40 is driven by the valve rod 50 to move, the channel blocking port 201 is closed, and the air blowing pipeline 3 is closed, so that air blowing to the wafer 7 is stopped.

It should be noted that the utility model discloses linkage's concrete structure is not limited, as long as can open the pipeline of blowing automatically when the pipeline of breathing in internal gas pressure reduces, and can self-closing the pipeline of blowing when the pipeline of breathing in internal gas pressure increases can.

In the embodiment of the present invention, as shown in fig. 4, the blowing port 33 is an opening which is inwardly contracted. Specifically, the blowing port 33 is formed with a gradually decreasing opening with respect to the size of the blowing pipe 3, so that the blown compressed gas is gathered and directed to the surface of the wafer 7, thereby enhancing the cleaning capability.

In the embodiment of the invention, as shown in fig. 4, the upper part of the air blowing port 33 is an inclined surface, and the included angle a of the inclined surface relative to the length direction of the air blowing pipeline 3 is more than or equal to 0.5 degrees and less than or equal to 5 degrees, so that the blown compressed air can be smoothly blown onto the wafer 7, and the air blowing is more uniform.

In the embodiment of the invention, as shown in fig. 4, the blowing port 33 is a flat structure, the aspect ratio of the cross section of the blowing port 33 is greater than 1, and the design further homogenizes the distribution of the compressed gas at the gas outlet, so that the blown compressed gas can be smoothly blown onto the wafer 7, and the blowing is more uniform.

The above disclosure is only a preferred embodiment of the present invention, and certainly, the scope of the present invention should not be limited thereto, and the same changes and modifications as the claims of the present invention are also included.

Claims

1. A vacuum suction pen is characterized in that: the wafer adsorption device comprises a shell, and an air suction pipeline and an air blowing pipeline which are arranged in the shell, wherein the air suction pipeline is provided with a first air suction end protruding out of one side of the shell and a second air suction end protruding out of the other side of the shell, the air blowing pipeline is provided with a first air blowing end protruding out of one side of the shell and a second air blowing end protruding out of the other side of the shell, the first air suction end is communicated with a vacuumizing device, the second air suction end is connected with a sucker for adsorbing a wafer, the first air blowing end is communicated with an air feeding device, the second air blowing end is provided with an air blowing port corresponding to the wafer adsorbed by the sucker, and the air blowing port is positioned above the side of the wafer adsorbed by the sucker;

the blowing pipeline and the suction pipeline are further respectively connected with a linkage device, air pressure in the suction pipeline drives the linkage device to enable the linkage device to have a first state and a second state, in the first state, the blowing pipeline is opened by the linkage device to blow air to the wafer, and in the second state, the blowing pipeline is closed by the linkage device to stop blowing air to the wafer.

2. The vacuum wand of claim 1, wherein: the linkage device comprises an elastic membrane, a sliding block and a connecting rod, wherein the elastic membrane is arranged on the air suction pipeline, the sliding block corresponds to the elastic membrane arranged on the air blowing pipeline, the sliding block is embedded in the air blowing pipeline and can move along the direction perpendicular to the air blowing pipeline, the sliding block is connected with one end of the connecting rod towards one side of the elastic membrane, the other end of the connecting rod is connected onto the elastic membrane, and the elastic membrane moves to enable the linkage device to have a first state and a second state through air pressure driving in the air suction pipeline.

3. The vacuum wand of claim 1, wherein: the linkage device is a pneumatic film valve, the pneumatic film valve is provided with a film chamber and a valve seat, a diaphragm is arranged in the film chamber, the diaphragm is divided into an upper chamber and a lower chamber by the film chamber, an air inlet is formed in the upper chamber, the air inlet is communicated with the air suction pipeline, the valve seat is connected to the air blowing pipeline, the diaphragm is connected with a valve rod, one end, located in the valve seat, of the valve rod is provided with a valve core, and the valve core is used for opening and closing a channel in the valve seat.

4. The vacuum wand of claim 1, wherein: the air blowing opening is an opening which is contracted inwards.

5. The vacuum wand of claim 4, wherein: the upper part of the air blowing opening is an inclined plane, and the included angle of the inclined plane relative to the length direction of the air blowing pipeline is more than or equal to 0.5 degrees and less than or equal to 5 degrees.

6. The vacuum wand of claim 4, wherein: the air blowing opening is of a flat structure, and the length-width ratio of the cross section of the air blowing opening is larger than 1.

7. The vacuum wand of claim 1, wherein: and the air suction pipeline is also provided with an air suction control valve, and the air suction control valve is arranged between the linkage device and the second end of the air suction pipeline and is used for opening or closing the air suction pipeline.

8. The vacuum wand of claim 2, wherein: the elastic membrane is made of rubber or plastic.