CN218566520U - Correcting tool - Google Patents

Abstract

The application provides a correction tool, relates to mechanical technical field. The correcting tool comprises a horizontal connecting rod and at least two correcting pieces, wherein the horizontal connecting rod is provided with at least one level meter, the at least two correcting pieces are arranged in parallel along the vertical direction and have preset intervals between each other, the horizontal connecting rod is respectively connected with the end part of each of the at least two correcting pieces, two ends of the horizontal connecting rod are respectively connected with the end parts of the two outermost correcting pieces of the at least two correcting pieces, so that the accurate correcting function is realized, the operation time is shortened, the working condition of a platform is adjusted in time when abnormal, and the production efficiency is greatly improved.

Description

Correcting tool

Technical Field

The application relates to the technical field of machinery, concretely relates to correction tool.

Background

In the process of processing products by matching a Transfer Robot (Transfer Robot) with a receiving table (Roller), typically, in the polishing and cleaning process of silicon wafer products, due to improper operation of a manipulator of the Transfer Robot or abnormal conditions of the receiving table (such as position deviation of the receiving table), the workpiece to be processed is dislocated, even the phenomenon of chip falling or breaking occurs, which not only affects the orderly operation of the tool, but also further dislocates the position of the receiving table seriously (such as abnormal breaking). In the conventional technology, a test workpiece (e.g., dummy wafer) is transported, a manual test is performed, a robot is used to manually clamp the test workpiece, and a manual test is performed according to whether the test workpiece (e.g., dummy wafer) is shaken or not, so as to determine whether the test stage is horizontal. When the position of the receiving platform is not horizontal, the risk of fragments of the test piece caused by clamping of the manipulator can exist, the fragments are remained to cause the scratch or other bad problems of a normal workpiece (such as a wafer) on one hand, and on the other hand, the fragments are not easy to clear, so that the time is wasted, the process efficiency is influenced, and the defects of insufficient testing precision and the like are also caused.

SUMMERY OF THE UTILITY MODEL

In view of this, this specification embodiment provides a correction instrument, has both realized accurate correction function, can reduce operating time again, receives a timely adjustment when the station operating mode takes place unusually, and to a great extent has improved production efficiency.

The correcting tool comprises a horizontal connecting rod and at least two correcting pieces, wherein the horizontal connecting rod is provided with at least one level meter, the at least two correcting pieces are arranged in parallel along the vertical direction and have preset intervals, the horizontal connecting rod is respectively connected with the end part of each of the at least two correcting pieces, and the two tail ends of the horizontal connecting rod are respectively connected with the end parts of the two outermost correcting pieces of the at least two correcting pieces.

In some embodiments, the three correction pieces are arranged at equal preset intervals, and the three gradienters are respectively arranged on the horizontal connecting rod.

In some embodiments, the two end levels are arranged in parallel and the middle level is arranged in a direction perpendicular to the two end levels.

In some embodiments, the length of the horizontal connecting rod is the same as the length of the receiving table working groove.

In some embodiments, the horizontal connecting rod has a length of 230mm to 240mm.

In some embodiments, the correction plate is a wafer structure, and the diameter of the wafer is the same as that of the workpiece in the receiving table working groove.

In some embodiments, the correction sheet is a wafer structure, and the thickness of the wafer is the same as that of the workpiece in the receiving table working groove.

In some embodiments, the disc has a thickness of 7mm to 10mm.

In some embodiments, the horizontal connecting rod is made of polyetheretherketone, and the correction sheet is a circular sheet made of polyetheretherketone.

In some embodiments, the size of the correction sheet is the same as the size of the workpiece in the receiving table working groove.

Compared with the prior art, the beneficial effects that can be achieved by the at least one technical scheme adopted by the embodiment of the specification at least comprise: the horizontal connecting rod is connected with the at least two correcting pieces, and the at least one level meter is arranged at the proper position of the horizontal connecting rod, so that not only can the accurate correcting function be realized, but also the operation time can be shortened, and the working condition of a receiving platform is timely adjusted when abnormal occurs, so that the fragment rate caused by the position deviation of the receiving platform can be reduced, the product reject ratio caused by the fragment risk is reduced, the problems that the fragments are difficult to clear and the like are avoided, and the production efficiency is greatly improved; meanwhile, the correcting tool has the obvious advantages of high correcting precision, simple structure, good structural stability, strong structural adjustability, low cost, easiness in manufacturing and the like.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a calibration tool provided in some embodiments of the present application;

FIG. 2 is a schematic diagram of a calibration tool according to some preferred embodiments of the present application;

FIG. 3 is an illustration of a calibration tool and a tool to be calibrated provided in accordance with further preferred embodiments of the present application;

FIG. 4 is an exemplary illustration of the operational status of a calibration tool provided in accordance with certain preferred embodiments of the present application;

fig. 5 is an illustration of a calibration tool calibration result being subject to stage adjustment, according to some embodiments of the present application.

Detailed Description

Embodiments of the present application are described in detail below with reference to the accompanying drawings.

The following embodiments of the present application are described by specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. The application is capable of other and different embodiments and its several details are capable of modifications and various changes in detail without departing from the spirit of the application. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number and aspects set forth herein. Additionally, such an apparatus may be implemented and/or such a method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.

It should be further noted that the drawings provided in the following embodiments are only schematic illustrations of the basic concepts of the present application, and the drawings only show the components related to the present application rather than the numbers, shapes and dimensions of the components in actual implementation, and the types, the numbers and the proportions of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.

In addition, in the following description, specific details are provided to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details.

In view of the technical situation that the traditional test method has no correction function, low operation efficiency and directly influences the process efficiency, the inventor provides a scheme of a correction tool through deep research and improved exploration, the scheme can realize the accurate correction function, can shorten the operation time, can adjust the working condition of a receiving platform in time when the working condition is abnormal, and greatly improves the production efficiency.

The following describes a calibration tool scheme provided in the embodiments of the present application in detail with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a calibration tool according to some embodiments of the present application. As shown in fig. 1, the calibration tool mainly includes a horizontal connecting rod 1 and two calibration sheets 2, the horizontal connecting rod 1 is provided with at least one level 3, the at least two calibration sheets 2 are arranged in parallel along a vertical direction and have a predetermined distance therebetween, the horizontal connecting rod 1 is connected to an end (an upper end as shown in the figure) of each of the two calibration sheets 2, that is, two ends of the horizontal connecting rod 1 are connected to ends of the two calibration sheets 2.

FIG. 2 illustrates a schematic diagram of a calibration tool provided in some preferred embodiments of the present application. In some embodiments, as shown in fig. 2, the number of the correction pieces 2 is set to 3, and the level 3 is disposed at the middle position of the horizontal link 1, which can further improve the overall balance and stability of the correction tool and ensure the correction effect. In some embodiments, the level 3 may also be embedded in the horizontal linkage 1 to save space.

Fig. 3 is a schematic diagram illustrating a calibration tool and a tool to be calibrated according to another preferred embodiment of the present application. As shown in fig. 3, the three correction pieces 2 are arranged at equal preset intervals, and the three levels 3 are respectively arranged on the horizontal connecting rod 1, so that the correction accuracy can be further improved and the correction error can be reduced by arranging a plurality of levels. In some embodiments, the three levels 3 may be arranged to correspond to the positions of the three correction sheets 2, which further improves the correction sensitivity and the tool stability. In other embodiments, the preset distances between three or more correction sheets 2 may be different or partially different according to specific requirements. As for the specific setting of the preset distance, different settings may be performed as required, and this is not particularly limited in the embodiment of the present application.

In some embodiments, as shown in fig. 3, the length L1 of the horizontal link 1 is the same as the length L2 of the platform work channel 4. In some embodiments, the size of the correction sheet 2 is the same as the size of the workpiece in the subject work groove. Therefore, the correction range of the correction tool can completely cover the work groove of the receiving platform, and all workpieces in the work groove of the receiving platform can be well corrected. In some embodiments, the correction sheet 2 is a disk structure. In some embodiments, the disk diameter d1 of the correction sheet 2 is the same as the diameter d2 of the workpiece 5 in the receiving table work tank 4. In some embodiments, the wafer thickness of the correction sheet 2 is the same as the thickness of the workpiece 5 in the receptor table work groove 4.

In some embodiments, the calibration wafer 2 of the calibration tool may be made to have the same size as the silicon wafer (or silicon wafer), that is, the calibration tool may be specifically used in a process of polishing and cleaning a silicon wafer workpiece by using a receiving platform slot, as shown in fig. 4 and 5, and specifically, the receiving platform working slot 4 may be a Roller slot. In some embodiments, the length of the horizontal connecting rod can be set to 230 mm-240 mm, so as to adapt to a common receptor Roller clamping groove. In some embodiments, the wafer thickness of the correction sheet 2 may be set according to the general thickness specification of a silicon wafer, for example, may be set to 7mm to 10mm, or specifically, to 7.5mm, so as to be able to cover the silicon wafer size more comprehensively. The setting mode that above-mentioned correction piece and work piece size are the same can guarantee receiving the even arrangement of platform work inslot work piece when realizing rectifying, improves system stability to also do benefit to receiving smooth going on of bench corresponding product processing (such as the polishing of silicon chip and washing etc.).

In some embodiments, as shown in fig. 4, the two end levels 3 are arranged in parallel, and the middle level 3 is arranged in a direction perpendicular to the two end levels 3, so that various correction states of whether the subject tool is deviated or not can be detected more accurately, and adjustment can be performed in time on the basis of the correction states. In some embodiments, the level 3 may be a bubble level.

In some embodiments, the horizontal connecting rod 1 may be a polyether ether ketone (PEEK) horizontal connecting rod, and the calibration sheet 2 may be a circular sheet made of PEEK, since PEEK is an aromatic crystal type thermoplastic polymer material, which has the advantages of high mechanical strength, high temperature resistance, impact resistance, flame retardance, acid and alkali resistance, hydrolysis resistance, wear resistance, fatigue resistance, radiation resistance, and the like, and can ensure structural stability of the tool. It should be noted that, the materials of the horizontal link 1 and the calibration sheet 2 may be different materials according to the specific requirements of the tool to be processed, as long as they meet the corresponding tool performance, and for example, the tool to be processed for polishing and cleaning silicon wafers needs to meet the performance requirements of certain hardness, high cleanliness, no contamination to the silicon wafers, and the like. In some embodiments, according to the number of arranged receiving platforms 4 (e.g. 3 receiving platforms 4 arranged in parallel as shown in fig. 4), the calibration tool may also be configured to form a calibration tool system by a corresponding number of sets, or a calibration tool formed by a corresponding number of sets of components, and the embodiments of the present invention are not limited in particular.

As shown in fig. 3 to 5, in an exemplary silicon wafer polishing and cleaning process, when a transfer robot places a corresponding wafer in the receiving table working groove 4 by the gripper, due to improper operation of the gripper itself or abnormal failure (such as receiving table position deviation, working groove deviation, etc.) of the receiving table and the working groove thereof, abnormal working conditions such as wafer position deviation, wafer dropping, or chipping may occur in the receiving table working groove 4, and at this time, the correcting tool may be correspondingly installed in the receiving table working groove 4, for example, the correcting wafer 2 may be inserted or embedded into a corresponding position in the receiving table working groove 4, and then calibration may be performed. As shown in fig. 4 and 5, for example, the height of the receiving platform working groove 4 can be determined according to the display value of the leveling instrument 3, so that the position of the receiving platform working groove 4 can be determined to be shifted, and then the brackets 6 on the two sides of the receiving platform working groove 4 can be adjusted, for example, the mounting positions of the brackets 6 on the two sides can be finely adjusted from left to right by loosening the screw parts on the brackets 6, so that the horizontal bubble scale ranges in all the leveling instruments 3 of the leveling instrument can be restored to the standard positions, thereby meeting the tooling requirements. It can be seen that the correction tool scheme that this application embodiment provided can realize accurate correction, can improve process work efficiency again.

It should be noted that in the embodiments of the present application, the level of the calibration tool may be any feasible level, such as a universal level, a cylinder level, an all-in-one level, a mini level, a camera level, a frame level, a ruler level, and an adjustable level or an non-adjustable level. Accordingly, the level of the calibration tool can measure any feasible parameter such as inclination, flatness, straightness, horizontal position, vertical position, etc. In addition, in the embodiment of the present application, the intermediate measurement data and/or the correction result data obtained by the correction tool level may be displayed in any possible display manner (such as an electronic display screen, etc.), or may be transmitted to a control end or any electronic device, etc., so as to facilitate obtaining and reading of the correction result. In fact, in some embodiments, it is also possible to mount the correction tool detachably in a predetermined suitable position, or to provide a corresponding automated control system, so that the correction tool can carry out an automated correction operation. In addition, it should be noted that, in the embodiment of the present application, the horizontal link of the correction tool maintains the horizontal position in the working state.

To sum up, the correction tool provided by the embodiment of the application has at least the following beneficial effects:

the horizontal connecting rod is connected with the at least two correcting pieces, and the at least one level meter is arranged at the proper position of the horizontal connecting rod, so that not only can the accurate correcting function be realized, but also the operation time can be shortened, and the working condition of a receiving platform is timely adjusted when abnormal occurs, so that the fragment rate caused by the position deviation of the receiving platform can be reduced, the product reject ratio caused by the fragment risk is reduced, the problems that the fragments are difficult to clear and the like are avoided, and the production efficiency is greatly improved; meanwhile, the correcting tool has the obvious advantages of high correcting precision, simple structure, good structural stability, strong structural adjustability, low cost, easiness in manufacturing and the like, and can be widely applied to various scenes relating to the correction of the workpiece receiving tool.

In the present specification, the same and similar parts among the various embodiments may be referred to each other, and each embodiment focuses on differences from the other embodiments. In particular, for the product embodiments described later, since they correspond to the method, the description is simple, and the relevant points can be referred to the partial description of the system embodiments.

Also, the description uses specific words to describe embodiments of the specification. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the specification is included. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the specification may be combined as appropriate.

Additionally, the order in which the elements and sequences of the process are recited in the specification, the use of alphanumeric characters, or other designations, is not intended to limit the order in which the processes and methods of the specification occur, unless otherwise specified in the claims. While certain presently contemplated useful embodiments have been discussed in the foregoing disclosure by way of examples, it is to be understood that such detail is solely for that purpose and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements that are within the spirit and scope of the embodiments herein described. For example, although the system components described above may be implemented by hardware devices, they may also be implemented by software-only solutions, such as installing the described system on an existing processing device or mobile device.

Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be considered as illustrative only and not limiting, of the present invention. Various modifications, improvements and adaptations to the present description may occur to those skilled in the art, although not explicitly described herein. Such modifications, improvements and adaptations are proposed in the present specification and thus fall within the spirit and scope of the exemplary embodiments of the present specification.

Claims (10)

1. The utility model provides a correction instrument, its characterized in that includes horizontal connecting rod and two at least correction pieces, horizontal connecting rod is equipped with at least one spirit level, two at least correction pieces are arranged and have the interval of predetermineeing between each other along vertical direction parallel, horizontal connecting rod respectively with the end connection of every in two at least correction pieces, two ends of horizontal connecting rod respectively with the end connection of two outside correction pieces of two at least correction pieces.

2. The alignment tool as claimed in claim 1, wherein three alignment plates are arranged at equal predetermined intervals, and three levels are respectively disposed on the horizontal link.

3. The correction tool of claim 2, wherein the two end levels are arranged in parallel and the middle level is arranged in a direction perpendicular to the two end levels.

4. The corrective tool of claim 1, wherein the length of the horizontal link is the same as the length of the receiving station work slot.

5. The correction tool of claim 4, wherein the horizontal link has a length of 230mm to 240mm.

6. The calibration tool of claim 1, wherein the calibration sheet is a wafer structure, and the diameter of the wafer is the same as the diameter of the workpiece in the receiving table working groove.

7. The calibration tool of claim 1 wherein the calibration sheet is in the form of a wafer having a thickness that is the same as the thickness of the workpiece in the receiving station's working channel.

8. The calibration tool of claim 7 wherein the disc has a thickness of 7mm to 10mm.

9. The calibration tool of claim 1, wherein the horizontal link is a PEEK horizontal link and the calibration sheet is a wafer of PEEK.

10. The correction tool of any one of claims 1 to 9, wherein the correction sheet has the same size as the workpiece in the receiving table slot.

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