CN218550463U

CN218550463U - Heat radiation structure of water pump driver

Info

Publication number: CN218550463U
Application number: CN202221199424.1U
Authority: CN
Inventors: 林利兵; 唐海林
Original assignee: Jinba Technology Co ltd
Current assignee: Jinba Technology Co ltd
Priority date: 2022-05-18
Filing date: 2022-05-18
Publication date: 2023-02-28
Anticipated expiration: 2032-05-18

Abstract

The utility model provides a water pump drive's heat radiation structure belongs to water pump controller technical field. It has solved the current poor problem of water pump drive radiating effect. This heat radiation structure of water pump driver includes module assembly, a plurality of power semiconductor and is used for the casing of installation module assembly, and the casing comprises the heat conduction material, and a plurality of power semiconductor set up along module assembly circumference interval, and is equipped with the heating panel on every power semiconductor, and heating panel one side face supports tightly with shells inner wall, and opposite side face supports tightly with the power semiconductor outer wall. This water pump drive's heat radiation structure can effectively guarantee water pump drive's radiating effect.

Description

Heat radiation structure of water pump driver

Technical Field

The utility model belongs to the technical field of water pump controller, a water pump drive's heat radiation structure is related to.

Background

The driver is a driving module arranged on the motor and generally comprises a shell, a circuit board, a capacitor, a power semiconductor (such as an IGBT, a SiC, a power diode, a rectifier bridge and the like), and the like, wherein all the components are arranged in the shell in a detachable connection or fixed connection mode, and are connected with a main loop (a driving circuit or a control circuit) of the circuit board through a lead; the water pump driver is at the working process, and each part all can produce certain heat when the operation, especially powerful controller, and its inside power semiconductor quantity of installing has a plurality ofly, and the produced temperature of its during operation can reach more than 150 degrees centigrade, but these some heats can't effectively discharge at the driver during operation, and long-time detention can cause irreversible injury to parts such as circuit board in the casing, very big influence the life of driver.

Disclosure of Invention

The utility model aims at having the above-mentioned problem to current technique, provided a pump drive's heat radiation structure, the utility model aims to solve the technical problem that: how to ensure the heat dissipation effect of the driver.

The purpose of the utility model can be realized by the following technical proposal: the utility model provides a heat radiation structure of water pump driver, includes module assembly, a plurality of power semiconductor and is used for the installation module assembly's casing, its characterized in that, the casing comprises the heat conduction material, and is a plurality of power semiconductor follows module assembly circumference interval sets up, and every power semiconductor is last to be equipped with the heating panel, heating panel one side face with shells inner wall supports tightly, the opposite side face with power semiconductor outer wall supports tightly.

The heat dissipation structure of the water pump driver comprises a module assembly and a shell, wherein the module assembly is composed of a circuit board, a group container, a capacitor, a power semiconductor, a heat dissipation plate and other parts, all the parts are installed together in a detachable connection mode, so that the module assembly is modularized, complete system function test can be performed in advance after assembly is completed, the water pump driver is installed into the shell after no defect is ensured, the parts are not required to be detached for function test for multiple times in the shell, the quality inspection work efficiency is ensured to be higher, the production efficiency is further improved, and meanwhile, when the subsequent module assembly breaks down, the subsequent module assembly can be integrally detached and the fault point can be accurately removed, so that the module assembly is convenient to overhaul; be equipped with a plurality of power semiconductor who sets up along its circumference interval on the module assembly, and be equipped with on every power semiconductor and support the heating panel between power semiconductor and shells inner wall tightly, the driver is at during operation each power semiconductor can correspond the heat conduction to each heating panel on, each heat dissipation piece is with on the inner wall of heat conduction to casing simultaneously, because the casing comprises the heat conduction material, thereby make the casing can carry out the heat exchange with heat and external water, and cause the damage for avoiding external water to the module assembly in the casing, generally can be at the both ends of casing to the casing embedment epoxy, thereby avoid causing the damage to the module assembly in the water infiltration casing when guaranteeing the radiating effect.

In foretell water pump driver's heat radiation structure, be equipped with a plurality of along circumference on the shells inner wall with the corresponding cooling surface in heating panel position, the heating panel is the strip slabby, the cooling surface is planar.

Be provided with a plurality of plane radiating surfaces that are on the shells inner wall, and the heating panel is the bar platelike, and its circumference outer wall also is plane, and when leaning on heating panel one side outer wall and radiating surface, can effectively guarantee that contact between them is more abundant to guarantee heat conduction efficiency, and then guarantee the radiating effect of driver.

In the heat dissipation structure of the water pump driver, the housing is made of aluminum, and a shell is fixed outside the housing in a clamping manner.

The casing specifically comprises the aluminium gold, guarantees the heat conductivity of casing, guarantees that the heat transfer is more abundant, and the casing is the fixed shell of joint, and this shell preferred adopts stainless steel material to constitute, effectively avoids the casing hardness that the aluminium gold constitutes to be low, arranges in easily because water pressure reason is by extrusion deformation's defect under water.

In the above heat dissipation structure of the water pump driver, the power semiconductor is screwed into the heat dissipation plate through the fastener penetrating through the housing, and is abutted against the outer wall of the module assembly.

The heat dissipation plate penetrates through the shell through a fastener (specifically a bolt or a screw) and is screwed into the heat dissipation plate, so that the heat dissipation plate can be fixed, and meanwhile, the power semiconductor can be tightly abutted and fixed due to the locking force of the fastener when the heat dissipation plate is fixed; when guaranteeing that the power semiconductor installation is stable for the produced heat of power semiconductor work can be through on the heating panel transmits the casing, and carries out the heat exchange with the external world through the casing with the heat, guarantees the radiating effect in the casing from this.

In the heat radiation structure of the water pump driver, a plurality of yielding grooves are formed in the circumferential outer wall of the shell corresponding to the heat radiation surfaces along the circumferential direction, and the fasteners are embedded into the yielding grooves.

The outer wall of the axial direction and the circumferential direction of the shell is provided with a yielding groove, and the fastener is embedded in the yielding groove, so that the interference between the fastener and the shell is avoided when the shell is clamped and fixed with the shell.

Compared with the prior art, this water pump drive's heat radiation structure possesses following advantage:

1. set up the cooling surface on the shells inner wall, the module assembly supports through the cooling surface on one side face with each heating panel and the casing after installing in the casing and leans on, and the opposite side face corresponds and supports with each power semiconductor outer wall on the module assembly and lean on, and support power semiconductor tightly fixed through fastener cooperation heating panel, when making each part installation stability, the heat that power semiconductor work produced carries out the heat exchange with the external world on transmitting to the casing through the heating panel, guarantees the radiating effect of driver.

2. The long strip plate shape of the heat dissipation plate ensures that the heat dissipation plate and the heat dissipation plate are larger in fitting degree and contact area, and further ensures that the heat transfer effect is better.

Drawings

Fig. 1 is a first structural schematic diagram of a heat dissipation structure of the water pump driver.

Fig. 2 is a schematic structural view of the housing.

Fig. 3 is a schematic structural view of the module assembly.

In the figure, 1, module assembly; 2. a power semiconductor; 3. a housing; 31. a heat dissipating surface; 32. a housing; 33. a yielding groove; 4. a heat dissipation plate; 5. a fastener.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1 and 3, the heat dissipation structure of the water pump driver includes a housing 3 and a module assembly 1 detachably mounted in the housing 3, where the module assembly 1 is formed by detachably connecting components such as a circuit board, a capacitor, and a container, and in addition, the heat dissipation structure of the water pump driver further includes a power semiconductor 2 (the power semiconductor 2 is in the prior art, and specifically may be an IGBT, a SiC, a power diode, a rectifier bridge, and the like) and a heat dissipation plate 4, and in combination with fig. 2, four heat dissipation surfaces 31 are circumferentially spaced on an inner wall of the housing 3, each heat dissipation surface 31 is in a planar shape, the heat dissipation plate 4 is made of aluminum metal and is in a strip plate shape, one side plate surface of each heat dissipation plate 4 abuts against one heat dissipation surface 31 in the housing 3, and the other side abuts against an outer wall of one power semiconductor 2, and a fastening member 5 is further screwed on the housing 3, the fastening member 5 may be a bolt (or a screw), and the fastening member 5 penetrates through the housing 3 and is screwed into the heat dissipation plate 4, so that the power semiconductor 2 is abutted against the outer wall of the module assembly 1; in addition, as a preferred scheme, an insulating sheet can be further arranged between the power semiconductor 2 and the outer wall of the heat dissipation plate 4, so that the heat dissipation plate 4 and the power semiconductor 2 are subjected to insulating treatment, and the damage to quality inspection personnel and maintenance personnel caused by the current leaking to the heat dissipation plate 4 is avoided.

As shown in fig. 1, the housing 3 is made of aluminum, an outer shell 32 made of stainless steel is fixed to the exterior of the housing 3 in an interference fit manner, a plurality of yielding grooves 33 are formed in the outer wall of the housing 3, the positions of the yielding grooves 33 correspond to the positions of the heat dissipation surfaces 31 one by one, and the fasteners 5 are embedded in the yielding grooves 33 one by one, so that interference between the housing 3 and the outer shell 32 is avoided.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Although the terms module assembly 1, power semiconductor 2, housing 3, heat dissipation surface 31, housing 32, relief groove 33, heat dissipation plate 4, fastener 5, etc. are used more herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.

Claims

1. The utility model provides a heat radiation structure of water pump driver, includes module assembly (1), a plurality of power semiconductor (2) and is used for the installation casing (3) of module assembly (1), its characterized in that, casing (3) comprise the heat conduction material, and is a plurality of power semiconductor (2) are followed module assembly (1) circumference interval sets up, and every be equipped with heating panel (4) on power semiconductor (2), heating panel (4) one side face with casing (3) inner wall supports tightly, the opposite side face with power semiconductor (2) outer wall supports tightly.

2. The heat dissipation structure of the water pump driver according to claim 1, wherein a plurality of heat dissipation surfaces (31) corresponding to the positions of the heat dissipation plates (4) are circumferentially arranged on the inner wall of the housing (3), the heat dissipation plates (4) are in the shape of a strip plate, and the surfaces of the heat dissipation surfaces (31) are in the shape of a plane.

3. The heat dissipation structure of a water pump driver according to claim 2, wherein the housing (3) is made of aluminum metal, and a housing (32) is snap-fitted and fixed to the outside of the housing (3).

4. The heat dissipation structure of the water pump driver according to any one of claims 1 to 3, wherein the power semiconductor (2) is pressed against the outer wall of the module assembly (1) by a fastener (5) penetrating through the housing (3) and screwing into the heat dissipation plate (4).

5. The heat dissipation structure of the water pump driver according to claim 3, wherein a plurality of relief grooves (33) are formed in the circumferential outer wall of the housing (3) in the circumferential direction and correspond to the heat dissipation surfaces (31), and the fasteners (5) are embedded in the relief grooves (33).