CN218547284U

CN218547284U - Monitoring device for testing system working state

Info

Publication number: CN218547284U
Application number: CN202221200192.7U
Authority: CN
Inventors: 李少华; 蔡晓东; 周威; 李晓光
Original assignee: Suzhou Hengmei Electron Technology Co ltd
Current assignee: Suzhou Hengmei Electron Technology Co ltd
Priority date: 2022-05-19
Filing date: 2022-05-19
Publication date: 2023-02-28
Anticipated expiration: 2032-05-19

Abstract

The application discloses a monitoring device for testing system operating condition, including power input circuit, 24V lithium battery system, high-low voltage power supply converting circuit, current detection circuit, temperature and humidity sensor, acceleration sensor, clock circuit, data storage circuit, 485 communication circuit, 232 communication circuit, 422 communication circuit, display system, outside temperature acquisition circuit, I2C communication circuit, backplate interface down, main MCU module, vice MCU module, reserve interface, through the structure of its device, realized can gathering various data acquisition integrated circuit boards, load box, disconnected case, PXI machine case, adaptation case, the humiture information of equipment internal power supply, can gather information such as external impact in the equipment transportation, can gather information such as the current voltage of power, can gather the relevant part ID information of equipment, and can carry out local display and upload the information of gathering to the backstage host computer and show and handle, thereby realize the on-site unmanned operation of equipment.

Description

Monitoring device for testing system working state

Technical Field

The application relates to the technical field of working performance monitoring devices, in particular to a monitoring device for testing the working state of a system.

Background

At present, test systems on the market do not have special state monitoring devices, some data acquisition cards can monitor temperature, but only serve as internal protection of board cards, the functions are single, centralized monitoring and background uploading processing cannot be achieved, and therefore background personnel cannot acquire the working state of the test systems quickly and accurately, and therefore test experimenters need to monitor the running conditions of equipment on site.

Disclosure of Invention

The application aims to provide a monitoring device for testing the working state of a system, so as to solve the problem that the prior art provided in the background technology cannot intensively monitor and upload the running condition of equipment to be monitored on site by testing experimenters caused by the condition of background processing.

In order to achieve the above purpose, the present application provides the following technical solutions: a monitoring device for testing the working state of a system comprises a power input circuit, a 24V lithium battery system, a high-low voltage power supply conversion circuit, a current detection circuit, a temperature and humidity sensor, an acceleration sensor, a clock circuit, a data storage circuit, a 485 communication circuit, a 232 communication circuit, a 422 communication circuit, a display system, an external temperature acquisition circuit, an I2C communication circuit, an upper back plate interface, a lower back plate interface, a main MCU module, an auxiliary MCU module and a standby interface, wherein the main MCU module is connected with the auxiliary MCU module through a serial port, the high-low voltage power supply conversion circuit comprises a 24V-5V high-voltage conversion circuit, a first 5V-3V3 low-voltage conversion circuit and a second 5V-3V3 low-voltage conversion circuit, the output end of the power supply input circuit is connected with the 24V lithium battery system and the 24V-5V high-voltage conversion circuit respectively, the output end of the 24V lithium battery system is connected with the 24V-5V high-voltage conversion circuit through a first switch, the output end of the 24V-5V high-voltage conversion circuit is connected with the first 5V-3V3 low-voltage conversion circuit through a second switch, the first 5V-3V3 low-voltage conversion circuit is connected with the low-voltage input end of the main MCU module, the second 5V-3V3 low-voltage conversion circuit is connected with the low-voltage input end of the auxiliary MCU module, and the second switch is in control connection with the main MCU module; the current detection circuit, temperature and humidity sensor, acceleration sensor, clock circuit, data storage circuit, 485 communication circuit, display system respectively with main MCU module links to each other, 232 communication circuit, 422 communication circuit respectively through dial switch with main MCU module links to each other, I2C communication circuit passes through go up the backplate interface with main MCU module links to each other, go up the backplate interface with vice MCU module links to each other, the backplate interface respectively with main MCU module, vice MCU module links to each other down, outside temperature acquisition circuit passes through reserve interface with vice MCU module links to each other, reserve interface with main MCU module links to each other, just main MCU module pass through low limit drive circuit with reserve interface drive is connected.

Preferably, the chip model of the main MCU module is STM32F429, and the chip model of the auxiliary MCU module is STM32F103.

Preferably, the I2C communication circuit adopts data line and clock line double-line communication, the data line and the clock line are provided with TVS protection at an interface, and the data line and the clock line are connected with a pull-up resistor.

Preferably, the number of the I2C communication circuits is 40.

Preferably, the chip model of the external temperature acquisition circuit is DS18B20, the external temperature acquisition circuit adopts single-wire communication, the temperature acquisition of the upper backboard interface and the lower backboard interface is realized by multiplexing the I2C communication circuits which are correspondingly connected, the TVS protection is arranged at the interface of the external temperature acquisition circuit, and the external temperature acquisition circuit is connected with a pull-up resistor.

Preferably, the number of the temperature collecting channels of the external temperature collecting circuit is 38.

Preferably, the acceleration sensor is a 6-axis acceleration sensor, and the model of the chip of the acceleration sensor is MPU6550.

Preferably, the auxiliary MCU module is connected with an adapter interface through a digital isolation circuit.

Preferably, the chip model of the digital isolation circuit is SI8660.

Has the advantages that: the monitoring device for testing the working state of the system comprises a power input circuit, a 24V lithium battery system, a high-low voltage power supply conversion circuit, a current detection circuit, a temperature and humidity sensor, an acceleration sensor, a clock circuit, a data storage circuit, a 485 communication circuit, a 232 communication circuit, a 422 communication circuit, a display system, an external temperature acquisition circuit, an I2C communication circuit, an upper back plate interface, a lower back plate interface, a main MCU module, a secondary MCU module and a standby interface.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic circuit diagram of a monitoring apparatus for testing an operating state of a system according to an embodiment of the present application.

Reference numerals are as follows: 1. a power input circuit; 2. a 24V lithium battery system; 3. a high-low voltage power supply conversion circuit; 4. a current detection circuit; 5. a temperature and humidity sensor; 6. an acceleration sensor; 7. a clock circuit; 8. a data storage circuit; 9. 485 communication circuit; 10. 232 a communication circuit; 11. 422 a communication circuit; 12. a display system; 13. a digital isolation circuit; 14. an adapter interface; 15. an upper backplane interface; 16. a lower backplane interface; 17. a main MCU module; 18. a secondary MCU module; 19. a first switch; 20. a second switch; 21. a standby interface; 22. a low-side drive circuit; 23. a dial switch.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present disclosure, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. It should be noted that the standard parts used in the present specification are commercially available and can be customized according to the description and drawings. Unless expressly stated or limited otherwise, the terms "connected" and "connecting" are to be construed broadly, e.g., as electrical connections, signal connections, through wires/serial buses; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present disclosure can be understood as a specific case by a person of ordinary skill in the art.

In this document, the term "comprises/comprising" is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

Examples

Referring to fig. 1, a monitoring device for testing the working state of a system includes a power input circuit 1, a 24V lithium battery system 2, a high-low voltage power conversion circuit 3, a current detection circuit 4, a temperature and humidity sensor 5, an acceleration sensor 6, a clock circuit 7, a data storage circuit 8, a 485 communication circuit 9, a 232 communication circuit 10, a 422 communication circuit 11, a display system 12, an external temperature acquisition circuit, an I2C communication circuit, an upper backplane interface 15, a lower backplane interface 16, a main MCU module 17, an auxiliary MCU module 18, and a standby interface 21, where the power input circuit 1, the 24V lithium battery system 2, the high-low voltage power conversion circuit 3, the current detection circuit 4, the temperature and humidity sensor 5, the acceleration sensor 6, the clock circuit 7, the data storage circuit 8, the auxiliary MCU module 9, the 232 communication circuit 10, the 422 communication circuit 11, the display system 12, the external temperature acquisition circuit, the I2C communication circuit, the upper interface backplane 15, the lower backplane interface 16, the main MCU module 17, the auxiliary MCU module 18, and the 485 communication circuit 21 may be any one of the prior art. Meanwhile, it should be noted that, the present application aims to protect a specific circuit structure, a program implemented by the present application may be any one of the programs in the prior art, and a person skilled in the present application may directly use a driving program and a control program that are matched with corresponding components, so that the control program between the components is not described herein again. In fig. 1, the dashed connection lines indicate that the components connected to the connection lines operate only when the external power supply is active, and the solid connection lines indicate that the components connected to the connection lines operate when the power input circuit 1 and the 24V lithium battery system 2 are powered by the dual power supplies. In summary, the monitoring device (hereinafter referred to as monitoring device) for testing the operating state of the system in this embodiment is designed to monitor various data acquisition boards (such as analog acquisition cards, digital acquisition cards, analog/digital output cards, communication cards, various signal modulation cards, etc.), load boxes, disconnection boxes, PXI chassis, adapter boxes, the operating state of the internal power supply of the device, and ID information (such as electronic tags, etc.) of all components related to the device of the testing device/system, and to locally display the monitored and acquired state information and upload the information to the background monitoring computer through communication.

In particular, it relates to

The high-low voltage power supply conversion circuit 3 comprises a 24V-5V high-voltage conversion circuit, a first 5V-3V3 low-voltage conversion circuit and a second 5V-3V3 low-voltage conversion circuit, the output end of the power supply input circuit 1 is respectively connected with the 24V lithium battery system 2 and the 24V-5V high-voltage conversion circuit, the output end of the 24V lithium battery system 2 is connected with the 24V-5V high-voltage conversion circuit through a first switch 19, the output end of the 24V-5V high-voltage conversion circuit is connected with the first 5V-3V3 low-voltage conversion circuit through a second switch 20, the first 5V-3V3 low-voltage conversion circuit is connected with the low-voltage input end of the main MCU module 17, the second 5V-3V3 low-voltage conversion circuit is connected with the low-voltage input end of the auxiliary MCU module 18, and the second switch 20 is connected with the main MCU module 17 in a control mode. The working principle of the power supply is as follows: the 24V lithium battery system 2 is provided with the power input circuit 1, and the 24V lithium battery system 2 adopts a double power supply scheme of a 24V external input power supply and a 24V built-in power supply, the external input power supply can directly charge the internal battery, the internal battery does not participate in power supply when the external power supply is connected, and the power input circuit 1 and the 24V lithium battery system 2 have protection functions of reverse connection prevention and the like. The power voltage is reduced to a 5V peripheral circuit working power supply through a 24V-5V high-voltage conversion circuit, the power voltage is divided into two paths, one path is a direct 5V power supply, and the other path is controlled by the main MCU module 17 through a second switch 20. The two paths of 5V power supplies are converted into two paths of 3.3V power supplies through a first 5V-3V3 low-voltage conversion circuit and a second 5V-3V3 low-voltage conversion circuit respectively, the 3.3V power supplies obtained after the conversion of the first 5V-3V3 low-voltage conversion circuit supply power to the main MCU module 17 and circuits for the work of related dual power supply systems respectively, and the 3.3V power supplies obtained after the conversion of the second 5V-3V3 low-voltage conversion circuit supply power to other controlled devices.

The main MCU module 17 monitors the input voltage of the power input circuit 1 and the input voltage of the 24V lithium battery system 2 through the high-low voltage power conversion circuit 3, when the test equipment/system does not work normally and is in a power-off transportation state, the power supply is switched to an internal lithium battery, namely, the 24V lithium battery system 2 supplies power, and the battery capacity of the internal lithium battery can be set to be the power supply performance which can ensure that data for more than 10 days are monitored and stored locally.

The high-low voltage power supply conversion circuit 3 supplies power for 3.3v and 5v externally, the power supply is controlled power supply, and the high-low voltage power supply conversion circuit only works when the cabinet is connected with an external power supply. 3.3v is respectively provided for the upper back plate interface 15, the lower back plate interface 16 and the standby interface 21,5v is provided for each external communication combination in the standby interface 21, namely an external temperature acquisition circuit and an I2C communication circuit.

The main MCU module 17 is connected with the auxiliary MCU module 18 through a serial port, the chip model of the main MCU module 17 is STM32F429, and the chip model of the auxiliary MCU module 18 is STM32F103. The MCU control principle is as follows: the device is provided with two singlechips of a main MCU module 17 and an auxiliary MCU module 18, and the chip of the auxiliary MCU module 18 is mainly used for the chip expansion of the main MCU module 17 to realize the IO pin expansion so as to complete the functions of information acquisition of an external temperature acquisition circuit, low-side detection of an adapter and the like. The auxiliary MCU module 18 is connected to the adapter interface 14 through a digital isolation circuit 13, and the chip model of the digital isolation circuit 13 is SI8660. Namely, the I/O input circuit adopts 3 groups of 5V digital isolation chips, provides 16 independent digital isolation channels and is internally pulled up. The common ground is provided for the external purpose, and the low-side input is effectively realized. External components in the device are connected to the monitoring device of the present invention via I/O input circuitry to collect relevant conditions.

The current detection circuit 4, the temperature and humidity sensor 5, the acceleration sensor 6, the clock circuit 7, the data storage circuit 8, the 485 communication circuit 9 and the display system 12 are respectively connected with the main MCU module 17, and the 232 communication circuit 10 and the 422 communication circuit 11 are respectively connected with the main MCU module 17 through the dial switch 23. The host and the upper computer of the device communicate through a 232 communication circuit 10 or a 422 communication circuit 11, the 232 communication circuit 10 and the 422 communication circuit 11 respectively provide different interfaces for the outside, a dial switch 23 is used for selecting a level conversion chip in the 232 communication circuit 10 or the 422 communication circuit 11 inside, and the 232 communication circuit 10 and the 422 communication circuit 11 are the same serial port for the main MCU module 17. The 485 communication circuit 9 is used for standby extension, and the single chip microcomputer is provided with an independent serial port and can be externally connected with a 485 current sensor. The temperature and humidity sensor 5 and the acceleration sensor 6 are communicated with the main MCU module 17 through an I2C communication circuit, and the built-in temperature and humidity sensor 6 can realize temperature and humidity information acquisition in the monitoring device. The acceleration sensor 6 is a six-axis acceleration sensor with the model of MPU6550, and the acceleration sensor 6 is communicated with the main MCU module 17 through an I2C communication circuit. The acceleration sensor 6 is installed in the monitoring device of the present invention, and when the monitoring device of the present invention and the test system are installed together, information such as external impact received by the test equipment/system can be monitored.

I2C communication circuit links to each other with main MCU module 17 through last backplate interface 15, it links to each other with vice MCU module 18 to go up backplate interface 15, lower backplate interface 16 respectively with main MCU module 17, vice MCU module 18 links to each other, outside temperature acquisition circuit passes through reserve interface 21 and links to each other with vice MCU module 18, reserve interface 21 links to each other with main MCU module 18, and main MCU module 18 passes through low limit drive circuit 22 and is connected with reserve interface 21 drive. The I2C communication circuit has 40 paths, adopts double-line communication of a data line and a clock line, increases TVS protection at a connector of the data line and the clock line to prevent static electricity or pulse, and connects a pull-up resistor with the clock line. The chip model of the temperature acquisition circuit is DS18B20, the acquisition channels of the temperature acquisition circuit are 38 paths in total, and single-wire communication is adopted. The temperature acquisition of the upper back plate interface 15 and the lower back plate interface 16 is realized by multiplexing the I2C communication circuits which are correspondingly connected, the TVS protection is arranged at the interface of the external temperature acquisition circuit, and the external temperature acquisition circuit is connected with the pull-up resistor. All external components such as the data color card are connected with the I2C communication circuit of the monitoring device in a mode of being plugged into the upper back plate interface 15 and the lower back plate interface 16 so as to acquire temperature and humidity information.

The monitoring device is suitable for monitoring the working state of testing equipment, airport and other ground inspection equipment in the research and development stage of products of enterprises and research institutes, and testing experimenters need to monitor the running condition of the equipment on site without the monitoring device. The monitoring device can realize the on-site unmanned remote monitoring of the test equipment, and simultaneously enables the monitored information to be more comprehensive.

Finally, it should be noted that: although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still make modifications on the technical solutions described in the foregoing embodiments, or make equivalent substitutions on some technical features, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A monitoring device for testing the working state of a system comprises a power input circuit (1), a 24V lithium battery system (2), a high-low voltage power conversion circuit (3), a current detection circuit (4), a temperature and humidity sensor (5), an acceleration sensor (6), a clock circuit (7), a data storage circuit (8), a 485 communication circuit (9), a 232 communication circuit (10), a 422 communication circuit (11), a display system (12), an external temperature acquisition circuit, an I2C communication circuit, an upper back plate interface (15), a lower back plate interface (16), a main MCU module (17), an auxiliary MCU module (18) and a standby interface (21), and is characterized in that the main MCU module (17) is connected with the auxiliary MCU module (18) through a serial port, the high-low voltage power supply conversion circuit (3) comprises a 24V-5V high-voltage conversion circuit, a first 5V-3V3 low-voltage conversion circuit and a second 5V-3V3 low-voltage conversion circuit, the output end of the power supply input circuit (1) is respectively connected with the 24V lithium battery system (2) and the 24V-5V high-voltage conversion circuit, the output end of the 24V lithium battery system (2) is connected with the 24V-5V high-voltage conversion circuit through a first switch (19), the output end of the 24V-5V high-voltage conversion circuit is connected with the first 5V-3V3 low-voltage conversion circuit, and the output end of the 24V-5V high-voltage conversion circuit is connected with the first 5V-3V3 low-voltage conversion circuit through a second switch (20) The switching circuit is connected, the first 5V-3V3 low-voltage switching circuit is connected with the low-voltage input end of the main MCU module (17), the second 5V-3V3 low-voltage switching circuit is connected with the low-voltage input end of the auxiliary MCU module (18), and the second switch (20) is in control connection with the main MCU module (17); the current detection circuit (4), temperature and humidity sensor (5), acceleration sensor (6), clock circuit (7), data storage circuit (8), 485 communication circuit (9), display system (12) link to each other with main MCU module (17) respectively, 232 communication circuit (10), 422 communication circuit (11) respectively through dial switch (23) with main MCU module (17) link to each other, I2C communication circuit passes through go up backplate interface (15) with main MCU module (17) links to each other, go up backplate interface (15) with vice MCU module (18) link to each other, backplate interface (16) respectively with main MCU module (17) down, vice MCU module (18) link to each other, outside temperature acquisition circuit passes through reserve interface (21) with vice MCU module (18) link to each other, reserve interface (21) with main MCU module (17) link to each other, just MCU module (17) pass through low limit drive circuit (22) with reserve interface (21) drive connection.

2. The monitoring device for the working state of the test system according to claim 1, wherein the chip model of the main MCU module (17) is STM32F429, and the chip model of the auxiliary MCU module (18) is STM32F103.

3. The monitoring device for testing the operating condition of the system as claimed in claim 1, wherein the I2C communication circuit adopts a data line and a clock line for two-wire communication, and the data line and the clock line are provided with TVS protection at an interface, and the data line and the clock line are connected with a pull-up resistor.

4. The monitoring device for testing the operating condition of a system as claimed in claim 3, wherein the number of the I2C communication circuits is 40.

5. The monitoring device for the working state of the test system according to claim 1, wherein the external temperature acquisition circuit has a chip model of DS18B20, the external temperature acquisition circuit adopts single-wire communication, the temperature acquisition of the upper back plate interface (15) and the lower back plate interface (16) is realized by multiplexing the I2C communication circuits correspondingly connected, the external temperature acquisition circuit interface is provided with TVS protection, and the external temperature acquisition circuit is connected with a pull-up resistor.

6. The monitoring device for testing the operating condition of the system as claimed in claim 1, wherein the number of the temperature acquisition channels of the external temperature acquisition circuit is 38.

7. The monitoring device for testing the operating condition of a system according to claim 1, wherein the acceleration sensor (6) is a 6-axis acceleration sensor having a chip type of MPU6550.

8. Monitoring device for testing the operational status of a system according to claim 1, characterized in that the secondary MCU module (18) is connected with an adapter interface (14) through a digital isolation circuit (13).

9. The monitoring device for testing the operating condition of the system as recited in claim 8, wherein the digital isolation circuit (13) has a chip model of SI8660.