CN218535677U

CN218535677U - A quick packaging hardware for circuit board

Info

Publication number: CN218535677U
Application number: CN202221493275.XU
Authority: CN
Inventors: 黎发明
Original assignee: Die Micro Technology Shanghai Co ltd
Current assignee: Die Micro Technology Shanghai Co ltd
Priority date: 2022-06-15
Filing date: 2022-06-15
Publication date: 2023-02-28
Anticipated expiration: 2032-06-15

Abstract

The utility model discloses a quick packaging hardware for circuit board, which comprises a base, the top outer wall of the base is provided with a working chamber, the inner walls around the working chamber are all fixedly connected with a buffer member, one end of the buffer member is fixedly connected with a push plate; the top surface of the push plate is fixedly connected with an arc-shaped rubber plate, and one side surface of the arc-shaped rubber plate is in sliding fit with one side edge of the working cavity; the base is provided with a glue injection part on the top surface close to the working cavity, and the glue injection part consists of a displacement adjusting structure and a spot gluing structure; a conveying part is arranged on one side surface of the base; the conveying part comprises a conveying belt rotatably connected to the outer wall of one side of the base, a second motor fixed to the outer wall of one side of the base through a support plate, a conveying belt A and a conveying belt B, wherein the conveying belt A and the conveying belt B are vertically arranged from bottom to top and rotatably connected to one side of the base. The utility model discloses can accomplish the automatic centre gripping location to the circuit board, convenient to use improves work efficiency.

Description

A quick packaging hardware for circuit board

Technical Field

The utility model relates to a circuit board packaging technique field especially relates to a quick packaging hardware for circuit board.

Background

The existing circuit board adopts a low-pressure injection molding process to achieve the effects of waterproof sealing, insulation and flame retardance. Along with the continuous development of science and technology level, the specification size and the specification of thickness of circuit board are more and more various, and when the circuit board size was great, the area of injecting glue also can increase, and the injecting glue volume also increases correspondingly, and it is inhomogeneous to fill the sizing material in the injecting glue in-process, can appear filling not full or sizing material too much phenomenon to can form a large amount of defective products and wastrel.

In order to solve the above problems, according to a search, a chinese patent application No. CN201520083686.5 discloses a circuit board packaging apparatus, which includes a circuit board positioning device, an upper packaging mold, a lower packaging mold, a vacuum pumping device, a heating device and a pressurizing device; the circuit board positioning device bears the circuit board so as to be used for positioning the circuit board; the upper packaging mold and the lower packaging mold are arranged oppositely, and can be matched to form a cavity for accommodating the circuit board, and a packaging film for packaging the circuit board is arranged in the upper packaging mold; and the vacuumizing device is connected with the upper packaging mold and the lower packaging mold. The circuit board packaging device in the above patent has the following disadvantages: the circuit board is placed in the concave cavity for positioning, and although the size of the concave cavity is adjustable, the concave cavity needs to be manually replaced or adjusted according to the actual size of the circuit board when the circuit board is packaged every time, which is troublesome, so that the problem that automatic clamping and positioning cannot be carried out according to the size of the circuit board exists.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a quick packaging device for a circuit board.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a quick packaging device for a circuit board comprises a base, wherein a working cavity is formed in the outer wall of the top of the base, buffering parts are fixedly connected to the inner walls of the periphery of the working cavity, and a push plate is fixedly connected to one end of each buffering part; the top surface of the push plate is fixedly connected with an arc-shaped rubber plate, and one side surface of the arc-shaped rubber plate is in sliding fit with one side edge of the working cavity;

the base is provided with a glue injection part on the top surface close to the working cavity, and the glue injection part consists of a displacement adjusting structure and a spot gluing structure;

one side of the base is provided with a conveying part.

As a further aspect of the present invention: the conveying part comprises a conveying belt which is rotatably connected to the outer wall of one side of the base, a second motor which is fixed to the outer wall of one side of the base through an extension plate, a conveying belt A and a conveying belt B which are vertically arranged from bottom to top and are rotatably connected to one side of the base, the input end of the conveying belt is connected with the output end of the second motor through a connecting shaft, and the output end of the conveying belt is connected with one ends of the conveying belt A and the conveying belt B through a coupler.

As the utility model discloses further scheme again: the displacement adjusting structure comprises a moving groove arranged on the outer wall of the top of the base, a moving seat connected to the inner wall of the moving groove in a sliding mode through a sliding block, a telescopic column connected to the top face of the moving seat in a rotating mode, and a first motor fixedly connected to the inner wall of the bottom of the moving seat, wherein the output end of the first motor is connected with the bottom end of the telescopic column through a synchronizing shaft.

As a further aspect of the present invention: the glue dispensing structure comprises a glue injection plate fixed at the extending end of the telescopic column through the support, a material box fixedly connected to the outer wall of the support, a glue injection pipe fixedly connected to the outer wall of one side of the material box and the outer wall of the top of the glue injection plate at two ends of the glue injection pipe respectively, and a glue injection nozzle fixedly connected to the bottom surface of the glue injection plate.

As the utility model discloses further scheme again: and a heating pad is arranged on the outer wall of the circumference of the glue injection pipe.

As a further aspect of the present invention: the inner wall all around that the working chamber is close to the bottom is provided with the spout, and the inner wall sliding connection of spout has the fly leaf, and the bottom outer wall fixedly connected with vibrator of fly leaf.

As the utility model discloses further scheme again: the outer wall fixedly connected with supporting seat of one side of base, the bottom outer wall fixedly connected with top support piece of supporting seat, the extension end fixedly connected with clamp plate of top support piece.

As the utility model discloses further scheme again: the bottom surface of the pressing plate is fixedly connected with a suction nozzle.

Compared with the prior art, the utility model provides a quick packaging hardware for circuit board possesses following beneficial effect:

1. this a quick packaging hardware for circuit board, circuit board are in the same direction as extending arc rubber slab surface cunning all around and move to the work intracavity, and push pedal all around is laminated with the limit all around of circuit board under the elasticity release of bolster mutually, so can accomplish the automatic centre gripping location to the circuit board, and convenient to use improves work efficiency.

2. According to the rapid packaging device for the circuit board, after the circuit board is placed in the working cavity for positioning, the using direction of the dispensing structure is adjusted through the displacement adjusting structure, and the dispensing range on the circuit board is controlled through the first motor and the moving groove; and during glue injection, the vibrator is simultaneously started, so that the movable plate slightly moves, glue solution on the surface of the circuit board is uniformly paved and filled, and the glue injection quality is improved.

3. According to the rapid packaging device for the circuit board, the conveying belt A and the conveying belt B are driven by the conveying belt to carry out synchronous conveying through the structures such as the conveying part, so that parts can be automatically conveyed into the working cavity, and labor is saved; when the pressure plate is pressed on the top surface of the sealing cover, the suction nozzle adsorbs the upper surface of the sealed sealing cover, so that the pressure plate moves upwards to drive the sealed workpiece to move upwards synchronously to be separated from the working cavity, and at the moment, people take out the workpiece from the suction nozzle, thereby conveniently and automatically taking the workpiece.

Drawings

Fig. 1 is a schematic side view of a side-view partial cross-sectional structure of a fast packaging apparatus for a circuit board according to the present invention;

fig. 2 is a schematic top view of a fast packaging apparatus for a circuit board according to the present invention;

fig. 3 is a schematic view of a front view partial cross-sectional structure of a fast packaging apparatus for a circuit board according to the present invention.

In the figure: 1-base, 2-material conveying belt A, 3-material conveying belt B, 4-support base, 5-top support piece, 6-moving base, 7-telescopic column, 8-material box, 9-glue injection pipe, 10-glue injection plate, 11-first motor, 12-arc rubber plate, 13-working cavity, 14-conveying belt, 15-second motor, 16-push plate, 17-buffer piece, 18-moving groove, 19-suction nozzle, 20-pressing plate, 21-glue injection nozzle and 22-vibrator.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Example 1

In order to automatically clamp and position a circuit board, the rapid packaging device for the circuit board comprises a base 1, wherein a working cavity 13 is formed in the outer wall of the top of the base 1, buffering parts 17 are welded on the inner walls of the periphery of the working cavity 13, and a push plate 16 is welded at one end of each buffering part 17; preferably, in order to automatically guide the position of the circuit board, the arc-shaped rubber plate 12 is fixed on the top surface of the push plate 16 through a bolt, and one side surface of the arc-shaped rubber plate 12 is in sliding fit with one side edge of the working cavity 13; the circuit board slides along the surface of the arc-shaped rubber plate 12 around to the working cavity 13, and the push plates 16 around are attached to the edges around the circuit board under the elastic release of the buffer parts 17, so that the automatic clamping and positioning of the circuit board can be completed, the use is convenient, and the working efficiency is improved.

In order to conveniently glue the circuit board, as shown in fig. 1-3, a glue injection part is arranged on the top surface of the base 1 close to the working cavity 13, and the glue injection part is composed of a displacement adjusting structure and a glue injection structure, wherein the displacement adjusting structure comprises a moving groove 18 formed in the outer wall of the top of the base 1, a moving seat 6 connected to the inner wall of the moving groove 18 in a sliding manner through a sliding block, a telescopic column 7 connected to the top surface of the moving seat 6 in a rotating manner, and a first motor 11 fixed to the inner wall of the bottom of the moving seat 6 through a bolt, and the output end of the first motor 11 is connected with the bottom end of the telescopic column 7 through a synchronizing shaft; when the use position of adjustment point glued structure, start first motor 11 and drive the point glued structure through flexible post 7 and move towards the adjustment, then can remove the operating position of seat 6 in shifting chute 18 according to the size of circuit board, according to the circuit board thickness through the use height of flexible post 7 adjustment point glued structure.

The glue dispensing structure comprises a glue injection plate 10 fixed at the extending end of the telescopic column 7 through a support, a material box 8 fixed on the outer wall of the support through a bolt, a glue injection pipe 9 with two ends respectively fixed on the outer wall of one side of the material box 8 and the outer wall of the top of the glue injection plate 10 through bolts, and a plurality of glue injection nozzles 21 fixed on the bottom surface of the glue injection plate 10 through bolts; after the circuit board is positioned in the working cavity 13, the using position of the glue dispensing structure is adjusted through the displacement adjusting structure, then the glue dispensing nozzle 21 is started, and the glue dispensing range on the circuit board is controlled through the first motor 11 and the moving groove 18.

Preferably, the heating pad is sleeved on the circumferential outer wall of the glue injection pipe 9; the glue injection pipe is used for keeping the heat in the glue injection pipe 9 and avoiding the phenomenon of gelation and solidification caused by cold.

Further, the inner wall of the periphery of the working cavity 13 close to the bottom end is provided with a sliding chute, the inner wall of the sliding chute is connected with a movable plate in a sliding manner, the outer wall of the bottom of the movable plate is fixed with a vibrator 22 through a bolt, and preferably, the height of the sliding chute is 1-3cm; and during the glue injection, the vibrator 22 is simultaneously started, so that the movable plate slightly moves, the glue solution on the surface of the circuit board is uniformly paved and filled, and the glue injection quality is improved.

The working principle is as follows: when the circuit board is arranged in the working cavity 13, the circuit board slides to the working cavity 13 along the surface of the arc-shaped rubber plate 12 on the periphery, and the push plates 16 on the periphery are attached to the periphery of the circuit board under the elastic release of the buffer parts 17, so that the automatic clamping and positioning of the circuit board can be completed.

The first motor 11 is started to drive the dispensing structure through the telescopic column 7 to adjust the orientation, the dispensing plate 10 is located right above the circuit board, the height of the dispensing structure can be adjusted through the telescopic column 7 according to the thickness of the circuit board, the dispensing nozzle 21 is close to the surface of the circuit board, the suspension distance of the glue solution is shortened, the operation position of the movable seat 6 in the movable groove 18 is adjusted according to the size of the circuit board, the dispensing nozzle 21 is started, the dispensing range on the circuit board is controlled through the first motor 11 and the movable groove 18, the vibrator 22 is started simultaneously during glue dispensing, the movable plate slightly overturns, and the glue solution on the surface of the circuit board is laid and uniformly filled.

Example 2

A fast packaging device for circuit board, as shown in FIG. 1 and FIG. 3, is convenient for packaging the circuit board; the present embodiment is modified from embodiment 1 as follows: a conveying part is arranged on one side face of the base 1 and comprises a conveying belt 14 which is rotatably connected to the outer wall of one side of the base 1, a second motor 15 which is fixed to the outer wall of one side of the base 1 through a support plate, and a conveying belt A2 and a conveying belt B3 which are vertically and rotatably connected to one side face of the base 1 in a vertical manner from bottom to top, wherein the input end of the conveying belt 14 is connected with the output end of the second motor 15 through a connecting shaft, and the output end of the conveying belt 14 is connected with one ends of the conveying belt A2 and the conveying belt B3 through a coupler; the circuit board and the sealing covers with the corresponding specifications are respectively placed on the conveying belt A2 and the conveying belt B3, then the second motor 15 is started, the conveying belt A2 and the conveying belt B3 are driven by the conveying belt 14 to carry out synchronous conveying, so that parts are automatically conveyed into the working cavity 13, and labor is saved and the parts are sequentially placed.

A supporting seat 4 is fixed on the outer wall of one side of the base 1 through a bolt, a top supporting piece 5 is fixed on the outer wall of the bottom of the supporting seat 4 through a bolt, and a pressing plate 20 is fixed on the extending end of the top supporting piece 5 through a bolt; the circuit board and the cover conveyed from the conveying part fall into the working chamber 13 in sequence for automatic positioning, and the top support part 5 is started to drive the pressing plate 20 to press the top surface of the cover, so that the cover clamped on the circuit board is firmly pressed on the circuit board.

Further, a plurality of suction nozzles 19 are welded on the bottom surface of the pressure plate 20; after a period of stagnation, the pressing plate 20 is driven to move upwards by the jacking piece 5, and the suction nozzle 19 adsorbs the upper surface of the packaged sealing cover, so that the pressing plate 20 moves upwards to drive the packaged workpiece to move upwards synchronously to be separated from the working cavity 13, and at the moment, people take out the workpiece from the suction nozzle 19, and automatic material taking is conveniently completed.

The working principle is as follows: placing the circuit board and the sealing covers with corresponding specifications on a material conveying belt A2 and a material conveying belt B3 respectively, then starting a second motor 15, and driving the material conveying belt A2 and the material conveying belt B3 to carry out synchronous conveying through a conveying belt 14 so as to automatically convey parts into a working cavity 13; after the circuit board enters the working chamber 13 and is sealed with glue, the seal cover is conveyed to fall onto the circuit board, the jacking piece 5 is started to drive the pressing plate 20 to press the top surface of the seal cover, so that the seal cover clamped on the circuit board is firmly pressed on the circuit board, after a period of stagnation, the pressing plate 20 is driven by the jacking piece 5 to move upwards, the suction nozzle 19 adsorbs the upper surface of the sealed seal cover, the pressing plate 20 moves upwards to drive the sealed workpiece to move upwards synchronously to be separated from the working chamber 13, and at the moment, people take out the workpiece from the suction nozzle 19.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A quick packaging device for a circuit board comprises a base (1) and is characterized in that a working cavity (13) is formed in the outer wall of the top of the base (1), buffer parts (17) are fixedly connected to the inner walls of the periphery of the working cavity (13), and one end of each buffer part (17) is fixedly connected with a push plate (16); the top surface of the push plate (16) is fixedly connected with an arc-shaped rubber plate (12), and one side surface of the arc-shaped rubber plate (12) is in sliding fit with the edge of one side of the working cavity (13);

the top surface of the base (1) close to the working cavity (13) is provided with a glue injection part, and the glue injection part consists of a displacement adjusting structure and a spot gluing structure;

one side surface of the base (1) is provided with a conveying part.

2. The rapid packaging device for the circuit board as claimed in claim 1, wherein the conveying part comprises a conveyor belt (14) rotatably connected to an outer wall of one side of the base (1), a second motor (15) fixed to the outer wall of one side of the base (1) through a support plate, a conveyor belt a (2) and a conveyor belt B (3) rotatably connected to one side of the base (1) in a vertical arrangement from bottom to top, an input end of the conveyor belt (14) is connected to an output end of the second motor (15) through a connecting shaft, and an output end of the conveyor belt (14) is connected to one end of the conveyor belt a (2) and one end of the conveyor belt B (3) through a coupling.

3. The quick packaging device for the circuit board according to claim 1, wherein the displacement adjusting structure comprises a moving slot (18) disposed on the outer wall of the top of the base (1), a moving base (6) slidably connected to the inner wall of the moving slot (18) through a sliding block, a telescopic post (7) rotatably connected to the top surface of the moving base (6), and a first motor (11) fixedly connected to the inner wall of the bottom of the moving base (6), and the output end of the first motor (11) is connected to the bottom end of the telescopic post (7) through a synchronizing shaft.

4. The fast packaging device for the circuit board as claimed in claim 3, wherein the dispensing structure comprises a glue injection plate (10) fixed to the extending end of the telescopic column (7) through a bracket, a magazine (8) fixedly connected to the outer wall of the bracket, a glue injection pipe (9) with two ends respectively fixedly connected to the outer wall of one side of the magazine (8) and the outer wall of the top of the glue injection plate (10), and a glue injection nozzle (21) fixedly connected to the bottom surface of the glue injection plate (10).

5. A quick packaging device for circuit boards according to claim 4, characterized in that the peripheral outer wall of the glue injection tube (9) is provided with a heating pad.

6. The quick packaging device for the circuit board according to claim 5, wherein the working chamber (13) is provided with a chute on the inner wall near the bottom, the inner wall of the chute is connected with a movable plate in a sliding manner, and the outer wall of the bottom of the movable plate is fixedly connected with a vibrator (22).

7. The quick packaging device for the circuit board according to claim 1, wherein a supporting base (4) is fixedly connected to an outer wall of one side of the base (1), a top supporting member (5) is fixedly connected to an outer wall of a bottom portion of the supporting base (4), and a pressing plate (20) is fixedly connected to an extending end of the top supporting member (5).

8. A quick-action packaging device for circuit boards according to claim 7, characterised in that a suction nozzle (19) is fixedly connected to the bottom surface of the pressure plate (20).