CN218535184U

CN218535184U - Monocrystalline silicon piece cutting device

Info

Publication number: CN218535184U
Application number: CN202222421109.5U
Authority: CN
Inventors: 徐礼健; 蒋军
Original assignee: Jiangsu Heyang New Materials Co ltd
Current assignee: Jiangsu Heyang New Materials Co ltd
Priority date: 2022-09-13
Filing date: 2022-09-13
Publication date: 2023-02-28
Anticipated expiration: 2032-09-13

Abstract

The utility model relates to a cutting device technical field just discloses a monocrystalline silicon piece cutting device, the on-line screen storage device comprises a base, the L template is installed at the top of base, the outside of L template sets up cutting device, cutting device includes cutting wire mechanism and reciprocating mechanism. This monocrystalline silicon piece cutting device, make the pivot drive the driving gear through starter motor and rotate, be connected with driven gear meshing through the driving gear, thereby drive driven gear, bull stick and drive wheel rotate, cooperation leading wheel makes the motion of cutting steel wire, the pivot drives eccentric circle wheel simultaneously and rotates, utilize the spring action of spring, the dead weight of cooperation eccentric circle wheel, make the backup pad be hugged closely all the time to pivoted eccentric circle wheel, thereby make eccentric circle wheel drive cutting wire mechanism up-and-down reciprocating motion, the cutting steel wire is sliced the head of many monocrystalline silicon rods simultaneously, cutting wire mechanism cutting through reciprocating motion has been realized and is reduced the loss, effectively improve the utilization ratio of monocrystalline silicon rod.

Description

Monocrystalline silicon piece cutting device

Technical Field

The utility model relates to a cutting device technical field specifically is a monocrystalline silicon piece cutting device.

Background

With the development of the present society, single crystal silicon is widely applied, and semiconductors manufactured by using single crystal silicon are required in many high-tech products, which is determined by the properties of single crystal silicon, and are good semiconductor materials because of different properties in different directions, and cutting is an important process to be molded and used in the production process of single crystal silicon.

Generally, a cutting machine performs cutting by rotating a cutting disc, but the cutting disc is thick, which causes a lot of loss when cutting a single crystal silicon rod, resulting in an unsatisfactory utilization rate of the single crystal silicon rod.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a monocrystalline silicon piece cutting device possesses advantages such as cutting reduction loss through reciprocating motion's cutting wire mechanism, has solved the unsatisfactory problem of single crystal silicon rod's utilization ratio.

(II) technical scheme

In order to achieve the above purpose, the utility model provides a following technical scheme: a monocrystalline silicon wafer cutting device comprises a base, wherein an L-shaped plate is mounted at the top of the base, a cutting device is arranged outside the L-shaped plate, the cutting device comprises a cutting wire mechanism and a reciprocating mechanism, and the reciprocating mechanism is connected to the cutting wire mechanism;

the cutting wire mechanism includes U template, fixed plate, motor, pivot, driving gear, driven gear, bull stick, drive wheel, no. two fixed plates, no. two bull sticks, leading wheels, cutting steel wire, no. one the fixed plate is installed on the U template, the motor is installed on a fixed plate, the output of motor passes through shaft coupling and pivot fixed connection, the pivot runs through driving gear and driving gear fixed connection, bull stick and driven gear fixed connection, the driving gear is connected with driven gear meshing, a bull stick runs through a fixed plate and drive wheel fixed connection, a bull stick passes through a bearing and a fixed plate swing joint, no. two the fixed plate is installed on the U template, no. two bull sticks and leading wheels fixed connection, no. two the bull sticks pass through No. two bearings and No. two fixed plate swing joint, the cutting steel wire cover is established on drive wheel and the leading wheel.

Preferably, reciprocating mechanism includes eccentric round wheel, backup pad, gag lever post, limiting plate, spring, pivot and eccentric round wheel fixed connection, the backup pad is installed on the L template, eccentric round wheel and backup pad contact, the gag lever post is installed on the U template, the gag lever post runs through L template and limiting plate fixed connection, gag lever post and L template swing joint, the spring ring shape sets up on the gag lever post, the both ends of spring respectively with L template and limiting plate fixed connection.

Preferably, the base is provided with a compressing device, the compressing device comprises a fixed table, a first sliding rail, a sliding plate, a sliding placement groove, a baffle, a grabbing handle, a top plate, a knob, a screw rod, a pressing plate, a rubber pad, a second sliding rail and a fixed placement groove, the fixed table is installed on the base, the first sliding rail is installed on the fixed table, the sliding plate is in sliding connection on the first sliding rail, the sliding placement groove is installed on the sliding plate, the sliding placement groove is in contact with the fixed table, the baffle is installed on the sliding placement groove, the grabbing handle is installed on the baffle, the top plate is installed on the sliding plate, the knob is installed on the screw rod, the screw rod penetrates through the top plate and is fixedly connected with the pressing plate, the rubber pad is installed on the pressing plate, the second sliding rail is installed on the sliding plate, the pressing plate is in sliding connection on the second sliding rail, and the fixed placement groove is installed on the fixed table.

Preferably, the driving wheel and the guide wheel are both provided with wire winding grooves.

Preferably, the size and shape of the sliding placement groove and the fixed placement groove are completely consistent, and arc-shaped concave parts are uniformly arranged on the sliding placement groove and the fixed placement groove at intervals respectively.

Preferably, a collecting tank is arranged on the base, and a filter screen is arranged in the collecting tank.

Preferably, a scrap collecting box is arranged below the base.

Compared with the prior art, the utility model provides a monocrystalline silicon piece cutting device possesses following beneficial effect:

1. this monocrystalline silicon piece cutting device, make the pivot drive driving gear rotation through starter motor, be connected with driven gear meshing through the driving gear, thereby drive driven gear, bull stick and drive wheel rotate, cooperation leading wheel makes the cutting steel wire motion, the pivot drives the rotation of eccentric circle wheel simultaneously, utilize the spring action of spring, the dead weight of cooperation eccentric circle wheel, make the backup pad is hugged closely all the time to pivoted eccentric circle wheel, thereby make eccentric circle wheel drive the reciprocating motion from top to bottom of cutting wire mechanism, the cutting steel wire is sliced the head of many monocrystalline silicon rods simultaneously, cutting wire mechanism cutting through reciprocating motion has been realized and the loss is reduced, effectively improve the utilization ratio of monocrystalline silicon rod.

2. This monocrystalline silicon piece cutting device, the improvement is put the afterbody and the head of many monocrystalline silicon rods respectively in the arc depressed part of slip standing groove and fixed standing groove, make the afterbody of monocrystalline silicon rod support the baffle, make the screw rod rotate through the rotating knob, it reciprocates to drive the clamp plate, make the clamp plate move down, the rubber pad compresses tightly the afterbody of monocrystalline silicon rod, prevent that the monocrystalline silicon rod from rocking, it promotes the slip standing groove to grasp the handle again, make the sliding plate slide on a slide rail, release the head of monocrystalline silicon rod from fixed standing groove, it slices simultaneously to many monocrystalline silicon rods to have realized, prevent because the monocrystalline silicon rod rocks the effect that leads to influencing the slicing precision.

Drawings

Fig. 1 is a schematic structural view of the whole front side of the utility model;

FIG. 2 is a schematic structural view of the whole back of the present invention;

FIG. 3 is a schematic structural view of the entire front side of the cutting device of the present invention;

FIG. 4 is a front sectional view of the cutting device of the present invention;

fig. 5 is a schematic structural view of the entire front side of the pressing device of the present invention;

fig. 6 is a schematic structural diagram of the pressing device in front cross section.

Wherein: 1. a base; 2. a cutting device; 201. a U-shaped plate; 202. a first fixing plate; 203. a motor; 204. a rotating shaft; 205. a driving gear; 206. a driven gear; 207. a first rotating rod; 208. a drive wheel; 209. a second fixing plate; 210. a second rotating rod; 211. a guide wheel; 212. cutting a steel wire; 213. an eccentric circular wheel; 214. a support plate; 215. a limiting rod; 216. a limiting plate; 217. a spring; 3. a pressing device; 301. a fixed table; 302. a first slide rail; 303. a sliding plate; 304. sliding the placing groove; 305. a baffle plate; 306. a handle is grabbed; 307. a top plate; 308. a knob; 309. a screw; 310. pressing a plate; 311. a rubber pad; 312. a second sliding rail; 313. fixing the placing groove; 4. collecting tank; 5. filtering with a screen; 6. a scrap collecting box; 7. an L-shaped plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, an L-shaped plate 7 is mounted at the top of a base 1, a cutting device 2 is arranged outside the L-shaped plate 7, the cutting device 2 comprises a cutting wire mechanism and a reciprocating mechanism, the reciprocating mechanism is connected to the cutting wire mechanism, and the cutting wire mechanism which reciprocates cuts the silicon rod reduces loss and effectively improves the utilization rate of the silicon rod;

the cutting wire mechanism comprises a U-shaped plate 201, a first fixing plate 202, a motor 203, a rotating shaft 204, a driving gear 205, a driven gear 206, a first rotating rod 207, a driving wheel 208, a second fixing plate 209, a second rotating rod 210, a guide wheel 211 and a cutting steel wire 212, wherein the first fixing plate 202 is installed on the U-shaped plate 201, the motor 203 is installed on the first fixing plate 202, the output end of the motor 203 is fixedly connected with the rotating shaft 204 through a coupler, the rotating shaft 204 penetrates through the driving gear 205 and is fixedly connected with the driving gear 205, the first rotating rod 207 is fixedly connected with the driven gear 206, the driving gear 205 is meshed with the driven gear 206, the first rotating rod 207 penetrates through the first fixing plate 202 and is fixedly connected with the driving wheel 208, the first rotating rod 207 is movably connected with the first fixing plate 202 through a bearing, the second fixing plate 209 is installed on the U201, the second rotating rod 210 is fixedly connected with the guide wheel 211, the second rotating rod 210 is movably connected with the second fixing plate through a bearing, the cutting steel wire 212 is sleeved on the first fixing plate 208 and the guide wheel 211, the driving gear 205 drives the driven gear 206, the first rotating rod 207 and the driving wheel 208 to enable the cutting steel wire to conveniently cut silicon rods on the single crystal pair 208 and the guide wheel 211, and the single crystal pair silicon rods.

Referring to fig. 1-4, the reciprocating mechanism includes an eccentric wheel 213, a supporting plate 214, a limiting rod 215, a limiting plate 216, and a spring 217, the rotating shaft 204 is fixedly connected to the eccentric wheel 213, the supporting plate 214 is mounted on the L-shaped plate 7, the eccentric wheel 213 contacts the supporting plate 214 to facilitate the lifting and lowering of the cutting wire mechanism, the limiting rod 215 is mounted on the U-shaped plate 201, the limiting rod 215 penetrates the L-shaped plate 7 and is fixedly connected to the limiting plate 216, the limiting rod 215 is movably connected to the L-shaped plate 7 to facilitate the stable up-and-down movement of the cutting wire mechanism, the spring 217 is annularly disposed on the limiting rod 215, two ends of the spring 217 are respectively fixedly connected to the L-shaped plate 7 and the limiting plate 216, the eccentric wheel 213 is tightly attached to the supporting plate 214 by the elastic force of the spring 217, and the rotating shaft 204 is used to drive the eccentric wheel 213 to rotate, so as to continuously lift and lower the cutting wire mechanism for reciprocating cutting.

Referring to fig. 5-6, a pressing device 3 is disposed on a base 1, the pressing device 3 includes a fixed table 301, a first slide rail 302, a sliding plate 303, a sliding groove 304, a baffle 305, a grasping handle 306, a top plate 307, a knob 308, a screw 309, a pressing plate 310, a rubber pad 311, a second slide rail 312, and a fixed groove 313, the fixed table 301 is mounted on the base 1, the first slide rail 302 is mounted on the fixed table 301, the sliding plate 303 is slidably connected on the first slide rail 302, the sliding groove 304 is mounted on the sliding plate 303, the sliding groove 304 is in contact with the fixed table 301 so as to allow the sliding groove 304 to slide on the fixed table 301, the baffle 305 is mounted on the sliding groove 304, the grasping handle 306 is mounted on the baffle 305, the top plate 307 is mounted on the sliding plate 303, the knob 308 is mounted on the screw 309, the screw 309 penetrates through the top plate 307 and is fixedly connected with the pressing plate 310, the screw 309 is in threaded connection with the top plate 307, the rubber pad 311 is mounted on the pressing plate 310 so as to prevent the single crystal from shaking, the second slide rail 312 is mounted on the sliding plate 303, the silicon rod 312 is mounted on the fixed groove 301 so as to prevent the single crystal from shaking of the single crystal slicing precision effect caused by a plurality of the sliding rail 301.

Referring to fig. 3-4, the driving wheel 208 and the guide wheel 211 are provided with wire winding grooves for preventing the cutting wire 212 from being separated from the driving wheel 208 and the guide wheel 211.

Referring to fig. 5-6, the sliding placement groove 304 and the fixed placement groove 313 have the same size and shape, and arc-shaped concave portions are uniformly formed on the sliding placement groove 304 and the fixed placement groove 313 at intervals, so that a plurality of single crystal silicon rods can be horizontally placed in the grooves.

Referring to fig. 1-2, a collecting tank 4 is disposed on the base 1, and a filter screen 5 is disposed in the collecting tank 4, so as to facilitate collection of monocrystalline silicon wafers and make the scraps fall off the filter screen 5.

Referring to fig. 1-2, a scrap collecting box 6 is disposed under the base 1 for collecting dropped scraps and facilitating centralized processing.

When using, put the afterbody and the head of many single crystal silicon rods respectively in the arc depressed part of slip standing groove 304 and fixed standing groove 313 earlier, make the afterbody of single crystal silicon rod support baffle 305, make screw rod 309 rotate through rotating knob 308, it reciprocates to drive clamp plate 310, prevent through No. two slide rails 312 that clamp plate 310 is rotatory, make clamp plate 310 remove downwards, rubber pad 311 compresses tightly the afterbody of single crystal silicon rod, prevent that the single crystal silicon rod from rocking, it promotes slip standing groove 304 to grasp grab handle 306 again, make sliding plate 303 slide on a slide rail 302, release the head of single crystal silicon rod from fixed standing groove 313, thereby when slicing simultaneously many single crystal silicon rods, prevent to lead to influencing the slicing precision because the single crystal silicon rod rocks.

Make pivot 204 drive driving gear 205 rotate through starter motor 203, be connected with driven gear 206 meshing through driving gear 205, thereby drive driven gear 206, bull stick 207 and drive wheel 208 rotate, cooperation leading wheel 211 rotates and connects on No. two fixed plates 209, make cutting steel wire 212 round drive wheel 208 and leading wheel 211 motion, pivot 204 drives eccentric circular wheel 213 and rotates simultaneously, because spring 217 is in tensile state all the time, utilize the elastic force effect of spring 217, make gag lever post 215 receive downward thrust, thrust transmits eccentric circular wheel 213 for through U template 201, cooperation eccentric circular wheel 213's dead weight, make pivoted eccentric circular wheel 213 hug closely backup pad 214 all the time, thereby make eccentric circular wheel 213 drive cutting wire mechanism up and down reciprocating motion, cutting steel wire 212 slices the head of many single crystal silicon rods simultaneously.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A monocrystalline silicon piece cutting device comprises a base (1), and is characterized in that: an L-shaped plate (7) is mounted at the top of the base (1), a cutting device (2) is arranged outside the L-shaped plate (7), the cutting device (2) comprises a cutting wire mechanism and a reciprocating mechanism, and the reciprocating mechanism is connected to the cutting wire mechanism;

the cutting wire mechanism comprises a U-shaped plate (201), a first fixing plate (202), a motor (203), a rotating shaft (204), a driving gear (205), a driven gear (206), a first rotating rod (207), a driving wheel (208), a second fixing plate (209), a second rotating rod (210), a guide wheel (211) and a cutting steel wire (212), wherein the first fixing plate (202) is installed on the U-shaped plate (201), the motor (203) is installed on the first fixing plate (202), the output end of the motor (203) is fixedly connected with the rotating shaft (204) through a coupler, the rotating shaft (204) penetrates through the driving gear (205) and is fixedly connected with the driven gear (206), the driving gear (205) is meshed with the driven gear (206) and is connected with the first rotating rod (207) through the first fixing plate (202) and is fixedly connected with the driving wheel (208), the first rotating rod (207) is movably connected with the first fixing plate (202) through a first bearing, the second fixing plate (209) is installed on the U-shaped plate (209), and is connected with the second rotating rod (210) through a bearing and is connected with the second fixing plate (209), the cutting steel wire (212) is sleeved on the driving wheel (208) and the guide wheel (211).

2. A single crystal silicon wafer cutting apparatus according to claim 1, wherein: reciprocating mechanism includes eccentric circular wheel (213), backup pad (214), gag lever post (215), limiting plate (216), spring (217), pivot (204) and eccentric circular wheel (213) fixed connection, install on L template (7) backup pad (214), eccentric circular wheel (213) and backup pad (214) contact, install on U template (201) gag lever post (215), gag lever post (215) run through L template (7) and limiting plate (216) fixed connection, gag lever post (215) and L template (7) swing joint, spring (217) annular sets up on gag lever post (215), the both ends of spring (217) respectively with L template (7) and limiting plate (216) fixed connection.

3. The apparatus of claim 1, wherein: the base (1) is provided with a pressing device (3), the pressing device (3) comprises a fixed table (301), a first sliding rail (302), a sliding plate (303), a sliding placing groove (304), a baffle plate (305), a grabbing handle (306), a top plate (307), a knob (308), a screw rod (309), a pressing plate (310), a rubber pad (311), a second sliding rail (312) and a fixed placing groove (313), the fixed table (301) is installed on the base (1), the first sliding rail (302) is installed on the fixed table (301), the sliding plate (303) is connected on the first sliding rail (302) in a sliding mode, the sliding placing groove (304) is installed on the sliding plate (303), the sliding placing groove (304) is in contact with the fixed table (301), the baffle plate (305) is installed on the sliding placing groove (304), the grabbing handle (306) is installed on the baffle plate (305), the top plate (303) is installed on the sliding plate (303), the knob (308) is installed on the screw rod (309), the screw rod (309) penetrates through the top plate (307) and is connected with the screw rod (307) and is connected with the pressing plate (310) in a threaded mode, the second sliding rail (312) is installed on the sliding plate (303), the pressing plate (310) is connected on the second sliding rail (312) in a sliding mode, and the fixed placing groove (313) is installed on the fixed table (301).

4. The apparatus of claim 1, wherein: and wire winding grooves are formed in the driving wheel (208) and the guide wheel (211).

5. A single crystal silicon wafer cutting apparatus according to claim 3, wherein: the size and the shape of the sliding placing groove (304) and the fixed placing groove (313) are completely consistent, and arc-shaped concave parts are respectively and uniformly arranged on the sliding placing groove (304) and the fixed placing groove (313) at intervals.

6. The apparatus of claim 1, wherein: a collecting tank (4) is arranged on the base (1), and a filter screen (5) is installed in the collecting tank (4).

7. A single crystal silicon wafer cutting apparatus according to claim 1, wherein: and a scrap collecting box (6) is arranged below the base (1).