CN218517382U

CN218517382U - Semiconductor cleaning support

Info

Publication number: CN218517382U
Application number: CN202222593795.4U
Authority: CN
Inventors: 李琳
Original assignee: Suzhou Gaiqi Intelligent Technology Co ltd
Current assignee: Suzhou Gaiqi Intelligent Technology Co ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-02-24
Anticipated expiration: 2032-09-29

Abstract

The application belongs to the technical field of semiconductor processes, and discloses a semiconductor cleaning support which comprises an ultrasonic cleaning box, wherein support bodies are symmetrically and fixedly connected to two sides of the top end of the ultrasonic cleaning box, a spraying pipe is arranged on one side, close to the back, of the top end of the ultrasonic cleaning box, a cleaning tank is arranged in the center of the top end of the ultrasonic cleaning box, a lifting mechanism is arranged inside the support bodies, a bearing carrier is arranged on one side, opposite to the two support bodies, of each support body, and shells are symmetrically arranged on two sides of the bearing carrier; two the inside of casing is provided with rotating assembly, rotating assembly includes first gear and second gear. After the semiconductor is placed into the bearing carrier, the second knob is rotated, the semiconductor is driven to rotate to the horizontal state through the internal structure, the second knob stops rotating, and the rectangular semiconductor is submerged in the cleaning tank, so that the rectangular semiconductor can be cleaned, and the cleaning time is saved.

Description

Semiconductor cleaning support

Technical Field

The application relates to the technical field of semiconductor processes, in particular to a semiconductor cleaning support.

Background

The method for cleaning the semiconductor at present generally adopts a mode of ultrasonic waves and cleaning agents, and the operation mode of the method is mainly that after a semiconductor product required to be cleaned is placed into a bearing carrier, ultrasonic cleaning is carried out through support of a bracket, so that the surface of the processed semiconductor keeps clean.

The support that some existing small-size semiconductor cleaning equipment used, the function is comparatively single, and mainly used centre gripping bears the weight of the carrier, can't rotate, when wasing the rectangle semiconductor, the width that probably appears the semiconductor is narrower but the condition that highly is higher than the degree of depth of wasing the pond for the part that exceeds the surface of water can't wash in step-by-step operation, comparatively wasted time, consequently provides a semiconductor and washs support.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, the present application provides a semiconductor cleaning rack.

The application provides a semiconductor cleaning support adopts following technical scheme:

a semiconductor cleaning support comprises an ultrasonic cleaning box, wherein support bodies are symmetrically and fixedly connected to the two sides of the top end of the ultrasonic cleaning box, a spraying pipe is arranged on one side, close to the back, of the top end of the ultrasonic cleaning box, a water tank is fixedly connected to the back of the ultrasonic cleaning box, a cleaning tank is arranged in the center of the top end of the ultrasonic cleaning box, a lifting mechanism is arranged inside the support bodies, a bearing carrier is arranged on one side, opposite to the two support bodies, of each support body, and shells are symmetrically arranged on the two sides of the bearing carrier;

two the inside of casing is provided with runner assembly, runner assembly includes first gear and second gear, the top fixedly connected with dwang of first gear, two the top of dwang rotates with the top inner wall of two casings respectively and is connected, one of them the top of dwang extends to the top of casing, and fixedly connected with second knob.

Furthermore, the outer wall of the first gear is meshed with the outer wall of the second gear, and one side, opposite to the second gear, of each of the two second gears is fixedly connected with a connecting rod.

Through above-mentioned technical scheme, rotate the second knob and can drive first gear revolve through the dwang, the second gear is stirred to the first gear of accessible, makes its synchronous rotation.

Furthermore, the opposite ends of the two connecting rods are respectively fixedly connected with the two sides of the bearing carrier, and an arm rod at one end, far away from the bearing carrier, of the connecting rod is rotatably connected with one side, close to the bearing carrier, of the shell.

Through the technical scheme, the second gear drives the bearing carrier to rotate through the connecting rod in the rotating process, so that the semiconductor can be driven to rotate.

Further, elevating system includes threaded rod and movable block, the notch has been seted up to one side that the support body is close to the casing, the top and the bottom of threaded rod rotate with the top and the bottom inner wall of support body respectively and are connected, the top of threaded rod extends to the top of support body, and the first knob of fixedly connected with.

Through above-mentioned technical scheme, rotate first knob for the movable block reciprocates along the pole wall of threaded rod.

Further, the movable block sliding connection is in the inside of notch, the movable block cover is established at the top of threaded rod, two one side that the movable block is relative respectively with two casing opposite one side fixed connection.

Through the technical scheme, after cleaning is finished, the bearing carrier is driven to ascend through the movable block, and the cleaned semiconductor is convenient to take.

Further, the top that bears the weight of the carrier has seted up the standing groove, the inside of standing groove evenly is provided with a plurality of splint, splint all are provided with the division board between two liang, division board fixed connection is in the inside of standing groove.

Through above-mentioned technical scheme, through setting up splint, can a plurality of semiconductors of centre gripping, wash simultaneously.

In summary, the present application includes the following beneficial technical effects:

the utility model discloses a, be provided with the runner assembly in the carrier both sides, put into the semiconductor and bear the carrier after, will bear carrier and semiconductor through elevating system and put into the washing pond, when the rectangle semiconductor highly is higher than the washing pond degree of depth, rotate the second knob, drive first gear rotation through the dwang, stir the second gear of opposite side simultaneously, make the second gear drive connecting rod and bear the carrier and rotate, when the semiconductor rotates to the horizontality, the stall second knob, the rectangle semiconductor this moment, can submerge completely in the washing tank, can once only rinse the rectangle semiconductor, save the scavenging period.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present application;

FIG. 2 is a front cross-sectional structural view of the present application;

fig. 3 is an enlarged schematic view of the structure at a in fig. 2 of the present application.

The reference numbers in the figures illustrate:

1. an ultrasonic cleaning box; 2. a stent body; 3. a threaded rod; 4. a first knob; 5. a housing; 6. a second knob; 7. a connecting rod; 8. a carrying carrier; 9. a splint; 10. a partition plate; 11. a shower pipe; 12. a movable block; 13. rotating the rod; 14. a first gear; 15. a second gear; 16. a water tank.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application; it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments, and all other embodiments obtained by those of ordinary skill in the art without any inventive work based on the embodiments in the present application belong to the protection scope of the present application.

In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in this application will be understood to be a specific case for those of ordinary skill in the art.

The present application is described in further detail below with reference to figures 1-3.

The embodiment of the application discloses semiconductor cleaning support, including ultrasonic cleaning case 1, the top bilateral symmetry fixedly connected with support body 2 of ultrasonic cleaning case 1, the top of ultrasonic cleaning case 1 is close to back one side and is provided with shower 11, the semiconductor is after ultrasonic cleaning, after shower 11 spray rinsing, further wash the waste water on semiconductor surface, improve the cleaning performance of semiconductor, the back fixedly connected with water tank 16 of ultrasonic cleaning case 1, the top center department of ultrasonic cleaning case 1 has seted up the washing tank, the inside of support body 2 is provided with elevating system, elevating system includes threaded rod 3 and movable block 12, the notch has been seted up to one side that support body 2 is close to casing 5, the top and the bottom of threaded rod 3 rotate with the top of support body 2 and bottom inner wall respectively and are connected, the top of threaded rod 3 extends to the top of support body 2, and fixedly connected with first knob 4 of fixedly connected with, movable block 12 sliding connection is in the inside of notch, movable block 12 cover is established at the top of support body 3, the relative one side of two movable blocks 12 is fixedly connected with the opposite one side of two casings 5 respectively, one side relative to two support bodies 2 is provided with the bearing clamp plate 8, the both sides of the symmetrical connection of bearing clamp plate 8 that the bearing the inside of the bearing carrier was provided with the even 10 that the bearing groove 10 of the bearing clamp plate was seted up of the bearing plate 8, the bearing plate 10.

The inside of two casings 5 is provided with rotating assembly, rotating assembly includes first gear 14 and second gear 15, the top fixedly connected with dwang 13 of first gear 14, the top of two dwang 13 is rotated with the top inner wall of two casings 5 respectively and is connected, the top of one of them dwang 13 extends to the top of casing 5, and fixedly connected with second knob 6, the outer wall of first gear 14 and the outer wall intermeshing of second gear 15, the equal fixedly connected with connecting rod 7 in one side that two second gears 15 are relative, the shape of here two connecting rods 7 all is the zigzag, be convenient for put into the washing tank completely with bearing carrier 8, the one end that two connecting rods 7 are relative respectively with the both sides fixed connection who bears carrier 8, connecting rod 7 keeps away from one end armed lever that bears carrier 8 and casing 5 and is close to one side rotation connection who bears carrier 8.

The implementation principle of the semiconductor cleaning bracket in the embodiment of the application is as follows: after the carrier 8 is placed in the ultrasonic cleaning box 1, the second knob 6 is rotated to drive the first gear 14 to rotate through the rotating rod 13, the outer wall of the first gear 14 is meshed with the outer wall of the second gear 15, so that the second gear 15 can be stirred to rotate, the second gear 15 and the opposite side of the carrier 8 are connected through the connecting rod 7, the carrier 8 can be driven to rotate through the connecting rod 7, and the carrier can be horizontally placed in the ultrasonic cleaning box 1.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a semiconductor washs support, includes ultrasonic cleaning case (1), its characterized in that: the ultrasonic cleaning box comprises an ultrasonic cleaning box body (1), support bodies (2) are symmetrically and fixedly connected to two sides of the top end of the ultrasonic cleaning box body (1), a spray pipe (11) is arranged on one side, close to the back, of the top end of the ultrasonic cleaning box body (1), a water tank (16) is fixedly connected to the back of the ultrasonic cleaning box body (1), a cleaning tank is arranged in the center of the top end of the ultrasonic cleaning box body (1), a lifting mechanism is arranged inside the support body (2), a bearing carrier (8) is arranged on one side, opposite to the two support bodies (2), of each support body, and shells (5) are symmetrically arranged on two sides of each bearing carrier (8);

two the inside of casing (5) is provided with rotating assembly, rotating assembly includes first gear (14) and second gear (15), the top fixedly connected with dwang (13) of first gear (14), two the top of dwang (13) rotates with the top inner wall of two casings (5) respectively and is connected, one of them the top of dwang (13) extends to the top of casing (5), and fixedly connected with second knob (6).

2. A semiconductor cleaning rack as defined in claim 1, wherein: the outer wall of the first gear (14) is meshed with the outer wall of the second gear (15), and one side, opposite to the second gear (15), of each of the two gears is fixedly connected with a connecting rod (7).

3. A semiconductor cleaning rack according to claim 2, wherein: the two ends, opposite to the connecting rods (7), of the connecting rods are fixedly connected with the two sides of the bearing carrier (8) respectively, and one end arm rod, far away from the bearing carrier (8), of each connecting rod (7) is rotatably connected with one side, close to the bearing carrier (8), of the shell (5).

4. A semiconductor cleaning rack as defined in claim 1, wherein: elevating system includes threaded rod (3) and movable block (12), the notch has been seted up to one side that support body (2) are close to casing (5), the top and the bottom of threaded rod (3) rotate with the top and the bottom inner wall of support body (2) respectively and are connected, the top of threaded rod (3) extends to the top of support body (2), and the first knob (4) of fixedly connected with.

5. The semiconductor cleaning rack of claim 4, wherein: the movable block (12) is connected inside the groove opening in a sliding mode, the movable block (12) is sleeved at the top of the threaded rod (3), and one side, opposite to the movable block (12), of the movable block (12) is fixedly connected with one side, opposite to the two shells (5), of the movable block.

6. A semiconductor cleaning rack as defined in claim 1, wherein: the bearing carrier is characterized in that a placing groove is formed in the top end of the bearing carrier (8), a plurality of clamping plates (9) are evenly arranged in the placing groove, a partition plate (10) is arranged between every two clamping plates (9), and the partition plate (10) is fixedly connected in the placing groove.