CN218502855U

CN218502855U - Equipment for removing surface dirt of chip and wafer

Info

Publication number: CN218502855U
Application number: CN202222522840.7U
Authority: CN
Inventors: 王威; 安海岩
Original assignee: Wuhan Ruijing Laser Chip Technology Co ltd
Current assignee: Wuhan Ruijing Laser Chip Technology Co ltd
Priority date: 2022-09-22
Filing date: 2022-09-22
Publication date: 2023-02-21
Anticipated expiration: 2032-09-22

Abstract

The application provides a get rid of dirty equipment in chip surface, equipment includes: a chamber; the conveying table is positioned in the cavity, and a plurality of chips or wafers to be decontaminated are sequentially placed on the conveying table; the decontamination mechanism is positioned above the conveying table, and an adhesive film is arranged at the bottom of the decontamination mechanism; therefore, when the conveying table conveys the chip to be decontaminated to the lower part of the decontamination mechanism, the adhering film adhered to the bottom of the decontamination mechanism can be used for effectively removing the dirt on the surface of the chip and the surface of the wafer, and the performance of the chip and the yield of the wafer are ensured.

Description

Equipment for removing dirt on surfaces of chips and wafers

Technical Field

The application relates to the technical field of wafer equipment, in particular to equipment for removing dirtiness of chips and surfaces of wafers.

Background

Wafers are widely used in the semiconductor industry, and when the wafers are manufactured, the cleanliness of the wafers is required to be high, and the quality of the cleanliness directly affects the yield. And after the wafer is diced into chips, new contaminants may be introduced during the dicing process, which may affect the chip performance.

Taking a photoelectric chip as an example, especially for a high-power semiconductor laser chip, as the light output power of a single chip is high, for a light output cavity surface, the light power density born by a light output area reaches 35KW/mm ² Above, such a large power density would generate a large amount of heat energy; meanwhile, high current density in the optical waveguide can cause severe heating of the material; therefore, when the cavity surface or the surface of the chip is polluted, due to the fact that physicochemical properties such as refractive index of the polluted materials are suddenly changed at the position, a non-radiative recombination center is easily formed, light energy is further absorbed to generate heat energy, the efficiency of the chip is greatly reduced, and the polluted materials are used as heating centers to generate ablation, and finally the device is caused to be invalid.

Therefore, how to effectively remove the chip surface contamination and the wafer surface contamination is a technical problem that needs to be solved at present.

Disclosure of Invention

Aiming at the problems in the prior art, the embodiment of the application provides equipment for removing the surface stains of the chip and the wafer, so as to solve or partially solve the technical problem that the chip performance and the wafer yield cannot be ensured because the stains on the surface of the chip and the wafer cannot be effectively removed in the prior art.

The application provides a get rid of dirty equipment in chip and wafer surface, equipment includes:

a chamber;

the conveying table is positioned in the cavity, and a plurality of chips or wafers to be decontaminated are sequentially placed on the conveying table;

the decontamination mechanism is positioned above the conveying table, and an adhesive film is arranged at the bottom of the decontamination mechanism.

In the above solution, the apparatus further includes:

a rack mounted at the bottom of the vacuum chamber, the rack for supporting the transfer table.

In the above aspect, when the support includes one, the transfer table is placed on the support.

In the above scheme, when the number of the brackets is two, the brackets specifically include: a first bracket and a second bracket;

the first support is connected with one side of the conveying table;

the second support is connected with the other side of the conveying table.

In the above-mentioned scheme, scrubbing mechanism includes:

one end of the lifting rod is fixed at the top of the chamber;

and the stamping clamp is arranged at the other end of the lifting rod, and the adhesive film is arranged at the bottom of the stamping clamp.

In the above scheme, the decontamination mechanism further comprises:

and the driving motor is connected with the lifting rod.

In the above scheme, the areas of the imprinting clamp and the adhesive film are larger than the surface area of the chip.

In the above scheme, at least one end of the stamping clamp is bent.

In the above solution, the apparatus further includes: a vacuum pump;

communicating with the chamber through a conduit.

In the above-mentioned scheme, conveying platform bottom is provided with a plurality of penetrable absorption holes.

The application provides a get rid of dirty equipment in chip and wafer surface, equipment includes: a chamber; the conveying table is positioned in the cavity, and a plurality of chips or wafers to be decontaminated are sequentially placed on the conveying table; the decontamination mechanism is positioned above the conveying table, and an adhesive film is arranged at the bottom of the decontamination mechanism; therefore, when the conveying table conveys the chip to be decontaminated to the lower part of the decontamination mechanism, the adhering film adhered to the bottom of the decontamination mechanism can be used for effectively removing the dirt on the surface of the chip and the surface of the wafer, and the performance of the chip and the yield of the wafer are ensured.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to refer to like parts throughout the drawings.

In the drawings:

FIG. 1 is a schematic view of an apparatus for removing surface contamination of a wafer and a chip according to an embodiment of the present disclosure;

FIG. 2 illustrates a schematic structural diagram of a decontamination mechanism, according to one embodiment of the present application;

fig. 3 shows a schematic view of a corresponding desmear configuration when one end of the stamping fixture is curved according to an embodiment of the present application.

Description of reference numerals:

1-a chamber; 2-a transfer station; 3-adhering a film; 4-a vacuum pump; 5-a bracket; 21-a lifting rod; 22-an embossing fixture; 23-light emitting facet.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the positions or elements referred to must have specific orientations, be constructed and operated in specific orientations, and thus, should not be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in this application can be understood as appropriate by one of ordinary skill in the art.

The present embodiment provides an apparatus for removing surface contamination of a chip and a wafer, as shown in fig. 1, the apparatus includes: chamber 1, conveying platform 2 and scrubbing mechanism. The equipment can be used for removing dirt on the surface of a chip and also can be used for removing dirt on the surface of a wafer, and the chip or the wafer can be placed on the conveying table 2 as required.

The apparatus comprises: the conveying table 2 is positioned in the chamber 1, and a plurality of chips or wafers to be decontaminated are sequentially placed on the conveying table 2;

the decontamination mechanism is positioned above the conveying table 2, and the bottom of the decontamination mechanism is provided with an adhesive film 3.

In order to increase the stability of the wafer or the chip in the transmission process, the wafer or the chip can be fixed on the transmission platform 2 through a film with stronger adhesiveness; the chip or the wafer can be adsorbed on the conveying platform in a vacuum adsorption mode. When through vacuum adsorption, the bottom of conveying platform 2 is provided with a plurality of penetrable absorption holes, and accessible absorption hole adsorbs wafer or chip on conveying platform 2.

Thus, the device further comprises: and the vacuum pump 4 is communicated with the chamber 1 through a pipeline and is used for vacuumizing the chamber 1 to ensure that the vacuum state is kept in the chamber 1.

The apparatus of this embodiment further comprises: the motor is installed in the below of conveying platform 2 for drive conveying platform 2 is rotatory, and conveying platform 2 can be circular, also can be other shapes, can confirm based on actual design demand, does not do the restriction. The conveying table 2 can convey the chip or the wafer to a position to be decontaminated through rotation, and the position to be decontaminated is positioned right below the decontamination mechanism.

With continued reference to fig. 1, the apparatus further comprises: and a support 5 installed at the bottom of the chamber 1, the support 5 supporting the transfer table 2.

The bracket 5 of the present embodiment may include one or two brackets. When the support 5 comprises one, the support 5 can be mounted in the center of the chamber 1, with the transfer table 2 placed directly above the support 5; for example, it can be fixed above the bracket 5 by screws.

When the support 5 comprises two, the support 5 may be specifically: a first bracket and a second bracket;

the first bracket is arranged on one side of the chamber 1 and connected with one side of the conveying table 1;

the second support is arranged at the other side of the chamber 1, and the other side of the second support conveying table 1 is connected. The first bracket and the second bracket can also be fixedly connected with the conveying table 2 through screws.

In one embodiment, referring to fig. 2, the decontamination mechanism includes:

one end of the lifting rod 21 is fixed at the top of the chamber 1 and can move along a track at the top of the chamber;

an embossing jig 22 installed at the other end of the lifting rod 21, the bottom of the embossing jig 22 being provided with an adhesive film 3;

and the driving motor is connected with the lifting rod 21.

The driving motor can be a servo motor, and the servo motor can drive the lifting rod 21 to move up and down and can also drive the lifting rod 21 to rotate in a vertical plane.

In practical application, when the wafer or chip to be decontaminated moves to the lower part of the decontamination mechanism, the driving motor drives the lifting rod 21 to descend, the adhesive film 3 is pressed on the surface of the wafer or chip, and the dirt on the surface of the wafer or chip, such as dust and substrate base material scraps generated in the physical cutting process, is removed.

After the adhesion is finished, the driving motor drives the lifting rod 21 to ascend, the conveying table 2 rotates, and the next chip to be decontaminated is conveyed to the position below the decontamination mechanism. The decontaminated chips or wafers are transferred to a collection area. The adhesive film 3 is a special anti-static adhesive film polymer, has certain adhesive capacity, hardly volatilizes dust, and does not leave extra colloid on the surface of an adhered object, so that the dirt removing effect can be ensured.

Further, in order to improve the decontamination effect, the area of the stamping fixture 22 and the adhesive film 3 is larger than the surface area of the chip, so that the adhesive film 3 can be ensured to completely cover the surface of the chip or the wafer, dirt on the surface of the chip or the wafer is adhered away, and the cleanliness of the whole surface is ensured.

Note that, in order to facilitate understanding of the positional relationship among the imprint jig 22, the adhesive film 3, and the wafer or the chip, the gap between the three is exaggerated in fig. 2, and in practical applications, the gap between the imprint jig 22, the adhesive film 3, and the wafer/chip is in the millimeter level.

In view of the fact that the side light-emitting cavity surface needs to be cleaned if the chip is an optoelectronic chip, referring to fig. 3, at least one end of the stamping fixture 22 has a curved shape, which can be shown as 31 in fig. 3. After the stamping fixture 22 finishes cleaning the upper surface of the chip, the lifting rod 21 can rotate in the vertical plane, the curved end of the stamping fixture 22 is moved to one side of the light-emitting cavity surface 23 of the chip, and then the lifting rod 21 is horizontally moved to attach the curved stamping fixture 22 to the light-emitting cavity surface 23 for adhesion cleaning.

In the embodiment, the adhering film adhered to the bottom of the decontamination mechanism can be used for stripping the dirt from the surface of the chip or the wafer by a physical means of stamping adhesion to effectively remove the dirt on the surface of the chip or the surface of the wafer, and secondary pollution can not be introduced to ensure the yield of the wafer and the performance of the chip.

Through one or more embodiments of the present application, the present application has the following advantageous effects or advantages:

the application provides a get rid of dirty equipment in chip surface, equipment includes: a chamber; the conveying table is positioned in the cavity, and a plurality of chips or wafers to be decontaminated are sequentially placed on the conveying table; the decontamination mechanism is positioned above the conveying table, and an adhesive film is arranged at the bottom of the decontamination mechanism; therefore, when the conveying table conveys the chip to be decontaminated to the lower part of the decontamination mechanism, the adhering film adhered to the bottom of the decontamination mechanism can be used for effectively removing the dirt on the surface of the chip and the surface of the wafer, and the performance and the yield of the chip are ensured.

The above description is only exemplary of the present application and should not be taken as limiting the scope of the present application, as any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the scope of the present application.

Claims

1. An apparatus for removing contamination from surfaces of chips and wafers, the apparatus comprising:

a chamber;

2. The apparatus of claim 1, wherein the apparatus further comprises:

a support mounted at the bottom of the chamber, the support for supporting the transfer table.

3. The apparatus of claim 2, wherein the transfer table rests on the support when the support comprises one.

4. The device according to claim 2, characterized in that, when said support comprises two, it comprises in particular: a first bracket and a second bracket;

the first support is connected with one side of the conveying table;

the second support is connected with the other side of the conveying table.

5. The apparatus of claim 1, wherein the decontamination mechanism comprises:

one end of the lifting rod is fixed at the top of the chamber;

6. The apparatus of claim 5, wherein the scrubbing mechanism further comprises:

and the driving motor is connected with the lifting rod.

7. The apparatus of claim 5, wherein the stamping fixture and the adhesive film have an area greater than the chip surface area.

8. The apparatus of claim 5, wherein at least one end of the stamping fixture is curved.

9. The apparatus of claim 1, wherein the apparatus further comprises: a vacuum pump;

communicating with the chamber through a conduit.

10. The apparatus of claim 1, wherein the transfer table bottom is provided with a plurality of permeable adsorption holes.