CN218491839U

CN218491839U - Heating electrostatic adsorption disc assembly based on semiconductor physical vapor deposition equipment

Info

Publication number: CN218491839U
Application number: CN202222736026.5U
Authority: CN
Inventors: 武斌; 陈兆荣; 蔡红
Original assignee: Selinsmi Wuxi Electronic Technology Co ltd
Current assignee: Selinsmi Wuxi Electronic Technology Co ltd
Priority date: 2022-10-18
Filing date: 2022-10-18
Publication date: 2023-02-17
Anticipated expiration: 2032-10-18

Abstract

The utility model discloses a heating electrostatic chuck subassembly based on semiconductor physical vapor deposition equipment relates to heating electrostatic chuck technical field, including the supporting baseplate, the bottom fixed mounting of supporting baseplate has a plurality of supporting leg, the top fixed mounting of supporting baseplate has the setting tank, the internally mounted of setting tank has the backup pad, the mounting bracket is installed at the top of backup pad, the side-mounting of mounting bracket has the installation component. Heating electrostatic absorption dish subassembly based on semiconductor physical vapor deposition equipment, carry out the installation to electrostatic absorption dish through the installation component that sets up, C style of calligraphy installing frame carries out the both sides of installing at mounting bracket, heating brake subassembly and heating heat-conducting component through the construction bolt that sets up to carry out the installation to electrostatic absorption dish, conveniently carry out subsequent detection and dismantlement, increase the convenient degree of device, improve the practicality of device.

Description

Heating electrostatic adsorption disc assembly based on semiconductor physical vapor deposition equipment

Technical Field

The utility model relates to a heating static adsorbs dish technical field, in particular to heating static adsorbs dish subassembly based on semiconductor physical vapor deposition equipment.

Background

In the process steps of etching, physical vapor deposition and chemical vapor deposition of semiconductor wafers, an electrostatic adsorption device is usually used to fix and support the semiconductor wafers. The electrostatic chuck apparatus generally includes a susceptor and an electrostatic chuck disposed on the susceptor for chucking a semiconductor wafer. The electrostatic adsorption device utilizes the electrostatic adsorption principle to adsorb the semiconductor wafer to be processed on the surface of the electrostatic adsorption disc, so that the semiconductor wafer is prevented from shifting or misplacing in the process of technological treatment. However, some impurity particles are often accumulated on the surface of the electrostatic chuck in the conventional electrostatic chuck device, and the conventional electrostatic chuck device is only used for adsorbing the semiconductor wafer, and no removal measure is provided for the impurity particles on the surface of the electrostatic chuck, which not only causes an error alarm to be generated on the electrostatic chuck machine, and affects the normal operation of the semiconductor wafer processing procedure, but also may cause damage to the surface of the semiconductor wafer, and meanwhile, the electrostatic chuck is complicated to manufacture during installation, and is inconvenient for subsequent maintenance and disassembly. Therefore, how to effectively remove the impurity particles on the surface of the electrostatic chuck in the electrostatic chuck to ensure the normal and efficient processing of the semiconductor wafer processing procedure is a technical problem to be solved at present.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides heating static adsorption dish subassembly based on semiconductor physical vapor deposition equipment can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the heating electrostatic adsorption disc assembly based on the semiconductor physical vapor deposition equipment comprises a supporting base plate, wherein a plurality of supporting legs are fixedly installed at the bottom of the supporting base plate, a settling tank is fixedly installed at the top of the supporting base plate, a supporting plate is installed inside the settling tank, an installation frame is installed at the top of the supporting plate, and an installation assembly is installed on the side surface of the installation frame;

the mounting assembly comprises a C-shaped mounting frame arranged on the side surface of the mounting frame, mounting bolts are arranged at two ends of the C-shaped mounting frame, the C-shaped mounting frame is connected to the side surface of the mounting frame and the side surface of the heating brake assembly through the mounting bolts, a mounting plate is arranged on the side surface of the mounting frame through bolts, a supporting damping assembly is fixedly arranged on the side surface of the mounting plate, the top fixed mounting who supports damper has the rubber mounting panel, the rubber mounting panel passes through the bolt and installs the side at heating brake subassembly, the cover is equipped with buffer spring on supporting damper's the outer wall, it corresponds the setting with buffer spring to support damper, it corresponds the setting with C style of calligraphy installing frame to support damper, it sets up the top at C style of calligraphy installing frame to support damper.

Preferably, the mounting bracket has two, installs respectively in the top of backup pad and is close to the position on left side and right side, the top and the bottom fixed mounting of mounting bracket have T type installation piece, T type installation piece is pegged graft in the inside of T type mounting groove, T type mounting groove is seted up on the top of backup pad and the inner wall of setting tank, T type mounting groove corresponds the setting with T type installation piece.

Preferably, the position that the side of mounting bracket is close to the top is installed and is cleaned the subassembly, clean the subassembly including installing the install bin at the mounting bracket back, the cover is equipped with L type protective frame on the outer wall of install bin, the top fixed mounting of L type protective frame is at the back of mounting bracket.

Preferably, the internally mounted of install bin has driving motor, driving motor's openly installs the rotation axis, the rotation axis corresponds the setting with driving motor, the top cover of rotation axis is established in the inside of installation bearing housing, the installation bearing housing is installed inside the back of mounting bracket, the rotation axis passes through the installation bearing housing and installs inside the back of mounting bracket, the top fixedly connected with hob of rotation axis.

Preferably, the hob is connected with the rotating shaft through an installation bearing sleeve, the hob is installed in the sliding groove, the sliding groove is formed in the side face of the mounting frame, a sliding block is sleeved on the outer wall of the hob, the sliding block is installed in the sliding groove, the sliding block corresponds to be arranged with the sliding groove, a connecting plate is fixedly installed on the right side of the sliding block, a cleaning sponge brush is fixedly installed at the bottom of the connecting plate, and the cleaning sponge brush corresponds to be arranged with the connecting plate.

Preferably, the heating brake assembly is installed at the top of backup pad, the heating heat conduction subassembly is installed in the top installation of heating brake assembly, the mounting groove has been seted up at the top of heating heat conduction subassembly, the embedded lug that installs in the inside of mounting groove, electrostatic adsorption dish is installed at the top of lug, electrostatic adsorption dish passes through the lug and is connected with the heating heat conduction subassembly, the top of electrostatic adsorption dish is provided with cleans the sponge brush.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. the utility model discloses in, carry out the installation to the electrostatic absorption dish through the installation component that sets up, C style of calligraphy installing frame carries out the both sides to installing at mounting bracket, heating brake subassembly and heating heat conduction subassembly through the construction bolt that sets up to carry out the installation to the electrostatic absorption dish, conveniently carry out subsequent detection and dismantlement, increase the convenient degree of device, improve the practicality of device.

2. The utility model discloses in, carry out cleaning to the dust that cleans the subassembly surface through the subassembly that cleans that sets up, drive the hob through the driving motor operation that sets up and rotate to make the sliding block slide, reach the connecting plate and clean the cleaning action of sponge brush to the dust on electrostatic absorption dish surface, increase the stability of electrostatic absorption dish work, increase operating mass with efficiency.

Drawings

FIG. 1 is a schematic structural diagram of the whole device of the present invention;

FIG. 2 is a schematic view of the internal structure of the device of the present invention;

fig. 3 is a schematic structural diagram of the front view of the device of the present invention;

FIG. 4 is a schematic view of a portion of the sweeping assembly of the present invention;

fig. 5 is an enlarged schematic structural diagram of the utility model at a.

In the figure: 1. a support base plate; 2. supporting legs; 3. a settling tank; 4. a support plate; 5. a mounting frame; 6. a T-shaped mounting block; 7. a T-shaped mounting groove; 8. heating the brake assembly; 9. heating the heat conducting assembly; 10. an electrostatic chuck; 11. mounting grooves; 12. a bump; 13. mounting the component; 14. c-shaped mounting frames; 15. installing a bolt; 16. mounting a plate; 17. supporting the shock-absorbing assembly; 18. a buffer spring; 19. a rubber mounting plate; 20. a sweeping assembly; 21. installing a box; 22. an L-shaped protective frame; 23. a drive motor; 24. a rotating shaft; 25. mounting a bearing sleeve; 26. a screw rod; 27. a sliding groove; 28. a slider; 29. a connecting plate; 30. cleaning sponge brush.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

Referring to fig. 1, 2, 3 and 5, the heating electrostatic chuck assembly based on the semiconductor physical vapor deposition device includes a support base plate 1, a plurality of support legs 2 are fixedly installed at the bottom of the support base plate 1, a settling tank 3 is fixedly installed at the top of the support base plate 1, a support plate 4 is installed inside the settling tank 3, a mounting frame 5 is installed at the top of the support plate 4, and a mounting assembly 13 is installed at the side surface of the mounting frame 5;

the mounting assembly 13 comprises a C-shaped mounting frame 14 mounted on the side of the mounting frame 5, mounting bolts 15 are mounted at two ends of the C-shaped mounting frame 14, the C-shaped mounting frame 14 is connected to the side of the mounting frame 5 and the side of the heating brake assembly 8 through the mounting bolts 15, a mounting plate 16 is mounted on the side of the mounting frame 5 through bolts, a supporting damping assembly 17 is fixedly mounted on the side of the mounting plate 16, a rubber mounting plate 19 is fixedly mounted at the top end of the supporting damping assembly 17, the rubber mounting plate 19 is mounted on the side of the heating brake assembly 8 through bolts, a buffer spring 18 is sleeved on the outer wall of the supporting damping assembly 17, the supporting damping assembly 17 corresponds to the buffer spring 18, the supporting damping assembly 17 corresponds to the C-shaped mounting frame 14, the supporting damping assembly 17 is arranged at the top of the C-shaped mounting frame 14, the mounting assembly 13 is used for mounting the electrostatic adsorption disc, the C-shaped mounting frame 14 is used for mounting the two sides of the mounting frame 5, the heating brake assembly 8 and the heating heat conduction assembly 9 through the mounting bolt 15, so as to mount the electrostatic adsorption disc, the subsequent detection and disassembly are convenient, the convenience of the device is increased, and the convenience of the device is improved, and the practicability of the device;

referring to fig. 1, 2, 3 and 4, a cleaning assembly 20 is installed at a position close to the top of the side surface of the mounting frame 5, the cleaning assembly 20 includes a mounting box 21 installed at the back surface of the mounting frame 5, an L-shaped protective frame 22 is sleeved on the outer wall of the mounting box 21, the top end of the L-shaped protective frame 22 is fixedly installed at the back surface of the mounting frame 5, a driving motor 23 is installed inside the mounting box 21, a rotating shaft 24 is installed at the front surface of the driving motor 23, the rotating shaft 24 is arranged corresponding to the driving motor 23, the top end of the rotating shaft 24 is sleeved inside a mounting bearing sleeve 25, the mounting bearing sleeve 25 is installed inside the back surface of the mounting frame 5, the rotating shaft 24 is installed inside the back surface of the mounting frame 5 through the mounting bearing sleeve 25, a screw rod 26 is fixedly connected to the top end of the rotating shaft 24, the screw rod 26 is connected to the rotating shaft 24 through the mounting bearing sleeve 25, screw 26 installs the inside at sliding tray 27, sliding tray 27 sets up the side at mounting bracket 5, the cover is equipped with sliding block 28 on screw 26's the outer wall, sliding block 28 installs the inside at sliding tray 27, sliding block 28 corresponds the setting with sliding tray 27, sliding block 28's right side fixed mounting has connecting plate 29, connecting plate 29's bottom fixed mounting has cleans sponge brush 30, clean sponge brush 30 and connecting plate 29 and correspond the setting, clean subassembly 20 through the setting and go on cleaning to the dust on cleaning subassembly 20 surface, driving motor 23 through the setting runs and drives screw 26 and rotate, thereby make sliding block 28 slide, reach connecting plate 29 and clean the cleaning effect of sponge brush 30 to the dust on electrostatic absorption dish surface, increase the stability of electrostatic absorption dish work, increase operating mass and efficiency.

It should be noted that, the utility model discloses a heating electrostatic chuck subassembly based on semiconductor physical vapor deposition equipment, the installation effect to electrostatic chuck is carried out through the installation component 13 that sets up during the use, the both ends fixed mounting of mounting bracket 5 has T type installation piece 6, peg graft through T type installation piece 6 and install in the inside of T type mounting groove 7, the installation bolt 15 of rethread setting carries out the installation to C style of calligraphy installing frame 14, make C style of calligraphy installing frame 14 connect mounting bracket 5, heating brake subassembly 8 and heating heat conduction subassembly 9, thereby reach the installation of electrostatic chuck, conveniently carry out subsequent detection and dismantlement, increase the convenient degree of device, support damping component 17 and buffer spring 18 are installed at the top of C style of calligraphy installing frame 14 simultaneously, carry out support and cushioning effect to mounting bracket 5 and electrostatic chuck subassembly, increase the stability of device, the top of electrostatic chuck is provided with subassembly 20 simultaneously, through the driving motor 23 operation that sets up, it rotates to drive rotation axis 24, make rotation axis 24 drive the rotation of screw rod 26, make spiral 28 drive connecting plate 29 and sponge brush 30 carry out the cleaning of electrostatic chuck dust, guarantee the quality of the work of electrostatic chuck.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. Heating electrostatic chuck subassembly based on semiconductor physical vapor deposition equipment, including supporting baseplate (1), its characterized in that: the bottom of the supporting base plate (1) is fixedly provided with a plurality of supporting legs (2), the top of the supporting base plate (1) is fixedly provided with a settling tank (3), a supporting plate (4) is arranged inside the settling tank (3), the top of the supporting plate (4) is provided with an installing frame (5), and the side surface of the installing frame (5) is provided with an installing component (13);

installing component (13) is including installing C style of calligraphy installing frame (14) in mounting bracket (5) side, installing bolt (15) are installed at the both ends of C style of calligraphy installing frame (14), C style of calligraphy installing frame (14) is connected in the side of mounting bracket (5) and the side of heating brake subassembly (8) through installing bolt (15), mounting panel (16) are installed through the bolt to the side of mounting bracket (5), the side fixed mounting of mounting panel (16) has support damping component (17), the top fixed mounting who supports damping component (17) has rubber mounting panel (19), rubber mounting panel (19) are installed in the side of heating brake subassembly (8) through the bolt, the cover is equipped with buffer spring (18) on the outer wall of support damping component (17), support damping component (17) and buffer spring (18) and correspond the setting, support damping component (17) and C style of calligraphy installing frame (14) and correspond the setting, support damping component (17) and set up the top at C style of calligraphy installing frame (14).

2. The semiconductor physical vapor deposition apparatus-based heated electrostatic chuck assembly of claim 1, wherein: mounting bracket (5) have two, install respectively and be close to left side and right side position at the top of backup pad (4), the top and the bottom fixed mounting of mounting bracket (5) have T type installation piece (6), T type installation piece (6) are pegged graft in the inside of T type mounting groove (7), set up on the inner wall of the top of backup pad (4) and setting tank (3) T type mounting groove (7) and T type installation piece (6) correspond the setting.

3. The semiconductor physical vapor deposition apparatus-based heated electrostatic chuck assembly of claim 1, wherein: the side of mounting bracket (5) is close to the position at top and installs and cleans subassembly (20), clean subassembly (20) including installing install bin (21) at mounting bracket (5) back, the cover is equipped with L type protective frame (22) on the outer wall of install bin (21), the top fixed mounting of L type protective frame (22) is at the back of mounting bracket (5).

4. The semiconductor physical vapor deposition apparatus-based heated electrostatic chuck assembly of claim 3, wherein: the internally mounted of install bin (21) has driving motor (23), rotation axis (24) are installed in the front of driving motor (23), rotation axis (24) correspond the setting with driving motor (23), the inside at installation bearing housing (25) is established to the top cover of rotation axis (24), installation bearing housing (25) are installed inside the back of mounting bracket (5), rotation axis (24) are installed inside the back of mounting bracket (5) through installation bearing housing (25), the top fixedly connected with hob (26) of rotation axis (24).

5. The semiconductor physical vapor deposition apparatus-based heated electrostatic chuck assembly of claim 4, wherein: screw rod (26) are connected with rotation axis (24) through installation bearing housing (25), the inside at sliding tray (27) is installed in screw rod (26), the side at mounting bracket (5) is seted up in sliding tray (27), the cover is equipped with sliding block (28) on the outer wall of screw rod (26), the inside at sliding tray (27) is installed in sliding block (28), the right side fixed mounting of sliding block (28) has connecting plate (29), the bottom fixed mounting of connecting plate (29) has cleans sponge brush (30).

6. The semiconductor physical vapor deposition apparatus-based heated electrostatic chuck assembly of claim 1, wherein: heating braking subassembly (8) are installed at the top of backup pad (4), heating heat conduction subassembly (9) are installed to the top installation of heating braking subassembly (8), mounting groove (11) have been seted up at the top of heating heat conduction subassembly (9), lug (12) are installed to the inside embedded of mounting groove (11), electrostatic adsorption dish (10) are installed at the top of lug (12), electrostatic adsorption dish (10) are connected with heating heat conduction subassembly (9) through lug (12), the top of electrostatic adsorption dish (10) is provided with cleans sponge brush (30).