CN218487454U

CN218487454U - Laser processing apparatus

Info

Publication number: CN218487454U
Application number: CN202121945246.8U
Authority: CN
Inventors: 张远修; 刘振
Original assignee: Makeblock Co Ltd
Current assignee: Makeblock Co Ltd
Priority date: 2021-08-18
Filing date: 2021-08-18
Publication date: 2023-02-17
Anticipated expiration: 2031-08-18

Abstract

The application provides a laser processing apparatus. The laser processing equipment comprises a rack, wherein a processing space is formed in the rack and used for placing a workpiece to be processed; a mounting frame mounted on the frame and located within the processing space, the mounting frame having a mounting surface facing the processing space; the camera is arranged on the mounting surface of the mounting rack and is used for shooting an image of the workpiece to be machined; and the light supplement lamp is arranged on the mounting frame and is adjacent to the camera. The laser processing equipment of the embodiment of the application can greatly reduce the reflection of the imaging, and the imaging brightness is more uniform.

Description

Laser processing apparatus

Technical Field

The application relates to the field of laser processing, in particular to laser processing equipment.

Background

The design scheme of the light supplement lamp of the current small laser processing equipment (desktop laser processing equipment or desktop laser processing equipment) enables the obtained image of the workpiece to be processed to be uneven in brightness and serious in light reflection, so that the accuracy and precision of the laser processing equipment are greatly influenced.

SUMMERY OF THE UTILITY MODEL

To the above problem, the embodiment of the present application provides a laser processing apparatus, which can greatly reduce the reflection of the image, and the image is more uniform in brightness.

The embodiment of the application provides a laser processing equipment, it includes:

the machining device comprises a rack, a machining device and a machining device, wherein a machining space is formed in the rack and used for placing a workpiece to be machined;

a mounting bracket mounted on the frame and located within the processing space, the mounting bracket having a mounting surface facing the processing space;

the camera is arranged on the mounting surface of the mounting rack and used for shooting an image of the workpiece to be machined; and

the light supplement lamp is arranged on the mounting frame and is adjacent to the camera.

Optionally, the machine frame has a first opening, the first opening is communicated with the processing space, and the machine frame further includes a bearing table, the bearing table is located at one end of the machine frame far away from the first opening and is used for bearing the workpiece to be processed; the bearing table comprises a first end and a second end which are arranged oppositely, the plane formed by the camera and the first end is a first plane, the plane formed by the camera and the second end is a second plane, and the included angle between the optical axis of the camera and the first plane is equal to the included angle between the optical axis of the camera and the second plane;

or,

the rack is of a cylinder structure and comprises a first opening and a second opening which are oppositely arranged; the machine frame encloses the processing space communicated with the first opening and the second opening, and the second opening end of the machine frame comprises a third end and a fourth end which are oppositely arranged; the camera with the plane that the third end is constituteed is the third plane, the camera with the plane that the fourth end is constituteed is the fourth plane, the optical axis of camera with contained angle between the third plane with the optical axis of camera with the contained angle on fourth plane equals.

Optionally, when the rack includes a stage, an intersection point of a center line of the fill-in light and the stage is an irradiation point, and a ratio between a vertical distance from the irradiation point to the first end and a vertical distance from the irradiation point to the second end is 1 to 3: 5;

when the rack is of a cylindrical structure, an intersection point of a center line of the light supplement lamp and a plane formed by the second opening is a radiation point, and a ratio of a vertical distance from the radiation point to the third end to a vertical distance from the radiation point to the fourth end is 1 to 1:5.

optionally, the light filling lamp includes a plurality of light filling sub-lamps, and a plurality of light filling sub-lamps are arranged along the extending direction of the mounting bracket at intervals in sequence.

Optionally, the plurality of light supplement sub-lamps are arranged at equal intervals.

Optionally, the camera is disposed in a middle position of the plurality of fill-in sub-lamps.

Optionally, the mounting surface of the mounting frame is provided with a receiving groove, and the camera is arranged in the receiving groove.

Optionally, the frame has a first opening, the first opening communicates with the processing space, the laser processing apparatus further includes a cover plate, the cover plate is rotatably connected to the frame for closing the first opening, and the mounting frame is located at one end of the frame adjacent to the first opening.

Optionally, the rack comprises a bottom plate, and a first side plate, a second side plate, a third side plate and a fourth side plate which are sequentially connected end to end, wherein the bottom plate is respectively connected with the first side plate, the second side plate, the third side plate and the fourth side plate; the bottom plate, the first side plate, the second side plate, the third side plate and the fourth side plate are enclosed to form the processing space, the rack is provided with a first opening, and the first opening is communicated with the processing space.

Optionally, the laser processing equipment further comprises a laser head, wherein the laser head is arranged on the rack, is positioned in the processing space, and is used for emitting laser to process the workpiece to be processed; the rack further comprises a shielding plate, the shielding plate is arranged at the end part, adjacent to the first opening, of the first side plate, the shielding plate extends from the first side plate to the third side plate, and the mounting rack is arranged on one side, away from the first opening, of the shielding plate.

The camera and the light filling lamp that this application embodiment's laser beam machining set up all set up on the mounting bracket, and the light filling lamp is close to the camera setting, and this makes to treat that bright dark on the machined part is more even, can not see obvious reflection of light region, and greatly reduced the reflection of light has improved the quality that the camera acquireed the image to laser beam machining equipment's processing accuracy and precision have been promoted. In addition, the camera sets up on the mounting bracket, compares in the camera and installs in the scheme of apron, has not only simplified walking of camera, can also be better prevent that the apron warp or the camera position that the relapse switch caused from changing to the debugging before having avoided laser beam machining has improved machining efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic configuration diagram of a laser processing apparatus of the related art.

Fig. 2 is a schematic structural diagram of a laser processing apparatus according to an embodiment of the present application.

Fig. 3 is a schematic diagram of a partially exploded structure of a laser processing apparatus according to an embodiment of the present application.

Fig. 4 is an exploded view of another perspective of the laser processing apparatus of the embodiment of the present application.

Fig. 5 is a schematic structural view of a laser processing apparatus according to still another embodiment of the present application.

Fig. 6 is a schematic diagram of a positional relationship between a camera and a carrier stage of the laser processing apparatus according to the embodiment of the present application.

Fig. 7 is a schematic diagram of a positional relationship between a camera and an end of a frame, which is far from the camera, of the laser processing apparatus according to the embodiment of the present application.

Fig. 8 is a schematic view of a position relationship between a fill-in lamp and a carrying table of the laser processing apparatus according to the embodiment of the present application.

Fig. 9 is a schematic view of a position relationship between a fill-in light of the laser processing device and an end of the frame far from the camera according to the embodiment of the present application.

Fig. 10 is a circuit block diagram of a laser processing apparatus according to an embodiment of the present application.

Description of reference numerals:

100' -laser processing device 101-processing space

10' -frame 103-first opening

30' -cover plate 105-second opening

50' -Camera 11-first side plate

111-air exhaust hole of 70' -light supplement lamp

100-laser machining apparatus 12-second side plate

10-frame 13-third side plate

14-fourth side panel 20-cover panel

15-base plate 30-mounting rack

151-third end 31-mounting surface

153-fourth end 312-receiving groove

16-bearing table 40-laser head

161-first end 50-camera

163-second end 60-exhaust fan

17-baffle 70-light supplement lamp

102-first plane 71-fill light sub-lamp

104-second plane 80-processor

106-third plane 90-memory

108-fourth plane

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.

When the laser processing equipment carries out laser processing, the image of the workpiece to be processed needs to be acquired, the laser head of the laser processing equipment is controlled according to the image of the workpiece to be processed to process the workpiece, and if the acquired image is poor in quality or has the phenomena of light reflection and the like, the processing quality, the processing accuracy and the processing precision of the laser processing equipment can be greatly influenced. As shown in fig. 1, the camera 50' of the laser processing apparatus 100' of the related design is typically disposed on the cover plate 30' (door panel), and the fill-in light 70' is disposed at opposite ends of the frame 10 '. Therefore, when the camera 50 'takes a picture to acquire an image of a workpiece to be processed, the acquired image is uneven in brightness, and two strong reflective belts are formed below the light supplement lamp 70'. Thereby affecting the quality of the image obtained by the camera 50 'and further affecting the accuracy and precision of the laser processing device 100' for processing the workpiece to be processed.

Referring to fig. 2 to 4, the present embodiment provides a laser processing apparatus 100, which includes: the machining device comprises a machine frame 10, wherein a machining space 101 is formed in the machine frame 10, and the machining space 101 is used for placing a workpiece to be machined; a mounting block 30, the mounting block 30 being mounted on the frame 10 and located in the processing space 101, the mounting block 30 having a mounting surface 31 facing the processing space 101; the camera 50 is arranged on the mounting surface 31 of the mounting frame 30 and is used for shooting an image of the workpiece to be machined; and a light supplement lamp 70, wherein the light supplement lamp 70 is disposed on the mounting frame 30 and adjacent to the camera 50.

The camera 50 and the light filling lamp 70 of the laser processing equipment 100 of the embodiment of the application are arranged on the mounting frame 30, the light filling lamp 70 is arranged close to the camera 50, the brightness of the workpiece to be processed is more uniform, the obvious reflection area cannot be seen, the reflection of light is greatly reduced, the quality of the image acquired by the camera 50 is improved, and the processing accuracy and precision of the laser processing equipment 100 are improved. In addition, camera 50 sets up on mounting bracket 30, compares in the scheme that camera 50 installed in the apron, has not only simplified camera 50's the line of walking, can also be better prevent that the apron from warping or the camera 50 position that the repetition switch caused changes to debugging before having avoided laser beam machining, improved machining efficiency.

Referring again to fig. 4, in some embodiments, the frame 10 has a first opening 103, and the first opening 103 is in communication with the processing space 101. In a specific embodiment, the rack 10 includes a bottom plate 15, and a first side plate 11, a second side plate 12, a third side plate 13, and a fourth side plate 14 connected end to end in sequence, where the bottom plate 15 is connected to the first side plate 11, the second side plate 12, the third side plate 13, and the fourth side plate 14 respectively; the bottom plate 15, the first side plate 11, the second side plate 12, the third side plate 13, and the fourth side plate 14 enclose the processing space 101, and form the first opening 103.

In some embodiments, the machine frame 10 further comprises a bearing table 16, wherein the bearing table 16 is located at the bottom of the processing space 101 and is used for bearing the workpiece to be processed; in other words, the bearing platform 16 is located at an end of the frame 10 away from the first opening 103. Optionally, the carrier 16 is disposed on the base plate 15. The carrier 16 includes a first end 161 and a second end 163 disposed opposite to each other. In other embodiments, the base plate 15 serves as the carrier 16, in other words, the base plate 15 and the carrier 16 are integrated or are the same component.

Referring to fig. 5, in some embodiments, the frame 10 is a cylindrical structure, and the frame 10 includes a first opening 103 and a second opening 105 disposed oppositely; the frame 10 encloses the processing space 101 communicating with the first opening 103 and the second opening 105, and the second opening 105 end of the frame 10 includes a third end 151 and a fourth end 153 oppositely disposed.

It is understood that the specific shape of the frame 10 may be various, for example, the frame may be a cylinder with two open ends or one closed end, and the cross section may be a circle, a triangle, a quadrangle, a polygon, a special shape, etc., and the frame 10 of this embodiment is not limited specifically, and only needs to participate in forming the processing space 101. In some embodiments, the bottom of the frame 10 may be hollowed out, and when in use, the laser processing apparatus 100 may be placed on an external bearing surface such as a table or a metal plate surface.

In one embodiment, the frame 10 includes a first side plate (not shown), a second side plate (not shown), a third side plate (not shown), and a fourth side plate (not shown) connected end to end in sequence; the first side plate, the second side plate, the third side plate and the fourth side plate enclose the processing space 101, and form the first opening 103 and the second opening 105. In other words, the bottom of the frame 10 is hollowed, so that when in use, the laser processing apparatus 100 can be placed on a supporting surface outside a table or a metal plate, and a workpiece to be processed can be directly placed on the table or the metal plate.

Referring to fig. 4, in some embodiments, the rack 10 further includes a shielding plate 17, the shielding plate 17 is disposed at an end of the first side plate 11 adjacent to the first opening 103, and the shielding plate 17 extends from the first side plate 11 to the third side plate 13.

Referring to fig. 3 and 4, in some embodiments, the mounting frame 30 is disposed near the first side plate 11 and away from the bottom plate 15; in other words, the mounting bracket 30 is located at the end of the first side plate 11 away from the bottom plate 15, so that the whole laser processing device 100 can be more compact and more miniaturized. In some embodiments, the mount 30 is mounted to the first side plate 11. In other embodiments, the opposite ends of the mounting frame 30 are respectively mounted to the second side plate 12 and the fourth side plate 14. Optionally, the mounting bracket 30 extends from the second side panel 12 to the fourth side panel 14. Optionally, the mounting surface 31 of the mounting bracket 30 is provided with a receiving groove 312. Optionally, the receiving groove 312 is located at a middle position of the mounting frame 30, and is used for disposing the camera 50. The term "neutral position" in this application refers to the exact center, or a portion near the exact center, of the component.

In some embodiments, the mounting bracket 30 is disposed on a side of the shielding plate 17 facing away from the first opening 103, in other words, the mounting bracket 30 is disposed on a side of the shielding plate 17 facing the processing space 101. The shielding plate 17 can shield the mounting frame 30, so that the inside of the laser processing equipment 100 can not be seen by naked eyes, and the whole appearance is more attractive.

In some embodiments, mount 30 and frame 10 are two distinct components that are assembled together to form the structure described in the embodiments of the present application. In other embodiments, the mounting frame 30 and the rack 10 are an integral structure or the mounting frame 30 is a part of the rack 10, in other words, the camera 50 and the fill light 70 are both disposed on the rack 10.

Referring to fig. 3, in some embodiments, the camera 50 is disposed in the accommodating groove 312. Optionally, the camera 50 is disposed in the accommodating groove 312. Like this can be better when preventing to treat the machined part, accidentally injure camera 50, still have better dustproof effect, improve camera 50's life. When the accommodating groove 312 is disposed at the middle position of the mounting bracket 30, the overall image of the workpiece to be processed can be better photographed.

Referring to fig. 6, in some embodiments, a plane formed by the camera 50 and the first end 161 of the carrier 16 is a first plane 102, a plane formed by the camera 50 and the second end 163 of the carrier 16 is a second plane 104, and an included angle α between an optical axis of the camera 50 and the first plane 102 is equal to an included angle β between the optical axis of the camera 50 and the second plane 104. This may enable the image of the workpiece to be processed acquired by the camera 50 to have better quality, so that the laser processing apparatus 100 may process the workpiece to be processed more accurately. The term "optical axis" in the present application refers to an axis of symmetry of the camera 50 or an axis of symmetry of an optical system of the camera 50.

Referring to fig. 7, in other embodiments, a plane formed by the camera 50 and the third end 151 is a third plane 106, a plane formed by the camera 50 and the fourth end 153 is a fourth plane 108, and an included angle between an optical axis of the camera 50 and the third plane 106 is equal to an included angle between the optical axis of the camera 50 and the fourth plane 108. This can make the image of the workpiece to be processed acquired by the camera 50 have better quality, so that the laser processing apparatus 100 can process the workpiece to be processed more accurately.

Referring to fig. 3 and 4 again, optionally, the fill light 70 may be disposed on the mounting surface 31, or may be disposed on another surface adjacent to the camera 50, which is not specifically limited in the present application. The vertical distance from the camera 50 to the fill-in light 70 is less than or equal to 10cm, for example: less than 8cm, less than 6cm, less than 3cm, etc.; specifically, the vertical distance from the camera 50 to the fill light 70 may be, but is not limited to, 10cm, 8cm, 6cm, 4cm, 3cm, and the like. This can make the image of the workpiece to be processed acquired by the camera 50 have better quality, so that the laser processing apparatus 100 can process the workpiece to be processed more accurately.

Optionally, the supplementary lighting lamp 70 includes a plurality of supplementary lighting sub-lamps 71, and the supplementary lighting sub-lamps 71 are sequentially arranged at intervals along an extending direction (as shown by an arrow a in fig. 3) of the mounting frame 30. Optionally, the light supplement sub-lamps 71 are sequentially spaced from the second side plate 12 to the fourth side plate 14. In some embodiments, the light supplement sub-lamps 71 are disposed at equal intervals, and in other embodiments, the light supplement sub-lamps 71 may also be arranged at unequal intervals. When the plurality of light supplement sub-lamps 71 are arranged on the mounting frame 30 at equal intervals, the brightness of the image obtained by the camera 50 is more uniform, and the reflected light is smaller.

Optionally, the camera 50 is disposed in a middle position of the plurality of fill-in sub-lamps 71. This can make the image obtained by the camera 50 more uniform in brightness and less reflective.

Referring to fig. 8, in some embodiments, an intersection point of the center line of the fill-in lamp 70 and the carrier 16 is an irradiation point O, and a ratio between a vertical distance S1 from the irradiation point O to the first end 161 and a vertical distance S2 from the irradiation point O to the second end 163 is 1:5; specifically, there may be, but is not limited to, 1. This can make the image obtained by the camera 50 more uniform in brightness and less reflective. The term "center line of the fill light 70" in the present application refers to a center line of a light beam emitted from the fill light 70. Further, when the ratio of the vertical distance S1 from the irradiation point O to the first end 161 to the vertical distance S2 from the irradiation point O to the second end 163 is 1.

Referring to fig. 9, in some embodiments, an intersection point of a center line of the fill light 70 and a plane formed by the second opening 105 is an irradiation point O, and a ratio between a vertical distance from the irradiation point O to the third end 151 and a vertical distance from the irradiation point to the fourth end 153 is 1:5; specifically, there may be, but is not limited to, 1. This can make the image obtained by the camera 50 more uniform in brightness and less reflective. Further, when the ratio of the vertical distance S1 from the irradiation point O to the third end 151 to the vertical distance S2 from the irradiation point O to the fourth end 153 is 1.

Referring to fig. 2 and 3, in some embodiments, the laser processing apparatus 100 of the present embodiment further includes a cover plate 20, the cover plate 20 is rotatably connected to the frame 10, and the cover plate 20 is used for enclosing the processing space 101. Optionally, the cover plate 20 is used for closing the first opening 103, and the mounting frame 30 is located at one end of the rack 10 adjacent to the first opening 103. Optionally, the cover plate 20 is hinged to the frame 10; or, the cover plate 20 and the frame 10 are movably connected through a rotating shaft respectively. Further, the cover plate 20 is rotatably connected to the first side plate 11. Optionally, the cover plate 20 is made of plastic or plastics, and the cover plate 20 is made of plastic or plastics through injection molding. The plastic or plastic may be, but is not limited to, one or more of Polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polypropylene (PP), or Polyethylene (PE).

Referring to fig. 4, in some embodiments, the laser processing apparatus 100 of the embodiment of the present application further includes a laser head 40, where the laser head 40 is disposed on the frame 10 and located in the processing space 101, and is configured to emit laser light to process the workpiece to be processed, for example, to perform carving, cutting, and the like on the workpiece to be processed according to the pattern to be processed. Alternatively, the laser head 40 may be moved in a three-dimensional space within the processing space 101 to perform more precise processing on a dummy sample.

Referring to fig. 3 and 4, in some embodiments, the laser processing apparatus 100 of the embodiment of the present application further includes: the exhaust fan 60 is arranged on the installation surface 31 of the installation frame 30, and is used for exhausting smoke generated in the laser processing equipment 100. Further, the exhaust fan 60 is disposed at one end of the mounting bracket 30. This makes it possible to make the entire laser processing apparatus 100 more compact and more compact. Optionally, the exhaust fan 60 is detachably mounted to the mounting bracket 30. This facilitates removal of the exhaust fan 60 for cleaning. Alternatively, the exhaust fan 60 is detachably mounted to the mounting bracket 30 by screws or bolts.

Referring to fig. 10, in some embodiments, the laser processing apparatus 100 of the present application further includes a processor 80 and a memory 90, the processor 80 is electrically connected to the memory 90, the laser head 40 and the camera 50, the processor 80 is configured to control the laser head 40 to process the workpiece according to the image of the workpiece to be processed acquired by the camera 50, and the memory 90 is configured to store a software program required by the processor 80 to operate.

Alternatively, processor 80 includes one or more general-purpose processors, which may be any type of device capable of Processing electronic instructions, including a Central Processing Unit (CPU), microprocessor, microcontroller, host processor, controller, ASIC, and the like. The processor 80 is operative to execute various types of digitally stored instructions, such as software or firmware programs stored in the memory 90, which enable the computing device to provide a wide variety of services.

Alternatively, the Memory 90 may include a Volatile Memory (Volatile Memory), such as a Random Access Memory (RAM); the Memory 90 may also include a Non-volatile Memory (NVM), such as a Read-Only Memory (ROM), a Flash Memory (FM), a Hard Disk Drive (HDD), or a Solid-State Drive (SSD). The memory 90 may also comprise a combination of the above-mentioned kinds of memories.

It should be noted that the laser processing apparatus of the present application aims to achieve the purpose of the present application through the positional relationship and the connection relationship among the respective devices (the processor 80, the memory 90, the camera 50, and the laser head 40). The signals processed by each device are only functions which can be realized by itself, and the algorithm or software level improvement is not carried out on each device, so that the application is not considered to be in conformity with the object protected by the utility model by the patent law.

Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments.

Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A laser machining apparatus, comprising:

the machining device comprises a rack, a machining device and a control device, wherein a machining space is formed in the rack and used for placing a workpiece to be machined;

a mounting frame mounted on the frame and located within the processing space, the mounting frame having a mounting surface facing the processing space;

2. The laser processing apparatus of claim 1, wherein the frame has a first opening, the first opening communicating with the processing space, the frame further comprising a bearing table, the bearing table being located at an end of the frame remote from the first opening for bearing the workpiece to be processed; the bearing table comprises a first end and a second end which are arranged oppositely, the plane formed by the camera and the first end is a first plane, the plane formed by the camera and the second end is a second plane, and the included angle between the optical axis of the camera and the first plane is equal to the included angle between the optical axis of the camera and the second plane;

or,

3. The laser processing apparatus of claim 2, wherein when the gantry includes a stage, an intersection point of a center line of the fill light and the stage is a radiation point, and a ratio between a vertical distance from the radiation point to the first end and a vertical distance from the radiation point to the second end is 1:5;

when the frame is a cylindrical structure, an intersection point of a center line of the light supplement lamp and a plane formed by the second opening is a radiation point, and a ratio of a vertical distance from the radiation point to the third end to a vertical distance from the radiation point to the fourth end is 1:5.

4. the laser processing apparatus according to claim 1, wherein the light filling lamp includes a plurality of light filling sub-lamps, and the plurality of light filling sub-lamps are sequentially arranged at intervals along an extending direction of the mounting frame.

5. The laser processing apparatus of claim 4, wherein the plurality of fill-in sub-lamps are equally spaced.

6. The laser processing apparatus according to claim 4, wherein the camera is disposed at a middle position of the plurality of fill-in sub-lamps.

7. The laser processing apparatus according to claim 1, wherein the mounting surface of the mounting frame is provided with a receiving groove, and the camera is provided in the receiving groove.

8. The laser machining apparatus of claim 1, wherein the frame has a first opening communicating with the machining space, the laser machining apparatus further comprising a cover plate rotatably connected to the frame for closing the first opening, the mounting bracket being located at an end of the frame adjacent the first opening.

9. The laser processing device according to claim 1, wherein the frame comprises a bottom plate and a first side plate, a second side plate, a third side plate and a fourth side plate which are sequentially connected end to end, and the bottom plate is respectively connected with the first side plate, the second side plate, the third side plate and the fourth side plate; the bottom plate, the first side plate, the second side plate, the third side plate and the fourth side plate are enclosed to form the processing space, the rack is provided with a first opening, and the first opening is communicated with the processing space; the rack further comprises a shielding plate, the shielding plate is arranged at the end part, adjacent to the first opening, of the first side plate, the shielding plate extends from the first side plate to the third side plate, and the mounting rack is arranged on one side, away from the first opening, of the shielding plate.

10. The laser processing apparatus according to any one of claims 1 to 9, further comprising a laser head, the laser head being disposed on the machine frame and located in the processing space for emitting laser light to process the workpiece to be processed.