CN218482213U - Centering device - Google Patents

Abstract

The application relates to a centering device, which comprises: a main body; the centering mechanism is arranged on the main body, the carrying platform is arranged on the centering mechanism, and the carrying platform can bear and drive the workpiece to move synchronously or release the workpiece onto the main body; the vision mechanism is arranged on the main body and is controlled to shoot the workpiece and the carrying platform, the centering mechanism is controlled to adjust the relative position of the carrying platform and the workpiece according to the information shot by the vision mechanism so as to enable the center of the workpiece to be overlapped with the center of the carrying platform, and the positioning part of the workpiece is circumferentially rotated to a target position. The centering device can position the positioning notch of the non-transparent wafer and the positioning notch of the transparent wafer, and compared with the situation that the prior art cannot be suitable for positioning the positioning notch of the transparent wafer, the application range of the centering device is expanded.

Description

Centering device

Technical Field

The application relates to the technical field of processing and detecting equipment, in particular to a centering device.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, and in order to ensure the processing accuracy of the wafer, it is necessary to align the wafer with a center and position a positioning Notch (usually a Flat groove or a Notch) of the wafer.

The conventional wafer centering device is generally provided with a correlation sensor, and the correlation sensor detects whether a signal exists or not to detect a positioning notch on the wafer. However, the correlation sensor can directly penetrate through the transparent wafer, and the positioning notch of the transparent wafer cannot be positioned. Therefore, the conventional wafer centering apparatus has a narrow application range.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a centering apparatus with a wider application range to solve the problem of a narrow application range of the conventional wafer centering apparatus.

A centering apparatus, comprising:

a main body;

the centering mechanism is arranged on the main body, the carrying platform is arranged on the centering mechanism, and the carrying platform can bear and drive a workpiece to move synchronously or release the workpiece onto the main body;

the alignment mechanism is controlled to adjust the relative position of the carrying platform and the workpiece according to the information shot by the vision mechanism, so that the centers of the workpiece and the carrying platform are overlapped, and the positioning part of the workpiece circumferentially rotates to a target position.

According to the centering device, the visual mechanism is adopted to shoot the wafer and the carrying platform, and even if the wafer is transparent, the visual mechanism can still shoot and obtain the transparent positioning notch of the wafer, so that the positioning notch can be conveniently adjusted to the target position. Therefore, the centering device can position the positioning notch of the non-transparent wafer and the positioning notch of the transparent wafer, and the application range of the centering device is expanded compared with the condition that the prior art cannot be applied to positioning notches for positioning transparent wafers.

In one embodiment, the centering device further comprises a leveling mechanism, and the leveling mechanism is mounted on the main body and used for leveling the vision mechanism.

In one embodiment, the leveling mechanism comprises a leveling plate and a plurality of leveling members, the leveling plate is horizontally arranged on the main body, and the leveling members are movably arranged on the leveling plate in a penetrating way;

every leveling piece has to wear out leveling end of leveling board, every leveling end with vision mechanism butt and adjustable length to the leveling vision mechanism.

In one embodiment, the centering mechanism comprises a horizontal motion component, a vertical motion component and a rotary motion component, wherein the horizontal motion component is mounted on the main body, the vertical motion component is mounted on the horizontal motion component, the rotary motion component is mounted on the vertical motion component, and the carrier is mounted on the rotary motion component;

the horizontal motion assembly is controlled to drive the vertical motion assembly and the rotary motion assembly to move in the horizontal direction, the vertical motion assembly is controlled to drive the rotary motion assembly to move in the vertical direction, and the rotary motion assembly is controlled to drive the carrier to rotate; the horizontal movement assembly, the vertical movement assembly and the rotation movement assembly jointly adjust the relative position of the workpiece and the carrying platform and the position of the positioning part of the workpiece.

In one embodiment, the horizontal motion assembly comprises a first driving part, a sliding plate and a sliding block, wherein the sliding plate and the sliding plate are connected in a sliding manner, the first driving part and the sliding plate are mounted on the main body, the vertical motion assembly is connected with the sliding block, and the first driving part is controlled to drive the sliding block to slide in a horizontal direction relative to the sliding plate; and/or

The vertical motion assembly comprises a second driving piece and a connecting plate, the second driving piece is installed on the horizontal motion assembly, the connecting plate is connected with the horizontal motion assembly in a sliding mode, the rotary motion assembly is connected with the connecting plate, and the second driving piece is controlled to drive the connecting plate to slide in the vertical direction relative to the horizontal motion assembly.

In one embodiment, the rotary motion assembly comprises a third driving member, a rotary shaft and a fixed seat; the third driving piece and the fixed seat are both connected with the vertical motion assembly, and the rotating shaft is arranged in the fixed seat in a penetrating way and is connected with the third driving piece;

runners are arranged on the fixed seat, the rotating shaft and the carrying platform to form an adsorption air passage for adsorbing a workpiece on the carrying platform; the third driving part is controlled to drive the rotating shaft to drive the carrying platform to rotate relative to the fixed seat.

In one embodiment, the main body comprises a body and a plurality of supporting columns, and the centering mechanism and the vision mechanism are both arranged on the body; the supporting columns are supported on the main body, and the surfaces of the supporting columns, which are far away from the main body, form a supporting surface for supporting a workpiece;

when the centering mechanism drives the carrying platform to vertically move downwards, the carrying platform can release the workpiece to the supporting surface of the supporting column.

In one embodiment, the centering device further includes a light source mounted on the main body to supplement light when the vision mechanism photographs the workpiece and the stage.

In one embodiment, the centering device further comprises a control module and an opposite insertion interface, the control module is arranged on the main body and used for controlling the centering mechanism and the vision mechanism, the opposite insertion interface is electrically connected with the control module, and the opposite insertion interface is connected with an external industrial personal computer.

In one embodiment, the plug-in interface comprises a visual network cable relay adapter and a control communication adapter, and the control module comprises a control driver module and a control relay terminal module;

the control network cable of the vision mechanism is plugged with the vision network cable relay adapter, the centering mechanism is connected with the control driver module and the control relay terminal module, and the control driver module and the control relay terminal module are plugged with the control communication adapter.

Drawings

FIG. 1 is a front view of a centering apparatus according to an embodiment of the present application;

FIG. 2 is a right side view of the centering apparatus shown in FIG. 1;

FIG. 3 is a top view of the centering device shown in FIG. 1 with the vision mechanism omitted;

FIG. 4 is a partial block diagram of a centering mechanism of the centering device shown in FIG. 1;

FIG. 5 is a partial block diagram of the structure shown in FIG. 4;

FIG. 6 is a diagram of the electrical hardware distribution of the centering device shown in FIG. 1, with other structures omitted;

FIG. 7 is a misalignment diagram showing XY directions existing between the center of the wafer and the center of the stage of the centering device shown in FIG. 1;

FIG. 8 is a diagram illustrating a misalignment between the center of the wafer and the center of the stage of the centering device shown in FIG. 1 in a Y-direction;

fig. 9 is an alignment chart of the center of the wafer and the center of the stage of the centering device shown in fig. 1.

100. A centering device; 10. a main body; 11. a body; 12. a support pillar; 20. a centering mechanism; 21. a horizontal motion assembly; 211. a slide plate; 212. a slider; 22. a vertical motion assembly; 221. a connecting plate; 23. a rotational motion assembly; 231. a third driving member; 232. a rotating shaft; 233. a fixed seat; 234. a seal ring; 235. a joint; 30. a stage; 40. a vision mechanism; 50. a leveling mechanism; 60. a light source; 71. a visual network cable relay adapter; 72. controlling the communication adapter; 73. triggering a network cable relay adapter; 74. an equipment power adapter; 75. a gas path adapter; 81. controlling a driver module; 82. a control relay terminal module; 83. a control relay module; 84. a vacuum generating module; 85. a control trigger module; 90. and operating the indicator light.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and encompass, for example, both fixed and removable connections or integral parts thereof; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1, an embodiment of the present application provides a centering device 100 for aligning a center of a workpiece with a center of a stage 30 (described below), that is, the centering device 100 is adjusted to achieve the purpose of centering the workpiece with the stage 30. Meanwhile, the positioning portion of the workpiece can also be circumferentially rotated to the target position by the centering device 100. The workpiece and the carrier 30 are adjusted to be centered, and the positioning part of the workpiece is circumferentially rotated to a target position, so that the machining precision of the workpiece is improved.

The present application will be described in detail with reference to the application of the centering apparatus 100 to positioning of a wafer, but it should be understood that the centering apparatus 100 may be applied to positioning of other workpieces besides wafers.

It should be noted that, when the workpiece is a wafer, the positioning portion is a positioning notch formed on the wafer. It is understood that, in other embodiments, when the workpiece is not a wafer, the positioning portion may be a positioning notch or not, and may be set as required.

Specifically, the centering device 100 is applied to an accurate positioning step before the wafer processing procedure, and can correct and coincide the center of the roughly positioned wafer and the center of the stage 30, and when the two coincide, the positioning notch of the wafer can be positioned to the target position in the circumferential direction.

The centering device 100 includes a main body 10, a centering mechanism 20, and a stage 30, wherein the centering mechanism 20 is installed on the main body 10, the stage 30 is installed on the centering mechanism 20, and the stage 30 is configured to carry and drive a wafer to move synchronously or release the wafer onto the main body 10. When the carrier 30 releases the wafer on the main body 10, the centering mechanism 20 is controlled to drive the carrier 30 to move so as to adjust the relative position of the carrier 30 and the wafer, so that the wafer and the carrier 30 are centered. After the wafer and the carrier 30 are centered, the carrier 30 carries the wafer, the centering mechanism 20 is controlled to drive the carrier 30 to move, and at this time, the carrier 30 drives the wafer to move synchronously, so that the positioning notch of the wafer moves to the target position in the circumferential direction.

With reference to fig. 1, the centering device 100 further includes a vision mechanism 40, and the vision mechanism 40 is mounted on the main body 10 and controlled to photograph the workpiece and the stage 30. Further, the centering mechanism 20 is controlled to adjust the relative position between the wafer and the stage 30 according to the information captured by the vision mechanism 40, so that the center of the wafer coincides with the center of the stage 30, and the positioning notch of the wafer circumferentially moves to the target position. That is, vision mechanism 40 images the wafer and stage 30, and centering mechanism 20 can adjust the relative positions of the wafer and stage 30 based on the information imaged by vision mechanism 40 so that the centers of the wafer and stage 30 coincide when the centers of the wafer and stage 30 are not aligned. Meanwhile, after the wafer and the stage 30 are centered, the stage 30 bears the wafer, the vision mechanism 40 shoots and acquires the specific position of the positioning notch of the wafer, the centering mechanism 20 is controlled to drive the stage 30 to rotate circumferentially according to the information of the wafer shot by the shooting mechanism, and at the moment, the stage 30 drives the wafer to move synchronously, so that the positioning notch of the wafer moves circumferentially to a target position.

It should be noted that the target position is a preset position, and when the wafer is processed after the position is preset, the centering device 100 can rotate the positioning notches of all the wafers to the target position, so as to ensure the processing accuracy of each wafer.

According to the centering device 100 provided by the embodiment of the application, the vision mechanism 40 is used for shooting the wafer and the stage 30, even if the wafer is transparent, the vision mechanism 40 can still shoot the positioning notch for obtaining the transparent wafer, so that the positioning notch can be conveniently adjusted to the target position. Thus, the centering device 100 can position the positioning notch of the non-transparent wafer as well as the positioning notch of the transparent wafer, and the application range of the centering device 100 is expanded compared with the situation that the prior art cannot be applied to positioning the positioning notch of the transparent wafer.

In one embodiment, referring to fig. 1-3, the main body 10 includes a main body 11 and a plurality of supporting pillars 12, and the centering mechanism 20 and the vision mechanism 40 are mounted on the main body 11. The supporting pillars 12 are supported on the body 11, and the surfaces of the supporting pillars 12 far away from the body 11 together form a supporting surface for supporting the wafer. When the centering mechanism 20 drives the stage 30 to move vertically downward, the stage 30 can release the wafer onto the supporting surface of the supporting column 12.

With the above arrangement, when a wafer needs to be released onto the main body 10 to adjust the relative position of the carrier 30 and the wafer, the centering mechanism 20 is controlled to drive the carrier 30 to move vertically downward, and after the carrier 30 moves downward for a certain distance, the wafer is in contact with the supporting surface of the supporting column 12 and is jacked up by the supporting column 12 to be separated from the carrier 30. In this way, the separation of the wafer from the stage 30 is conveniently achieved, so as to facilitate the subsequent adjustment of the relative position of the two.

It is contemplated that in other embodiments, the support post 12 may be omitted from the main body 10, and the carrier 30 may release the wafer directly onto the main body 11.

In an embodiment, the body 11 is a hollow structure having a receiving cavity for receiving at least a portion of the centering mechanism 20 therein, so that the centering apparatus 100 has a compact structure and a reduced occupied space.

The main body 10 includes four support columns 12, and the four support columns 12 are arranged at intervals around a circumference such that the shape formed by the four support columns 12 matches the shape of the wafer, so as to support the wafer. In other embodiments, the number of the support posts 12 included in the main body 10 is not particularly limited, as long as the wafer can be supported and separated from the carrier 30.

Further, the heights of the support columns 12 are equal, that is, the support surfaces formed by the ends, far away from the body 11, of the support columns 12 are horizontal planes, so that the flatness of the wafer can be ensured.

The support posts 12 are made of soft material to avoid damaging the surface of the wafer. Specifically, the support post 12 is made of POM (polyoxymethylene) material.

The vision mechanism 40 is supported on the body 11 and is vertically above the supporting column 12, so as to photograph the wafer and the stage 30. Specifically, the vision mechanism 40 is a camera. It should be understood that, in other embodiments, the type of the vision mechanism 40 is not limited, as long as the purpose of photographing the stage 30 and the wafer to facilitate centering of the wafer and adjusting the positioning gap to the target position can be achieved.

With continued reference to fig. 1, the centering device 100 further includes a leveling mechanism 50, and the leveling mechanism 50 is mounted on the body 11 for leveling the vision mechanism 40. When the vision mechanism 40 is adjusted to be horizontal by the leveling mechanism 50, the photographing effect of the vision mechanism 40 can be ensured.

In one embodiment, the leveling mechanism 50 includes a leveling plate and a plurality of leveling members, the leveling plate is mounted on the body 11, and the leveling members are movably disposed on the leveling plate. Each leveling member has a leveling end extending through the leveling plate, and each leveling end is abutted against the vision mechanism 40 and has an adjustable length so as to level the vision mechanism 40. When the leveling visual mechanism 40 is needed, the adjusting piece is screwed, and moves relative to the leveling plate to change the length of the leveling end of the adjusting piece extending out of the leveling plate, so that the purpose of leveling the visual mechanism 40 is achieved.

Of course, in other embodiments, the arrangement of the leveling mechanism 50 is not limited, and can be selected according to the requirement.

With reference to fig. 3, the centering device 100 further includes a light source 60, and the light source 60 is installed on the body 11 to supplement light when the vision mechanism 40 photographs the wafer and the stage 30, so as to make the photographing more clear.

In one embodiment, the centering mechanism 20 includes a horizontal movement component 21, a vertical movement component 22, and a rotation component 23, the horizontal movement component 21 is installed on the body 11, the vertical movement component 22 is installed on the horizontal movement component 21, the rotation component 23 is installed on the vertical movement component 22, and the stage 30 is installed on the rotation component 23. Specifically, the horizontal movement assembly 21 is controlled to drive the vertical movement assembly 22 and the rotary movement assembly 23 to move in the horizontal direction, the vertical movement assembly 22 is controlled to drive the rotary movement assembly 23 to move in the vertical direction, and the rotary movement assembly 23 is controlled to drive the carrier 30 to rotate. The horizontal movement assembly 21, the vertical movement assembly 22 and the rotational movement assembly 23 cooperate to adjust the relative positions of the wafer and the stage 30, and the position of the positioning portion of the wafer.

In the above arrangement, the carrier 30 is installed on the rotary motion assembly 23, the horizontal motion assembly 21 drives the vertical motion assembly 22 and the rotary motion assembly 23 to move so as to drive the carrier 30 to move horizontally, the vertical motion assembly 22 drives the rotary motion assembly 23 to move so as to drive the carrier 30 to move vertically, and the rotary motion assembly 23 drives the carrier 30 to rotate circumferentially. That is, the centering mechanism 20 can perform horizontal adjustment, vertical adjustment, and circumferential adjustment of the stage 30. Meanwhile, when the wafer is loaded on the carrier 30, the centering mechanism 20 can synchronously realize horizontal adjustment, vertical adjustment and circumferential adjustment of the wafer.

It should be noted that, through the adjustment of the horizontal movement assembly 21, the centering device 100 can be compatible with wafers of different sizes, such as the current sizes in the market: 6 cun, 8 cun and 12 cun.

With continued reference to fig. 1, the horizontal motion assembly 21 includes a first driving member, a sliding plate 211 and a sliding block 212, the first driving member and the sliding plate 211 are mounted on the body 11, the sliding block 212 is slidably connected to the sliding plate 211, the first vertical motion assembly 22 is connected to the sliding block 212, and the first driving member is controlled to drive the sliding block 212 to slide in the horizontal direction relative to the sliding plate 211. When the stage 30 needs to be adjusted horizontally, the first driving member drives the sliding block 212 to slide in the horizontal direction relative to the sliding plate 211, so that the stage 30 is driven to move in the horizontal direction by the vertical moving assembly 22 and the rotating moving assembly 23.

Specifically, the first driving member is a motor, and the sliding block 212 is driven by the first transmission member to slide relative to the sliding plate 211, if the first transmission member includes a first lead screw and a first nut, the first lead screw is connected with the first driving member, the first nut is connected with the sliding block 212, and the first nut is screwed with the first lead screw. In other embodiments, the first driving element is not a motor, and the horizontal moving assembly 21 may omit the first driving element, and the first driving element directly drives the sliding block 212 to slide in the horizontal direction relative to the sliding plate 211.

In one embodiment, the vertical movement assembly 22 includes a second driving member and a connecting plate 221, the second driving member is mounted on the sliding block 212, the connecting plate 221 is slidably connected to the sliding block 212, the rotating movement assembly 23 is connected to the connecting plate 221, and the second driving member is controlled to drive the connecting plate 221 to slide in the vertical direction relative to the sliding block 212. When the carrier 30 needs to be vertically adjusted, the second driving member drives the connecting plate 221 to slide in the vertical direction relative to the slider 212, so that the carrier 30 is driven to move in the vertical direction by the rotating assembly 23.

Specifically, the second driving element is a motor, and the connecting plate 221 is driven by a second transmission element to slide relative to the slider 212, for example, the second transmission element includes a second lead screw and a second nut, the second lead screw is connected to the second driving element, the second nut is connected to the connecting plate 221, and the second nut is screwed to the second lead screw. In other embodiments, the second driving member is not a motor, and the vertical motion assembly 22 may omit the second driving member, and the second driving member directly drives the connecting plate 221 to slide in the vertical direction relative to the sliding block 212.

In an embodiment, referring to fig. 4 and fig. 5, the rotation assembly 23 includes a third driving member 231, a rotation shaft 232 and a fixing base 233, the third driving member 231 and the fixing base 233 are both connected to the connecting plate 221, the rotation shaft 232 is disposed in the fixing base 233 and connected to the third driving member 231, and the third driving member 231 is controlled to drive the rotation shaft 232 to drive the carrier 30 to rotate relative to the fixing base 233. When the circumferential adjustment of the stage 30 is required, the third driving member 231 drives the rotating shaft 232 to rotate relative to the fixing base 233, so that the stage 30 is driven to rotate circumferentially by the rotating shaft 232.

Further, the fixing base 233, the rotating shaft 232, and the stage 30 are all provided with flow passages for forming an adsorption air passage for adsorbing the workpiece to the stage 30. When the carrier 30 needs to carry the wafer and drive the wafer to move together, the adsorption air channel is controlled to generate negative pressure so as to adsorb the wafer on the carrier 30. When the carrier 30 needs to release the wafer to adjust the relative position of the carrier and the wafer, the suction air channel is controlled to release the negative pressure, and at this time, the suction force of the carrier 30 to the wafer disappears, so that the wafer is supported on the supporting surface of the supporting column 12. Thus, the carrier 30 is not suitable for carrying hard materials, but also soft materials, so as to avoid damaging the soft materials by clamping the soft materials in the prior art.

Further, an air passage ring is formed between the fixed seat 233 and the rotating shaft 232, and the rotary motion assembly 23 further includes a sealing ring 234, wherein the sealing ring 234 is sealingly disposed between the fixed seat 233 and the rotating shaft 232 to seal the air passage ring. That is, the rotary motion assembly 23 passes through the pneumatic slip ring structure to realize the flow of the air flow in the adsorption air passage.

The rotary motion assembly 23 further includes a joint 235, the joint 235 is connected to the fixing base 233 and is communicated with the adsorption air channel, the centering device 100 further includes a vacuum generation module 84, the joint 235 is communicated with the vacuum generation module 84, and the vacuum generation module 84 can enable the adsorption air channel to generate negative pressure vacuum to adsorb the wafer on the carrier 30.

In some embodiments, the centering device 100 further includes a control module disposed in the body 11 and a docking socket disposed on the body 11. The control module is used for controlling the centering mechanism 20 and the vision mechanism 40, and specifically, the control module can control the corresponding components of the centering mechanism 20 to move according to the information of the wafer and the carrier 30 shot by the shooting mechanism 40, so as to realize edge finding and positioning of the wafer. The plug-in interface is electrically connected with the control module and is connected with an external Industrial Personal Computer (IPC). Docking socket is connected with external industrial computer, control module is connected with the industrial computer through docking socket, control module control docking mechanism and visual mechanism 40, for prior art (among the prior art, need connect external equipment and carry out the centre of a circle position coordinate value that complicated calculation obtained the wafer, the cost has been increased when consuming time longer), realize that the fine positioning of wafer and the locating gap seek and unify to fixed position with visual mechanism 40 and software electrical integration an organic whole, it is high to heart device 100 integrated level, visual mechanism 40 and centering mechanism 20 need not carry out complicated communication with the outside, it is consuming time shorter to the heart.

Referring to fig. 2 and 6, the docking socket includes a visual network cable relay adapter 71 and a control communication adapter 72, and the control module includes a control driver module 81 and a control relay terminal module 82. The control network cable of the vision mechanism 40 is inserted into the vision network cable relay adapter 71, the centering mechanism 20 is connected with the control driver module 81 and the control relay terminal module 82, and the control driver module 81 and the control relay terminal module 82 are inserted into the control communication adapter 72. Specifically, the visual network cable relay adapter 71 is connected to an external industrial personal computer, and the industrial personal computer controls the visual mechanism 40 through the visual network cable relay adapter 71. And the control communication adapter 72 is connected to an industrial personal computer, and the control driver module 81 and the control relay terminal module 82 have a function of controlling each moving component of the centering mechanism 20.

The docking socket further comprises a trigger network cable relay adapter 73, the control module further comprises a control relay module 83, the centering device 100 is provided with an operation indicator lamp 90, the operation indicator lamp 90 is connected with the control relay module 83, and finally the control relay module is connected with an industrial personal computer through the trigger network cable relay adapter 73.

Further, the docking socket further includes a device power adapter 74, and all power requirements of the centering apparatus 100 are connected to an external power supply system through the device power adapter 74. The docking socket further includes a gas path adapter 75, the control module includes a vacuum generation module 84, and positive pressure air enters the vacuum generation module 84 through the gas path adapter 75 to generate negative pressure vacuum so that the carrier 30 can adsorb wafers.

Furthermore, the control module further comprises a control trigger module 85, and the control trigger module 85 is connected with the industrial personal computer and used for signal acquisition, signal input and output and control. In particular, the amount of the solvent to be used,

above-mentioned setting, concentrate on electric hardware in main part 10, only reserve the quick interface with external butt joint usefulness for to heart device 100 has the independence, can realize quick replacement of quick equipment.

The operating principle of the centering device 100 provided by the present application is as follows:

the vision mechanism 40 is leveled by a leveling mechanism 50. The wafer is placed on the stage 30, the positive pressure air enters the vacuum generation module 84 through the air path adapter 75 to generate negative pressure vacuum, the stage 30 adsorbs the wafer, and the center a of the wafer and the center B of the stage 30 have XY misalignment in the horizontal plane (see fig. 7).

The industrial personal computer controls the vision mechanism 40 through the vision network cable relay adapter 71, and the vision mechanism 40 shoots the carrier 30 and the wafer under the light supplement effect of the light source 60. The rotating motion assembly 23 of the centering mechanism 20 drives the carrier 30 to rotate, and the carrier 30 drives the wafer to rotate synchronously, so that the center a of the wafer is rotated to be offset from the center B of the carrier 30 in only one direction in the horizontal plane (see fig. 8).

The vacuum generation module 84 performs vacuum removal to remove the negative pressure, so that the suction force of the stage 30 to the wafer disappears. The vertical motion assembly 22 of the centering mechanism 20 drives the stage 30 down, while the wafer is stopped on the support surface of the support column 12. The horizontal movement assembly 21 drives the stage 30 to move, so that the stage 30 is aligned with the center of the wafer, and the center a of the wafer and the center B of the stage 30 are centered (see fig. 9).

The vertical motion assembly 22 drives the stage 30 to move upward, and the vacuum generation module 84 generates a negative pressure vacuum on the stage 30 to absorb the wafer again. The rotary motion assembly 23 of the centering mechanism 20 drives the carrier 30 to drive the wafer to rotate circumferentially according to the information captured by the vision mechanism 40, so that the positioning notch of the wafer rotates circumferentially to the target position.

The centering device 100 provided by the embodiment of the application has the following beneficial effects:

1. the vision mechanism 40 is matched with the centering mechanism 20, so that the problems of circle center correction of the transparent workpiece and the soft workpiece and searching and positioning of the positioning part can be solved, high-precision positioning can be realized, and the edge searching and positioning precision can be 002-0.04mm;

2. the centering mechanism 20 is provided with a horizontal movement assembly 21, so that the centering device 100 can perform both circle center correction and locating of locating parts of workpieces with different specifications.

3. All electrical hardware is integrated in the body 11, and only a quick docking socket needs to be reserved, so that the centering device 100 has independence, and quick replacement of equipment can be realized.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A centering device, characterized in that, the centering device comprises:

a main body;

the centering mechanism is arranged on the main body, the carrying platform is arranged on the centering mechanism, and the carrying platform can bear and drive a workpiece to move synchronously or release the workpiece onto the main body;

the alignment mechanism is controlled to adjust the relative position of the loading platform and the workpiece according to the information shot by the vision mechanism, so that the center of the workpiece coincides with the center of the loading platform, and the positioning part of the workpiece circumferentially rotates to a target position.

2. The centering device as claimed in claim 1, further comprising a leveling mechanism mounted on said main body for leveling said vision mechanism.

3. The centering device as claimed in claim 2, wherein the leveling mechanism comprises a leveling plate and a plurality of leveling members, the leveling plate is horizontally mounted on the main body, and the leveling members are movably arranged on the leveling plate in a penetrating manner;

every leveling piece has and wears out the leveling end of leveling board, every leveling end with vision mechanism butt and adjustable length to the leveling vision mechanism.

4. The centering device according to claim 1, wherein the centering mechanism comprises a horizontal motion assembly, a vertical motion assembly and a rotary motion assembly, the horizontal motion assembly is mounted on the main body, the vertical motion assembly is mounted on the horizontal motion assembly, the rotary motion assembly is mounted on the vertical motion assembly, and the stage is mounted on the rotary motion assembly;

the horizontal motion assembly is controlled to drive the vertical motion assembly and the rotary motion assembly to move in the horizontal direction, the vertical motion assembly is controlled to drive the rotary motion assembly to move in the vertical direction, and the rotary motion assembly is controlled to drive the carrier to rotate; the horizontal movement assembly, the vertical movement assembly and the rotation movement assembly jointly adjust the relative position of the workpiece and the carrying platform and the position of the positioning part of the workpiece.

5. The centering device as claimed in claim 4, wherein the horizontal movement assembly comprises a first driving member, and a sliding plate and a sliding block which are slidably connected, the first driving member and the sliding plate are mounted on the main body, the vertical movement assembly is connected with the sliding block, and the first driving member is controlled to drive the sliding block to slide in a horizontal direction relative to the sliding plate; and/or

The vertical movement assembly comprises a second driving piece and a connecting plate, the second driving piece is installed on the horizontal movement assembly, the connecting plate is connected with the horizontal movement assembly in a sliding mode, the rotary movement assembly is connected with the connecting plate, and the second driving piece is controlled to drive the connecting plate to slide in the vertical direction relative to the horizontal movement assembly.

6. The centering device as claimed in claim 4, wherein said rotary motion assembly comprises a third driving member, a rotary shaft and a fixing seat; the third driving piece and the fixed seat are both connected with the vertical motion assembly, and the rotating shaft penetrates through the fixed seat and is connected with the third driving piece;

runners are arranged on the fixed seat, the rotating shaft and the carrying platform to form an adsorption air passage for adsorbing a workpiece on the carrying platform; the third driving part is controlled to drive the rotating shaft to drive the carrying platform to rotate relative to the fixed seat.

7. The centering device as claimed in claim 1, wherein said main body comprises a body and a plurality of supporting pillars, said centering mechanism and said vision mechanism are mounted on said body; the supporting columns are supported on the main body, and the surfaces of the supporting columns, which are far away from the main body, form a supporting surface for supporting a workpiece;

when the centering mechanism drives the carrying platform to vertically move downwards, the carrying platform can release the workpiece to the supporting surface of the supporting column.

8. The centering device of claim 1, further comprising a light source mounted on the main body for supplementing light when the vision mechanism photographs the workpiece and the stage.

9. The centering device according to any one of claims 1 to 8, further comprising a control module and an insertion interface, wherein the control module is disposed on the main body, the control module is used for controlling the centering mechanism and the vision mechanism, the insertion interface is electrically connected to the control module, and the insertion interface is connected to an external industrial personal computer.

10. The centering device as claimed in claim 9, wherein said docking interface comprises a visual network line relay adapter and a control communication adapter, and said control module comprises a control driver module and a control relay terminal module;

the control network cable of the vision mechanism is plugged with the vision network cable relay adapter, the centering mechanism is connected with the control driver module and the control relay terminal module, and the control driver module and the control relay terminal module are plugged with the control communication adapter.

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