CN218482202U - A compression fittings for semiconductor lead frame - Google Patents
A compression fittings for semiconductor lead frame Download PDFInfo
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- CN218482202U CN218482202U CN202222058069.2U CN202222058069U CN218482202U CN 218482202 U CN218482202 U CN 218482202U CN 202222058069 U CN202222058069 U CN 202222058069U CN 218482202 U CN218482202 U CN 218482202U
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- lead frame
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Abstract
The utility model discloses a compression fittings for semiconductor lead frame, including the location base, the equal movable mounting in both ends of location base inside has locating component, and the inside movable mounting of location base has a centre gripping positioner, and the top fixed mounting of location base has the flattening device. Above-mentioned scheme, place the lead frame at the top of supporting the backing plate, press the briquetting through the pulling, under positioning spring's effect, press briquetting to control the lead frame and fix a position, then rotate the hand wheel through rotating, under the effect of incorgruous screw rod, the sliding block drives the grip block and fixes a position the centre gripping to the lead frame, fix a position automatically, the lead frame is placed at the top of supporting the backing plate, it has the pole cylinder to start, push down to pressing down the frame through there being the pole cylinder, utilize to press the frame to flatten the lead frame, avoid demonstrating the quality problems such as the solder joint is not firm because of the lead bonding in-process that lead frame self deformation and slope lead, promote the quality of lead frame, and the solder joint effect.
Description
Technical Field
The utility model relates to a semiconductor lead frame technical field, more specifically say, the utility model relates to a compression fittings for semiconductor lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit, the electrical connection between a leading-out end of an internal circuit of a chip and an external lead is realized by means of bonding materials (gold wires, aluminum wires and copper wires) to form a key structural member of an electrical loop, the lead frame plays a role of a bridge Liang Zuoyong connected with an external lead, in order to fix the chip on the lead frame, the lead frame is firstly conveyed to a double-point glue dispenser or an electrical glue assembly, then the double-point glue dispenser or the electrical glue assembly is used for carrying out glue dispensing on the lead frame, and finally the chip is glued at the glue dispensing position to finish the installation of the chip.
Generally in actual pressfitting in-process, because lead frame itself is thinner, there is not deformation of equidimension very easily or lamination device has the slope of horizontal direction, causes the pressfitting jail, finally leads to presenting quality problems such as the solder joint jail among the wire bonding in-process, and current lead frame simultaneously often fixes a position through the manual work, and not only positioning efficiency is lower, consumes time and manpower moreover, has reduced the pressfitting efficiency of lead frame.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a compression fittings for semiconductor lead frame, with solve present because lead frame itself is thinner, there is the slope that there is the horizontal direction in deformation or compression fittings of different degrees very easily, cause the pressfitting not jail, finally lead to the bonding in-process of lead to demonstrate the quality problems such as solder joint not jail, the lead frame that has now simultaneously, often fix a position through the manual work, not only the positioning efficiency is lower, and time and manpower are spent, the problem of the pressfitting efficiency of lead frame has been reduced.
In order to solve the technical problem, the utility model provides a following technical scheme: the utility model provides a compression fittings for semiconductor lead frame, includes the location base, the equal movable mounting in both ends of location base has locating component, the inside movable mounting of location base has centre gripping positioner, the top fixed mounting of location base has the flattening device.
The clamping and positioning device comprises a heterodromous screw rod, sliding blocks are movably sleeved on the outer surfaces of two ends of the heterodromous screw rod, a clamping plate is fixedly connected to the top of each sliding block, and a rotating hand wheel is fixedly mounted at one end of the heterodromous screw rod.
The positioning base comprises a fixing base, a supporting base plate is fixedly mounted at the top of the fixing base, the supporting base plate is made of rubber, sliding grooves corresponding to the sliding blocks are formed in the two ends of the top of the fixing base, positioning holes are formed in the two ends of the side edge of the fixing base, limiting holes are formed in the two ends of the side edge of the fixing base, the limiting holes are located in the inner sides of the positioning holes, the sliding grooves are arranged, the sliding blocks are limited through the sliding grooves, the sliding blocks slide in the sliding grooves, the positioning holes are arranged to limit the pressing blocks, the positioning assemblies slide on the two sides of the positioning base, and meanwhile through the action of the positioning holes, the situation that the positioning springs are stressed to deviate when moving is avoided, the supporting base plate is arranged, the supporting base plate is made of rubber, the lead frame is made to be more laminated with the supporting base plate, and the lead frame is more smooth.
The different-direction screw rod is movably mounted inside the fixed base, the sliding block is slidably mounted inside the sliding groove, and the rotating hand wheel is movably mounted on the side of the fixed base.
The positioning assembly comprises a sliding rod, a pressing block is fixedly mounted on the side edge of the sliding rod, a positioning spring is fixedly mounted on the side edge of the pressing block, one end of the positioning spring is fixedly mounted at the bottom of the limiting hole, the positioning spring is movably mounted in the limiting hole, the sliding rod is slidably mounted in the positioning hole, and the upper end of the pressing block is slidably mounted at the top of the supporting base plate.
Wherein, flattening device includes the support frame, support frame fixed mounting is in unable adjustment base side, the top fixed mounting of support frame has the pole cylinder, the bottom fixed mounting who has the pole cylinder has the frame of pressing, press frame movable mounting at the top of supporting the backing plate, set up and press the frame, and have pole cylinder atress and press the positive centre of frame, make and press the frame holding down force more even.
The utility model discloses a technological effect and advantage:
according to the scheme, the lead frame is placed at the top of the supporting base plate, the pressing block is pulled to position the lead frame left and right under the action of the positioning spring, then the hand wheel is rotated by rotation, and under the action of the incongruous screw rod, the sliding block drives the clamping plate to position and clamp the lead frame, so that the lead frame is automatically positioned, the time and the labor are saved, and the pressing efficiency of the lead frame is improved;
the lead frame is placed at the top of supporting the backing plate, and it has the pole cylinder to start, pushes down to pressing the frame through having the pole cylinder, utilizes to press the frame to flatten the lead frame, avoids appearing the quality problems such as the solder joint is not firm because of the lead bonding in-process that the deformation of lead frame self and slope lead to, promotes the quality of lead frame, and the solder joint effect.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural view of the clamping and positioning device of the present invention;
FIG. 3 is a schematic structural view of the positioning assembly of the present invention;
FIG. 4 is a schematic view of the positioning base structure of the present invention;
fig. 5 is a schematic structural view of the flattening device of the present invention.
The reference signs are: 1. positioning a base; 2. a positioning assembly; 3. a clamping and positioning device; 4. a flattening device; 11. a fixed base; 12. supporting the base plate; 13. a sliding groove; 14. positioning holes; 15. a limiting hole; 21. a slide bar; 22. a positioning spring; 23. a pressing block; 31. a screw rod in different directions; 32. a slider; 33. a clamping plate; 34. rotating a hand wheel; 41. a support frame; 42. a rod cylinder; 43. and a pressing frame.
Detailed Description
To make the technical problems, technical solutions and advantages of the present invention clearer, the following description is made in conjunction with the accompanying drawings and specific embodiments.
Like fig. 1 to fig. 5, the embodiment of the utility model provides a compression fittings for semiconductor lead frame, including location base 1, the equal movable mounting in both ends of location base 1 inside has locating component 2, and the inside movable mounting of location base 1 has clamping position device 3, and the top fixed mounting of location base 1 has flattening device 4.
Wherein, centre gripping positioner 3 includes incorgruous screw rod 31, and the surface activity at incorgruous screw rod 31 both ends has cup jointed the sliding block 32, and the top fixedly connected with grip block 33 of sliding block 32, the one end fixed mounting of incorgruous screw rod 31 has rotation hand wheel 34.
Wherein, positioning base 1 includes unable adjustment base 11, unable adjustment base 11's top fixed mounting has supporting backing plate 12, supporting backing plate 12's material is the rubber material, sliding tray 13 corresponding with sliding block 32 has all been seted up at the both ends at unable adjustment base 11 top, locating hole 14 has all been seted up at the both ends of unable adjustment base 11 side, spacing hole 15 is located the inboard of locating hole 14, set up sliding tray 13, it is spacing to sliding block 32 through sliding tray 13, make sliding block 32 slide in sliding tray 13's inside, it is spacing to press briquetting 23 to set up locating hole 14, make locating component 2 slide in positioning base 1's both sides, simultaneously through locating hole 14's effect, avoid positioning spring 22 when the motion, the atress produces the skew, set up supporting backing plate 12, and supporting backing plate 12's material is rubber, make the lead frame laminate with supporting backing plate 12 more, the lead frame is more level and more smooth.
Wherein, the different-direction screw 31 is movably installed inside the fixed base 11, the sliding block 32 is slidably installed inside the sliding groove 13, and the rotating handwheel 34 is movably installed on the side of the fixed base 11.
Wherein, locating component 2 includes slide bar 21, and slide bar 21's side fixed mounting has according to briquetting 23, presses briquetting 23's side fixed mounting to have positioning spring 22, and positioning spring 22's one end fixed mounting is in the bottom of spacing hole 15, and positioning spring 22 movable mounting is in the inside of spacing hole 15, slide bar 21 slidable mounting in the inside of locating hole 14, presses briquetting 23's upper end slidable mounting at the top of supporting backing plate 12.
The flattening device 4 comprises a support frame 41, the support frame 41 is fixedly mounted on the side face of the fixed base 11, a rod cylinder 42 is fixedly mounted at the top of the support frame 41, a pressing frame 43 is fixedly mounted at the bottom of the rod cylinder 42, the pressing frame 43 is movably mounted at the top of the support base plate 12, the pressing frame 43 is arranged, and the rod cylinder 42 is stressed in the middle of the pressing frame 43, so that the downward pressure of the pressing frame 43 is more uniform.
The working process of the utility model is as follows:
the lead frame is placed on the top of the support base plate 12, the pressing block 23 is pulled to position the lead frame left and right under the action of the positioning spring 22, then the hand wheel 34 is rotated by rotating, and under the action of the incongruous screw 31, the sliding block 32 drives the clamping plate 33 to position and clamp the lead frame, so that the lead frame is automatically positioned, the time and the labor are saved, and the pressing efficiency of the lead frame is improved;
the lead frame is placed at the top of supporting backing plate 12, and the start has pole cylinder 42, pushes down pressing frame 43 through having pole cylinder 42, utilizes pressing frame 43 to flatten the lead frame, avoids demonstrating the quality problem such as the solder joint is not firm because of the lead bonding in-process that lead frame self deformation and slope lead to, promotes the quality of lead frame, and solder joint effect.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," "connecting," and "connecting" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be directly connected, and "upper," "lower," "left," and "right" are only used to indicate relative positional relationships, and when the absolute position of the object to be described is changed, the relative positional relationships may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a compression fittings for semiconductor lead frame, includes location base (1), its characterized in that, the equal movable mounting in both ends of location base (1) has locating component (2), the inside movable mounting of location base (1) has centre gripping positioner (3), the top fixed mounting of location base (1) has flattening device (4).
2. The stitching device for the semiconductor lead frame according to claim 1, wherein the clamping and positioning device (3) comprises a counter screw (31), sliding blocks (32) are movably sleeved on outer surfaces of two ends of the counter screw (31), a clamping plate (33) is fixedly connected to the top of each sliding block (32), and a rotating hand wheel (34) is fixedly mounted at one end of the counter screw (31).
3. The laminating device for the semiconductor lead frame according to claim 1, wherein the positioning base (1) comprises a fixing base (11), a supporting pad (12) is fixedly installed on the top of the fixing base (11), the supporting pad (12) is made of rubber, sliding grooves (13) corresponding to the sliding blocks (32) are formed in both ends of the top of the fixing base (11), positioning holes (14) are formed in both ends of the side of the fixing base (11), limiting holes (15) are formed in both ends of the side of the fixing base (11), and the limiting holes (15) are located inside the positioning holes (14).
4. The stitching device for semiconductor lead frames according to claim 2, wherein the counter screw (31) is movably mounted inside the fixed base (11), the sliding block (32) is slidably mounted inside the sliding groove (13), and the rotating handwheel (34) is movably mounted on the side of the fixed base (11).
5. The stitching device for semiconductor lead frames according to claim 1, wherein the positioning assembly (2) comprises a sliding rod (21), a pressing block (23) is fixedly mounted on a side edge of the sliding rod (21), a positioning spring (22) is fixedly mounted on a side edge of the pressing block (23), one end of the positioning spring (22) is fixedly mounted at the bottom of the limiting hole (15), the positioning spring (22) is movably mounted inside the limiting hole (15), the sliding rod (21) is slidably mounted inside the positioning hole (14), and an upper end of the pressing block (23) is slidably mounted at the top of the supporting pad (12).
6. The pressing device for the semiconductor lead frame according to claim 1, wherein the flattening device (4) comprises a supporting frame (41), the supporting frame (41) is fixedly installed on the side surface of the fixed base (11), a rod cylinder (42) is fixedly installed at the top of the supporting frame (41), a pressing frame (43) is fixedly installed at the bottom of the rod cylinder (42), and the pressing frame (43) is movably installed at the top of the supporting cushion plate (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222058069.2U CN218482202U (en) | 2022-08-05 | 2022-08-05 | A compression fittings for semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222058069.2U CN218482202U (en) | 2022-08-05 | 2022-08-05 | A compression fittings for semiconductor lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218482202U true CN218482202U (en) | 2023-02-14 |
Family
ID=85164861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222058069.2U Active CN218482202U (en) | 2022-08-05 | 2022-08-05 | A compression fittings for semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218482202U (en) |
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2022
- 2022-08-05 CN CN202222058069.2U patent/CN218482202U/en active Active
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