CN215187637U

CN215187637U - Quick tinning stack of diode pin

Info

Publication number: CN215187637U
Application number: CN202121347151.6U
Authority: CN
Inventors: 严伟坚
Original assignee: Wuxi Qinghangxin Technology Co ltd
Current assignee: Wuxi Qinghangxin Technology Co ltd
Priority date: 2021-06-17
Filing date: 2021-06-17
Publication date: 2021-12-14
Anticipated expiration: 2031-06-17

Abstract

The utility model discloses a quick tinning stack of diode pin, include the circuit board and press the board, the upper surface of circuit board is equipped with the mount pad, two mounts of one side fixedly connected with of mount pad, one side fixedly connected with cassette of mount pad, press the both sides of board and all seted up the constant head tank, and constant head tank and cassette sliding connection, be equipped with according to the bottom of board and melt the tin head, melt the bottom of tin head and seted up the draw-in groove, one side swing joint of mount has a connecting plate, two stoppers of the bottom fixedly connected with of connecting plate. The utility model discloses not only can use through the cooperation of stopper with the draw-in groove, make to melt that the tin head is accurate melt tin to the diode, improve the tinning quality of device, can avoid removing simultaneously through the limiting plate and control the production skew about the diode, improve the location effect of device, can also make more firm of being connected between mount pad and the circuit board through the slipmat, improve the stability of device.

Description

Quick tinning stack of diode pin

Technical Field

The utility model relates to a diode technical field especially relates to a quick tinning stack of diode pin.

Background

In the electronic industry, diodes become basic elements of various electronic products, the diodes include rectifier diodes, switching diodes, fast diodes, variable capacitance diodes, light emitting diodes and the like, and the diodes are used in a matched manner with a circuit board, so that the diodes need to be connected and fixed.

On the pin of adopting tin-plated mode to be fixed in the circuit board with the diode usually, the tinning stack in the existing market need be fixed in the circuit board earlier when using, adopts the tinning stack to melt tin and then fixed pin again, causes easily to melt tin head and pin dislocation, leads to the tinning quality not good, consequently, proposes a quick tinning stack of diode pin and seems very necessary.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a quick tinning device for a diode pin.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a quick tinning stack of diode pin, includes the circuit board and presses the board, the upper surface of circuit board is equipped with the mount pad, two mounts of one side fixedly connected with of mount pad, one side fixedly connected with cassette of mount pad, the constant head tank has all been seted up according to the both sides of board, and constant head tank and cassette sliding connection, be equipped with according to the bottom of board and melt the tin head, melt the bottom of tin head and seted up the draw-in groove, one side swing joint of mount pad has the connecting plate, two stoppers of bottom fixedly connected with of connecting plate, the upper surface of mount pad is equipped with the diode, and the diode is located the inside of draw-in groove, the upper surface of mount pad has been seted up and has been kept away the position groove.

Furthermore, the top of the clamping seat is fixedly connected with a spring, and the spring is fixed with the pressing plate.

Furthermore, a placing box is fixedly connected to the top of the mounting seat.

Furthermore, one side fixedly connected with limiting plate of placing the box, and the limiting plate is fixed mutually with the mount.

Furthermore, one side fixedly connected with of connecting plate dials the board, dials the bottom of board and has seted up a plurality of anti-skidding lines.

Furthermore, the bottom of the mounting seat is fixedly connected with an anti-skid pad, and the anti-skid pad is in contact with the circuit board.

Furthermore, a plurality of rubber pads are fixedly connected to the upper surface of the pressing plate and are uniformly distributed.

Furthermore, both sides of the mounting seat are fixedly connected with handles, and one side of each handle is fixedly connected with an anti-slip sleeve.

The utility model has the advantages that:

1. the limiting block is matched with the clamping groove to be used, the limiting block can limit the position of the diode, so that the diode is accurately positioned, the two ends of the diode are accurately clamped by the clamping groove in the tin melting head, the tin melting head can accurately melt the diode, the conventional tin melting fixing pin mode is prevented from easily causing the dislocation of the tin melting head and the pin, and the tin plating quality of the device is improved.

2. Through the setting of installing the limiting plate on the mount frame, the limiting plate can restrict the position that the diode removed, and it leads to the location inaccurate to avoid the diode to remove the production skew about, has improved the location effect of device.

3. Through the setting at the mount pad mounting connection board, melt the tin and accomplish the back, stir the group board upwards, make the stopper leave the diode, then promote the mount pad and move forward to make fixed diode and the circuit board and the mount pad separation of accomplishing, improved the convenience of device.

4. Through the setting of installation slipmat on the mount pad, the slipmat can increase the frictional force between circuit board and the mount pad, makes being connected between mount pad and the circuit board more firm, has improved the stability of device.

Drawings

Fig. 1 is a schematic view of a front view structure of a rapid diode pin tinning device provided by the present invention;

fig. 2 is a schematic rear view of the rapid diode pin tinning device according to the present invention;

fig. 3 is the utility model provides a diode pin quick tinning stack's sectional structure schematic diagram.

In the figure: 1. pressing a plate; 2. a rubber pad; 3. dialing a plate; 4. a diode; 5. a circuit board; 6. melting the tin head; 7. positioning a groove; 8. a card holder; 9. a fixed mount; 10. a mounting seat; 11. a handle; 12. placing the box; 13. a limiting plate; 14. a position avoiding groove; 15. a spring; 16. a non-slip mat; 17. a card slot; 18. a limiting block; 19. a connecting plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. It should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and their meaning in the context of this patent may be understood by those skilled in the art as appropriate.

Referring to fig. 1-3, a diode pin rapid tinning device comprises a circuit board 5 and a press plate 1, wherein the upper surface of the circuit board 5 is provided with a mounting seat 10, one side of the mounting seat 10 is welded with two fixing frames 9, one side of the fixing frame 9 is welded with a clamping seat 8, two sides of the press plate 1 are both provided with positioning grooves 7, the positioning grooves 7 are in sliding connection with the clamping seat 8, the bottom of the press plate 1 is provided with a tin melting head 6, the bottom of the tin melting head 6 is provided with a clamping groove 17, one side of the fixing frame 9 is rotatably connected with a connecting plate 19, the bottom of the connecting plate 19 is welded with two limiting blocks 18, the upper surface of the mounting seat 10 is provided with a diode 4, after the tin melting is finished, the connecting plate 19 is stirred upwards to enable the limiting blocks 18 to leave the diode 4, then the mounting seat 10 is pushed to move forwards, so that the fixed diode 4 and the circuit board 5 are separated from the mounting seat 10, and the diode 4 is positioned inside the clamping groove 17, keep away groove 14 has been seted up to the upper surface of mount pad 10, and stopper 18 can restrict diode 4's position to make diode 4 obtain accurate location, and then make the both ends that the draw-in groove 17 on the tin melting head 6 is accurate blocked diode 4, make tin melting head 6 can be accurate melt tin to diode 4, avoid the mode of conventional tin melting fixed pin to cause easily that tin melting head 6 and pin misplace.

In the utility model, it should be noted that the spring 15 is welded on the top of the card holder 8, the spring 15 is fixed with the pressing plate 1, the placing box 12 is welded on the top of the mounting seat 10, the limiting plate 13 is welded on one side of the placing box 12, the limiting plate 13 is fixed with the fixing frame 9, the limiting plate 13 can limit the position of the diode 4 to prevent the diode 4 from moving left and right to cause inaccurate positioning, the poking plate 3 is welded on one side of the connecting plate 19, the poking plate 3 is convenient for a worker to poke the connecting plate 19, the bottom of the poking plate 3 is provided with a plurality of anti-skid lines, the bottom of the mounting seat 10 is bonded with the anti-skid pad 16, the anti-skid pad 16 is contacted with the circuit board 5, the anti-skid pad 16 can increase the friction force between the circuit board 5 and the mounting seat 10, so that the connection between the mounting seat 10 and the circuit board 5 is more stable, the upper surface of the pressing plate 1 is bonded with a plurality of rubber pads 2, and rubber pad 2 evenly distributed, handle 11 has all been welded to the both sides of mount pad 10, and one side bonding of handle 11 has the antiskid cover, and handle 11 makes things convenient for the staff to remove mount pad 10, has saved staff's physical power.

The working principle is as follows: when the diode 4 needs to be melted, the diode 4 is firstly placed into the placing box 12, then the diode 4 rolls downwards along the avoiding groove 14, meanwhile, the limiting plate 13 limits the position of the diode 4 to avoid the diode 4 from moving left and right, then the limiting block 18 blocks the diode 4 to enable the diode 4 to move downwards to a proper position to stop, then the pressing plate 1 is pressed downwards to enable the pressing plate to move downwards along the clamping seat 8, and the spring 15 contracts, so that the melting tin head 6 drives the clamping groove 17 to move downwards to a proper position to clamp two ends of the diode 4, and two ends of the diode 4 are pressed to be in contact with the circuit board 5, so that the diode 4 is melted and fixed, after the melting is completed, the pressing plate 1 is loosened, the spring 15 rebounds to extend, the pressing plate 1 drives the melting tin head 6 to move upwards and reset, then the dial plate 3 and the connecting plate 19 are shifted upwards to rotate, thereby moving the stopper 18 away from the diode 4 and then pushing the mount 10 forward to separate the diode 4 and the circuit board 5, which are fixed, from the mount 10.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A diode pin rapid tinning device comprises a circuit board (5) and a press plate (1), and is characterized in that the upper surface of the circuit board (5) is provided with a mounting seat (10), one side of the mounting seat (10) is fixedly connected with two fixing frames (9), one side of each fixing frame (9) is fixedly connected with a clamping seat (8), positioning grooves (7) are respectively formed in two sides of the press plate (1), the positioning grooves (7) are slidably connected with the clamping seats (8), a tin melting head (6) is arranged at the bottom of the press plate (1), clamping grooves (17) are formed in the bottom of the tin melting head (6), one side of each fixing frame (9) is movably connected with a connecting plate (19), two limiting blocks (18) are fixedly connected with the bottom of the connecting plate (19), a diode (4) is arranged on the upper surface of the mounting seat (10), and the diode (4) is positioned in the clamping grooves (17), the upper surface of the mounting seat (10) is provided with an avoiding groove (14).

2. The rapid tinning device for the diode pins is characterized in that a spring (15) is fixedly connected to the top of the clamping seat (8), and the spring (15) is fixed to the press plate (1).

3. The rapid tinning device for diode pins according to claim 2, characterized in that a placing box (12) is fixedly connected to the top of the mounting seat (10).

4. The rapid tinning device for the diode pins according to claim 3, characterized in that a limiting plate (13) is fixedly connected to one side of the placing box (12), and the limiting plate (13) is fixed to the fixing frame (9).

5. The rapid tinning device for the diode pins according to claim 1, wherein a shifting plate (3) is fixedly connected to one side of the connecting plate (19), and a plurality of anti-skidding threads are formed at the bottom of the shifting plate (3).

6. The rapid tinning device for the diode pins is characterized in that a non-slip pad (16) is fixedly connected to the bottom of the mounting seat (10), and the non-slip pad (16) is in contact with the circuit board (5).

7. The rapid tinning device for the diode pins is characterized in that a plurality of rubber pads (2) are fixedly connected to the upper surface of the pressing plate (1), and the rubber pads (2) are uniformly distributed.

8. The rapid diode pin tinning device according to claim 6, characterized in that handles (11) are fixedly connected to both sides of the mounting base (10), and an anti-slip sleeve is fixedly connected to one side of each handle (11).