CN218482198U - Detection system for intelligent card module encapsulation gluing size - Google Patents
Detection system for intelligent card module encapsulation gluing size Download PDFInfo
- Publication number
- CN218482198U CN218482198U CN202221819311.7U CN202221819311U CN218482198U CN 218482198 U CN218482198 U CN 218482198U CN 202221819311 U CN202221819311 U CN 202221819311U CN 218482198 U CN218482198 U CN 218482198U
- Authority
- CN
- China
- Prior art keywords
- convex lens
- card module
- power supply
- digital camera
- speed digital
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The utility model relates to a smart card module encapsulation rubber coating size's detecting system carries out institutional advancement on current encapsulation rubber coating assembly line, uses high-speed digital camera to detect along with the assembly line is synchronous, from pure people's work mode in the past, improves to online image acquisition and detects, and the automatic image recognition technology of the computer that reunites now realizes that the in-process examines entirely, has avoided the error that the manual measure caused. The prior post-detection is improved into on-line detection, and the discovery time point of the defective product is advanced.
Description
Technical Field
The utility model relates to a detection technology, in particular to smart card module encapsulation rubber coating size's detecting system.
Background
The smart card (IC card) is a card form which is made by embedding a microelectronic chip module into a card base. The IC card has the characteristics of small volume, convenient carrying, large storage capacity, high reliability, long service life, strong confidentiality, high safety and the like.
As the most important link in the card making link: the module embedding, the requirement to module encapsulation rubber coating size is very high, and the too big module of size can not be embedded into the card, and undersize can cause the subassembly of chip, gold thread to expose or cause the not enough problem of module self intensity, so control module encapsulation rubber coating size in a reasonable range is very important. The operation of the card making process is schematically shown in fig. 1.
At present, a manual sampling method is used for measuring and judging the size of the module packaging glue coating in China, and the problems are that the detection sample size is small (less than 2%), the measuring method is complex (vernier caliper measurement), and the judgment is difficult (manual and visual judgment).
Disclosure of Invention
The detection system for the module packaging gluing size of the intelligent card is provided aiming at the problems that the quality cannot be guaranteed in module packaging gluing size detection sampling and the time and labor consumption is caused in full detection.
The technical scheme of the utility model is that: a detection system for the size of packaging and gluing of a smart card module is characterized in that a chip strip reel is arranged on a wheel disc of a packaging and gluing assembly line, a belt pulley is driven by a stepping motor to rotate, the chip strip is taken to a plane of an operation table, the smart card modules arrayed on the chip strip are sequentially packaged and glued, the detection system comprises a high-speed digital camera, a support frame, a fixed hanging disc, a convex lens with a power source, a control unit and a computer, the support frame is fixed on the operation table, the high-speed digital camera is fixed on the support frame, one end of the fixed hanging disc, which is used for fixing the convex lens with the power source, is fixed on the support frame, the convex lens with the power source and the high-speed digital camera share the same optical axis, the convex lens with the power source is arranged above a tested smart card module packaged and glued on the chip strip, the control unit receives a stepping signal of a stepping motor driving unit, the control unit outputs a shutter signal serving as the high-speed digital camera to the high-speed digital camera, and the high-speed digital camera acquires an image and sends the image to the computer for size recognition processing.
Preferably, the other end of the fixed hanging disc, which is far away from the support frame, is a hollow disc body, and the convex lens with the power supply is embedded into the disc body of the fixed hanging disc.
Preferably, the control unit outputs a power switch signal to the convex lens with the power supply, and controls the convex lens with the power supply to supplement light to the tested smart card module.
The beneficial effects of the utility model reside in that: the utility model discloses smart card module encapsulation rubber coating size's detecting system, from pure people's work industry mode in the past, improve to online image acquisition and detect, and the automatic image recognition technology of the computer that recombines now realizes that the in-process examines entirely, has avoided the error that the manual measurement caused. The prior post-detection is improved into on-line detection, and the discovery time point of the defective product is advanced.
Drawings
FIG. 1 is a schematic diagram of the operation of a card making process;
FIG. 2 is a schematic structural view of a system for detecting the size of the smart card module package glue of the present invention;
fig. 3 is a schematic diagram of a chip strip of the smart card module of the present invention;
FIG. 4 is a control block diagram of the system for detecting the size of the smart card module package glue;
figure 5 is the utility model discloses gather the image and send module encapsulation rubber coating discernment picture behind the computer.
The attached drawings are as follows: 1. a high-speed digital camera; 2. a support frame; 3. fixing a hanging disc; 4. a convex lens with a power supply; 5. a smart card module; 6. a chip strip; 7. an operation table; 8. a stepping motor driving unit; 9. a control unit; 10. a computer; 11. actual gluing and packaging boundaries; 12. the maximum glue spreading range.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and specific embodiments. The embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.
As shown in fig. 2, a structural schematic diagram of a system for detecting a size of an encapsulation glue coating of a smart card module is shown, a plurality of smart card modules 5 are arrayed on a chip strip 6, as shown in fig. 3, a reel of the chip strip 6 is arranged on a wheel disc of an encapsulation glue coating production line, a belt pulley is driven to rotate by a stepping motor, the chip strip 6 is brought to a plane of an operation table 7, the smart card modules 5 on the chip strip 6 are sequentially encapsulated and glued, a support frame 2 is built above the operation table 7, a high-speed digital camera 1 (shooting speed of 25 high-definition images per second of the high-speed camera) is fixed on the support frame 2, one end of the fixed hanging disc 3 which can be adjusted up and down is fixed on the support frame 2, the other end of the fixed hanging disc 3 which is far away from the support frame 2 can be adjusted up and down is a hollow disc body, a convex lens 4 with a power supply is embedded in the disc body of the fixed hanging disc 3, the convex lens 4 with the power supply is coaxial with the high-speed digital camera 1, the convex lens 4 is arranged above the smart card modules 5 which are encapsulated and glued on the chip strip 6, the chip strip 5, the smart card modules are amplified and subjected to image acquisition, and sent to an image acquisition and calculation and processing machine.
As shown in fig. 4, the step signal of the step motor driving unit 8 is equivalent to the moving displacement signal of the chip strip 6, the distance between two adjacent modules of the smart card modules 5 arranged in an array can be converted into a step signal, the control unit 9 receives the step signal of the step motor driving unit 8, the control unit 9 outputs a trigger signal to the high-speed digital camera 1 as a shutter signal of the high-speed digital camera 1, the high-speed digital camera 1 performs image acquisition on the module package glue amplified by the power supply convex lens 4, the high-speed digital camera 1 sequentially performs image acquisition on the smart card modules 5 on the chip strip 6 under the control of the control unit 9, the acquired image is sent to the computer 10, and the computer 10 performs automatic identification on the module package glue.
Image acquisition operation: 1. the position of the first image acquisition intelligent card module 5 is calibrated, namely the high-speed digital camera 1, the convex lens with the power supply 4 and the intelligent card module 5 are positioned on the same optical axis, the convex lens with the power supply is adjusted up and down, and the high-speed digital camera 1 focuses on the intelligent card module 5; 2. obtaining the distance between the corresponding intelligent card modules 5 to be acquired according to the detection sample amount, such as full detection, wherein the distance is the distance between two adjacent modules, such as spot detection, and the distance is the distance between 3 adjacent modules, and the control unit 9 converts the number of step signals corresponding to the distance signals into trigger time signals according to the detection requirements and in combination with the parameters of the step motors; 3. after synchronously obtaining the signals of the stepping motor driving unit 8, the control unit 9 controls the shutter of the high-speed digital camera 1 according to the triggering detection requirement, and can also synchronously control the light source switch in the convex lens 4 with the power supply, thereby realizing the on-line image acquisition.
As shown in fig. 5, the image is collected and sent to a computer, and then the module is packaged and glued with a recognition map, 11 in fig. 5 is the actual gluing and packaging boundary, 12 is the maximum gluing range, the recognized actual gluing and packaging boundary does not exceed the maximum gluing range, the packaging gluing is qualified, and if the recognized actual gluing and packaging boundary exceeds the maximum gluing range, the packaging gluing is unqualified.
The smart card (IC card) is made in the form of a card by embedding a microelectronic chip module in a card base. The IC card has the characteristics of small volume, convenient carrying, large storage capacity, high reliability, long service life, strong confidentiality, high safety and the like. As the most important link in the card making link: the module embedding, the requirement to module encapsulation rubber coating size is very high, and the oversize module can't be embedded in the card, and undersize can cause the subassembly of chip, gold wire to expose or cause the not enough problem of module self intensity, so control module encapsulation rubber coating size in a reasonable scope is very important. The prior after-the-fact detection is improved into the online detection of production equipment, and once the defects are found, measures are taken in time, so that the finding time points of the defective products are advanced.
The above-mentioned embodiments only represent several embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (3)
1. A detection system for the size of intelligent card module packaging glue coating is characterized by comprising a high-speed digital camera, a support frame, a fixed hanging disc, a convex lens with a power supply, a control unit and a computer, wherein the support frame is fixed on an operation table, the high-speed digital camera is fixed on the support frame, one end of the fixed hanging disc for fixing the convex lens with the power supply is fixed on the support frame, the convex lens with the power supply and the high-speed digital camera are coaxial, the convex lens with the power supply is arranged above a tested intelligent card module packaged and glued on a chip strip, the control unit receives a stepping signal of a stepping motor driving unit, outputs a shutter signal serving as the high-speed digital camera to the high-speed digital camera, and acquires an image of the amplified tested intelligent card module, and the acquired image is sent to the computer for size recognition processing.
2. The system for detecting the size of the smart card module package glue according to claim 1, wherein the other end of the fixed hanging tray, which is away from the supporting frame, is a hollow tray body, and the convex lens with the power supply is embedded in the tray body of the fixed hanging tray.
3. The system for detecting the encapsulation and gluing size of the smart card module as claimed in claim 1, wherein the control unit outputs a power switch signal to the convex lens with power supply to control the convex lens with power supply to supplement light for the smart card module to be detected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221819311.7U CN218482198U (en) | 2022-07-14 | 2022-07-14 | Detection system for intelligent card module encapsulation gluing size |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221819311.7U CN218482198U (en) | 2022-07-14 | 2022-07-14 | Detection system for intelligent card module encapsulation gluing size |
Publications (1)
Publication Number | Publication Date |
---|---|
CN218482198U true CN218482198U (en) | 2023-02-14 |
Family
ID=85164579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202221819311.7U Active CN218482198U (en) | 2022-07-14 | 2022-07-14 | Detection system for intelligent card module encapsulation gluing size |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN218482198U (en) |
-
2022
- 2022-07-14 CN CN202221819311.7U patent/CN218482198U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103149524A (en) | Reversed LED (Light Emitting Diode) chip tester and test method | |
CN109813655A (en) | Damage equipment is shown in a kind of full-automatic quality inspection of copper foil | |
CN207434545U (en) | A kind of automatic checkout equipment | |
CN101571451A (en) | Device for continuously detecting integrative luminescence properties of light emitting diode (LED) light source | |
CN109772721A (en) | Engine commutator open defect automatic online vision inspection apparatus and detection method | |
CN103252320A (en) | Automatic chip on board (COB) optical assembly testing and sorting machine | |
CN207606001U (en) | A kind of textile automatic sorting apparatus | |
CN207503914U (en) | A kind of wafer defect of view-based access control model identification detects, selects integrated apparatus automatically | |
CN210376168U (en) | Rotating disc type automatic optical detection device | |
CN114441149B (en) | Micron light-emitting diode detection system and detection method | |
CN102890093A (en) | Machine vision detecting device of surface quality of master cylinder piston of automobile brake | |
CN108246657A (en) | L ED chip detection device and detection method | |
CN218482198U (en) | Detection system for intelligent card module encapsulation gluing size | |
CN103245901A (en) | LED flip-chip testing machine and testing method | |
CN203217044U (en) | Inverted-mounting LED chip testing machine | |
CN101552313A (en) | Magnetic field excitation LED on-line detection method | |
CN203011849U (en) | Silicon wafer defect detecting device | |
CN208187993U (en) | Cosmetics paper labels defect detecting device | |
CN207816850U (en) | Sheet-fed printed matter online quality control device | |
CN109520888A (en) | A kind of cheese denseness on-line detection device | |
CN102914547B (en) | System and method for automatically detecting impurities in bottled liquid | |
KR20130008187A (en) | Measurment device for flux and method for measurment thereof | |
CN210358133U (en) | Automatic inspection equipment for realizing product appearance inspection | |
CN208066795U (en) | L ED chip detection equipment | |
CN217903091U (en) | Die bonder with double swing arms |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |