CN218475526U

CN218475526U - Semiconductor chip's point gum machine constructs

Info

Publication number: CN218475526U
Application number: CN202223041779.0U
Authority: CN
Inventors: 丁桃宝
Original assignee: Rudong Huishengtong Semiconductor Technology Co ltd
Current assignee: Rudong Huishengtong Semiconductor Technology Co ltd
Priority date: 2022-11-16
Filing date: 2022-11-16
Publication date: 2023-02-14
Anticipated expiration: 2032-11-16

Abstract

The utility model discloses a semiconductor chip glue dispensing mechanism, which relates to the technical field of glue dispensing devices and comprises a base and a glue dispensing component; base: the automatic glue dispensing device comprises a rack body, wherein grooves on the left side surface and the right side surface are internally fixed with a main linear motor, the outer side surface of a main linear motor electronic seat is connected with the bottom end of the inner side surface of the rack body, the groove on the top surface of the rack body is internally provided with a linear motor, the top surface of the linear motor electronic seat is provided with a fixing rack which slides outside the rack body, the front side surface and the back side surface of the fixing rack are respectively fixed with an electric push rod, the bottom ends of the two electric push rods are respectively connected with the two sides of the top surface of an adjusting rack which slides outside the fixing rack body, a glue dispensing assembly is fixed on the left side surface of the fixing rack body, the top surface of the rack body is provided with a feeding unit, and the two sides of the top surface of a base are respectively provided with a fixing unit; wherein: still include the controller, this a point gum machine constructs for semiconductor chip production, the feed volume is sufficient, and the practicality is strong, and work efficiency is high.

Description

Semiconductor chip's point gum machine constructs

Technical Field

The utility model relates to a dispensing device technical field specifically is a semiconductor chip's dispensing mechanism.

Background

A semiconductor chip: etching and wiring are carried out on a semiconductor wafer to manufacture a semiconductor device which can realize a certain function, a glue dispensing device is used in the production process of the semiconductor chip and is used for dispensing and fixing the semiconductor chip, most of the existing glue dispensing devices adopt a single placing table for dispensing and processing, so that time waste can be caused when the semiconductor chip is taken and replaced, the dispensing efficiency of the device is influenced, the size of a glue box of the traditional glue dispensing device is small, and the glue solution in the glue box is easy to solidify.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to overcome current defect, provide a semiconductor chip's point gum machine constructs, the feed volume is sufficient, and the practicality is strong, and work efficiency is high, can effectively solve the problem in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: a glue dispensing mechanism of a semiconductor chip comprises a base and a glue dispensing component;

base: the glue dispensing device comprises a frame, a groove, a linear motor seat, a fixing frame, a glue dispensing assembly, a feeding unit and a fixing unit, wherein the groove is formed in the left side surface and the right side surface of the frame;

wherein: the automatic glue dispensing device is characterized by further comprising a controller, wherein the controller is arranged on the front side face of the base, the input end of the main linear motor, the input end of the electric push rod, the input end of the linear motor and the glue dispensing assembly are electrically connected with the output end of the controller, and the input end of the controller is electrically connected with the output end of an external power supply.

The main linear motor and the linear motor are started to accurately adjust the position of the dispensing component, and the electric push rod can adjust the height of the dispensing component to realize accurate dispensing operation.

Further, the feed unit contains gluey case, hot plate, level sensor, siren, injecting glue valve and support, the top surface at the support body is fixed to the support, the mid-mounting of support has gluey case, the left and right sides face of gluing the case all is fixed with the siren, the bottom surface of gluing incasement portion is placed to the hot plate, level sensor fixes the trailing flank at gluing incasement portion, the leading flank of gluing the case is equipped with the injecting glue valve, the discharging pipe of injecting glue valve is connected with the feed inlet of gluing the subassembly, the input electric connection director's of hot plate, siren and injecting glue valve output, level sensor's output electric connection director's input can heat gluey incasement portion's glue solution through the hot plate to prevent its problem that the solidification appears, level sensor can be to liquid level detection simultaneously, crosses at the liquid level low messenger simultaneously and starts the siren and reminds personnel to add, adopts the gluey case of large capacity also can reduce the frequency of gluing simultaneously.

Further, fixed unit contains places platform, splint, rubber pad, lead screw and motor, it has two and fixes respectively in the front and back both sides of base top surface to place the platform, it is connected with the lead screw all to rotate in the spout of both sides around the platform top surface to place, the motor is fixed at the left surface of placing the platform, the output shaft of motor is connected with the left end of lead screw, the screw threaded connection of lead screw and splint side, the bottom of splint and the spout sliding connection of placing the platform top surface, the rubber pad bonds at the top surface of placing the platform, the input electric connection director's of motor output, it is rotatory that the starter motor drives the lead screw to make splint press from both sides semiconductor chip tightly fixed to the problem that the malfunction appears in the time of can preventing follow-up point gluing in cooperation rubber pad.

Further, still include connector, display screen and video detection head, the right flank of display screen is fixed with the connector, the connector rotates the logical inslot of connecting at the support body left surface, the bottom surface at the mount is installed to the video detection head, the output of the input electric connection controller of display screen and video detection head can be with semiconductor chip's point glue process display on the display screen through the video detection head to make things convenient for personnel to look over and adjust, can be timely when the point is glued to go wrong simultaneously and adjust.

Further, still include the light, the right flank at the support body inside is fixed to the light, the output of input electric connection controller of light, the light can provide sufficient illumination to prevent the darker problem of light.

Furthermore, still include T type piece, T type piece is fixed in the inside of mount, T type piece and the T type groove sliding connection of the inside bottom surface of support body, T type piece slide in the T type groove of support body bottom surface to increase the stability that the mount removed.

Compared with the prior art, the beneficial effects of the utility model are that: this a point gum machine constructs for semiconductor chip production has following benefit:

1. can heat the inside glue solution of gluey case through the hot plate to prevent that it from appearing the problem of solidification, level sensor can be to liquid level detection simultaneously, crosses at the liquid level simultaneously and low to make the start alarm remind personnel to add, adopts the gluey case of large capacity also can reduce the frequency of gluing simultaneously.

2. Can make splint press from both sides tight fixedly with semiconductor chip through starter motor to the problem of maloperation appears in semiconductor chip when cooperation rubber pad can prevent follow-up point from gluing, the light can provide sufficient illumination, thereby prevents to appear the darker problem of light.

3. The dispensing process of the semiconductor chip can be displayed on the display screen through the video detection head, so that the dispensing device is convenient for people to check and adjust, and can be timely adjusted when dispensing is in a problem.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the cross-sectional structure of the frame body of the present invention;

fig. 3 is a schematic view of the structure of the fixing unit of the present invention.

In the figure: the automatic glue dispensing device comprises a base 1, a feeding unit 2, a glue box 21, a heating plate 22, a liquid level sensor 23, a 24 alarm, a 25 glue dispensing valve, a 26 support, a fixing unit 3, a placing table 31, a 32 clamping plate, a 33 rubber pad, a 34 screw rod, a 35 motor, a 4 main linear motor, a 5 support body, a 6 fixing frame, a 7 electric push rod, an 8 linear motor, a 9 adjusting frame, a 10 glue dispensing assembly, a 11 connecting head, a 12 display screen, a 13 video detection head, a 14 illuminating lamp, a 15T-shaped block and a 16 controller.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-3, the present embodiment provides a technical solution: a glue dispensing mechanism of a semiconductor chip comprises a base 1 and a glue dispensing assembly 10;

base 1: the main linear motor 4 is fixed in the groove of the left and right side surfaces, the outer side surface of the rotor seat of the main linear motor 4 is connected with the bottom end of the inner side surface of the frame body 5, the linear motor 8 is arranged in the groove of the top surface of the frame body 5, the top surface of the rotor seat of the linear motor 8 is provided with a fixed frame 6 which slides with the outer side of the frame body 5, the front and back side surfaces of the fixed frame 6 are respectively fixed with an electric push rod 7, the bottom ends of the two electric push rods 7 are respectively connected with the two sides of the top surface of an adjusting frame 9 which slides with the outer side of the fixed frame 6, the glue dispensing assembly 10 is fixed on the left side surface of the fixed frame 6, the main linear motor 4 and the linear motor 8 are started to accurately adjust the position of the glue dispensing assembly 10, meanwhile, the electric push rods 7 can adjust the height of the glue dispensing assembly 10 to realize accurate glue dispensing operation, the top surface of the frame body 5 is provided with a feeding unit 2, the feeding unit 2 comprises a glue box 21, a heating plate 22, a liquid level sensor 23, an alarm 24, a glue dispensing valve 25 and a support 26, the support 26 is fixed on the top surface of the frame body 5, the glue box 21 is installed in the middle of the support 26, the left side surface and the right side surface of the glue box 21 are both fixed with the alarms 24, the heating plate 22 is placed on the bottom surface inside the glue box 21, the liquid level sensor 23 is fixed on the rear side surface inside the glue box 21, the glue injection valve 25 is arranged on the front side surface of the glue box 21, the discharge pipe of the glue injection valve 25 is connected with the feed inlet of the glue dispensing assembly 10, the input ends of the heating plate 22, the alarms 24 and the glue injection valve 25 are electrically connected with the output end of the controller 16, the output end of the liquid level sensor 23 is electrically connected with the input end of the controller 16, glue solution inside the glue box 21 can be heated through the heating plate 22 to prevent the glue solution from being solidified, meanwhile, the liquid level sensor 23 can detect the liquid level, and the alarm 24 is started to remind a person to add when the liquid level is too low, meanwhile, the frequency of adding glue can be reduced by adopting a large-capacity glue box 21, the two sides of the top surface of the base 1 are respectively provided with the fixing units 3, each fixing unit 3 comprises a placing table 31, a clamping plate 32, a rubber pad 33, a screw rod 34 and a motor 35, the placing tables 31 are two and are respectively fixed on the front side and the rear side of the top surface of the base 1, the screw rods 34 are rotatably connected in the chutes on the front side and the rear side of the top surface of the placing table 31, the motor 35 is fixed on the left side surface of the placing table 31, an output shaft of the motor 35 is connected with the left side end of the screw rod 34, the screw rod 34 is in threaded connection with a screw hole on the side surface of the clamping plate 32, the bottom end of the clamping plate 32 is in sliding connection with the chutes on the top surface of the placing table 31, the rubber pad 33 is adhered on the top surface of the placing table 31, the input end of the motor 35 is electrically connected with the output end of the controller 16, the motor 35 is started to drive the screw rod 34 to rotate, so that the clamping plate 32 clamps and fixes the semiconductor chips, and the semiconductor chips can be matched with the rubber pad 33 to prevent the semiconductor chips from being mistakenly moved during subsequent glue dispensing;

wherein: the LED lamp is characterized by further comprising a controller 16, the controller 16 is arranged on the front side face of the base 1, the main linear motor 4, the electric push rod 7, the linear motor 8 and an input end of the dispensing component 10 are electrically connected with an output end of the controller 16, an input end of the controller 16 is electrically connected with an output end of an external power supply, the LED lamp further comprises a connector 11, a display screen 12 and a video detection head 13, the connector 11 is fixed on the right side face of the display screen 12, the connector 11 is rotatably connected in a through groove in the left side face of the frame 5, the video detection head 13 is installed on the bottom face of the frame 6, the input ends of the display screen 12 and the video detection head 13 are electrically connected with the output end of the controller 16, dispensing processes of semiconductor chips can be displayed on the display screen 12 through the video detection head 13, accordingly, people can conveniently check and adjust the dispensing processes, meanwhile, timely adjustment can be carried out when dispensing problems occur, the dispensing processes also comprising a T-shaped block 15, the illuminating lamp 14 is fixed on the right side face inside the frame 5, the input end of the illuminating lamp 14 is electrically connected with the output end of the controller 16, sufficient illumination, accordingly, the problem of darker light is prevented, the T-shaped block 15 is further comprising a T-shaped block 15, and the T-shaped groove which is connected with a sliding groove in the fixing frame, and the T-shaped groove in which is connected with the T-shaped groove in a sliding manner, and the T-shaped groove of the frame, and the T-shaped groove of the T-shaped slot of the frame, and the T-shaped slot of the frame, so that the T-shaped slot of the T-shaped block 15, and the T-shaped slot of the frame.

The utility model provides a pair of semiconductor chip's point gum machine constructs's theory of operation as follows: at first, put semiconductor chip to the top surface of placing platform 31, starter motor 35 drives lead screw 34 to rotate, thereby make splint 32 press from both sides semiconductor chip tight fixed, and cooperation rubber pad 33 can prevent the problem that semiconductor chip appears the maloperation when follow-up some glue, then start main linear electric motor 4 and linear electric motor 8 and can carry out accurate regulation to the position of some glue subassembly 10, electric putter 7 then can adjust the altitude mixture control of some glue subassembly 10 simultaneously, in order to realize accurate some glue operation, some glue in-process can show semiconductor chip's some glue process on display screen 12 through video detection head 13, thereby make things convenient for personnel to look over and adjust, and light 14 can provide sufficient illumination, thereby prevent the darker problem of light, simultaneously can be timely when some glue goes wrong, and the injecting glue valve 25 of gluey case 21 front side can carry the inside of glue subassembly 10 with the glue solution, can heat the glue solution of gluing case 21 inside through hot plate 22, so as to prevent it from appearing the problem that solidification, level sensor 23 can detect the liquid level, simultaneously make the low pressure that the siren 24 comes to start the large capacity to add, adopt gluey case 21 also can reduce the frequency of gluing.

It should be noted that the controller 16 disclosed in the above embodiments is selected as the model S7-200, the main linear motor 4 and the linear motor 8 can be freely configured according to the actual application scenario, it is suggested that the linear motor with the model JL-C16 is selected, the linear motor with the model JL-C16 is selected as the electric heating plate with the model YH-5-5, the video detection head 13 is selected as the video detection head with the model GX2500-C, the liquid level sensor 23 is selected as the liquid level sensor with the model MPM4700W, and the alarm 24 is selected as the audible and visual alarm with the model KXB 127-T. The controller 16 controls the operation of the heating plate 22, the liquid level sensor 23, the alarm 24, the glue injection valve 25, the main linear motor 4, the linear motor 8, the display screen 12, the illuminating lamp 14 and the video detection head 13 by a method commonly used in the prior art.

The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.

Claims

1. The utility model provides a semiconductor chip's point gum machine constructs which characterized in that: comprises a base (1) and a glue dispensing component (10);

base (1): the glue dispensing device is characterized in that main linear motors (4) are fixed in grooves in the left side face and the right side face, the outer side face of a rotor seat of each main linear motor (4) is connected with the bottom end of the inner side face of a frame body (5), linear motors (8) are arranged in grooves in the top face of the frame body (5), a fixing frame (6) sliding outside the frame body (5) is installed on the top face of the rotor seat of each linear motor (8), electric push rods (7) are fixed on the front side face and the rear side face of the fixing frame (6), the bottom ends of the two electric push rods (7) are connected with the two sides of the top face of an adjusting frame (9) sliding outside the fixing frame (6) respectively, glue dispensing assemblies (10) are fixed on the left side face of the fixing frame (6), a feeding unit (2) is arranged on the top face of the frame body (5), and fixing units (3) are arranged on the two sides of the top face of a base (1);

wherein: still include controller (16), establish the leading flank at base (1) in controller (16), the output of controller (16) is connected to main linear electric motor (4), electric putter (7), linear electric motor (8) and the input electricity of gluing subassembly (10), the output of external power source is connected to the input electricity of controller (16).

2. The dispensing mechanism of a semiconductor chip as claimed in claim 1, wherein: supply unit (2) contain gluey case (21), hot plate (22), level sensor (23), siren (24), injecting glue valve (25) and support (26), the top surface at support body (5) is fixed in support (26), the mid-mounting of support (26) has gluey case (21), the left and right sides face of gluing case (21) all is fixed with siren (24), hot plate (22) are placed in the inside bottom surface of gluing case (21), level sensor (23) are fixed at the inside trailing flank of gluing case (21), the leading flank of gluing case (21) is equipped with injecting glue valve (25), the discharging pipe of injecting glue valve (25) is connected with the feed inlet of gluing subassembly (10), the output of input electric connection controller (16) of hot plate (22), siren (24) and injecting glue valve (25), the input of output electric connection controller (16) of level sensor (23).

3. The dispensing mechanism of a semiconductor chip as claimed in claim 1, wherein: fixed unit (3) contain place platform (31), splint (32), rubber pad (33), lead screw (34) and motor (35), place platform (31) have two and fix both sides around base (1) top surface respectively, it is connected with lead screw (34) all to rotate in the spout of both sides around placing platform (31) top surface, motor (35) are fixed at the left surface of placing platform (31), the output shaft of motor (35) is connected with the left side end of lead screw (34), the screw threaded connection of lead screw (34) and splint (32) side, the bottom of splint (32) with place the spout sliding connection of platform (31) top surface, rubber pad (33) bond the top surface of placing platform (31), the input electricity connection director's (16) output of motor (35).

4. The dispensing mechanism of a semiconductor chip as claimed in claim 1, wherein: still include connector (11), display screen (12) and video detection head (13), the right flank of display screen (12) is fixed with connector (11), connector (11) rotate the logical inslot of connecting at support body (5) left surface, the bottom surface at mount (6) is installed in video detection head (13), the output of the input electricity connection controller (16) of display screen (12) and video detection head (13).

5. The dispensing mechanism of a semiconductor chip as claimed in claim 1, wherein: still include light (14), right flank in support body (5) inside is fixed in light (14), the output of input electricity connection controller (16) of light (14).

6. The dispensing mechanism of a semiconductor chip as claimed in claim 1, wherein: still include T type piece (15), the inside at mount (6) is fixed in T type piece (15), T type piece (15) and the T type groove sliding connection of the inside bottom surface of support body (5).