CN218470908U - ESD electrostatic impact tester for semiconductor detection - Google Patents

ESD electrostatic impact tester for semiconductor detection Download PDF

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Publication number
CN218470908U
CN218470908U CN202221948738.7U CN202221948738U CN218470908U CN 218470908 U CN218470908 U CN 218470908U CN 202221948738 U CN202221948738 U CN 202221948738U CN 218470908 U CN218470908 U CN 218470908U
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plate
esd electrostatic
storage rack
storage
impact tester
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CN202221948738.7U
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Chinese (zh)
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黄进
李伟
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Nanjing Chuangrui Semiconductor Co ltd
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Nanjing Chuangrui Semiconductor Co ltd
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Abstract

The utility model relates to a semiconductor detection technology field specifically is an ESD electrostatic shock tester for semiconductor detects, include: a storage bin is arranged on the side surface of the detection rack, and a guide rod is arranged inside the storage bin; the storage rack inner plate is arranged inside the storage bin, the surface of the storage rack inner plate is provided with an arc winding plate, and the surface of the arc winding plate is provided with a storage rack outer plate; the mounting shell is arranged on the surface of the outer plate of the containing frame, and a sliding groove is formed in the surface of the mounting shell; the beneficial effects are that: the outer plate of the containing frame and the arc winding plate are pulled out from the containing bin through the control handle, the connecting wires are wound on the surface of the arc winding plate, the outer plate of the containing frame is pushed into the containing bin through the control handle, then the positioning plate is controlled to be plugged into the positioning groove through the control handle, the outer plate of the containing frame and the arc winding plate are fixed inside the containing bin, and therefore the connecting wires wound on the surface of the arc winding plate are fixed inside the containing bin.

Description

ESD electrostatic impact tester for semiconductor detection
Technical Field
The utility model relates to a semiconductor detection technology field specifically is an ESD electrostatic impact tester for semiconductor detects.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and the semiconductor device is subjected to electrostatic impact in the using process, so that the semiconductor device needs to be tested by an ESD electrostatic impact tester in the production process of the semiconductor device;
when the existing ESD electrostatic impact tester is used, a discharge gun is inserted into a body of the ESD electrostatic impact tester through a connecting wire, the tester is set through a control panel, then a semiconductor device to be tested is placed on a test bench, and the semiconductor device is tested by releasing static electricity through the discharge gun;
however, the connection wire of the discharge gun of the existing ESD electrostatic impact tester is fixedly connected with the discharge gun, and the connection wire is usually wound on the discharge gun after use, or the connection wire is hung on one side of the discharge gun after being wound, so that the connection wire is easily scattered when the ESD electrostatic impact tester is transported and moved, and troubles are caused to the transportation and the movement of the ESD electrostatic impact tester.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an ESD electrostatic shock tester for semiconductor testing to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
an ESD electrostatic impact tester for semiconductor testing, comprising:
the ESD electrostatic impact tester comprises an ESD electrostatic impact tester main body, wherein a detection rack is arranged on one side of the ESD electrostatic impact tester main body, a storage bin is arranged on the side surface of the detection rack, and a guide rod is arranged inside the storage bin;
the storage rack inner plate is arranged inside the storage bin, an arc winding plate is arranged on the surface of the storage rack inner plate, and a storage rack outer plate is arranged on the surface of the arc winding plate;
the installation shell sets up in the surface of accomodating frame planking, and the spout has been seted up on the surface of installation shell, and the inside of installation shell is provided with the locating plate.
Preferably, the surface that detects the rack is provided with the semiconductor device mount, and the top surface that detects the rack is provided with the discharge gun through the support, and the fixed surface of discharge gun is connected with connecting wire, and the discharge gun passes through connecting wire and ESD electrostatic impact tester main part electric connection, and the side of ESD electrostatic impact tester main part is provided with power socket.
Preferably, the storage bin is arranged on one side, far away from the ESD electrostatic impact tester main body, of the detection rack, a through groove is formed in the side wall of the storage bin, and the through groove penetrates through the side wall of the storage bin and the surface of the through groove.
Preferably, the guide bar is provided with two sets ofly, and the fixed limiting plate that is provided with in top of guide bar, the limiting plate keep away from the one end of guide bar and extend to the outside of collecting storage facility, and the constant head tank has been seted up on the surface of limiting plate, and two sets of limiting plate symmetry set up.
Preferably, the storage rack inner plate is arranged in a sliding manner on the inner wall of the storage bin, two groups of guide holes are formed in the surface of the storage rack inner plate, and the storage rack inner plate is slidably sleeved on the surface of the guide rod through the guide holes.
Preferably, arc winding plate and the one side fixed connection who accomodates a frame inner panel towards the storage bin outside, arc winding plate symmetry is provided with two sets ofly.
Preferably, the end, away from the inner plate of the storage frame, of the outer plate of the storage frame and the end, away from the inner plate of the storage frame, of the arc winding plate are fixedly connected, the surface of the outer plate of the storage frame is provided with a plug hole, and the inner wall of the plug hole is arranged with the limiting plate in a sliding mode.
Preferably, the mounting shell is of a '21274', the surface of one side, away from the arc winding plate, of the outer plate of the containing frame is fixedly connected with the surface of the other side, the sliding grooves penetrate through two sides of the mounting shell, a first limiting groove and a second limiting groove are formed in the side wall of each sliding groove, two groups of sliding grooves are formed, and the two groups of sliding grooves are symmetrically formed in the sliding grooves.
Preferably, the positioning plate is of a square plate-shaped structure, the positioning plate is arranged on the inner wall of the mounting shell in a sliding manner, the positioning plate is arranged on the surface of the outer plate of the containing frame in a sliding manner, a control handle is fixedly arranged on one side of the positioning plate close to the mounting shell, the control handle is of a '21274', two ends of the control handle are respectively arranged in the sliding groove in a sliding manner, and elastic positioning blocks are respectively fixedly arranged at two ends of the control handle.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model provides a ESD electrostatic impact tester for semiconductor detection, pull out storage rack planking and arc winding board from the inside of collecting storage facility through the control handle, twine connecting wire to the surface of arc winding board, push the inside of collecting storage rack planking through the control handle, make connecting wire get into the inside that leads to the groove, then peg graft the inside of constant head tank through control handle control locating plate, be fixed in the inside of collecting storage facility with storage rack planking and arc winding board, thereby will twine the inside that is fixed in the collecting storage facility at the connecting wire on arc winding board surface, when having avoided moving ESD electrostatic impact tester, lead to the problem that connecting wire scatters.
Drawings
FIG. 1 is a schematic view of the connecting wire of the present invention in use;
FIG. 2 is an enlarged schematic view of the structure at A of FIG. 1 according to the present invention;
FIG. 3 is a schematic structural view of the connection lead of the present invention after being stored;
FIG. 4 is a schematic view of the structure of the detecting rack of the present invention;
FIG. 5 is a schematic view of the inner plate structure of the storage rack of the present invention;
FIG. 6 is an enlarged schematic view of the structure of FIG. 5B according to the present invention;
FIG. 7 is a schematic view of the positioning plate structure of the present invention;
fig. 8 is an enlarged schematic structural view of the point C in fig. 7 according to the present invention.
In the figure: ESD electrostatic impact tester main part 1, discharge gun 11, connecting wire 12, test bench 2, storage bin 21, guide bar 22, limiting plate 23, constant head tank 24, logical groove 25, storage rack inner panel 3, guiding hole 31, arc winding board 32, storage rack planking 33, spliced eye 34, installation shell 4, spout 41, spacing groove 42, no. two spacing grooves 43, locating plate 5, control handle 51, elastic locating piece 52.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clear and fully described, embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are illustrative of some, but not all, embodiments of the invention and are not to be construed as limiting the scope of the invention, as those skilled in the art will recognize and appreciate that many other embodiments can be made without inventive faculty.
Example one
Referring to fig. 1-7, the present invention provides a technical solution:
an ESD electrostatic impact tester for semiconductor testing, comprising: a detection rack 2 is arranged on one side of the ESD electrostatic impact tester main body 1, a storage bin 21 is arranged on the side surface of the detection rack 2, and a guide rod 22 is arranged inside the storage bin 21; the storage rack inner plate 3 is arranged inside the storage bin 21, an arc winding plate 32 is arranged on the surface of the storage rack inner plate 3, and a storage rack outer plate 33 is arranged on the surface of the arc winding plate 32; the mounting shell 4 is arranged on the surface of the outer plate 33 of the containing frame, a sliding groove 41 is formed in the surface of the mounting shell 4, and a positioning plate 5 is arranged inside the mounting shell 4; a semiconductor device fixing frame is arranged on the surface of the detection rack 2, a discharge gun 11 is arranged on the top surface of the detection rack 2 through a support, a connecting lead 12 is fixedly connected to the surface of the discharge gun 11, the discharge gun 11 is electrically connected with the ESD electrostatic impact tester main body 1 through the connecting lead 12, and a power supply socket is arranged on the side surface of the ESD electrostatic impact tester main body 1; after the ESD electrostatic impact tester is used, the connecting wire 12 is pulled out from the discharge gun 11, and then the connecting wire 12 is wound on the surface of the arc winding plate 32, so as to push the outer plate 33 of the storage rack into the storage bin 21, and fix the position of the outer plate 33 of the storage rack, thereby storing the connecting wire 12 in the storage bin 21.
Example two
On the basis of the first embodiment, in order to realize the movement of the outer plate 33 of the storage rack, the storage bin 21 is opened at one side of the detection rack 2 away from the ESD electrostatic impact tester main body 1, a through groove 25 is formed in the side wall of the storage bin 21, and the through groove 25 penetrates through the side wall of the storage bin 21 and the surface of the through groove 25; two groups of guide rods 22 are arranged, limiting plates 23 are fixedly arranged at the top ends of the guide rods 22, one ends of the limiting plates 23, which are far away from the guide rods 22, extend to the outside of the storage bin 21, positioning grooves 24 are formed in the surfaces of the limiting plates 23, and the two groups of limiting plates 23 are symmetrically arranged; the inner storage rack plate 3 and the inner wall of the storage bin 21 are arranged in a sliding manner, two groups of guide holes 31 are formed in the surface of the inner storage rack plate 3, and the inner storage rack plate 3 is slidably sleeved on the surface of the guide rod 22 through the guide holes 31; the arc winding plates 32 are fixedly connected with one surface of the storage rack inner plate 3 facing the outer side of the storage bin 21, and two groups of arc winding plates 32 are symmetrically arranged; the outer storage rack plate 33 is fixedly connected with one end, away from the inner storage rack plate 3, of the arc-shaped winding plate 32, the surface of the outer storage rack plate 33 is provided with a plug hole 34, and the inner wall of the plug hole 34 is arranged with the limiting plate 23 in a sliding manner; because the inner wall of the containing frame inner plate 3 and the containing bin 21 is slidably arranged, and the containing frame inner plate 3 is slidably sleeved on the surface of the guide rod 22 through the guide hole 31, the containing frame outer plate 33 is fixedly connected with the containing frame inner plate 3 through the arc-shaped winding plate 32, and the containing frame outer plate 33 is moved.
EXAMPLE III
On the basis of the second embodiment, in order to fix the position of the outer plate 33 of the storage frame, the mounting shell 4 is in a '21274', the surface of one side of the mounting shell 4, which is far away from the arc winding plate 32, of the outer plate 33 of the storage frame is fixedly connected with the surface of the other side of the outer plate 33 of the storage frame, the sliding grooves 41 penetrate through two sides of the mounting shell 4, the side walls of the sliding grooves 41 are provided with a first limiting groove 42 and a second limiting groove 43, the sliding grooves 41 are provided with two groups, and the two groups of sliding grooves 41 are symmetrically provided; the positioning plate 5 is of a square plate-shaped structure, the positioning plate 5 is arranged on the inner wall of the installation shell 4 in a sliding mode, the positioning plate 5 is arranged on the surface of the outer plate 33 of the containing frame in a sliding mode, a control handle 51 is fixedly arranged on one side, close to the installation shell 4, of the positioning plate 5, the control handle 51 is of a '21274' -shaped cylinder structure, two ends of the control handle 51 are arranged inside the sliding groove 41 in a sliding mode, and elastic positioning blocks 52 are fixedly arranged at two ends of the control handle 51; promote the control handle 51 and drive the inside that accomodates a planking 33 and remove storage facility 21, make limiting plate 23 pass spliced eye 34, positioning groove 24 aligns with the position of positioning plate 5 this moment, drive positioning plate 5 through control handle 51 and peg graft the inside of positioning groove 24, elastic locating piece 52 breaks away from the inside of pegging graft No. two spacing grooves 43 from accompanying the inside of you passing No. one spacing groove 42 simultaneously, the inside that has prevented accomodate a planking 33 and has broken away from storage facility 21, thereby the position of accomodating a planking 33 has been fixed.
In practical use, when detecting a semiconductor device, the semiconductor device is fixed on a fixing frame on the surface of a detection bench 2, a discharge gun 11 is connected with an ESD electrostatic impact tester body 1 through a connecting lead 12, the ESD electrostatic impact tester body 1 is set through a control panel, then the discharge gun 11 releases static to detect the semiconductor device, after the detection is completed, the connecting lead 12 is pulled out from the ESD electrostatic impact tester body 1, a positioning plate 5 is controlled to be separated from the inside of a positioning groove 24 through a control handle 51, an elastic positioning block 52 is separated from the inside of a first limiting groove 43 and clamped to the inside of the first limiting groove 42, then the storage rack outer plate 33 and an arc winding plate 32 are pulled out from the inside of the storage bin 21 through the control handle 51, the connecting lead 12 is wound on the surface of the arc winding plate 32, the storage rack outer plate 33 is pushed into the inside of the storage bin 21 through the control handle 51, the connecting lead 12 enters the inside of a through groove 25, extrusion of the connecting lead 12 is avoided, meanwhile, a limiting plate 23 passes through a plugging hole 34, at the moment, the positioning plate 24 is aligned with the positioning plate 5, the positioning plate 5 is fixed on the fixing frame outer plate 21 through the connecting groove 32, and the positioning block 21, and the positioning plate 32, thereby the connecting rod is fixed on the positioning block 21.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (9)

1. An ESD electrostatic impact tester for semiconductor detection is characterized in that: the ESD electrostatic impact tester for semiconductor detection comprises:
the ESD electrostatic impact tester comprises an ESD electrostatic impact tester main body (1), wherein a detection rack (2) is arranged on one side of the ESD electrostatic impact tester main body (1), a storage bin (21) is arranged on the side surface of the detection rack (2), and a guide rod (22) is arranged inside the storage bin (21);
the storage rack comprises a storage rack inner plate (3), the storage rack inner plate (3) is arranged inside a storage bin (21), an arc winding plate (32) is arranged on the surface of the storage rack inner plate (3), and a storage rack outer plate (33) is arranged on the surface of the arc winding plate (32);
the installation structure comprises an installation shell (4), wherein the installation shell (4) is arranged on the surface of the storage rack outer plate (33), a sliding groove (41) is formed in the surface of the installation shell (4), and a positioning plate (5) is arranged inside the installation shell (4).
2. An ESD electrostatic shock tester for semiconductor testing according to claim 1, wherein: the surface that detects rack (2) is provided with the semiconductor device mount, and the top surface that detects rack (2) is provided with discharge gun (11) through the support, and the fixed surface of discharge gun (11) is connected with connecting wire (12), and discharge gun (11) are through connecting wire (12) and ESD electrostatic impact tester main part (1) electric connection, and the side of ESD electrostatic impact tester main part (1) is provided with power socket.
3. An ESD electrostatic shock tester for semiconductor testing according to claim 2, wherein: storage bin (21) is opened in one side that ESD electrostatic impact tester main part (1) was kept away from in detection rack (2), and logical groove (25) have been seted up to the lateral wall of storage bin (21), and logical groove (25) run through the surface of the lateral wall of storage bin (21) and logical groove (25).
4. An ESD electrostatic shock tester for semiconductor testing according to claim 3, wherein: guide bar (22) are provided with two sets ofly, and the fixed limiting plate (23) that is provided with in top of guide bar (22), and the one end that guide bar (22) were kept away from in limiting plate (23) extends to the outside of collecting storage (21), and constant head tank (24), two sets of limiting plate (23) symmetry setting have been seted up on the surface of limiting plate (23).
5. The ESD electrostatic impact tester for semiconductor detection according to claim 4, wherein: the inner wall of the storage rack inner plate (3) and the inner wall of the storage bin (21) are arranged in a sliding mode, two groups of guide holes (31) are formed in the surface of the storage rack inner plate (3), and the surface of the guide rod (22) is sleeved with the storage rack inner plate (3) in a sliding mode through the guide holes (31).
6. An ESD electrostatic shock tester for semiconductor testing according to claim 5, wherein: arc winding board (32) and storage rack inner panel (3) are towards the one side fixed connection in storage bin (21) outside, and arc winding board (32) symmetry is provided with two sets ofly.
7. An ESD electrostatic shock tester for semiconductor testing according to claim 6, wherein: the storage rack outer plate (33) is fixedly connected with one end, away from the storage rack inner plate (3), of the arc-shaped winding plate (32), a plug hole (34) is formed in the surface of the storage rack outer plate (33), and the inner wall of the plug hole (34) is arranged with the limiting plate (23) in a sliding mode.
8. An ESD electrostatic shock tester for semiconductor testing according to claim 7, wherein: the mounting shell (4) is of a '21274', the surface of one side of the mounting shell (4) far away from the arc winding plate (32) is fixedly connected with the surface of the outer plate (33) of the containing frame, the sliding grooves (41) penetrate through the two sides of the mounting shell (4), the side wall of each sliding groove (41) is provided with a first limiting groove (42) and a second limiting groove (43), the sliding grooves (41) are provided with two groups, and the two groups of sliding grooves (41) are symmetrically provided with the two groups of limiting grooves.
9. An ESD electrostatic shock tester for semiconductor testing according to claim 8, wherein: the positioning plate (5) is of a square plate-shaped structure, the positioning plate (5) is arranged on the inner wall of the mounting shell (4) in a sliding mode, the positioning plate (5) is arranged on the surface of the outer plate (33) of the containing frame in a sliding mode, a control handle (51) is fixedly installed on one side, close to the mounting shell (4), of the positioning plate (5), the control handle (51) is of a '21274', the two ends of the control handle (51) are arranged inside the sliding groove (41) in a sliding mode respectively, and elastic positioning blocks (52) are fixedly arranged at the two ends of the control handle (51) respectively.
CN202221948738.7U 2022-07-26 2022-07-26 ESD electrostatic impact tester for semiconductor detection Active CN218470908U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221948738.7U CN218470908U (en) 2022-07-26 2022-07-26 ESD electrostatic impact tester for semiconductor detection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221948738.7U CN218470908U (en) 2022-07-26 2022-07-26 ESD electrostatic impact tester for semiconductor detection

Publications (1)

Publication Number Publication Date
CN218470908U true CN218470908U (en) 2023-02-10

Family

ID=85134993

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221948738.7U Active CN218470908U (en) 2022-07-26 2022-07-26 ESD electrostatic impact tester for semiconductor detection

Country Status (1)

Country Link
CN (1) CN218470908U (en)

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