CN218470811U

CN218470811U - PCBA test fixture

Info

Publication number: CN218470811U
Application number: CN202222538857.1U
Authority: CN
Inventors: 陈星光; 陈景胜
Original assignee: Guangzhou Jiadu Technology Software Development Co ltd; PCI Technology Group Co Ltd
Current assignee: Guangzhou Jiadu Technology Software Development Co ltd; PCI Technology Group Co Ltd
Priority date: 2022-09-23
Filing date: 2022-09-23
Publication date: 2023-02-10
Anticipated expiration: 2032-09-23

Abstract

The embodiment of the application provides a PCBA test fixture, the on-line screen storage device comprises a base, a supporting plate, the PCB keysets, thimble and electronic module, the backup pad is fixed on the base, the PCB keysets has the ground of contact to set up in the backup pad top, spacing hole has been seted up in the backup pad, the thimble pad has been laid on the PCB keysets, thimble pad and spacing hole coincidence, the thimble alternates on PCB keysets and backup pad via thimble pad and spacing hole, the top of thimble is located the top of PCB keysets, electronic module passing signal line is connected on the PCB keysets, through letting the test point of being surveyed PCBA contact with the thimble, just can realize being surveyed PCBA's test, and not only the efficiency of software testing has been improved, still reduced the cost of labor.

Description

PCBA test fixture

Technical Field

The embodiment of the application relates to the technical field of testing, and especially relates to a PCBA test fixture.

Background

Printed Circuit Board Assembly (PCBA) is a Printed Circuit Board (PCB) with electronic components welded, and in order to ensure the processing quality of the PCBA, the PCBA needs to be tested before leaving a factory. The PCBA test tool is used as a main tool for completing the test, the PCBA test tool is connected with the test points on the PCBA to be tested, and under the condition that the PCBA to be tested is electrified, the PCBA to be tested is determined whether the electronic components are in wrong welding, missing welding, insufficient welding and the like through obtaining electric signals of the test points, so that the test is realized.

In the prior art, in the testing process, a tested PCBA is connected with a testing tool in a manual wiring mode, and the problems of high labor cost and low testing efficiency exist due to the fact that the number of circuits is large.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a PCBA test fixture to solve the problems of high labor cost and low test efficiency in the prior art.

This application is implemented and is provided a PCBA test fixture, includes: the device comprises a base, a supporting plate, a PCB (printed circuit board) adapter plate, a thimble and an electronic module;

the supporting plate is fixed on the base, and the PCB adapter plate is arranged above the supporting plate in a contact manner;

a limiting hole is formed in the supporting plate, a thimble bonding pad is distributed on the PCB adapter plate, and the thimble bonding pad is superposed with the limiting hole;

the ejector pin is inserted into the PCB adapter plate and the supporting plate through the ejector pin bonding pad and the limiting hole, and the top end of the ejector pin is positioned above the PCB adapter plate;

the electronic module is connected to the PCB adapter plate through a signal wire.

Optionally, a copper foil lead and a wiring pad of the signal line are further arranged on the PCB adapter plate, one end of the copper foil lead is connected with the thimble pad, and the other end of the copper foil lead is connected with the wiring pad; the number of the copper foil leads is equal to that of the thimbles.

Optionally, the connection pad is a socket pad, the PCBA test fixture further includes a socket, and the socket is soldered on the socket pad by reflow soldering or wave soldering; the tail end of the signal wire is provided with a plug, and the signal wire is plugged in the socket through the plug.

Optionally, the signal line is a flexible printed circuit FPC line, a radio frequency coaxial line, or a common line.

Optionally, the wiring pad is a wire bonding pad, the signal wire is bonded to the wire bonding pad, and the signal wire is a common wire.

Optionally, the PCBA test fixture further comprises a thimble sleeve; the thimble passes through the thimble cover via the thimble pad with spacing hole alternates in the PCB keysets with on the backup pad.

Optionally, the thimble sleeve is soldered to the thimble pad by reflow soldering or wave soldering.

Optionally, the electronic module comprises a high speed electronic module and/or a low speed electronic module.

Optionally, the support plate is an acrylic fixation plate.

Optionally, the number of the thimbles is the same as the number of the test points on the PCBA to be tested.

The utility model provides a PCBA test fixture, the on-line screen storage device comprises a base, a supporting plate, the PCB keysets, thimble and electronic module, the backup pad is fixed on the base, the PCB keysets has the ground of contact to set up in the backup pad top, spacing hole has been seted up in the backup pad, the thimble pad has been laid on the PCB keysets, thimble pad and spacing hole coincidence, the thimble alternates on PCB keysets and backup pad via thimble pad and spacing hole, the top of thimble is located the top of PCB keysets, electronic module passes through the signal line and connects on the PCB keysets, through letting the test point of being surveyed PCBA contact with the thimble, just can realize being surveyed PCBA's test, owing to change PCBA's in-process, do not need artifical wiring, thereby not only improved efficiency of software testing, the cost of labor has still been reduced.

Drawings

FIG. 1 is a schematic structural diagram of a testing tool in the prior art;

fig. 2 is a schematic structural diagram of a PCBA test fixture provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of another PCBA test fixture provided in the embodiments of the present application;

fig. 4 is a schematic structural diagram of a PCB interposer provided in an embodiment of the present application;

fig. 5 is a schematic installation diagram of a PBC interposer and a support plate according to an embodiment of the present disclosure.

Description of reference numerals:

200-PCBA test fixture;

210-a base;

220-a support plate;

221-limiting hole;

230-PCB pinboard;

231-thimble pads;

232-copper foil lead;

233-a bonding pad;

240-thimble;

250-an electronic module;

260-socket.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures.

Exemplarily, fig. 1 is a schematic structural diagram of a test fixture in the prior art, as shown in fig. 1, a low-speed electronic module is connected to a PCBA to be tested via a low-speed signal line and a thimble, and a high-speed electronic module is connected to the PCBA to be tested via a high-speed signal line, so that the following problems exist in the prior art:

(1) High-speed signal line among the prior art is Flexible Printed Circuit (FPC) winding displacement or ordinary electric wire, if be the FPC winding displacement, because the FPC winding displacement is in the test procedure, need artifical one by one wiring, and, every change a quilt PCBA, all will carry out the wiring again, lead to prior art to have the problem that the cost of labor is high and efficiency of software testing is low, if be ordinary electric wire, because impedance matching can't be realized to ordinary electric wire, test signal quality is poor, probably need to test repeatedly many times to same high-speed electronic module, also have the problem that efficiency of software testing is low.

(2) In the prior art, the low-speed signal wire is manually welded at the tail part of the thimble, so that the test fixture is not beneficial to batch production of the test fixture on the one hand, and on the other hand, when the thimble is replaced, a base shell needs to be opened and the low-speed signal wire is welded again, so that the problem of difficulty in replacement exists.

Based on the technical problem that exists among the prior art, this application provides a PCBA test fixture, through introducing a PCB keysets, on the one hand, make all to be connected through the thimble between survey PCBA and high-speed electronic module and the low-speed electronic module, compare traditional artifical mode of connection, this scheme is in the test process, will be surveyed PCBA crimping at the thimble can, not only practice thrift the cost of labor, still improved efficiency of software testing, on the other hand, the thimble passes through the copper foil lead wire on the PCB keysets and realizes being connected with high-speed electronic module and/or low-speed electronic module, because the copper foil lead wire can realize impedance matching, the signal quality of high-speed signal has been promoted greatly, thereby further improved efficiency of software testing. In addition, in this scheme, low-speed electronic module also is connected with the PCBA that is surveyed through the copper foil lead wire through the thimble, consequently, does not need artifical welding low-speed signal line at the in-process of processing test fixture, is favorable to the batch generation of test fixture to, because the thimble does not weld on, just can carry out the change of thimble through the mode of plug, the later maintenance of test fixture of being convenient for.

For example, fig. 2 is a schematic structural diagram of a PCBA test fixture provided in an embodiment of the present application, and fig. 3 is a schematic structural diagram of another PCBA test fixture provided in an embodiment of the present application, as shown in fig. 2 and fig. 3, a PCBA test fixture 200 in this embodiment includes: a base 210, a support plate 220, a PCB interposer 230, a pin 240, and an electronic module 250.

In order to solve the problems of high labor cost and low testing efficiency caused by manual wiring of the high-speed electronic module, in this embodiment, a PCB adapter board 230 is disposed in the PCBA testing tool 200, as shown in fig. 2 and 3, the PCB adapter board 230 is disposed above the supporting plate 220 in a contact manner, and the ejector pins 240 are disposed to penetrate through the supporting plate 220 and the PCB adapter board 230.

The ejector pin 240 penetrates through the PCB interposer 230, and the top end of the ejector pin 240 is located above the PCB interposer 230, i.e. the top end of the ejector pin 240 is exposed outside the PCB interposer 230; the tail of the thimble 240 is located below the PCB adapter plate 230, and according to actual requirements such as the thickness of the supporting plate 220 and the length of the thimble, the tail of the thimble 240 may be located below the supporting plate 220, that is, the thimble 240 penetrates through both the PCB adapter plate 230 and the supporting plate 220, as shown in fig. 2, or the tail of the thimble 240 may be located inside the supporting plate 220, that is, the thimble 240 only penetrates through the PCB adapter plate 230, but does not penetrate through the supporting plate 220, as shown in fig. 3.

In this embodiment, the thimble 240 is electrically connected to the PCB adapter board 230, as shown in fig. 2 and fig. 3, the electronic module 250 is connected to the PCB adapter board 230 through a signal line, in this embodiment, the electronic module 250 may be a high-speed electronic module, such as a display screen and a camera, or a low-speed electronic module, such as a speaker and a timer, that is, the high-speed electronic module and the low-speed electronic module are connected to the PCBA to be tested in the same manner.

It should be noted that, the number of the electronic modules 250 in the PCBA test fixture 200 may be one or multiple, and when there are multiple electronic modules 250, the multiple electronic modules 250 may only include a high-speed electronic module or a low-speed electronic module, or may include both a high-speed electronic module and a low-speed electronic module, which is determined by an actual test scenario, and is not limited herein.

In the testing process, the testing point of the PCBA to be tested is contacted with the top end of the ejector pin 240, the testing signal can be transmitted to one or more electronic modules 250 through the ejector pin and the PCB adapter plate 230, whether the PCBA to be tested has faults or not is determined according to whether the electronic modules 250 can normally work or not, and therefore the testing of the PCBA to be tested is completed.

Exemplarily, fig. 4 is a schematic structural diagram of a PCB interposer provided in an embodiment of the present application, as shown in fig. 4, in this embodiment, in a processing process of the PCB interposer 230, according to the number and the position of test points on a tested PCBA, a certain number of thimble pads 231 are arranged on the PCB interposer 230, and a thimble 240 penetrates through the PCB interposer 230 through the thimble pads 231, so as to implement an electrical connection with the PCB interposer 230.

Exemplarily, fig. 5 is an installation schematic diagram of a PBC interposer and a supporting plate provided in the embodiment of the present application, and as shown in fig. 5, in the embodiment, a limiting hole 221 is formed in the supporting plate 220, and positions and numbers of the limiting hole 221 are also correspondingly formed in a processing process of the supporting plate 220 according to the number and the positions of test points on a tested PCBA, so as to ensure that a thimble 240 can be inserted in the supporting plate 220 and the PCB interposer 230. The limiting hole may be a through hole (in which case the tail of the thimble 240 penetrates through the supporting plate 220), or may not be a through hole (in which case the tail of the thimble 240 is located inside the supporting plate 220).

Specifically, in the machining process of the PCBA test fixture 200, the limit holes on the supporting plate 220 may be aligned with the pin pads on the PCB adapter plate 230 to make the limit holes and the pin pads corresponding to the same test point coincide, and then the pins 240 pass through the PCB adapter plate 230 via the pin pads and are inserted into the supporting plate 220 along the limit holes.

It is understood that the number of the pins 240 in the present embodiment is equal to the number of test points on the tested PCBA, and is also equal to the number of the pin pads 231 on the PCB adapter board 230 and the number of the positioning holes 221 on the supporting board 220.

In this embodiment, the supporting plate 220 is made of an insulating material, and optionally, the supporting plate 220 is an acrylic fixing plate which has good stability, low cost and is easy to process.

In this embodiment, as shown in fig. 2 and 3, in order to ensure the stability of the entire PCBA test fixture, the supporting plate 220 needs to be fixed on the base 210.

Optionally, the base 210 is a wood electrical base.

Alternatively, the support plate 220 is fixed to the base 210 by bolts.

In a possible embodiment, the PCB interposer 230 is further disposed with copper foil leads 232 and signal line connection pads 233, and the signal lines of the electronic module 250 are connected to the PCB interposer through the connection pads. The number of the copper foil leads 232 is the same as that of the ejector pins 240 and the ejector pin pads 231, and the number of the wiring pads 233 may be the same as or different from that of the electronic modules 250. As shown in fig. 4 and 5, one end of the copper foil lead 232 is connected to the ejector pad 231, and the other end of the copper foil lead 232 is connected to the connection pad 233, so that a test signal is transmitted from the ejector pin 240 to the electronic module 250 via the copper foil lead 232 and the signal line.

In this embodiment, in order to ensure the transmission quality of signals, especially the transmission quality of high-speed signals, when designing the PCB interposer 230, a designer can implement impedance matching between the load resistor and the signal source resistor by reasonably setting the line distance of the copper foil leads 232, so that a test signal can be transmitted to the electronic module 250 with a small distortion, thereby achieving the purpose of further improving the test efficiency.

In a possible embodiment, the wire bonding pad 233 is a socket bonding pad, and accordingly, as shown in fig. 3, the PCBA test fixture further includes a socket 260, and the tail end of the signal wire is further provided with a plug, and the signal wire is plugged in the socket 260 through the plug.

The socket 260 is soldered to the socket pad by reflow soldering or wave soldering. The sockets 260 may have different types according to the types of the signal lines, and specifically, if the signal lines are FPC lines, the sockets 260 are first sockets, if the signal lines are ordinary electric lines, the sockets 260 are second sockets, and if the signal lines are rf coaxial lines, the sockets 260 are third sockets.

Optionally, the first jack is an FPC jack.

Alternatively, the second socket is a socket matching the wire diameter of a common wire, such as an MX1.25 socket, a PH2.0 socket, or an XH2.54 socket.

Optionally, the third outlet is a radio frequency outlet, such as IPEX1, IPEX2, IPEX3, IPEX4, SMA, SMB, BNC, TNC, N-type, or the like.

In this embodiment, the thimble pads 231, the copper foil leads 232, and the connection pads 233 may be directly set according to a designed drawing, the PCB interposer 230 may be processed, and then the socket 260 may be soldered by a soldering apparatus through reflow soldering or wave soldering, and manual soldering is not required, thereby facilitating mass production of the PCB interposer 230 and the entire test fixture.

In one possible embodiment, the bonding pads 233 are wire bonding pads, accordingly, the signal wires are ordinary wires, and the terminals of the signal wires need to be bare wires without being wrapped by an insulating layer, so that the electronic module 250 is connected to the PCB interposer 230 by bonding the bare wires to the wire bonding pads.

The common wire may be a twisted pair, a non-twisted pair, a shielded wire, or a non-shielded wire, which is not limited herein.

In a possible implementation mode, still include the thimble cover in the PCBA test fixture, the quantity of thimble cover equals with the quantity of thimble, the thimble cover also can be through reflow soldering or wave-soldering welding on the thimble pad, correspondingly, in the course of working of PCBA test fixture, paste the thimble cover with the thimble pad of PCB keysets correspondingly earlier, rethread thimble cover aligns spacing hole, peg graft the PCB keysets in the backup pad, insert the thimble in the thimble cover at last, guarantee that the thimble is movable, thereby be convenient for carry out the change of thimble in the testing process, in order to further improve efficiency of software testing, and reduce the maintenance cost of frock.

In this embodiment, through setting up PCBA test fixture and including the base, a supporting plate, the PCB keysets, thimble and electronic module, the backup pad is fixed on the base, the PCB keysets has the ground of contact to set up in the backup pad top, spacing hole has been seted up in the backup pad, the thimble pad has been laid on the PCB keysets, the thimble pad coincides with spacing hole, the thimble alternates on PCB keysets and backup pad via thimble pad and spacing hole, the top of thimble is located the top of PCB keysets, electronic module passes through the signal line and connects on the PCB keysets, through letting the test point of being surveyed PCBA contact with the thimble, just can realize being surveyed PCBA's test, because change PCBA's in-process, do not need artifical wiring, thereby not only improve efficiency of software testing, and labor cost is also reduced.

It is to be noted that the foregoing is only illustrative of the presently preferred embodiments and application of the principles of the present invention. It will be understood by those skilled in the art that the present application is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the application. Therefore, although the present application has been described in more detail with reference to the above embodiments, the present application is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. The utility model provides a PCBA test fixture which characterized in that includes: the device comprises a base, a supporting plate, a PCB (printed circuit board) adapter plate, a thimble and an electronic module;

2. The PCBA test tool according to claim 1, wherein a copper foil lead and a wiring pad of the signal wire are further arranged on the PCB adapter plate, one end of the copper foil lead is connected with the thimble pad, and the other end of the copper foil lead is connected with the wiring pad; the number of the copper foil leads is equal to that of the thimbles.

3. The PCBA test tool according to claim 2, wherein the wiring pad is a socket pad, the PCBA test tool further comprises a socket, and the socket is soldered on the socket pad by reflow soldering or wave soldering; the tail end of the signal wire is provided with a plug, and the signal wire is inserted in the socket through the plug.

4. The PCBA test fixture of claim 3, wherein the signal line is a Flexible Printed Circuit (FPC) line, a radio frequency coaxial line or a common line.

5. The PCBA test fixture of claim 2, wherein the wire bonding pad is a wire bonding pad, the signal wire is bonded on the wire bonding pad, and the signal wire is a common wire.

6. The PCBA test tool in accordance with claim 1, further comprising a thimble sleeve therein; the thimble passes through the thimble cover via the thimble pad with spacing hole alternates in the PCB keysets with on the backup pad.

7. The PCBA test tool according to claim 6, wherein the thimble sleeve is soldered to the thimble pad by reflow soldering or wave soldering.

8. A PCBA test tool according to any one of claims 1 to 7, in which the electronics module comprises a high speed electronics module and/or a low speed electronics module.

9. A PCBA test fixture as claimed in any one of claims 1-7, in which the support plate is an acrylic fixing plate.

10. The PCBA test tool according to any one of claims 1-7, wherein the number of the ejector pins is the same as the number of test points on the PCBA to be tested.