CN218463007U - Bonding equipment for high-conductivity insulating resin - Google Patents
Bonding equipment for high-conductivity insulating resin Download PDFInfo
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- CN218463007U CN218463007U CN202222909084.3U CN202222909084U CN218463007U CN 218463007 U CN218463007 U CN 218463007U CN 202222909084 U CN202222909084 U CN 202222909084U CN 218463007 U CN218463007 U CN 218463007U
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- outlet pipe
- glue
- insulating resin
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Abstract
The utility model discloses a bonding device for high-conductivity insulating resin, which relates to the technical field and comprises a bottom plate, a flexible bag, a leveling mechanism, a transfer mechanism and a resin plate; a bottom plate: the middle part of the upper surface is fixedly provided with an installation seat, the top of the installation seat is fixedly provided with a positioning table, the middle part of the positioning table is provided with a positioning groove for bearing a resin plate, the bottom surface of the positioning table is fixedly connected with the top surface of a telescopic bag, a glue outlet pipe with the end part extending to the upper side of the two ends of the resin plate is arranged on an interface of the side surface of the bottom end of the telescopic bag, the middle part of the glue outlet pipe is connected in series with a first one-way valve, the upper surface of the bottom plate is fixedly provided with a glue box, the glue box is provided with a glue outlet pipe with the lower end extending to the bottom surface of the inner cavity of the glue box, and the upper end opening of the glue outlet pipe is fixedly connected with an interface of the side surface of the upper end of the telescopic bag; the bonding equipment for the high-conductivity insulating resin automatically performs positioning bonding, the glue layer is uniform and controllable, and good heat dissipation capability of electrical elements is guaranteed.
Description
Technical Field
The utility model relates to an insulating resin's bonding technical field specifically is a bonding equipment of high conduction insulating resin.
Background
The insulating resin is widely applied to insulation treatment of various motors and electric appliances, because the heat conducting performance and the isolation effect of elements need to be kept, high-conductivity insulating resin is often adopted, the high-conductivity insulating resin is bonded with the electric appliance elements needing heat conduction, the bonding process needs manual positioning, the thickness of a glue layer is difficult to control, and a thicker glue layer is not favorable for heat dissipation of the electric elements.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome current defect, provide a bonding equipment of high conduction insulating resin, fix a position the bonding automatically, the glue film is even controllable, guarantees the good heat-sinking capability of electrical components, can effectively solve the problem in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a bonding device for high-conductivity insulating resin comprises a bottom plate, a telescopic bag, a leveling mechanism, a transfer mechanism and a resin plate;
a bottom plate: the middle part of the upper surface is fixed with an installation seat, the top of the installation seat is fixed with a positioning table, the middle part of the positioning table is provided with a positioning groove for bearing a resin plate, the bottom surface of the positioning table is fixedly connected with the top surface of a telescopic bag, a glue outlet pipe with the end part extending to the upper side of the two ends of the resin plate is arranged on a connector on the side surface of the bottom end of the telescopic bag, the middle part of the glue outlet pipe is connected in series with a first one-way valve, the upper surface of the bottom plate is fixed with a glue box, the glue box is provided with a glue outlet pipe with the lower end extending to the bottom surface of the inner cavity of the glue box, an opening at the upper end of the glue outlet pipe is fixedly connected with a connector on the side surface of the upper end of the telescopic bag, the middle part of the glue outlet pipe is connected in series with a second one-way valve, and an elevating mechanism for driving the telescopic bag is arranged in the installation seat;
even flat-bed machine constructs: is arranged on the edge of the upper surface of the positioning table;
the transfer mechanism: the transfer mechanism is arranged on the upper surface of the bottom plate, and a manipulator is arranged at the movable end of the transfer mechanism;
wherein: the manipulator is characterized by further comprising a controller, wherein the controller is installed on the bottom plate, the input end of the controller is electrically connected with the output end of an external power supply, and the output end of the controller is electrically connected with the input end of the manipulator.
Furthermore, the leveling mechanism comprises a first linear motor and a rubber roller, the first linear motor is installed at the edge position of the upper surface of the positioning table, and the rubber roller is rotatably installed on a rotor base of the first linear motor. The extruded sizing material is scraped by the leveling mechanism, so that the uniform connection with the electric element is facilitated.
Furthermore, the diameter of the middle position of the rubber roller is small, the diameters of the two ends of the rubber roller are large, two opposite conical surfaces are formed, and grooves are formed in the conical surfaces. The rubber material is beneficial to the inward side flow, and the surface of the resin plate is uniformly covered.
Further, elevating system includes bellows, fly leaf and vacuum machine, the bottom surface at the location platform is fixed to the upper end of bellows, the lower extreme of bellows is fixed with the fly leaf, and the fly leaf links to each other with the lower extreme stationary phase of flexible bag, the vacuum machine is installed on the mount pad, the interface of vacuum machine passes through the inner chamber intercommunication of hose and bellows. The lifting mechanism drives the telescopic bag to stretch, suck and extrude the sizing material, and the conveying and supplying of the sizing material are completed.
Further, transfer mechanism includes roof-rack, second linear electric motor and electric telescopic handle, the upper surface at the bottom plate is fixed to the lower extreme of roof-rack, horizontally second linear electric motor is installed to the upper end of roof-rack, second linear electric motor's active cell seat is connected with electric telescopic handle's stiff end, electric telescopic handle's flexible arm links to each other with the manipulator is fixed, second linear electric motor and electric telescopic handle's input is connected with the output electricity of controller respectively. The transfer mechanism conveys the electrical components to be bonded, and the electrical components are matched with the resin plate for bonding operation.
Furthermore, the middle part of location platform is equipped with logical groove, and this logical inslot is inlayed and is had the sucking disc, the upper end of bellows sets up the interface and this interface is connected with the sucking disc. The resin plate is adsorbed and fixed through the sucking disc, and the resin plate gluing device has good stability in the gluing process.
Compared with the prior art, the beneficial effects of the utility model are that: the bonding equipment for the high-conductivity insulating resin has the following advantages:
1. according to the high-conductivity insulating resin bonding equipment, the resin plate is positioned through the positioning table, bonding between the resin plate and an electrical element is realized in a compression joint mode after gluing, and compared with manual bonding, the glue layer is uniform and controllable, so that good heat dissipation capacity of the electrical element is guaranteed;
2. the extruded rubber material is scraped by the leveling mechanism, so that the rubber material is favorably and uniformly connected with an electrical element, the diameter of the middle position of the rubber roller is small, the diameters of the two ends of the rubber roller are large, the rubber material is favorably guided to flow inwards, and the surface of the resin plate is uniformly covered;
3. the resin plate is adsorbed and fixed through the sucking disc, and the resin plate gluing device has good stability in the gluing process.
Drawings
FIG. 1 is a schematic view of the overall axial structure of the present invention;
FIG. 2 is a schematic view of the overall left-side view structure of the present invention;
fig. 3 is a schematic view of a partial structure of the present invention.
In the figure: the device comprises a base plate 1, a mounting seat 2, a positioning table 3, a positioning groove 301, a telescopic bag 4, a rubber outlet pipe 5, a first one-way valve 501, a rubber inlet pipe 6, a second one-way valve 601, a leveling mechanism 7, a first linear motor 701, a rubber roller 702, an elevating mechanism 8, a corrugated pipe 801, a movable plate 802, a vacuum machine 803, a transfer mechanism 9, a top frame 901, a second linear motor 902, an electric telescopic rod 903, a rubber box 10, a manipulator 11, a resin plate 12, a controller 13, a groove 14 and a sucker 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present embodiment provides a technical solution: a high-conductivity insulating resin bonding device comprises a bottom plate 1, a telescopic bag 4, a leveling mechanism 7, a transfer mechanism 9 and a resin plate 12;
bottom plate 1: the middle part of the upper surface is fixed with an installation seat 2, the top of the installation seat 2 is fixed with a positioning table 3, the middle part of the positioning table 3 is provided with a positioning groove 301 for bearing a resin plate 12, the bottom surface of the positioning table 3 is fixedly connected with the top surface of a telescopic bag 4, a glue outlet pipe 5 with the end part extending to the upper side of the two ends of the resin plate 12 is arranged on a connector on the side surface of the bottom end of the telescopic bag 4, the middle part of the glue outlet pipe 5 is connected in series with a first one-way valve 501, the upper surface of a bottom plate 1 is fixed with a glue box 10, the glue box 10 is provided with a glue outlet pipe 6 with the lower end extending to the bottom surface of the inner cavity of the glue box 10, the upper end opening of the glue outlet pipe 6 is fixedly connected with the connector on the side surface of the upper end of the telescopic bag 4, the middle part of the glue outlet pipe 6 is connected in series with a second one-way valve 601, and the installation seat 2 is internally provided with a lifting mechanism 8 for driving the telescopic bag 4 to stretch;
the lifting mechanism 8 comprises a corrugated pipe 801, a movable plate 802 and a vacuum machine 803, the upper end of the corrugated pipe 301 is fixed on the bottom surface of the positioning table 3, the movable plate 802 is fixed at the lower end of the corrugated pipe 801, the movable plate 802 is fixedly connected with the lower end of the telescopic bag 4, the vacuum machine 803 is installed on the installation base 2, and the interface of the vacuum machine 803 is communicated with the inner cavity of the corrugated pipe 801 through a hose;
the lifting mechanism 8 drives the flexible bag 4 to stretch, and the rubber materials are sucked and extruded to complete the conveying and supplying of the rubber materials;
a through groove is formed in the middle of the positioning table 3, a sucker 15 is embedded in the through groove, and an interface is formed in the upper end of the corrugated pipe 801 and is connected with the sucker 15;
the resin plate 12 is adsorbed and fixed through the sucking disc 15, and the stability is good in the gluing process;
leveling mechanism 7: is arranged at the edge of the upper surface of the positioning table 3;
the extruded sizing material is scraped by the leveling mechanism 7, so that the uniform connection with the electrical element is facilitated;
the leveling mechanism 7 comprises a first linear motor 701 and a rubber roller 702, the first linear motor 701 is installed at the edge position of the upper surface of the positioning table 3, and the rubber roller 702 is rotatably installed on a rotor base of the first linear motor 701;
the diameter of the middle position of the rubber roller 702 is small, the diameters of the two ends of the rubber roller are large, two opposite conical surfaces are formed, and the grooves 14 are formed in the conical surfaces;
because the rubber material is extruded from two sides through the rubber outlet pipe 5, the structure of the rubber roller 702 is beneficial to guiding the rubber material to the inner side and uniformly covering the surface of the resin plate;
the transfer mechanism 9: the moving end of the transfer mechanism 9 is provided with a manipulator 11;
the transfer mechanism 9 is used for conveying the electrical elements to be bonded and matching with the resin plate for bonding operation;
the transfer mechanism 9 comprises a top frame 901, a second linear motor 902 and an electric telescopic rod 903, wherein the lower end of the top frame 901 is fixed on the upper surface of the bottom plate 1, the horizontal second linear motor 902 is installed at the upper end of the top frame 901, a moving seat of the second linear motor 902 is connected with the fixed end of the electric telescopic rod 903, a telescopic arm of the electric telescopic rod 903 is fixedly connected with the manipulator 11, and the input ends of the second linear motor 902 and the electric telescopic rod 903 are respectively electrically connected with the output end of the controller 13;
wherein: the manipulator is characterized by further comprising a controller 13, wherein the controller 13 is installed on the bottom plate 1, the input end of the controller 13 is electrically connected with the output end of an external power supply, and the output end of the controller 13 is electrically connected with the input end of the manipulator 11.
The utility model provides a pair of high conduction insulating resin's bonding equipment's theory of operation as follows:
firstly, a resin plate 12 is placed in a positioning groove 301 on the upper side of a positioning table 3, a vacuum machine 803 works to draw out air in a corrugated pipe 801 outwards, so that negative pressure is generated in the corrugated pipe 801 and a suction cup 15, the suction cup 15 is adsorbed on the bottom surface of the resin plate 12, the resin plate 12 is stably attached to the positioning groove 301, in the air-extracting process, the corrugated pipe 801 is shortened and a movable plate 802 is driven to ascend, the movable plate 802 compresses a flexible bag 4 so that glue in the flexible bag 4 is extruded to the upper surface of the resin plate 12 through a first one-way valve 501 and a glue outlet pipe 5, at the moment, a second one-way valve 601 is in a closed state, then a first linear motor 701 drives a glue roller 702 to transversely move, the extruded glue is evenly leveled on the upper surface of the resin plate 12, the vacuum machine 803 stops working, the corrugated pipe 801 drives the flexible bag 4 to extend, the flexible bag 4 sucks the glue in a glue box 10 through an upper glue pipe 6 and a second one-way valve 601, at the first one-way valve is closed and synchronous, the second linear motor drives a manipulator 902 to convey electric elements to convey the electric elements above the resin plate 903 to descend, and then the telescopic rod 11 is pressed on the manipulator 11 to take the lower resin plate 12, and then the telescopic rod can take out.
It should be noted that the controller 13 disclosed in the above embodiments may select a programmable controller with model S7-200, the electric telescopic rod 6 may select model JL-C16, the linear motor may select LMSSA-80 series, the vacuum machine 803 may select a vacuum pump with 2BEA series of nanxim, and the controller 13 controls the above electrical components in a conventional manner in the prior art, and is not innovative per se and will not be described herein again.
The above is only the embodiment of the present invention, and the patent scope of the present invention is not limited thereby, and all the equivalent structures or equivalent processes made by the contents of the specification and the drawings are utilized, or directly or indirectly applied to other related technical fields, and all the same principles are included in the patent protection scope of the present invention.
Claims (6)
1. A bonding apparatus for high-conductivity insulating resin, characterized in that: comprises a bottom plate (1), a telescopic bag (4), a leveling mechanism (7), a transfer mechanism (9) and a resin plate (12);
base plate (1): the middle part of the upper surface is fixed with a mounting seat (2), the top of the mounting seat (2) is fixed with a positioning table (3), the middle part of the positioning table (3) is provided with a positioning groove (301) for bearing a resin plate (12), the bottom surface of the positioning table (3) is fixedly connected with the top surface of a telescopic bag (4), a glue outlet pipe (5) with the end part extending to the upside of the two ends of the resin plate (12) is arranged on an interface of the bottom side of the telescopic bag (4), a first one-way valve (501) is connected in series with the middle part of the glue outlet pipe (5), a glue box (10) is fixed on the upper surface of a bottom plate (1), a glue outlet pipe (6) with the lower end extending to the bottom surface of the inner cavity of the glue box (10) is arranged on the glue box (10), an upper end opening of the glue outlet pipe (6) is fixedly connected with an interface of the upper end side of the telescopic bag (4), a second one-way valve (601) is connected in series with the middle part of the glue outlet pipe (6), and a lifting mechanism (8) for driving the telescopic bag (4) to stretch is arranged in the mounting seat (2);
leveler mechanism (7): is arranged on the edge of the upper surface of the positioning table (3);
transfer mechanism (9): the manipulator is arranged on the upper surface of the bottom plate (1), and the movable end of the transfer mechanism (9) is provided with a manipulator (11);
wherein: the manipulator is characterized by further comprising a controller (13), wherein the controller (13) is installed on the bottom plate (1), the input end of the controller (13) is electrically connected with the output end of an external power supply, and the output end of the controller (13) is electrically connected with the input end of the manipulator (11).
2. The bonding apparatus of high-conductivity insulating resin according to claim 1, wherein: the leveling mechanism (7) comprises a first linear motor (701) and a rubber roller (702), the first linear motor (701) is installed at the edge position of the upper surface of the positioning table (3), and the rubber roller (702) is installed on a rotor base of the first linear motor (701) in a rotating mode.
3. The bonding apparatus of highly conductive insulating resin according to claim 2, wherein: the diameter of the middle position of the rubber roller (702) is small, the diameters of the two ends of the rubber roller are large, two opposite conical surfaces are formed, and grooves (14) are formed in the conical surfaces.
4. The bonding apparatus of high-conductivity insulating resin according to claim 1, wherein: elevating system (8) are including bellows (801), fly leaf (802) and vacuum machine (803), the bottom surface at locating station (3) is fixed to the upper end of bellows (801), the lower extreme of bellows (801) is fixed with fly leaf (802), and fly leaf (802) are fixed with the lower extreme of flexible bag (4) and are linked together, install on mount pad (2) vacuum machine (803), the interface of vacuum machine (803) passes through the inner chamber intercommunication of hose and bellows (801).
5. The bonding apparatus of high-conductivity insulating resin according to claim 1, wherein: the transfer mechanism (9) comprises an upper frame (901), a second linear motor (902) and an electric telescopic rod (903), the lower end of the upper frame (901) is fixed to the upper surface of the bottom plate (1), the upper end of the upper frame (901) is provided with the second horizontal linear motor (902), a rotor base of the second linear motor (902) is connected with the fixed end of the electric telescopic rod (903), a telescopic arm of the electric telescopic rod (903) is fixedly connected with the manipulator (11), and the input ends of the second linear motor (902) and the electric telescopic rod (903) are respectively and electrically connected with the output end of the controller (13).
6. The bonding apparatus of high-conductivity insulating resin according to claim 4, wherein: the middle part of location platform (3) is equipped with logical groove, and this logical inslot is inlayed and is had sucking disc (15), the upper end of bellows (801) sets up the interface and this interface is connected with sucking disc (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222909084.3U CN218463007U (en) | 2022-11-02 | 2022-11-02 | Bonding equipment for high-conductivity insulating resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222909084.3U CN218463007U (en) | 2022-11-02 | 2022-11-02 | Bonding equipment for high-conductivity insulating resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218463007U true CN218463007U (en) | 2023-02-10 |
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ID=85149304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222909084.3U Active CN218463007U (en) | 2022-11-02 | 2022-11-02 | Bonding equipment for high-conductivity insulating resin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218463007U (en) |
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2022
- 2022-11-02 CN CN202222909084.3U patent/CN218463007U/en active Active
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