CN218450658U

CN218450658U - Flexible circuit board with buffer structure

Info

Publication number: CN218450658U
Application number: CN202221195489.9U
Authority: CN
Inventors: 王文宝; 洪诗阅; 洪礼辉
Original assignee: Xiamen Bolion Tech Co ltd
Current assignee: Xiamen Bolion Tech Co ltd
Priority date: 2022-05-18
Filing date: 2022-05-18
Publication date: 2023-02-03
Anticipated expiration: 2032-05-18

Abstract

The utility model relates to a flexible circuit board field relates to a flexible circuit board with buffer structure especially. The utility model discloses a flexible circuit board with buffer structure, including flexible circuit board body and buffer structure, buffer structure is a crooked strip structure, and buffer structure's first end and flexible circuit board body fixed connection are equipped with the pad on buffer structure's the second end, and the last line of still being equipped with of buffer structure is walked to the line, and the pad is walked the line through the circuit and is connected with the circuit layer electricity of flexible circuit board body. The utility model discloses have buffer function, can effectively avoid the welding point stress to pull appearing, lead to the problem that the solder joint splits or drops, the reliability of the product that improves greatly.

Description

Flexible circuit board with buffer structure

Technical Field

The utility model belongs to the flexible circuit board field specifically relates to a flexible circuit board with buffer structure.

Background

A Flexible Printed Circuit (FPC) is a Printed Circuit board having high reliability and flexibility, which is made of a material such as polyimide as a base material. The flat cable manufactured by taking the flexible circuit board as a support not only has the characteristics of high density, light weight, thin thickness and the like, but also can be fixedly arranged at the position in advance, thereby eliminating the trouble of wiring harness and flat cable and being capable of being assembled more conveniently, neatly and beautifully. Therefore, more and more electronic related products in the market adopt the FPC solution.

The pad 1 'of current flexible circuit board directly sets up on flexible circuit board body 2' (flexible substrate), as shown in fig. 1, after welding with the product by the welded through pad 1', when the product coefficient of thermal expansion that is welded is inconsistent with flexible circuit board body 2', if the temperature changes, the welding point can exist and be dragged to there is the problem that the welding point splits or drops, leads to the risk of product functional failure.

Disclosure of Invention

The utility model aims at providing a flexible circuit board with buffer structure is used for solving the technical problem that above-mentioned exists.

In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a flexible circuit board with buffer structure, includes flexible circuit board body and buffer structure, and buffer structure is a crooked strip structure, and buffer structure's first end and flexible circuit board body fixed connection are equipped with the pad on buffer structure's the second end, still are equipped with the circuit on the buffer structure and walk the line, and the pad is walked the line through the circuit and is connected with the circuit layer electricity of flexible circuit board body.

Furthermore, the edge of the flexible circuit board body is provided with a notch, and the buffer structure is arranged in the notch.

Furthermore, the notch is a rectangular notch.

Furthermore, the flexible circuit board body and the buffer structure are of an integrated structure.

Furthermore, buffer structure includes first linkage segment, second linkage segment, third linkage segment and fourth linkage segment in proper order by its first end to second end, the first end and the flexible circuit board body fixed connection of first linkage segment, and the second end of first linkage segment is connected with the first end of second linkage segment, and second linkage segment and the parallel interval of fourth linkage segment set up, and the second end of second linkage segment and the first end of fourth linkage segment are connected respectively to the both ends of third linkage segment.

Furthermore, the interval between the second connecting section and the fourth connecting section is more than or equal to 0.5mm.

Furthermore, the edge distance between the line routing and the buffer structure is more than or equal to 0.2mm.

Furthermore, the width of the buffer structure is more than or equal to 0.5mm.

Furthermore, the circuit wiring is made of copper materials.

Furthermore, the flexible circuit board body comprises a flexible base material, the flexible base material is a polyimide base material, and the buffer structure is formed by extending the flexible base material integrally outwards.

The utility model has the advantages of:

the utility model discloses a set up buffer structure, have buffer function, can effectively avoid when taking place vibration or temperature variation by the welding product, the welding point stress appears and pulls, leads to the problem that the solder joint splits or drops, the reliability of the product that improves greatly.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a structural view of a conventional flexible circuit board;

FIG. 2 is a block diagram of an embodiment of the present invention;

fig. 3 is an enlarged view of a portion a in fig. 2.

Detailed Description

To further illustrate the various embodiments, the present invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. With these references, one of ordinary skill in the art will appreciate other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.

The present invention will now be further described with reference to the accompanying drawings and detailed description.

As shown in fig. 2 and 3, a flexible circuit board with a buffer structure includes a flexible circuit board body 1 and a buffer structure 2, the buffer structure 2 is a curved strip-shaped structure, a first end of the buffer structure 2 is fixedly connected with the flexible circuit board body 1, a pad 3 is arranged at a second end of the buffer structure 2, a line 4 is further arranged on the buffer structure 2, and the pad 3 is electrically connected with a line layer 11 of the flexible circuit board body 1 through the line 4.

In this embodiment, the flexible circuit board body 1 includes a flexible substrate 12, the flexible substrate 12 is a polyimide substrate, and the circuit layer 11 is disposed on the flexible substrate 12, which is simple in structure and easy to implement, but not limited thereto, in some embodiments, the flexible circuit board body 1 may also adopt other existing flexible circuit board structures, such as a multi-layer board structure, which can be easily implemented by those skilled in the art and will not be described in detail.

Preferably, in this embodiment, the cushioning structure 2 is formed by integrally extending the flexible base material 12, and can be formed by cutting the flexible base material 12, which is easy to process, low in cost, and stable, but not limited thereto.

Preferably, in this embodiment, the edge of the flexible circuit board body 1 is provided with a notch 13, and the buffer structure 2 is disposed in the notch 13, so that the overall structure is more compact and smaller, the consumption of the flexible base material 12 is less, and the cost is lower, but not limited thereto, and in some embodiments, the buffer structure 2 may also be disposed outside the edge of the flexible circuit board body 1.

In this embodiment, the notch 13 is a rectangular notch, which is easy to process and has a more compact structure, but not limited thereto, and in some embodiments, the notch 13 may also be in other shapes such as a U-shape, a semi-circle shape, and the like.

In this embodiment, the buffer structure 2 sequentially includes a first connection section 21, a second connection section 22, a third connection section 23 and a fourth connection section 24 from a first end to a second end thereof, the first end of the first connection section 21 is integrally and fixedly connected to the flexible circuit board body 1 (a side wall of the notch 13), the second end of the first connection section 21 is perpendicularly connected to the first end of the second connection section 22, the second connection section 22 and the fourth connection section 24 are arranged in parallel and spaced, two ends of the third connection section 23 are respectively connected to the second end of the second connection section 22 and the first end of the fourth connection section 24, the second connection section 22 and the fourth connection section 24 are located at the third connection section 23, and the pads 3 are arranged at the second end of the fourth connection section 24.

Preferably, in this embodiment, the distance d1 between the second connecting section 22 and the fourth connecting section 24 is greater than or equal to 0.5mm, which not only facilitates the processing, but also prevents the second connecting section 22 and the fourth connecting section 24 from being torn easily, thereby improving the reliability.

Preferably, in this embodiment, the distance d2 between the line trace 4 and the edge of the buffer structure 2 is greater than or equal to 0.2mm, so as to ensure that the line trace 4 is not cut off when the buffer structure 2 is processed, and the line trace 4 is not easily torn when the buffer structure 2 is pulled, thereby improving reliability.

Preferably, in this embodiment, the width d3 of the buffer structure 2 is greater than or equal to 0.5mm, so that the strength of the buffer structure 2 is improved, the buffer structure is not easy to break, and the reliability is high.

In this embodiment, the circuit trace 4 and the pad 3 are made of copper material, and can be integrally formed by a copper-clad layer on the flexible substrate 12, which is easy to implement and low in cost, but not limited thereto.

The number and the arrangement position of the buffer structures 2 can be set according to the number and the position distribution of the specifically required pads 3, for example, in this embodiment, the number of the buffer structures 2 is 8, and the buffer structures are uniformly distributed on the two opposite sides of the flexible circuit board body 1, but not limited thereto.

During the use, weld and be connected electrically with being welded the product through pad 3 on buffer structure 2, when being welded the product because temperature variation takes place the harmomegathus, buffer structure 2 can follow and take place deformation flexible by the welded product, if along the left and right sides of figure 2, the upper and lower direction is flexible, and when being welded the product and taking place the vibration, buffer structure 2 also can follow and be vibrated by the welded product together, consequently can effectively avoid the welding point stress to appear and pull, lead to the problem that the solder joint splits or drops, the reliability of the product that improves greatly.

When flexible circuit board body 1 has and is equipped with to glue and is used for laminating on the structure, do not prepare to glue in buffer structure 2 region to ensure that this buffer structure 2 can follow the harmomegathus of welding product and carry out the deformation and stretch out and draw back.

While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The utility model provides a flexible circuit board with buffer structure which characterized in that: including flexible circuit board body and buffer structure, buffer structure is a crooked strip structure, and buffer structure's first end and flexible circuit board body fixed connection are equipped with the pad on buffer structure's the second end, still are equipped with the circuit on the buffer structure and walk the line, and the pad is walked the line through the circuit and is connected with the line layer electricity of flexible circuit board body.

2. The flexible circuit board with a buffer structure according to claim 1, wherein: the edge of flexible circuit board body is equipped with the breach, and buffer structure sets up in the breach.

3. The flexible circuit board with a buffer structure according to claim 2, wherein: the notch is a rectangular notch.

4. The flexible circuit board with a buffer structure according to claim 1, 2 or 3, wherein: the flexible circuit board body and the buffer structure are of an integrated structure.

5. The flexible circuit board with a buffer structure according to claim 1, 2 or 3, wherein: buffer structure includes first linkage segment, second linkage segment, third linkage segment and fourth linkage segment in proper order by its first end to second end, and the first end and the flexible circuit board body fixed connection of first linkage segment, the second end of first linkage segment are connected with the first end of second linkage segment, and the second linkage segment sets up with fourth linkage segment parallel interval, and the second end of second linkage segment and the first end of fourth linkage segment are connected respectively to the both ends of third linkage segment.

6. The flexible circuit board with a buffer structure according to claim 5, wherein: the interval between the second connecting section and the fourth connecting section is more than or equal to 0.5mm.

7. The flexible circuit board with a buffer structure according to claim 1, wherein: the edge distance between the line routing and the buffer structure is more than or equal to 0.2mm.

8. The flexible circuit board with a buffer structure according to claim 1, wherein: the width of the buffer structure is more than or equal to 0.5mm.

9. The flexible circuit board with a buffer structure according to claim 1, wherein: the circuit wiring is made of copper materials.

10. The flexible circuit board with a buffer structure according to claim 1, wherein: the flexible circuit board body comprises a flexible base material, the flexible base material is a polyimide base material, and the buffer structure is formed by extending the flexible base material integrally outwards.