CN218447833U

CN218447833U - Semiconductor etching equipment

Info

Publication number: CN218447833U
Application number: CN202222514983.3U
Authority: CN
Inventors: 张霖芝; 眭朝萍; 田帅
Original assignee: Suzhou Ruihong Jixin Technology Co ltd
Current assignee: Suzhou Ruihong Jixin Technology Co ltd
Priority date: 2022-09-22
Filing date: 2022-09-22
Publication date: 2023-02-03
Anticipated expiration: 2032-09-22

Abstract

The utility model discloses a belong to semiconductor etching technical field, specifically be a semiconductor etching equipment, including etching cistern, support frame and roof, the both ends upside at the etching cistern is installed to the support frame, the roof is installed in the upper end of support frame, still includes: a multi-angle drying subassembly for being directed at semiconductor drying after the etching, multi-angle drying unit mount is on support frame and roof, multi-angle drying unit includes motor one and heating rod, the lateral surface at the support frame is installed to motor one, the utility model discloses beneficial effect is: through putting into the semiconductor between two sets of rotatable backup pads, then take the semiconductor to dip etching in the etching solution automatically, the back that finishes of etching, automatic etching solution that shifts out again heats the etching solution through the heating rod, and to the semiconductor etching with higher speed, on blowing the semiconductor through the heat of fan on the heating rod, the backup pad drives the semiconductor rotation simultaneously and bloies, the drying efficiency of technique semiconductor.

Description

Semiconductor etching equipment

Technical Field

The utility model relates to a semiconductor etching technical field specifically is a semiconductor etching equipment.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, semiconductor etching is divided into dry etching and wet etching, the wet etching process mainly comprises the step of soaking an etching material in corrosive liquid for corrosion, and the wet etching is generally used for links which do not relate to patterns, such as wafer preparation, cleaning and the like in the front of a process flow.

The existing semiconductor is etched in the etching solution to remove unnecessary substances attached to the surface, the semiconductor is conveyed to the next procedure after the purity of the semiconductor is ensured, but the semiconductor cannot be quickly dried after being taken out of the etching solution, and the processing quality of the next procedure is directly influenced.

Therefore, it is necessary to invent a semiconductor etching apparatus.

SUMMERY OF THE UTILITY MODEL

The present invention has been made in view of the above and/or other problems occurring in the conventional semiconductor etching apparatus.

Therefore, the utility model aims at providing a semiconductor etching equipment, through putting into the semiconductor between two sets of rotatable backup pads, then automatic take the semiconductor to dip etching liquid in the etching, the etching finishes the back, automatic etching liquid that shifts out again, heat etching liquid through the heating rod, to semiconductor etching with higher speed, blow the semiconductor through the heat of fan on the heating rod, the backup pad drives the semiconductor rotation and blows simultaneously, technical semiconductor's drying efficiency, can solve the above-mentioned current semiconductor that proposes and etch in dipping etching liquid, get rid of the adnexed unnecessary material in surface, it sends down one process after guaranteeing its clean purity, but the semiconductor can't reach dry state fast after taking out from etching liquid, just directly influenced the problem of the quality of next process processing.

For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:

a semiconductor etching apparatus, comprising: etching cistern, support frame and roof, the both ends upside at the etching cistern is installed to the support frame, the roof is installed in the upper end of support frame, still includes:

the multi-angle drying component is used for drying the etched semiconductor and is installed on the supporting frame and the top plate.

As a preferred embodiment of the semiconductor etching apparatus of the present invention, wherein: the multi-angle drying assembly comprises a first motor and a heating rod, the first motor is installed on the outer side face of the support frame, and the heating rod is installed at the output end of the first motor.

As a preferred embodiment of the semiconductor etching apparatus of the present invention, wherein: fans are further installed on the outer side face of the supporting frame, and the two sets of fans are used for blowing air in a convection mode.

As a preferred embodiment of the semiconductor etching apparatus of the present invention, wherein: the telescopic link is installed to the upper end of roof, the connecting block is installed to the output of telescopic link, the lower extreme erection bracing board of connecting block is one.

As a preferred embodiment of the semiconductor etching apparatus of the present invention, wherein: the inner wall of the right end of the first supporting plate is connected with a first U-shaped connecting rod in an inserting mode, and the inner wall of the left end of the first supporting plate is connected with a second U-shaped connecting rod in an inserting mode.

As a preferred embodiment of the semiconductor etching apparatus of the present invention, wherein: the lower ends of the first U-shaped connecting rod and the second U-shaped connecting rod are inserted with a second supporting plate, and nuts are mounted at the lower ends of the first U-shaped connecting rod and the second U-shaped connecting rod and used for supporting the second supporting plate.

As a preferred embodiment of the semiconductor etching apparatus of the present invention, wherein: the inner wall of the lower end of the first supporting plate is rotatably provided with a first rotating disc, the upper end of the first supporting plate is provided with a second motor, the output end of the second motor is connected with the first rotating disc, and the lower end of the first rotating disc is provided with a first clamping strip.

As a preferred embodiment of the semiconductor etching apparatus of the present invention, wherein: and the inner wall of the upper end of the second supporting plate rotates to be provided with a second rotary table, the upper end of the second rotary table is provided with a second clamping strip, and the second clamping strip and the first clamping strip are clamped with a semiconductor.

Compared with the prior art:

through putting into the semiconductor between two sets of rotatable backup pads, then take the semiconductor to dip etching in the etching solution automatically, the back that the etching finishes, automatic etching solution that shifts out again, through heating rod heating etching solution, to semiconductor etching with higher speed, blow the semiconductor through the heat of fan on the heating rod, the backup pad drives the semiconductor rotation simultaneously and bloies, the drying efficiency of technique semiconductor.

Drawings

FIG. 1 is a schematic diagram of a semiconductor etching apparatus according to the present invention;

FIG. 2 is a schematic view illustrating the connection between a first supporting plate and a second supporting plate of the semiconductor etching apparatus of the present invention;

FIG. 3 is a schematic view of a second supporting plate of the semiconductor etching apparatus of the present invention;

FIG. 4 is a left side view of the first support plate and the second support plate of the semiconductor etching apparatus of the present invention;

fig. 5 is a schematic view illustrating the installation of the support frame in the semiconductor etching apparatus of the present invention.

In the figure: the device comprises an etching liquid tank 1, a support frame 11, a top plate 12, a multi-angle drying component 2, a first motor 21, a fan 22, a heating rod 23, a first U-shaped connecting rod 24, a second U-shaped connecting rod 241, a first support plate 25, a first clamping strip 251, a connecting block 252, a first rotary disc 26, a second rotary disc 261, a second motor 27, an expansion rod 28, a second support plate 29 and a second clamping strip 291.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

The utility model provides a semiconductor etching device, please refer to fig. 1-5, which comprises an etching solution tank 1, a support frame 11 and a top plate 12;

support frame 11 is installed at the both ends upside of etching cistern 1, and support frame 11 is used for supporting the effect of the installation of motor 21 and fan 22, and roof 12 is installed in the upper end of support frame 11, and roof 12 is used for supporting the effect of the installation of telescopic link 28, still includes: the multi-angle drying component 2 is used for drying the etched semiconductor and is arranged on the support frame 11 and the top plate 12, and the drying efficiency of the etched semiconductor is improved.

The multi-angle drying component 2 comprises a motor I21 and a heating rod 23, the motor I21 is installed on the outer side surface of a support frame 11, the motor I21 is used for driving the heating rod 23 to rotate, the heating rod 23 faces upwards, air can be blown onto the heating rod 23 through a fan 22, heat on the heating rod 23 is blown onto a semiconductor, the drying efficiency of the semiconductor is accelerated, the heating rod 23 faces downwards, the heating rod 23 is inserted into etching liquid to heat the etching liquid, the heating rod 23 is installed at the output end of the motor I21, the fan 22 is further installed on the outer side surface of the support frame 11, two groups of fans 22 carry out convection air blowing, the fan 22 is used for blowing air on the etched semiconductor to accelerate the drying of the etched semiconductor, an expansion link 28 is installed at the upper end of a top plate 12, the expansion link 28 is used for driving a support plate I25 and a support plate II 29 to lift, so that the semiconductor on the inner sides of the support plate I25 and the support plate II 29 is immersed into an etching liquid tank 1, the output end of the telescopic rod 28 is provided with a connecting block 252, the connecting block 252 is used for connecting the telescopic rod 28 and the first supporting plate 25, the lower end of the connecting block 252 is provided with a first supporting plate 25, the first supporting plate 25 is used for supporting the first rotating disc 26, the inner wall of the right end of the first supporting plate 25 is inserted with a first U-shaped connecting rod 24, the inner wall of the left end of the first supporting plate 25 is inserted with a second U-shaped connecting rod 241, the lower ends of the first U-shaped connecting rod 24 and the second U-shaped connecting rod 241 are inserted with a second supporting plate 29, the first supporting plate 25 and the second supporting plate 29 are connected through the first U-shaped connecting rod 24 and the second U-shaped connecting rod 241, the distance between the first supporting plate 25 and the second supporting plate 29 can be adjusted, nuts are arranged at the lower ends of the first U-shaped connecting rod 24 and the second U-shaped connecting rod 241 and are used for supporting the second supporting plate 29, the inner wall of the lower end of the first supporting plate 25 is rotatably provided with a first rotating disc 26, and the first rotating disc 26 rotates, the semiconductor is driven to rotate, a second motor 27 is installed at the upper end of the first support plate 25, the second motor 27 is used for driving the first rotating disc 26 to rotate, the output end of the second motor 27 is connected with the first rotating disc 26, the first rotating disc 26 supports the semiconductor to rotate, a first clamping strip 251 is installed at the lower end of the first rotating disc 26, a second rotating disc 261 is installed on the inner wall of the upper end of the second support plate 29 in a rotating mode, a second clamping strip 291 is installed at the upper end of the second rotating disc 261, the semiconductor is clamped between the second clamping strip 291 and the first clamping strip 251, and the second clamping strip 291 and the first clamping strip 251 are used for clamping the semiconductor and driving the semiconductor to rotate.

When the etching solution tank is used specifically, the support frame 11 is installed on the upper sides of two ends of the etching solution tank 1, the top plate 12 is installed at the upper end of the support frame 11, the first motor 21 is installed on the outer side surface of the support frame 11, the heating rod 23 is installed at the output end of the first motor 21, the fans 22 are also installed on the outer side surface of the support frame 11, two groups of fans 22 are used for blowing air in a convection mode, the telescopic rod 28 is installed at the upper end of the top plate 12, the connecting block 252 is installed at the output end of the telescopic rod 28, the first support plate 25 is installed at the lower end of the connecting block 252, the first U-shaped connecting rod 24 is inserted into the inner wall of the right end of the first support plate 25, the second U-shaped connecting rod 241 is inserted into the inner wall of the left end of the first support plate 25, the first U-shaped connecting rod 24 and the second U-shaped connecting rod 241 are inserted into the support plate 29, nuts are installed at the lower ends of the first U-shaped connecting rod 24 and the second U-shaped connecting rod 241, the lower end of the support plate 29 is rotatably installed, the inner wall of the support plate 25 is provided with the first rotating disk 26, the upper end of the first support plate 25 is installed with the second motor 27, the output end of the motor II 27 is connected with the rotating disc I26, the lower end of the rotating disc I26 is provided with the clamping strip I251, the inner wall of the upper end of the support plate II 29 is rotatably provided with the rotating disc II 261, the upper end of the rotating disc II 261 is provided with the clamping strip II 291, the semiconductor is clamped between the clamping strip II 291 and the clamping strip I251, etching solution is filled in the etching solution tank 1, the semiconductor is clamped between the clamping strip II 291 and the clamping strip I251, the support plate I25 is pushed downwards by the telescopic rod 28 to immerse the semiconductor into the etching solution, the semiconductor is extracted again by the telescopic rod 28 after etching, the motor I21 drives the heating rod 23 to rotate, the motor II 23 drives the rotating disc I26 to rotate, the rotating disc I26 drives the semiconductor to rotate, the fan 22 blows air to the heating rod 23 to blow heat on the heating rod 23 to the semiconductor, drying of the semiconductor is accelerated, and the semiconductor is placed between the two groups of rotatable support plates, then automatically immersing the semiconductor into the etching solution for etching, automatically moving out the etching solution after etching, heating the etching solution through the heating rod to etch the semiconductor at high speed, blowing heat on the heating rod to the semiconductor through the fan, and simultaneously driving the semiconductor to rotate and blow through the supporting plate, thereby realizing the drying efficiency of the semiconductor.

While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the description of these combinations not exhaustive in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. The utility model provides a semiconductor etching equipment, includes etching liquid groove (1), support frame (11) and roof (12), both ends upside at etching liquid groove (1) is installed in support frame (11), the upper end at support frame (11) is installed in roof (12), its characterized in that still includes:

the multi-angle drying component (2) is used for drying the etched semiconductor, and the multi-angle drying component (2) is installed on the supporting frame (11) and the top plate (12).

2. The semiconductor etching equipment as claimed in claim 1, wherein the multi-angle drying assembly (2) comprises a first motor (21) and a heating rod (23), the first motor (21) is installed on the outer side surface of the support frame (11), and the heating rod (23) is installed at the output end of the first motor (21).

3. A semiconductor etching apparatus according to claim 2, wherein fans (22) are further installed on the outer side of the support frame (11), and two sets of fans (22) are used for blowing air in a convection manner.

4. The semiconductor etching equipment as claimed in claim 1, wherein the top plate (12) is provided with a telescopic rod (28) at the upper end thereof, the telescopic rod (28) is provided with a connecting block (252) at the output end thereof, and the first supporting plate (25) is provided at the lower end of the connecting block (252).

5. The semiconductor etching apparatus according to claim 4, wherein the right inner wall of the first support plate (25) is inserted with a first U-shaped connecting rod (24), and the left inner wall of the first support plate (25) is inserted with a second U-shaped connecting rod (241).

6. The semiconductor etching equipment according to claim 5, wherein the lower ends of the first U-shaped connecting rod (24) and the second U-shaped connecting rod (241) are inserted into the second support plate (29), and nuts are mounted at the lower ends of the first U-shaped connecting rod (24) and the second U-shaped connecting rod (241) for supporting the second support plate (29).

7. The semiconductor etching equipment as claimed in claim 4, wherein a first rotating disc (26) is rotatably mounted on the inner wall of the lower end of the first supporting plate (25), a second motor (27) is mounted on the upper end of the first supporting plate (25), the output end of the second motor (27) is connected with the first rotating disc (26), and a first clamping strip (251) is mounted on the lower end of the first rotating disc (26).

8. The semiconductor etching equipment according to claim 6, wherein a second rotating disc (261) is rotatably installed on the inner wall of the upper end of the second supporting plate (29), a second clamping bar (291) is installed on the upper end of the second rotating disc (261), and the semiconductor is clamped between the second clamping bar (291) and the first clamping bar (251).