CN218445950U - Probe performance testing device - Google Patents

Abstract

The utility model provides a probe performance testing device, which comprises a testing panel, a testing frame, at least one testing unit and a control terminal electrically connected with the testing unit; the test unit comprises a pressing component, a probe clamp component and a buffer component; the probe clamp assembly comprises a bottom plate, a top plate, a needle template, an upper test plate and a lower test plate, wherein the upper test plate and the lower test plate are arranged on the upper side and the lower side of the needle template, and the upper test plate and the lower test plate are electrically connected with the control terminal. The utility model provides a every test element of probe capability test device all includes and pushes down subassembly, buffering subassembly and probe anchor clamps subassembly, and last survey test panel in the probe anchor clamps subassembly is connected with control terminal electricity with surveying test panel down, can realize the test to resistance, life-span and stability electrical property ability of probe, pushes down subassembly and buffering subassembly through changing simultaneously, realizes the change to electrical property ability under the different state of pushing down of same probe or different probe.

Description

Probe performance testing device

Technical Field

The utility model belongs to the technical field of probe production and processing equipment technique and specifically relates to a probe capability test device is related to.

Background

With the continuous development of science and technology, people have higher and higher requirements on the size, the function and the quality of intelligent electronic products. As a core component in an existing intelligent electronic device, a flexible circuit board is increasingly applied to various products. Various semiconductor components in the flexible circuit board need to be tested in various links of design, manufacture, packaging and application. Probes are required for testing semiconductor devices. Therefore, the probe plays a crucial role in the testing of semiconductor devices, and the performance of the probe will directly affect the result of the semiconductor testing.

The existing probe performance testing equipment only tests certain functions of the existing probe performance testing equipment, such as the test of the pressing performance of the probe, the test of the elastic performance of the probe and the test of the resistance of the probe. But not the comprehensive electrical property of the probe.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to solve and only can carry out the shortcoming of testing to probe comprehensive electrical property ability in the test equipment of current probe, can't realize providing a probe capability test device to its single function.

The utility model provides a technical scheme that its technical problem adopted is: a probe performance testing device comprises a testing panel, a testing frame arranged on the testing panel, at least one testing unit and a control terminal electrically connected with the testing unit; the test unit comprises a pressing assembly fixed on the test frame and electrically connected with the control terminal, a probe clamp assembly fixed on the test panel and a buffer assembly fixed at the bottom of the pressing assembly and capable of abutting against the probe clamp assembly; the probe clamp assembly comprises a bottom plate fixed on the test panel, a top plate elastically connected with the bottom plate, a needle template arranged between the bottom plate and the top plate and used for fixing a probe, an upper test plate and a lower test plate arranged on the upper side and the lower side of the needle template, and the upper test plate and the lower test plate are electrically connected with the control terminal.

In one embodiment, the needle template in the probe clamp assembly comprises an upper needle die and a lower needle die, a groove for the lower needle die to be embedded is formed in the bottom surface of the upper needle die, and a plurality of mounting holes which are arranged in an array and used for the probes to be embedded are formed in each of the upper needle die and the lower needle die.

In one embodiment, the bottom plate is provided with a first pin, and the lower test plate is sleeved on the first pin; the needle template is provided with a second pin, and the upper test plate and the upper plate are sleeved on the second pin.

In one embodiment, the probe holder assembly further comprises a plurality of first elastic members disposed between the top plate and the bottom plate.

In one embodiment, the pressing assembly includes a carrier plate, a driving member disposed on the carrier plate, and a pressing plate located below the carrier plate and driven by the driving member to move up and down, the carrier plate is fixed on the testing frame through a supporting column, and the buffering assembly is fixed at the bottom of the pressing plate.

In one embodiment, the hold-down assembly further comprises a pair of first hydraulic buffers disposed between the carrier plate and the hold-down plate.

In one embodiment, the pressing assembly further includes four linear bearings connecting the pressing plate and the carrier plate, a pair of hydraulic buffer supports respectively disposed on two adjacent linear bearings, and a second hydraulic buffer fixed on the hydraulic buffer supports.

In one embodiment, the buffer assembly comprises a horizontal mounting plate fixed on the lower press plate, a mounting seat fixed at the bottom of the horizontal mounting plate, a lower press block extending from the bottom of the mounting seat, and a plurality of second elastic pieces arranged in the mounting seat, wherein the second elastic pieces are arranged between the lower press block and the horizontal mounting plate.

In one embodiment, the buffer assembly further comprises a pair of limit blocks fixed at the bottom of the horizontal mounting plate, and the bottom surfaces of the limit blocks can abut against the top surface of the test panel.

In one embodiment, the control terminal includes a computer and an electrical testing box electrically connected to each other, the electrical testing box is electrically connected to the upper testing board and the lower testing board, and the computer is electrically connected to the push-down assembly.

The utility model provides a probe capability test device's beneficial effect lies in: each test unit comprises a pressing component, a buffering component and a probe clamp component, wherein an upper test board and a lower test board in the probe clamp component are electrically connected with the control terminal, so that the tests on the electrical properties of the probes, such as resistance, service life, stability and the like, can be realized, and meanwhile, the change of the electrical properties of the same probe or different probes in different pressing states is realized by changing the pressing component and the buffering component; each test unit can realize different test effects by adjusting different parameter settings of the pressing component, the buffering component and the probe clamp component, so that the comprehensive electrical property of the probe can be tested.

Drawings

Fig. 1 is a schematic perspective view of a probe performance testing apparatus provided by the present invention;

fig. 2 is a schematic perspective view of a test unit in the probe performance testing apparatus provided by the present invention;

fig. 3 is a side view of a pressing member of a probe performance testing apparatus provided by the present invention;

fig. 4 is a schematic perspective view of a pressing assembly in the probe performance testing apparatus provided by the present invention;

fig. 5 is an exploded view of a probe clamp assembly in a probe performance testing apparatus provided by the present invention;

fig. 6 is a cross-sectional view of a needle template in a probe performance testing apparatus provided by the present invention;

FIG. 7 is an enlarged view of a portion of FIG. 6 at A;

fig. 8 is a schematic perspective view of a buffer assembly in a probe performance testing apparatus provided by the present invention;

fig. 9 is an exploded view of a buffer assembly in a probe performance testing apparatus according to the present invention.

In the figure: 100-a probe performance testing device, 10-a testing panel, 20-a testing frame, 30-a testing unit, 40-a control terminal, 41-a computer and 42-an electrical testing box;

31-a lower pressing component, 311-a carrier plate, 312-a driving part, 313-a lower pressing plate, 314-a supporting column, 315-a first hydraulic buffer, 316-a linear bearing, 317-a hydraulic buffer bracket and 318-a second hydraulic buffer;

32-probe clamp assembly, 321-bottom plate, 322-top plate, 323-pin template, 3231-upper pin mold, 3231 a-groove, 3231 b-mounting hole of upper pin mold, 3232-lower pin mold, 3232 a-mounting hole of lower pin mold, 324-upper test plate, 325-lower test plate, 326-first pin, 327-second pin, 328-first elastic member;

33-a buffer component, 331-a horizontal mounting plate, 332-a mounting seat, 333-a lower pressing block, 334-a second elastic component and 335-a limiting block.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1 to 9, a probe performance testing apparatus 100 according to the present invention is provided. The utility model provides a probe capability test device 100 can realize the probe capability test under the different conditions, and whole testing arrangement divide into a plurality of different modules, through the setting of adjusting different modules, realizes different test conditions to the completion is to the test of the different conditions of same kind of probe, also can be under same test condition, tests multiple different probes, thereby accomplishes the test to the same conditions of different probes. The utility model provides a probe performance test device 100 can accomplish the test to different performances such as resistance, life-span and stability of probe.

As shown in fig. 1, it is a schematic diagram of a three-dimensional structure of a probe performance testing apparatus 100 provided by the present invention. The utility model provides a probe capability test device 100 includes test panel 10, sets up test frame 20 on test panel 10, at least one test unit 30 and the control terminal 40 of being connected with test unit 30 electricity. In this embodiment, four sets of test units 30 are simultaneously disposed between the test panel 10 and the test frame 20, the four sets of test units 30 can simultaneously test one type of probe, and can also simultaneously test four different types of probe, and the probe disposed in each set of test unit 30 is one type. The test unit 30 is electrically connected to the control terminal 40 under the same test conditions, and analyzes, stores and displays the test result through the control terminal 40. As shown in fig. 1, in order to ensure the safety during the test, a safety light curtain is further disposed on the side surface of the test frame 20, and the entire test frame 20 is in an open structure, so that an operator can conveniently operate and monitor the normal operation of the test unit 30 in real time. When the safety light curtain detects that a person or a foreign object enters the testing frame 20, the testing operation of the testing unit 30 is stopped in time, so as to ensure the safety of the operator in the testing process.

As shown in fig. 2, the present invention provides a schematic three-dimensional structure diagram of a single set of test units 30 in the probe performance testing apparatus 100. In this embodiment, four sets of test units 30 are simultaneously disposed on the test panel 10, the four sets of test units 30 are arranged on the test panel 10 in a matrix manner, each set of test units 30 are spaced from each other, and the structures of each set of test units 30 are completely the same.

The utility model provides a test unit 30 among probe performance testing arrangement 100 is including being fixed in the test frame 20 on with the push down subassembly 31 that the control terminal 40 electricity is connected, be fixed in the probe anchor clamps subassembly 32 on the test panel 10 and be fixed in the bottom that pushes down subassembly 31 can with the buffer assembly 33 of probe anchor clamps subassembly 32 butt. Each group of test units 30 includes a down-pressure component 31, a buffer component 33, and a probe clamp component 32 from top to bottom, wherein the probe clamp component 32 is used to fix the probe 90, and test boards are respectively disposed on the upper and lower sides of the probe 90, and the performance parameters of the probe 90 are fed back to the control terminal 40 for display through the electrical connection between the test boards and the control terminal 40. In the testing process, the pressing member 31 drives the buffer member 33 to move downward, and the two test boards in the probe clamp member 33 are clamped to contact with the upper and lower ends of the probe 90 to form an electrical path, a signal obtained on the test board is fed back to the control terminal 40 to obtain a test data, and then the pressing member 31 drives the buffer member 33 to move upward to be reset, so that the upper and lower ends of the probe 90 are separated from the two test boards. After the reciprocating operation is performed for several times, after the preset amount of test data is obtained on the control terminal 40, the pressing component 31 drives the buffering component 33 to recover the initial position, and then a test on the probe 90 is completed. The probe 90 in the probe clamp assembly 32 is then removed and the test unit cleaned in preparation for the next test.

As shown in fig. 3 and fig. 4, there are schematic three-dimensional structures of the pressing component 31 in the probe performance testing apparatus 100 provided by the present invention. The utility model provides a push down subassembly 31 is connected with computer 41 electricity in the control terminal 40 to speed when this push down subassembly 31 is pushed down, pressure when pushing down and the number of times of pushing down are driven by computer 41. Specifically, as shown in fig. 3, the pressing assembly 31 in the test unit 30 includes a carrier plate 311, a driving part 312 disposed on the carrier plate 311, and a pressing plate 313 located below the carrier plate 311 and driven by the driving part 312 to move up and down, wherein the carrier plate 311 is fixed on the test frame 20 through a supporting pillar 314. The pressing assembly 31 is fixed on the testing frame 20 by four supporting columns 314, and drives the pressing plate 313 to move up and down in a vertical direction relative to the carrier plate 311 by the driving part 312. The driving component 312 may be a motor screw module, an electric cylinder module, or an air cylinder module, which can realize linear driving. In this embodiment, the driving member 312 is an air cylinder fixed on the carrier plate 311, and a driving rod of the air cylinder is fixedly connected to the lower pressing plate 313 and drives the lower pressing plate 313 to move downward.

As shown in fig. 4, the pressing assembly 31 further includes a pair of first hydraulic buffers 315 disposed between the carrier plate 311 and the lower pressing plate 313. The two first hydraulic buffers 315 are fixed on the carrier plate 311, and the buffer heads of the first hydraulic buffers 315 are disposed at the bottom of the carrier plate 311, and can abut against the top surface of the lower pressing plate 313 in the pressing assembly 31 to prevent the pressing block 313 from being reset too fast, and abut against the lower pressing block 313, so that the pressing block 313 returns to the initial position, thereby reducing the vibration to the driving component 312 and the whole pressing assembly 31 when the pressing block 313 is reset, and improving the stability of the pressing assembly 31.

In order to ensure the stability of the lifting of the lower pressing plate 313 in the vertical direction, the present invention provides that the lower pressing assembly 31 further includes four linear bearings 316 connecting the lower pressing plate 313 and the carrier plate 311. The four linear bearings 316 are uniformly distributed around the driving part 312, and the linear bearings 316 increase the smooth ascending and descending of the lower pressing plate 313, thereby prolonging the service life of the guide shaft arranged on the linear bearings 316.

As shown in fig. 3 and 4, the hold-down assembly 31 further includes a pair of hydraulic buffer supports 317 respectively disposed on two adjacent linear bearings 316 and a second hydraulic buffer 318 fixed to the hydraulic buffer supports 317. The hydraulic buffer support 317 is arranged above the carrier plate 311 and is respectively positioned on two sides of the driving part 312, the two second hydraulic buffers 318 are fixed on the hydraulic buffer support 317, the buffer heads of the second hydraulic buffers 318 are positioned at the bottom of the hydraulic buffer support 317 and can be abutted against the top surface of the carrier plate 311, the second hydraulic buffers 318 and the first hydraulic buffers 315 have the same effect, the buffer and deceleration effects can be achieved in the resetting process of the lower pressure plate 313, and the service life of the driving part 312 is prevented from being influenced by too fast impact.

As shown in fig. 2, the buffer assembly 33 of the testing unit 30 of the present invention is fixed to the bottom of the lower pressing plate 313 of the lower pressing assembly 31. As shown in fig. 8 and 9, the buffering component 33 in the testing unit 30 provided by the present invention includes a horizontal mounting plate 331 fixed on the lower pressing plate 313, a mounting seat 332 fixed at the bottom of the horizontal mounting plate 331, a lower pressing block 333 extending from the bottom of the mounting seat 332, and a plurality of second elastic members 334 arranged in the mounting seat 332, wherein the second elastic members 334 are arranged between the lower pressing block 333 and the horizontal mounting plate 331. The lower pressing block 333 is disposed inside the mounting seat 332, wherein the bottom surface of the lower pressing block 333 extends from the through hole at the bottom of the mounting seat 332, and abuts against the top surface of the probe clamp assembly 32 during the pressing process, and the clamping of the probe clamp assembly 32 is driven by the lower pressing block 333. The pressing block 333 is disposed in the mounting seat 332, and after the pressing block 333 contacts with the top surface of the probe clamp assembly 32, the pressing block 333 is supported by the probe clamp assembly 32 with a continuous pressing force, so that the pressing block 33 presses the second elastic member 334 in the mounting seat 332, thereby achieving a buffering effect.

As shown in fig. 8, the buffer assembly 33 further includes a pair of stoppers 335 fixed to the bottom of the horizontal mounting plate 331, and the bottom surfaces of the stoppers 335 may abut against the top surface of the test panel 10. When the buffer assembly 33 is pushed down along with the push-down assembly 31, the bottom surface of the stopper 335 abuts against the test panel 10 to perform a limiting function, so as to prevent the push-down assembly 31 from being over-pressurized.

As shown in fig. 5, which is an exploded view of the probe holder assembly 32 provided by the present invention. The probe card assembly 32 includes a base plate 321 fixed to the test panel 10, a top plate 322 elastically connected to the base plate 321, a needle template 323 disposed between the base plate 321 and the top plate 322 for fixing the probes 90, and an upper test plate 324 and a lower test plate 325 disposed on upper and lower sides of the needle template 323. The probe template 323 in the probe clamp assembly 32 is designed separately according to different probes 90, and the rest parts are adaptive parts, so that the probe clamp assembly 32 can be suitable for probes 90 with different structures, different sizes and different materials. Most of the bottom plate 321, the top plate 322, the upper test plate 324 and the lower test plate 325 are connected by pins, so that the pin mold plate 323 can be quickly replaced.

In the initial state of the probe holder assembly 32, the bottom plate 321 and the top plate 322 are elastically connected, so that there is a mounting gap between the top plate 322 and the bottom plate 321, and the top plate 322 can also be lifted relative to the bottom plate 321. The pin stencil 323, the upper test board 324 and the lower test board 325 are disposed in the mounting gap enclosed by the bottom board 321 and the top board 322. The probes 90 are fixed by the probe template 323, two ends of the probes 90 are respectively perpendicular to the upper test board 324 and the lower test board 325, and at this time, the lower ends of the probes 90 are abutted against the lower test board 325, but the upper ends of the probes are not in contact with the upper test board 324. Thus, in the initial state, the probe holder assembly 32 is in a short-circuited state.

In the testing state of the probe clamp assembly 32, the pressing assembly 31 drives the buffer assembly 33 to move downward, and the buffer assembly is pressed downward from above the probe clamp assembly 32 and pushes the top plate 322 to move downward, so as to push the upper testing plate 324 to move downward, so that the top ends of the probes 90 contact the upper testing plate 324, and at this time, the probes 90 communicate the upper testing plate 324 and the lower testing plate 325, thereby forming an electrical communication loop. The upper test board 324 and the lower test board 325 disposed in the probe holder assembly 32 are electrically connected to the control terminals 40, and as the probes 90 make the whole circuit conductive, the test data of the probes 90 are obtained on the control terminals 40.

As shown in fig. 1, in the probe performance testing apparatus 100 provided by the present invention, the control terminal 40 includes the computer 41 and the electrical property testing box 42 which are electrically connected to each other, the electrical property testing box 42 is electrically connected to the upper testing board 324 and the lower testing board 325, and the computer 41 is electrically connected to the lower pressing component 31. The electrical property testing box 42, the upper testing board 324 and the lower testing board 325 form a circuit therebetween, and the electrical property parameters such as the resistance of the probe 90 are tested through the circuit formed on the electrical property testing box 42 and fed back to the computer 41, and the data is analyzed, stored and outputted through the computer 41.

Further, as shown in fig. 6 and 7, the present invention provides a cross-sectional view of the needle template 323 in the probe clamp assembly 32. The utility model provides a needle template 323 corresponds the setting according to the probe 90 structure of difference for needle template 323 can fix the not isostructure, not unidimensional, the probe 90 of different materials. The needle template 323 includes an upper needle mold 3231 and a lower needle mold 3232, and a groove 3231a for the lower needle mold 3232 to be inserted into is formed on a bottom surface of the upper needle mold 3231. The lower needle mold 3232 is completely fitted into the groove 3231a of the upper needle mold 3231. As shown in fig. 5, the probe 90 is inserted into the lower needle mold 3232, the lower needle mold 3232 is inserted into the groove 3231a of the upper needle mold 3231 from the bottom up, and the lower needle mold 3232 is fixed to the groove 3231a of the upper needle mold 3231 by a screw, thereby fixing the probe 90. As shown in fig. 7, in this embodiment, the upper needle mold 3231 is provided with a plurality of mounting holes 3231b arranged in an array for the probes 90 to be embedded therein, and the lower needle mold 3232 is provided with a plurality of mounting holes 3232a arranged in an array for the probes 90 to be embedded therein. The mounting hole 3231b of the upper pin mold 3231 and the mounting hole 3232a of the lower pin mold 3232 are stepped holes, so that both upper and lower ends of the probe 90 can be fixed in the pin mold plate 323. The compression amount of the probe 90 can be adjusted by changing the depths of the mounting hole 3231b of the upper pin die 3231 and the mounting hole 3232a of the lower pin die 3232 in the pin die plate 323, so that the performance parameter difference of the same probe 90 under the same pressing condition and different compression amounts can be realized through the test operation of the test unit 30.

As shown in fig. 5, the bottom plate 321 of the probe holder assembly 32 is provided with a first pin 326. The bottom plate 321 is provided with a pair of first pins 326, wherein the bottom of the first pins 326 is in interference fit with the bottom plate 321, and the first pins 326 are quickly assembled and disassembled by means of plugging and unplugging. The lower testing board 325 of the probe clamp assembly 32 is sleeved on the first pin 326 to achieve the precise positioning between the lower testing board 325 and the bottom plate 321, and meanwhile, the lower testing board 325 is fixed on the bottom plate 321 through a screw bone to achieve the fixed connection between the lower testing board 325 and the bottom plate 321.

Meanwhile, the needle template 323 in the probe fixture assembly 32 is provided with a second pin 327, the upper test board 324 and the top plate 322 are both sleeved on the second pin 327, the upper test board 324 is fixedly connected with the top plate 322 through a screw, and the upper test board is accurately positioned with the needle template 323 through the second pin 327. And the second pin 327 functions as a guide during the depression of the top plate 322.

As shown in fig. 5, the probe holder assembly 32 further includes a plurality of first elastic members 328 disposed between the top plate 322 and the bottom plate 321. The top plate 322 and the bottom plate 321 are fixedly connected together by a connecting member, wherein a first elastic member 328 is disposed to maintain a certain elastic space between the top plate 322 and the bottom plate 321, so that when the top plate 322 is driven by the pressing assembly 31, the first elastic member 328 is pressed and drives the top plate 322 to move toward the needle template 323 until the tai chi surface of the top plate 322 contacts with the top surface of the upper needle template 3231 of the needle template 323. In the process, the upper test plate 324 abuts the upper ends of the probes 90 and compresses the probes 90 as they are pressed down.

The utility model provides an every test element 30 all includes and pushes down subassembly 31 in probe capability test device 100, buffering subassembly 33 and probe holder subassembly 32, survey test panel 324 and survey test panel 325 down and be connected with control terminal 40 electricity in the probe holder subassembly 32, can realize the resistance to probe 90, the test of electrical property such as life-span and stability, simultaneously through changing and pushing down subassembly 31 and buffering subassembly 33, the change of the electrical property under the different states of pushing down of realization to same probe 90 or different probe 90. The test unit 30 is provided with a buffer assembly 33, the buffer assembly 33 can be compatible with the probes 90 with different lengths for testing, and can change the pressing state by adjusting a pressing block in the buffer assembly 33, so as to obtain the pressure test of the same probe 90 in different pressing states. Meanwhile, the pin templates 323 in the probe clamp assembly 32 can design the mounting holes 3231b according to different structures of the probes 90, so that the whole test unit 30 can meet the test requirements of different probes 90, the performance change of different compression amounts of the same probe 90 can be obtained by adjusting the mounting holes 3231b of the pin templates 323, and the performance change of different probes 90 can be realized in the same pressing state by designing the mounting holes 3231b of different probes 90 on the same pin template 323. Moreover, the push down subassembly 31 in this test unit 30 can adjust different push down velocity, and the cooperation buffering subassembly 33 realizes different push down pressure to realize different push down velocity or the performance change of the probe 90 under the push down pressure, the utility model provides an every test unit 30 all can realize foretell different test effects through the different parameter settings of adjusting push down subassembly 31, buffering subassembly 33 and probe anchor clamps subassembly 32 in probe capability test device 100, thereby realizes testing probe 90 comprehensive electrical property.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. The probe performance testing device is characterized by comprising a testing panel, a testing frame arranged on the testing panel, at least one testing unit and a control terminal electrically connected with the testing unit;

the test unit comprises a pressing component which is fixed on the test frame and is electrically connected with the control terminal, a probe clamp component which is fixed on the test panel, and a buffer component which is fixed at the bottom of the pressing component and can be abutted against the probe clamp component;

the probe clamp assembly comprises a bottom plate fixed on the test panel, a top plate elastically connected with the bottom plate, a needle template arranged between the bottom plate and the top plate and used for fixing a probe, an upper test plate and a lower test plate arranged on the upper side and the lower side of the needle template, and the upper test plate and the lower test plate are electrically connected with the control terminal.

2. The device for testing the performance of the probe as claimed in claim 1, wherein the pin templates in the probe fixture assembly comprise an upper pin die and a lower pin die, the bottom surface of the upper pin die is provided with a groove for the lower pin die to be embedded, and the upper pin die and the lower pin die are respectively provided with a plurality of mounting holes which are arranged in an array and are used for the probe to be embedded.

3. The apparatus according to claim 2, wherein the base plate has a first pin, and the lower testing plate is disposed on the first pin; the needle template is provided with a second pin, and the upper test plate and the upper plate are sleeved on the second pin.

4. The apparatus of claim 2, wherein the probe holder assembly further comprises a plurality of first elastic members disposed between the top plate and the bottom plate.

5. The apparatus according to claim 1, wherein the pressing assembly comprises a carrier, a driving member disposed on the carrier, and a pressing plate located below the carrier and driven by the driving member to move up and down, the carrier is fixed on the testing frame through a supporting column, and the buffer assembly is fixed at the bottom of the pressing plate.

6. The apparatus of claim 5, wherein the hold-down assembly further comprises a pair of first hydraulic buffers disposed between the carrier plate and the hold-down plate.

7. The apparatus of claim 6, wherein the pressing assembly further comprises four linear bearings connecting the pressing plate and the carrier plate, a pair of hydraulic buffer supports respectively disposed on two adjacent linear bearings, and a second hydraulic buffer fixed on the hydraulic buffer supports.

8. The apparatus according to claim 5, wherein the buffer assembly comprises a horizontal mounting plate fixed on the lower press plate, a mounting seat fixed at the bottom of the horizontal mounting plate, a lower press block extending from the bottom of the mounting seat, and a plurality of second elastic members disposed in the mounting seat, and the second elastic members are disposed between the lower press block and the horizontal mounting plate.

9. The apparatus according to claim 8, wherein the buffer assembly further comprises a pair of stoppers fixed to the bottom of the horizontal mounting plate, and bottom surfaces of the stoppers are abutted against the top surface of the test panel.

10. The apparatus according to claim 1, wherein the control terminal comprises a computer and an electrical testing box electrically connected to each other, the electrical testing box is electrically connected to the upper testing board and the lower testing board, and the computer is electrically connected to the lower pressing member.

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