CN218445661U

CN218445661U - Cantilever type probe card with segmented structure

Info

Publication number: CN218445661U
Application number: CN202222506852.0U
Authority: CN
Inventors: 刘明星; 周智伟; 曹智
Original assignee: Maxone Semiconductor Suzhou Co Ltd
Current assignee: Strong Half Conductor Suzhou Co ltd
Priority date: 2022-09-21
Filing date: 2022-09-21
Publication date: 2023-02-03
Anticipated expiration: 2032-09-21

Abstract

A cantilever type probe card with a segmented structure comprises probes, epoxy resin, a ceramic ring, a fixing plate and a PCB (printed Circuit Board); the fixing plate is fixedly connected with the PCB, and the ceramic ring is fixedly connected to the fixing plate; the epoxy is bonded to the ceramic ring; the number of the probes is at least two, the epoxy resin is provided with a plurality of probes which correspond to the probes one by one, and each probe is fixedly penetrated through the corresponding epoxy resin to form that each probe is fixed on the ceramic ring through the combination effect of the epoxy resin; gaps are formed among the epoxy resins. The cantilever type probe card can eliminate the influence of internal stress on the probe caused by thermal expansion.

Description

Cantilever type probe card with segmented structure

Technical Field

The utility model relates to a probe card field especially relates to a cantilever type probe card with segmentation structure.

Background

The cantilever type probe card mainly comprises a probe, epoxy resin, a ceramic ring, a fixing plate and a PCB (printed Circuit Board), wherein the PCB and the fixing plate are fixedly connected through a locking bolt, the probe is fixed on the ceramic ring through the epoxy resin, and the ceramic ring and the fixing plate are fixed through the epoxy resin; among them, the probe in the cantilever type probe card is usually provided with a plurality of probes, which are passed through the same block of epoxy resin along the same direction, and are fixed on the ceramic ring side by side under the bonding action of the epoxy resin.

However, as the demand of the electrical testing environment for semiconductor wafers is higher and higher, more and more electrical testing environments for wafers are required to be tested at-60 ℃ to 150 ℃, and in this testing temperature range, the cantilever probe card is affected by the internal stress caused by thermal expansion (mainly, expansion and contraction of epoxy resin) during the use process, which causes the pin position of each probe to shift greatly, and finally affects the accuracy of the testing data.

In view of the above problems, it is desirable to provide a cantilever type probe card capable of eliminating the influence of internal stress on a probe due to thermal expansion.

Disclosure of Invention

An object of the utility model is to provide a cantilever type probe card with segmentation structure.

The utility model adopts the technical proposal that: a cantilever type probe card with a segmented structure comprises probes, epoxy resin, a ceramic ring, a fixing plate and a PCB (printed Circuit Board); the fixing plate is fixedly connected with the PCB, and the ceramic ring is fixedly connected to the fixing plate; the epoxy is bonded to the ceramic ring;

the number of the probes is at least two, the epoxy resin is provided with a plurality of probes which correspond to the probes one by one, and each probe is fixedly penetrated through the corresponding epoxy resin to form that each probe is fixed on the ceramic ring through the combination effect of the epoxy resin; gaps are formed among the epoxy resins.

The relevant content in the above technical solution is explained as follows:

1. in the above scheme, the fixing plate is connected with the PCB plate by bolts.

2. In the above scheme, the fixing plate is arranged on the first side of the PCB, the ceramic ring is arranged on the second side of the PCB, the PCB is provided with a notch, and the ceramic ring is fixedly connected to the fixing plate through the notch.

3. In the above scheme, the notch is arranged at the central position of the PCB.

4. In the above scheme, the width of the gap between the epoxy resins is greater than or equal to 200 micrometers.

The beneficial effects of the utility model reside in that: this cantilever type probe card with segmentation structure is through designing the epoxy sectional type, epoxy is divided into the polylith, in order to be used for fixed a corresponding probe alone respectively, and reserve the clearance between each epoxy, when making each epoxy expend with heat and contract with cold under the high temperature difference environment, because the existence in clearance can not extrude each other, thereby the influence to the probe needle position has been avoided, the internal stress influence to the probe that brings because material thermal expansion has been eliminated, the stability of probe needle position has been guaranteed, the degree of accuracy of test data has finally been ensured.

Drawings

FIG. 1 is a schematic view of a first side of an embodiment of the present invention;

FIG. 2 is a schematic view of a second side of the embodiment of the present invention;

fig. 3 is an enlarged view of the area a in fig. 2.

In the above drawings: 1. probe 2, epoxy; 3. a ceramic ring; 4. a fixing plate; 5, PCB board; 6. and (4) a notch.

Detailed Description

The invention will be further described with reference to the following drawings and examples:

the present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the disclosure may be shown and described, and which, when modified and varied by the techniques taught herein, can be made by those skilled in the art without departing from the spirit and scope of the disclosure.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms "a", "an", "the" and "the", as used herein, also include the plural forms.

The terms "first," "second," and the like, as used herein, do not denote any order or importance, nor do they denote any order or importance, but rather are used to distinguish one element from another element or operation described in such technical terms.

As used herein, "connected" or "positioned" refers to two or more elements or devices being in direct physical contact with each other or in indirect physical contact with each other, and may also refer to two or more elements or devices being in operation or acting on each other.

As used herein, the terms "comprising," "including," "having," and the like are open-ended terms that mean including but not limited to.

As used herein, the term (terms), unless otherwise indicated, shall generally have the ordinary meaning as commonly understood by one of ordinary skill in the art, in this written description and in the claims. Certain words used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the disclosure.

The terms "front", "rear", "upper", "lower", "left" and "right" used herein are directional terms, and are used only for describing the positional relationship between the structures, and are not intended to limit the scope of protection and the actual direction of the present invention.

As shown in the embodiments of fig. 1 to 3, there is provided a cantilever type probe card having a segmented structure, including probes 1, epoxy 2, a ceramic ring 3, a fixing plate 4, and a PCB board 5.

The fixing plate 4 and the PCB 5 are provided with corresponding threaded holes and fixedly connected through locking bolts; the fixed plate 4 is arranged on the first side of the PCB 5, the ceramic ring 3 is arranged on the second side of the PCB 5, a notch 6 is formed in the PCB 5, and the ceramic ring 3 is fixedly connected with the fixed plate 4 through the notch 6.

Specifically, the notch 6 is disposed at the center of the PCB board 5.

The epoxy resin 2 is provided with a plurality of blocks which are combined with the ceramic ring 3, and gaps are formed among the epoxy resin 2; in this embodiment, the epoxy resin 2 is provided in a total of six blocks, and arranged in two rows.

Wherein the width of the gap between the epoxy resins 2 is greater than or equal to 200 micrometers to leave a space sufficient to accommodate thermal expansion of the epoxy resins 2.

The number of the probes 1 is at least two, in this embodiment six, the probes correspond to the epoxy resins 2 one by one, and the probes respectively penetrate through the corresponding epoxy resins 2 along the same direction, so that the probes 1 are fixed on the ceramic ring 3 through the bonding effect of the epoxy resins 2.

This cantilever type probe card with segmentation structure is through designing epoxy 2 sectional type, epoxy 2 is divided into six, be used for fixed probe 1 that corresponds alone respectively, and leave the clearance between each epoxy 2, make each epoxy 2 when expend with heat and contract with cold under the high temperature difference environment, because the existence in clearance can not extrude each other, thereby avoided the influence to 1 needle position of probe, eliminated because the internal stress influence to probe 1 that the material thermal expansion brought, the stability of 1 needle position of probe has been guaranteed, the degree of accuracy of test data has finally been ensured.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. A cantilever type probe card with a segmented structure comprises a probe (1), epoxy resin (2), a ceramic ring (3), a fixing plate (4) and a PCB (5); the fixing plate (4) is fixedly connected with the PCB (5), the ceramic ring (3) is fixedly connected on the fixing plate (4), and the epoxy resin (2) is combined with the ceramic ring (3);

the method is characterized in that: the number of the probes (1) is at least two, the epoxy resin (2) is provided with a plurality of probes which correspond to the probes (1) one by one, and each probe (1) is fixedly arranged on the corresponding epoxy resin (2) in a penetrating manner to form that each probe (1) is fixed on the ceramic ring (3) through the combination effect of the epoxy resin (2); gaps are formed among the epoxy resins (2).

2. The cantilever probe card having a segmented structure according to claim 1, wherein: the fixing plate (4) is connected with the PCB (5) through bolts.

3. The cantilever probe card having a segmented structure according to claim 1, wherein: fixed plate (4) are located the first side of PCB board (5), pottery porcelain ring (3) are located second side on PCB board (5), it has breach (6) to open on PCB board (5), pottery porcelain ring (3) are in through this breach (6) fixed connection on fixed plate (4).

4. The cantilever probe card having a segmented structure according to claim 3, wherein: the notch (6) is arranged at the central position of the PCB (5).

5. The cantilever probe card having a segmented structure according to claim 1, wherein: the width of the gap between the epoxy resins (2) is greater than or equal to 200 micrometers.